A sensor having a metallized structure
By incorporating test slots and conductive structures into the sensor structure, the problem of easy breakage of the pressure-sensitive film during bonding is solved, thereby improving the sensor's yield and overall reliability.
CN122408845APending Publication Date: 2026-07-17BANWATER TECH (XIAMEN) CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BANWATER TECH (XIAMEN) CO LTD
- Filing Date
- 2026-04-16
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In the existing sensor structure, the pressure-sensitive film is easily damaged during the bonding process, resulting in a low yield.
Method used
By improving the sensor structure, setting test grooves after bonding, and etching dielectric grooves and positioning grooves on the silicon wafer, combined with the design of conductive structures and electrode layers, the overall structural strength and reliability of the sensor are improved.
Benefits of technology
This improved the sensor yield, enhanced the bonding resistance of the pressure-sensitive film, and reduced the risk of breakage.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122408845A_ABST
Abstract
本发明提供一种具有金属化结构的传感器，包括第一硅片、与所述第一硅片键合的下电极；所述第一硅片的一表面设置介质槽，且另一表面设置测试槽，所述第一硅片具有介质槽的表面与下电极键合，形成介质腔；所述下电极包括基层、设置于基层上的导电结构以及与导电结构导通的电极层。本发明的传感器通过改进传感器的机构，同时在键合后设置测试槽，可以提高传感器的良品率。
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