基于软弹性附着体的复合结构、制备方法及薄膜传感器
By employing a composite structure of soft elastic adhesive and a heat-softening adhesive in thin-film sensors, the problems of voids and interface degradation in the metal-rubber interface encapsulation of thin-film sensors are solved, achieving a high airtightness and self-healing encapsulation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- AEW TECHNOLOGY GROUP CO LTD
- Filing Date
- 2026-04-20
- Publication Date
- 2026-07-17
AI Technical Summary
Existing thin-film sensors suffer from problems such as voids that are difficult to completely eliminate and interface degradation caused by interface stress in metal-rubber interface encapsulation, which affect the hermeticity and reliability of the encapsulation.
The composite structure employing a soft, elastic adhesive, including a functional layer and an adhesive, actively fills microcracks and interfacial gaps by using an adhesive that softens and deforms during extrusion or under thermal stress during the encapsulation process. It utilizes thermally softening or thermally flowing adhesives such as epoxy resin, acrylic resin, silicone rubber, and polyurethane rubber, combined with low-temperature injection molding curing or UV curing technology, to achieve dynamic sealing and self-healing.
It significantly reduces the risk of interface voids and peeling, improves the hermeticity and mechanical stability of the packaging, has dynamic sealing and self-healing capabilities, and enhances the reliability and lifespan of the sensor.
Smart Images
Figure CN122408846A_ABST