三维堆叠结构的热释电红外探测器
By integrating the MEMS modulation layer, pyroelectric sensing layer, and CMOS circuit layer in a three-dimensional stacked structure, the miniaturization and integration problems of pyroelectric detectors were solved, achieving efficient optical intensity modulation and signal acquisition without external mechanical choppers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN MEISI XIANRUI ELECTRONICS CO LTD
- Filing Date
- 2026-06-18
- Publication Date
- 2026-07-17
AI Technical Summary
Existing pyroelectric detectors rely on external mechanical choppers, making miniaturization and integration difficult, and also present the problem of balancing thermal isolation and mechanical reliability.
A three-dimensional stacked structure is adopted, in which the MEMS modulation layer, pyroelectric sensing layer and CMOS circuit layer are stacked sequentially through wafer-level bonding. The CMOS circuit layer drives the electrostatic comb drive structure to perform horizontal reciprocating motion above the pyroelectric sensing layer, thereby realizing the integration of light intensity modulation and signal acquisition.
It achieves a high degree of miniaturization and integration of pyroelectric infrared detectors, eliminating the need for external mechanical choppers and improving modulation efficiency and detection accuracy.
Smart Images
Figure CN122408968A_ABST