空气加热器及半导体设备
By integrating an air amplifier, heating device, and gas equalization device, the problem of uneven airflow temperature in semiconductor manufacturing is solved, achieving uniform airflow temperature and precise temperature control, thereby improving process consistency and equipment reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-21
- Publication Date
- 2026-07-17
AI Technical Summary
Existing air heaters are difficult to guarantee the uniformity of airflow temperature in semiconductor manufacturing, especially due to the significant radial temperature gradient, which fails to meet the high uniformity requirements of the process.
A combination of an air amplifier, a heating device, and an air equalization device is used. The air equalization device sets up a partial blockage of the airflow at the outlet of the heating device to mix the airflow. This includes internal and external air equalization structures, which improves the temperature uniformity of the airflow.
This achieves systematic uniformity of airflow temperature, improves temperature uniformity and temperature control accuracy within the process chamber, and enhances process consistency and equipment reliability.
Smart Images
Figure CN122408246A_ABST