Heat pump drive module and heat pump system

Abstract

This application belongs to the field of electrical technology, specifically relating to a heat pump drive module and a heat pump system. The heat pump drive module is used to control the compressor of the heat pump system. The heat pump drive module includes: a housing; a drive board connected to the housing; and a first heat-conducting element. The first heat-conducting element and the drive board are sequentially disposed on one side of the economizer of the heat pump system. The first heat-conducting element is used to transfer the heat generated by the drive board to the economizer. The heat pump drive module and heat pump system provided by this application can prevent the electronic components on the drive board from being damaged due to high temperature.

Description

Technical Field

[0001] This application relates to the field of electrical technology, and in particular to a heat pump drive module and a heat pump system. Background Technology

[0002] The variable frequency drive board in a heat pump system is an electrical control device. It is mainly used to control the speed of the compressor in the heat pump equipment in order to adjust the operating efficiency of the heat pump equipment.

[0003] The variable frequency drive board of the relevant technology is installed in the electrical control box, which is located in the closed compressor cavity.

[0004] However, because the frequency converter drive board contains electronic components such as intelligent power modules, these electronic components generate a lot of heat when they are working. If the temperature of the frequency converter drive board is too high, it may damage the electronic components on the frequency converter drive board. Summary of the Invention

[0005] This application provides a heat pump drive module and a heat pump system to solve the technical problem of damage to electronic components caused by high temperature in the inverter drive board of related technologies.

[0006] In a first aspect, embodiments of this application provide a heat pump drive module, which is used to control the compressor of a heat pump system. The heat pump drive module includes:

[0007] Box body;

[0008] A drive board, which is connected to the housing;

[0009] A first heat-conducting element and the drive plate are sequentially disposed on one side of the economizer of the heat pump system. The first heat-conducting element is used to transfer the heat generated by the drive plate to the economizer.

[0010] In some embodiments, the first heat-conducting element is disposed between the drive plate and the economizer, and the drive plate and the first heat-conducting element are in contact connection.

[0011] And / or the first heat-conducting element and the economizer are in contact connection.

[0012] In some embodiments, the housing is provided with a heat dissipation vent, and one side of the first heat-conducting element is connected to the drive plate through the heat dissipation vent.

[0013] In some embodiments, at least one second heat-conducting element is further included, wherein the second heat-conducting element is disposed between the first heat-conducting element and the drive plate, and between the first heat-conducting element and the receiving groove of the economizer.

[0014] In some embodiments, a limiting member is further included, which is disposed on the housing and is used to confine a portion of the first heat-conducting element within the housing.

[0015] In some embodiments, the limiting member includes a connecting portion and a limiting portion. The connecting portion is disposed along the inner peripheral wall of the heat dissipation port, and the limiting portion is disposed along the circumferential direction of the connecting portion. The limiting portion extends toward the inside of the heat dissipation port and is used to abut against the first heat-conducting member.

[0016] In some embodiments, the first heat-conducting element has a mating portion, and the limiting portion is used to abut against the mating portion to confine a portion of the first heat-conducting element within the housing.

[0017] In some embodiments, a plurality of connecting components are also included, the connecting components being disposed on the housing and the drive board, the connecting components being used to detachably connect the drive board to the housing.

[0018] In some embodiments, at least one of the connecting components includes a snap-fit ​​member and a fastener;

[0019] The snap-fit ​​component is disposed inside the housing and is used to snap-fit ​​or detach from the drive board to detachably connect the drive board to the housing.

[0020] The fastener is disposed on the drive plate and is used to insert into the housing to detachably connect the drive plate to the housing.

[0021] In some embodiments, the first heat-conducting element is disposed between the drive plate and the economizer, and the drive plate and the first heat-conducting element are spaced apart, with the distance between the drive plate and the first heat-conducting element being less than 1 cm;

[0022] And / or the first heat-conducting element and the economizer are spaced apart, with the distance between the first heat-conducting element and the economizer being less than 1 cm.

[0023] Secondly, this application provides a heat pump system, including a heat pump system body and a heat pump drive module disposed on the heat pump system body.

[0024] This application provides a heat pump drive module and a heat pump system. The heat pump drive module provided in this application ensures that, when the heat pump system is in cooling or heating mode, the refrigerant temperature in the economizer is lower than the temperature of the drive board. By employing a first heat-conducting element, the heat generated by the drive board during operation can be transferred to the economizer, allowing the economizer to cool the drive board using the refrigerant temperature. This enables the drive board to operate at a suitable temperature, improving its reliability and stability, and preventing damage to electronic components on the drive board due to high temperatures. The first heat-conducting element also improves heat transfer efficiency, indirectly increasing the economizer's cooling efficiency. Furthermore, by utilizing the economizer, there is no need for additional water-cooling or air-cooling components to cool the drive board, saving space occupied by components within the heat pump system and reducing the manufacturing costs of additional water-cooling or air-cooling components. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0026] Figure 1 A schematic diagram of the assembly state of the heat pump drive module provided in the embodiments of this application. Figure 1 ;

[0027] Figure 2 A cross-sectional structural diagram of the heat pump drive module in its assembled state, provided in an embodiment of this application;

[0028] Figure 3 A schematic diagram of the assembly state of the heat pump drive module provided in the embodiments of this application. Figure 2 ;

[0029] Figure 4 for Figure 3 Enlarged view of part A in the image;

[0030] Figure 5 A schematic diagram of the assembly state of the heat pump drive module provided in the embodiments of this application. Figure 3 .

[0031] Explanation of reference numerals in the attached figures:

[0032] 100. Box body; 110. Connecting components;

[0033] 110. Vent for heat dissipation; 120. Base plate; 130. Side plate; 131. Opening;

[0034] 200. Driver board;

[0035] 300, First heat-conducting component; 310, Mating part; 320, Second heat-conducting component;

[0036] 400. Limiting component; 420. Connecting part; 430. Limiting part;

[0037] 500. Snap-on connector; 510. Snap-on board; 520. Snap-on block;

[0038] 600. Support section;

[0039] 700. Mounting component; 710. Mounting bolt; 720. Mounting space; 730. First mounting part; 740. Second mounting part; 750. Third mounting part;

[0040] 800, Economizer; 810, Housing; 820, Receiving tank.

[0041] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0042] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0043] The variable frequency drive board of the relevant technology is installed in the electrical control box, which is located in the closed compressor cavity.

[0044] However, the inverter drive board integrates many electronic components, among which the intelligent power module is the main heat source. The intelligent power module is responsible for controlling and regulating the compressor's current, and it generates a significant amount of heat during operation. This is because energy loss occurs when current passes through the power module, and this loss is dissipated as heat. If the inverter drive board's temperature is too high, it will damage the electronic components. First, high temperatures accelerate the aging process of electronic components, reducing their performance and reliability. For example, capacitors are prone to electrolyte drying and leakage at high temperatures, and resistors may experience resistance drift.

[0045] To address the aforementioned technical problems, this application provides a heat pump drive module and a heat pump system. When the heat pump system is in cooling or heating mode, the refrigerant temperature in the economizer is lower than the temperature of the drive board. By employing a first and a second heat-conducting element, the heat generated by the drive board during operation can be transferred to the economizer through the first and second heat-conducting elements. This allows the economizer to cool the drive board using the refrigerant temperature, enabling the drive board to operate at a suitable temperature. This improves the reliability and stability of the drive board and prevents damage to electronic components on the drive board due to high temperatures. The first and second heat-conducting elements also improve heat transfer, indirectly increasing the cooling efficiency of the economizer on the drive board. Furthermore, by utilizing the economizer, there is no need for additional water-cooling or air-cooling components to cool the drive board, saving space occupied by components within the heat pump system and reducing the manufacturing costs of additional water-cooling or air-cooling components.

[0046] The technical solutions of this application and how they solve the aforementioned technical problems are described in detail below with specific embodiments. These specific embodiments may exist independently or in combination with each other. Identical or similar concepts or processes may not be repeated in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0047] Combination Figure 1 and Figure 2 This application provides a heat pump drive module for controlling the compressor of a heat pump system. The heat pump drive module includes:

[0048] Box body 100;

[0049] Drive board 200, which is connected to housing 100;

[0050] The first heat-conducting element 300 and the drive plate 200 are sequentially arranged on one side of the economizer 800 of the heat pump system. The first heat-conducting element 300 is used to transfer the heat generated by the drive plate 200 to the economizer 800.

[0051] Combination Figure 1 and Figure 2 The first heat-conducting component 300 is disposed between the drive plate 200 and the economizer 800, and the drive plate 200 and the first heat-conducting component 300 are in contact connection.

[0052] And / or the first heat-conducting element 300 and the economizer 800 are in contact connection.

[0053] In this embodiment, the drive plate 200 and the first heat-conducting component 300 are in contact connection, and the first heat-conducting component 300 and the economizer 800 are in contact connection.

[0054] Combination Figure 1 and Figure 2 The housing 100 is provided with a heat dissipation vent 110, and one side of the first heat conduction component 300 is connected to the drive board 200 through the heat dissipation vent 110.

[0055] In this embodiment, the housing 100 includes a base plate 120 and a side plate 130. The side plate 130 is connected to the base plate 120 and is arranged along the circumference of the base plate 120 and perpendicular to the base plate 120. The heat dissipation vent 110 is rectangular, and the first heat-conducting element 300 is an aluminum plate. The aluminum plate is rectangular and is configured to cooperate with the rectangular heat dissipation vent 110. By adopting the configuration of the heat dissipation vent 110, the contact area between the economizer 800 and the drive plate 200 is increased, thereby improving the cooling efficiency of the drive plate 200. In other embodiments, the first heat-conducting element 300 can be replaced with a silver plate or an aluminum plate, etc. The shape of the heat dissipation vent 110 and the first heat-conducting element 300 can be adaptively adjusted as needed. For example, the heat dissipation vent 110 can be set as a circle, and the first heat-conducting element 300 can be configured to cooperate with the circular heat dissipation vent 110.

[0056] In this application, when the heat pump system is in cooling or heating mode, the refrigerant temperature in the economizer 800 is lower than the temperature of the drive plate 200. By using the first heat-conducting element 300, the heat generated by the drive plate 200 during operation can be transferred to the economizer 800 through the first heat-conducting element 300. This allows the economizer 800 to cool the drive plate 200 by relying on the temperature of the refrigerant, enabling the drive plate 200 to operate at a suitable temperature. This improves the reliability and stability of the drive plate 200 and prevents the electronic components on the drive plate 200 from being damaged by high temperatures. The first heat-conducting element 300 can better transfer heat, thereby indirectly improving the cooling efficiency of the economizer 800 on the drive plate 200. Furthermore, by utilizing the economizer 800, there is no need to use additional water-cooling or air-cooling components to cool the drive plate 200, saving space occupied by components in the heat pump system and reducing the manufacturing cost of additional water-cooling or air-cooling components.

[0057] Combination Figure 1 and Figure 2 The heat pump drive module also includes at least one second heat-conducting element 320, wherein the second heat-conducting element 320 is disposed between the first heat-conducting element 300 and the drive plate 200, and between the first heat-conducting element 300 and the receiving groove 820 of the economizer 800.

[0058] In this embodiment, two second heat-conducting elements 320 are provided. One second heat-conducting element 320 is provided between the first heat-conducting element 300 and the drive plate 200, and the other second heat-conducting element 320 is provided between the first heat-conducting element 300 and the economizer 800.

[0059] In this embodiment, the economizer 800 includes a housing 810, and the housing 810 has a receiving groove 820 for accommodating a portion of the first heat-conducting element 300; in this embodiment, the receiving groove 820 is rectangular, and the rectangular receiving groove 820 is configured to cooperate with the rectangular first heat-conducting element 300.

[0060] In this embodiment, the second heat-conducting component 320 is thermally conductive silicone. The thermally conductive silicone is applied by smearing between the first heat-conducting component 300 and the drive plate 200, and between the first heat-conducting component 300 and the economizer 800. In other embodiments, the thermally conductive silicone can be replaced with thermally conductive rubber sheet or thermally conductive paste, etc.

[0061] In this application, by employing a second heat-conducting element 320, and by using the first heat-conducting element 300 in conjunction with the second heat-conducting element 320, the heat transfer efficiency generated by the drive plate 200 can be further improved, thereby further improving the cooling efficiency of the economizer 800 on the drive plate 200. By employing a receiving groove 820, a portion of the first heat-conducting element 300 can be placed within the receiving groove 820, allowing the surface of the first heat-conducting element 300 facing the bottom wall of the receiving groove 820 and the side wall of the first heat-conducting element 300 to abut against the inner wall of the receiving groove 820. This increases the contact area between the first heat-conducting element 300 and the housing 810 of the economizer 800, enabling the first heat-conducting element 300 to better transfer the heat received from the drive plate 200 to the economizer 800, thereby indirectly improving the cooling efficiency of the economizer 800 on the drive plate 200.

[0062] Combination Figure 1 and Figure 2 The cooling structure of the heat pump drive module also includes a limiting member 400, which is disposed on the box 100 and is used to restrict part of the first heat-conducting member 300 within the box 300.

[0063] The limiting member 400 includes a connecting part 420 and a limiting part 430. The connecting part 420 is disposed along the inner peripheral wall of the heat dissipation port 110, and the limiting part 430 is disposed along the circumference of the connecting part 420. The limiting part 430 extends toward the heat dissipation port 110 and is used to abut against the first heat-conducting member 300.

[0064] In this embodiment, the connecting part 420 is perpendicular to the plane where the heat dissipation vent 110 is located, and the connecting part 420 extends toward the inside and outside of the box body 100. One side of the limiting part 430 is connected to the side of the connecting part 420 located outside the box body 100, and the limiting part 430 is perpendicular to the connecting part 420.

[0065] In other embodiments, the limiting member 400 can be replaced by a limiting plate and a limiting bolt. By passing the limiting bolt through the limiting plate and inserting and threading the limiting bolt on the housing 100 at a position adjacent to the heat dissipation port 110, the limiting bolt can drive the limiting plate to abut against the first heat-conducting member 300, thereby enabling the limiting plate and the limiting bolt to also limit the first heat-conducting member 300.

[0066] Combination Figure 1 and Figure 2 The first heat-conducting element 300 has a mating part 310 and a limiting part 430 for abutting against the mating part 310 to fix part of the first heat-conducting element 300 within the limiting space 410.

[0067] In this embodiment, the mating part 310 is an aluminum plate, and the mating part 310 is integrally formed with the first heat-conducting element 300. The mating part 310 is located at a position away from the economizer 800 of the first heat-conducting element 300. The mating part 310 is arranged along the circumference of the first heat-conducting element 300, and the cross-section of the mating part 310 is set as rectangular. The mating part 310 can simultaneously abut with the limiting part 430 and the connecting part 420, thereby limiting the first heat-conducting element 300 in two different directions.

[0068] In this application, by adopting the configuration of the mating part 310, the first heat-conducting element 300 passes through the heat dissipation port 110 on the side away from the economizer 800, allowing a portion of the first heat-conducting element 300 to pass through the heat dissipation port 110. The first heat-conducting element 300 can drive the mating part 310 to move between the connecting part 420 and the limiting part 430, so that the mating part 310 abuts against the connecting part 420 and the limiting part 430, thereby confining a portion of the first heat-conducting element 300 within the housing 100 and preventing the first heat-conducting element 300 from detaching from the housing 100. This achieves the installation of the first heat-conducting element 300, making the installation method convenient and simple, and further improving the ease of installation of the first heat-conducting element 300.

[0069] In this embodiment, the area of ​​the second heat-conducting element 320 between the first heat-conducting element 300 and the receiving groove 820 is the same as the sum of the areas of the first heat-conducting element 300 and the mating part 310; the area of ​​the second heat-conducting element 320 between the first heat-conducting element 300 and the drive plate 200 is the same as the area of ​​the first heat-conducting element 300.

[0070] Combination Figure 3 and Figure 4 The heat pump drive module also includes multiple connecting components 110, which are disposed on the housing 100 and the drive board 200. The connecting components 110 are used to detachably connect the drive board 200 to the housing 100.

[0071] Combination Figure 3 and Figure 4At least one connecting component 110 includes a snap-fit ​​member 500 and a fastener. The snap-fit ​​member 500 is disposed within the housing 100 and is used to snap-fit ​​or de-snap with the drive board 200 to detachably connect the drive board 200 within the housing 100.

[0072] In this embodiment, four connecting components 110 are provided. Each of the four connecting components 110 includes a snap-fit ​​component 500 and a fixing component. The snap-fit ​​component 500 is a buckle and is made of plastic. There are four snap-fit ​​components 500, two of which are located on one side of the box body 100 and the other two are located on the other side of the box body 100. An opening 131 is provided on the side plate 130 of the box body 100. The snap-fit ​​component 500 includes a snap-fit ​​plate 510 and a snap-fit ​​block 520. One side of the snap-fit ​​plate 510 is connected to the bottom wall of the opening 131, and the other side is freely disposed. The snap-fit ​​block 520 is located on the side of the snap-fit ​​plate 510 facing the inside of the box body 100.

[0073] In this application, by using the snap-fit ​​component 500, the drive plate 200 is moved into the housing 100. At this time, the drive plate 200 can abut against the snap-fit ​​block 520, thereby causing the drive plate 200 to drive the snap-fit ​​plate 510 to deform outward from the housing 100. When the drive plate 200 passes the snap-fit ​​block 520, the snap-fit ​​block 520 can return to its original shape. At this time, the drive plate 200 can abut against the bottom of the snap-fit ​​block 520, so that the snap-fit ​​component 500 can snap into the drive plate 200, thereby fixing the drive plate 200 inside the housing 100. The method of fixing the drive plate 200 is convenient and simple, thereby improving the ease of installation and disassembly of the drive plate 200.

[0074] Combination Figure 3 and Figure 4 The fastener is set on the drive plate 200 and is used to insert into the housing 100 so that the drive plate 200 can be detachably connected to the housing 100.

[0075] In this embodiment, the bottom wall of the box 100 has a support portion 600. Four sets of fixing members and support portions 600 are provided. The four sets of fixing members and support portions 600 are respectively provided at the four corners of the drive plate 200. The fixing members are connecting bolts, which pass through the drive plate 200. The support portion 600 is a support column, which is provided on the bottom plate 120 of the box 100 and is perpendicular to the bottom plate 120. The connecting bolt is used for insertion and threaded connection in the support column of the bottom wall of the box 100, thereby fixing the drive plate 200 on the support column.

[0076] In this application, by adopting the setting of fasteners and support parts 600, and by connecting the connecting bolts to the support column by thread, the drive plate 200 can be detachably connected to the box 100, thereby further improving the fixing strength of the drive plate 200 in the box 100 and preventing the drive plate 200 from detaching from the box 100.

[0077] Combination Figure 2 and Figure 5 The heat pump drive module also includes a mounting component 700, which is disposed on the outer wall of the housing 100 and is used to detachably connect the economizer 800 to the outer wall of the housing 100.

[0078] In this embodiment, the mounting component 700 is a mounting plate, and mounting bolts 710 are provided on the mounting plate. Two sets of mounting components 700 and mounting bolts 710 are provided, and the two sets of mounting components 700 and mounting bolts 710 are respectively disposed on the housing 100 and located on both sides of the economizer 800. The mounting plate includes a first mounting portion 730, a second mounting portion 740, and a third mounting portion 750. The first mounting portion 730 and the third mounting portion 750 are respectively disposed on both sides of the second mounting portion 740. The first mounting portion 730 is parallel to the bottom plate 12 of the housing 100. 0. The second mounting part 740 is perpendicular to the bottom plate 120 of the box body 100, and the third mounting part 750 is parallel to the bottom plate 120 of the box body 100. The first mounting part 730 and the third mounting part 750 extend in opposite directions. An installation space 720 is formed between the bottom plate 120, the second mounting part 740 and the third mounting part 750. The mounting bolt 710 passes through the first mounting part 730 and is inserted and threaded into the bottom plate 120 of the box body 100, thereby detachably connecting the mounting part 700 to the box body 100.

[0079] In this application, by employing the mounting component 700 and mounting bolts 710, and by placing the economizer 800 and the first heat-conducting component 300 within the mounting space 720, and fixing the first mounting part 730 to the housing 100 using the mounting bolts 710, the mounting component 700 can fix the economizer 800 to the outer wall of the housing 100, allowing the economizer 800 to abut against the second heat-conducting component 320. This improves the contact strength between the economizer 800, the first heat-conducting component 300, and the second heat-conducting component 320, thereby indirectly improving the heat transfer efficiency between the first heat-conducting component 300 and the second heat-conducting component 320, improving the cooling efficiency of the economizer 800 on the drive plate 200, and facilitating the installation and removal of the first heat-conducting component 300 and the housing 100 from the economizer 800.

[0080] In some embodiments, the first heat-conducting element 300 is disposed between the drive plate 200 and the economizer 800, and the drive plate 200 and the first heat-conducting element 300 are spaced apart, with the distance between the drive plate 200 and the first heat-conducting element 300 being less than 1 cm.

[0081] And / or the first heat-conducting element 300 and the economizer 800 are spaced apart, with the distance between the first heat-conducting element 300 and the economizer 800 being less than 1 cm.

[0082] In this embodiment, the drive plate 200 and the first heat-conducting element 300 are spaced apart, with a distance of 0.3 cm between them. The first heat-conducting element 300 and the economizer 800 are also spaced apart, with a distance of 0.3 cm between them. Thus, the heat generated by the drive plate 200 can be transferred to the economizer 800 through the first heat-conducting element 300.

[0083] In other embodiments, the distance between the drive plate 200 and the first heat-conducting element 300 can be set to 2cm, and the distance between the first heat-conducting element 300 and the economizer 800 can also be set to 2cm; the distance between the drive plate 200 and the first heat-conducting element 300 and the distance between the first heat-conducting element 300 and the economizer 800 can be adjusted adaptively as needed.

[0084] This application also provides a heat pump system, including a heat pump system body and a heat pump drive module of any of the above embodiments disposed on the heat pump system body.

[0085] The heat pump drive module has been described in detail in the above embodiments and will not be repeated here.

[0086] The heat pump system provided in this application, by setting a heat pump drive module, ensures that the refrigerant temperature in the economizer 800 is lower than the temperature of the drive plate 200 when the heat pump system is in cooling or heating mode. Through the use of a first heat-conducting element 300 and a second heat-conducting element 320, the heat generated by the drive plate 200 during operation can be transferred to the economizer 800 via the second heat-conducting element 320 and the first heat-conducting element 300. This allows the economizer 800 to cool the drive plate 200 using the refrigerant temperature, enabling the drive plate 200 to operate at a suitable temperature. The system operates at low temperatures, thereby improving the reliability and stability of the drive board 200 and preventing damage to the electronic components on the drive board 200 due to high temperatures. The arrangement of the first heat-conducting element 300 and the second heat-conducting element 320 can better transfer heat, thereby indirectly improving the cooling efficiency of the economizer 800 on the drive board 200. Furthermore, by utilizing the economizer 800, there is no need to use additional water-cooling or air-cooling components to cool the drive board 200, saving space occupied by components in the heat pump system and reducing the manufacturing cost of additional water-cooling or air-cooling components.

[0087] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

[0088] The technical solutions of this application have been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of this application is obviously not limited to these specific embodiments. The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat pump drive module, wherein the heat pump drive module is used to control the compressor of a heat pump system, characterized in that, The heat pump drive module includes: Box body (100); A drive board (200) is connected to the housing (100); A first heat-conducting element (300) is connected to the housing (100). The first heat-conducting element (300) and the drive plate (200) are sequentially arranged on one side of the economizer (800) of the heat pump system. The first heat-conducting element (300) is used to transfer the heat generated by the drive plate (200) to the economizer (800).

2. The heat pump drive module according to claim 1, characterized in that, The first heat-conducting component (300) is disposed between the drive plate (200) and the economizer (800), and the drive plate (200) and the first heat-conducting component (300) are in contact connection. And / or the first heat-conducting element (300) and the economizer (800) are in contact connection.

3. The heat pump drive module according to claim 2, characterized in that, The housing (100) is provided with a heat dissipation port (110), and one side of the first heat-conducting component (300) is connected to the drive plate (200) through the heat dissipation port (110).

4. The heat pump drive module according to claim 2, characterized in that, It also includes at least one second heat-conducting element (320), wherein the second heat-conducting element (320) is disposed between the first heat-conducting element (300) and the drive plate (200), and between the first heat-conducting element (300) and the receiving groove (820) of the economizer (800).

5. The heat pump drive module according to claim 3, characterized in that, It also includes a limiting member (400) disposed on the housing (100) for confining a portion of the first heat-conducting member (300) within the housing (300).

6. The heat pump drive module according to claim 5, characterized in that, The limiting member (400) includes a connecting part (420) and a limiting part (430). The connecting part (420) is disposed along the inner peripheral wall of the heat dissipation port (110), and the limiting part (430) is disposed along the circumferential direction of the connecting part (420). The limiting part (430) extends toward the heat dissipation port (110) and is used to abut against the first heat-conducting member (300).

7. The heat pump drive module according to claim 6, characterized in that, The first heat-conducting element (300) has a mating portion (310), and the limiting portion (430) is used to abut against the mating portion (310) to restrict a portion of the first heat-conducting element (300) within the housing (300).

8. The heat pump drive module according to any one of claims 1-7, characterized in that, It also includes a plurality of connecting components (110) disposed on the housing (100) and the drive board (200), the connecting components (110) being used to detachably connect the drive board (200) inside the housing (100).

9. The heat pump drive module according to claim 8, characterized in that, At least one of the connecting components (110) includes a snap-fit ​​member (500) and a fastener; The snap-fit ​​member (500) is disposed inside the housing (100). The snap-fit ​​member (500) is used to snap-fit ​​or disengage from the drive board (200) so that the drive board (200) can be detached from the housing (100). The fastener is disposed on the drive plate (200) and is used to be inserted into the housing (100) to detachably connect the drive plate (200) to the housing (100).

10. The heat pump drive module according to claim 1, characterized in that, The first heat-conducting component (300) is disposed between the drive plate (200) and the economizer (800), and the drive plate (200) and the first heat-conducting component (300) are spaced apart, with the distance between the drive plate (200) and the first heat-conducting component (300) being less than 1 cm. And / or the first heat-conducting element (300) and the economizer (800) are spaced apart, and the distance between the first heat-conducting element (300) and the economizer (800) is less than 1 cm.

11. A heat pump system, characterized in that, It includes a heat pump system body and a heat pump drive module as described in any one of claims 1-10, which is disposed on the heat pump system body.

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