用于测量矢量力的传感器装置和方法
By using a flexible covering structure and an optical reflective surface to change the optical path, the problem of robustness and accurate measurement of existing force sensors in high-density arrays is solved, realizing accurate measurement and integration of external vector forces, which is suitable for a variety of application scenarios.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Filing Date
- 2026-03-24
- Publication Date
- 2026-07-17
AI Technical Summary
Existing force sensors are difficult to achieve robust and compact external force sensing in high-density sensor arrays. They cannot accurately distinguish and measure combinations of axial normal force, tangential shear force, and rotational torque. Furthermore, the sensors are easily damaged and difficult to integrate into compact modular packages.
The electronic chip and photodetector are packaged using a flexible encapsulation structure. Light is reflected by the optical reflective surface, and the optical path is changed by the deformation caused by the external vector force. The electronic chip processes the optical signal to estimate the force component, realizing direct mechanical coupling and high-density array integration.
It enables accurate differentiation and measurement of external vector forces, improves mechanical robustness, reduces wiring complexity, is suitable for high-density array integration, and is applicable to applications such as electronic skin systems, wearable devices, and robot sensing.
Smart Images
Figure CN122409033A_ABST