Parameter measurement method for manufacturing Beidou intelligent electronic modules

Abstract

This invention relates to the field of electrical component manufacturing technology and discloses a parameter measurement method for manufacturing Beidou intelligent electronic modules. The method includes: in the manufacturing process of the component carrier, using an induction detection unit comprising an induction detection circuit and a magnetic balance reference circuit to generate an induced magnetic field, simultaneously acquiring a loaded induction signal and an unloaded balance reference signal, extracting the original phase offset of the loaded induction signal relative to the excitation source, and monitoring the energy loss slope difference between the induction detection circuit and the magnetic balance reference circuit under operating conditions. This difference is used as a real-time gain adjustment factor to calculate a normalized value for the original phase offset, obtaining a target phase angle offset characterizing the physical thickness of the shielding layer. This invention utilizes a symmetrical circuit to achieve real-time common-mode suppression, eliminating phase angle jumps caused by excitation envelope distortion in manufacturing conditions, ensuring the stability of the measurement reference under dynamic conditions, and ensuring the consistency of the shielding layer.

Description

Technical Field

[0001] This invention relates to a parameter measurement method for manufacturing BeiDou intelligent electronic modules, belonging to the field of electrical component manufacturing technology. Background Technology

[0002] The current radio frequency signal shielding effectiveness of Beidou intelligent electronic modules is highly dependent on the consistency of shielding layer manufacturing. The physical thickness and internal stress state of the shielding cover during the stamping and packaging process are the core indicators that determine the impedance matching accuracy of high-frequency carriers. In the industry, optical reflection measurement or conventional electromagnetic induction detection methods are usually used to monitor the shielding layer parameters. The induction measurement mechanism based on the eddy current effect characterizes the geometric thickness of the metal layer by detecting the change in the complex impedance of the coil. However, in the high-dynamic environment of electronic manufacturing production lines, high-frequency welding equipment, servo motors, and frequency conversion drive devices generate a large amount of non-stationary stray electromagnetic noise. These interference signals overlap with the measurement excitation signal in the frequency domain, causing distortion of the original induction waveform acquired by the sensor and a decrease in the signal-to-noise ratio of the measurement system.

[0003] To address interference from the manufacturing environment, conventional industry solutions include adding physical shielding, introducing high-order hardware filters, or increasing the power of the excitation source. However, the introduction of physical shielding generates secondary induced eddy currents and creates complex mutual inductance interference. Furthermore, high-precision filtering and high-power regulated power supplies increase the infrastructure costs and space requirements of the packaging station. In addition, the lift-off height fluctuations during automated conveying and the thickness fluctuations of the shielding layer itself have extremely high electromagnetic coupling characteristics. Simply relying on amplitude detection makes it difficult to achieve essential separation of thickness parameters in the presence of attitude deflection. For example, Chinese invention patent CN104483333B discloses a combined X-ray energy calibration drive. The device and the X-ray energy calibration device achieve compact switching and position locking of multi-level calibration blocks through precision lead screws and reset elastic devices, which improves the stability at the mechanical level. However, when faced with non-stationary electromagnetic pulse interference unique to high-frequency induction measurement, this approach, which relies on static physical references and mechanical displacement control, is difficult to capture and counteract the instantaneous phase angle jump caused by excitation envelope distortion in real time. Especially under high-dynamic conditions where high-speed material conveying and heat accumulation coexist, due to the lack of common-mode suppression capability at the signal level and adaptive decoupling logic at the algorithm level, the system cannot essentially separate environmental noise and material property fluctuations, resulting in frequent drift of the measurement reference and restricting the real-time performance and reliability of parameter sensing on the production line.

[0004] Therefore, the technical problem to be solved by this invention is how to achieve essential decoupling and high stability sensing of shielding layer thickness parameters and stress parameters under manufacturing conditions with complex environmental noise interference and dynamic displacement deviation. Summary of the Invention

[0005] To address the problems mentioned in the background art, the technical solution of the present invention is as follows: A parameter measurement method for manufacturing Beidou intelligent electronic modules, comprising the following steps:

[0006] Step S101: In the manufacturing process of the component carrier, a high-frequency electromagnetic excitation source is used to drive an induction detection unit arranged below the manufacturing process to generate an induction magnetic field in the shielding layer area of ​​the electronic configuration to be tested; the induction detection unit includes an induction detection circuit and a magnetic balance reference circuit arranged symmetrically with the induction detection circuit.

[0007] Step S102: Simultaneously acquire the loaded induction signal output by the induction detection circuit and the unloaded balance reference signal output by the magnetic balance reference circuit.

[0008] Step S103: Extract the original phase offset of the loaded induction signal relative to the high-frequency electromagnetic excitation source, and monitor in real time the energy loss slope difference between the loaded induction signal and the unloaded balance reference signal under the high-frequency electromagnetic excitation source operating environment.

[0009] Step S104: Calculate the quotient of the original phase offset and the energy loss slope difference to eliminate the phase angle jump caused by the excitation envelope distortion and obtain the target phase angle offset characterizing the physical thickness of the shielding layer.

[0010] Step S105: Based on the preset parameter mapping model, the target phase angle offset is mapped to the consistency control parameter of the shielding layer of the electronic configuration under test.

[0011] Preferably, the induction detection circuit and the magnetic balance reference circuit are arranged in a mirror inductor matrix; when the high-frequency electromagnetic excitation source generates transient power jitter, the energy loss slope difference is obtained by comparing the rate of change of the current envelope of the induction detection circuit and the magnetic balance reference circuit in the same excitation pulse period, so as to achieve real-time common-mode suppression of the target phase angle offset.

[0012] Preferably, the method includes a temperature compensation step based on the difference in frequency domain response: Step S301, using a time-division reusable method, alternately transmitting a high-frequency surface induced magnetic field and a low-frequency penetration induced magnetic field to detect the induced current response of the shielding layer at different skin depths; Step S302, calculating a temperature compensation operator to characterize the effect of heat accumulation. The calculation rules are as follows: ,in, The induced phase angle is generated by the excitation of a high-frequency surface-induced magnetic field. β is the induced phase angle generated by the low-frequency penetrating induced magnetic field excitation, and β is the preset phase sensitivity conversion coefficient for the shielding layer material; in step S303, the target phase angle offset is corrected by the temperature compensation operator λ to eliminate parameter drift caused by heat accumulation in the manufacturing environment during the electronic packaging process.

[0013] Preferably, the method further includes a quality evaluation step for the edge region of the shielding layer of the electronic configuration under test: step S401, extracting the third harmonic phase lag characteristics in the load-inducing signal; step S402, monitoring the eddy current distortion characteristics generated in the edge region of the shielding layer under the excitation of a rotating alternating magnetic field; step S403, fusing the third harmonic phase lag characteristics and the eddy current distortion characteristics to determine whether there are physical continuity defects at the interface of the shielding layer.

[0014] Preferably, while performing step S101, material attitude correction is performed through the sensing detection circuit: Step S501, extract the transient voltage rise waveform of the sensing detection circuit at the initial stage of excitation; Step S502, based on the asymmetry of the leading and trailing edges of the transient voltage rise waveform, invert the geometric tilt angle of the shielding layer relative to the sensing detection unit; Step S503, compensate the target phase angle offset with the phase gain value based on the geometric tilt angle.

[0015] Preferably, the center frequency of the high-frequency electromagnetic excitation source is 300kHz to 500kHz; when the fluctuation value of the no-load balance reference signal exceeds 5%, the output ratio of the locking induction detection circuit is in fixed gain mode.

[0016] Preferably, the shielding layer is made of a conductive polymer substrate; the parametric mapping model includes a correction term for the effective permeability constant of the conductive polymer substrate under manufacturing packaging pressure.

[0017] Preferably, the inductive detection circuit includes a detection array composed of multiple sets of planar spiral coils, with mutual inductance reduction structures provided between each set of planar spiral coils to suppress electromagnetic interference between adjacent detection units.

[0018] Preferably, the sensing and detection unit is integrated inside the vacuum holding assembly at the manufacturing station, and the metal wall of the vacuum holding assembly is used as the electromagnetic boundary of the sensing magnetic field to improve the measurement of magnetic flux density.

[0019] Preferably, the consistency-controlled parameters include the physical thickness of the shielding layer and the surface resistivity distribution index.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. In the manufacturing of Beidou intelligent electronic modules, by collecting the phase angle offset of the shielding layer in the electromagnetic excitation region and mapping it to a preset complex impedance gradient model, the thickness parameter calculation process directly internalizes the conductivity and permeability characteristics of the metal material, establishing an essential relationship between the physical size of the shielding layer and the electromagnetic induction characteristics. Utilizing the skin effect at a specific frequency, the system can simultaneously sense the processing stress state inside the material while obtaining the physical thickness. This solves the technical bottleneck of traditional optical detection methods being unable to penetrate the metal surface to identify surface lattice distortion, ensuring that the consistency of the shielding layer during the manufacturing process can meet the impedance matching requirements of high-frequency carrier waves.

[0022] 2. By utilizing the co-modulation characteristics of the measurement induction branch and the balance compensation branch on the excitation source fluctuation, and by calculating the instantaneous phase correlation factor between the two branches, the common-mode interference components in the complex electromagnetic environment of the production line are canceled out. This cooperative offsetting mechanism reduces the dependence of the measurement unit on the high-precision constant current and voltage regulated power supply through the symmetrical layout at the physical level and the ratio calculation at the signal level. This enables the system to maintain high signal-to-noise ratio phase feature extraction even under amplitude and frequency jitter conditions caused by the start-up and shutdown of the main motor of the production line or the operation of the frequency converter, ensuring the absolute stability of the measurement reference in the dynamic manufacturing environment.

[0023] 3. By combining the time-division reusable detection of high-frequency surface induction magnetic field and low-frequency penetration induction magnetic field, and utilizing the physical boundaries of the skin depth of different frequencies within the shielding layer, a temperature compensation operator without external sensors is established. By exploiting the frequency domain response differences of the electromagnetic signal itself, real-time decoupling of conductivity fluctuations and physical thickness changes caused by material temperature rise is achieved. This eliminates measurement drift caused by heat accumulation in automated production lines, ensuring that the final output thickness parameter is controlled only by the physical dimensions of the shielding layer, thus improving the stability of the measurement system in continuous operation mode. Attached Figure Description

[0024] Figure 1 This is a flowchart of the shielding layer parameter measurement process for common-mode suppression of symmetrical loops in this invention.

[0025] Figure 2 This is a block diagram illustrating the principle of the measurement system integrating multidimensional compensation and quality evaluation of this invention. Detailed Implementation

[0026] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. The following embodiments are intended to explain the present invention and are not intended to limit the scope of protection of the present invention.

[0027] This invention provides a parameter measurement method for the manufacturing of Beidou intelligent connected electronic modules. An induction detection unit is deployed along the manufacturing path of the component carrier. Utilizing the principle of electromagnetic induction, the complex impedance characteristics of the shielding layer at a specific excitation frequency are collected. By extracting the original phase offset Δθ of the loaded induction signal relative to the excitation source, and introducing a magnetic balance reference loop to monitor the energy loss slope difference as a gain adjustment factor, a consistent and controllable parameter for the physical thickness of the shielding layer is obtained. The main stages include field environment calibration, dynamic signal acquisition, energy loss coordinated offsetting, impedance vector decoupling, and parameter closed-loop feedback. In the Beidou intelligent connected electronic module manufacturing production line, stray electromagnetic fields generated by high-frequency welding equipment and servo motors can interfere with the induced electromotive force of the measurement coil. To address this environmental interference, the induction detection unit adopts a symmetrical structure including an induction detection loop and a magnetic balance reference loop to achieve real-time common-mode suppression. The induction detection unit is deployed below the manufacturing path and driven by a high-frequency electromagnetic excitation source with a center frequency range of 300kHz to 500kHz. The processor synchronously acquires the loaded induction signal output by the induction detection loop and the unloaded slope difference output by the magnetic balance reference loop. The processor extracts the original phase offset Δθ of the load-inducing signal relative to the high-frequency electromagnetic excitation source, while simultaneously monitoring the energy loss slope difference between the induction detection circuit and the magnetic balance reference circuit under operating conditions. The quotient of the original phase offset Δθ and the energy loss slope difference is calculated and used as a real-time gain adjustment factor. This quotient calculation is performed in the arithmetic logic unit of the underlying processor. The specific instruction sequence is as follows: calculate the difference between the current real-time slope and the reference slope; if the difference is within the range of 0.05 to 0.15, then adjust the original phase offset directly... The product of this difference and 1.10 is used as the target phase output value after eliminating high-frequency welding interference. This ratio calculation eliminates the phase angle jump caused by excitation envelope distortion, maintaining the stability of the measurement reference in a dynamic manufacturing environment. When extracting the energy loss slope difference, the processor acquires the induced current response sequence of the induction detection circuit and the magnetic balance reference circuit within the excitation pulse period at a sampling frequency of not less than 10MHz. After selecting the response period, the least squares linear regression calculation is performed on the sampling point data along the 30% region to obtain the real-time slope characterizing the energy attenuation characteristics under load. Compared with the reference slope characterizing the energy decay characteristics of the no-load balance reference By calculating the difference between the two The gain compensation function is then used to offset the common envelope bias caused by transient power jitter of the high-frequency electromagnetic excitation source, so that the signal-to-noise ratio of the phase extraction stage is maintained above 25dB. When the fluctuation value of the no-load balance reference signal exceeds 5%, the system locks the output ratio of the induction detection circuit to a fixed gain mode.

[0028] Heat accumulation during the electronic packaging process can cause fluctuations in the conductivity of the metal shielding layer, leading to parameter drift. To address temperature rise interference, the system executes a temperature compensation procedure based on frequency domain response differences. The high-frequency electromagnetic excitation source alternately emits high-frequency surface-induced magnetic fields and low-frequency penetrating induced magnetic fields using a time-division reusable method. The skin depth of the high-frequency surface-induced magnetic field within the shielding layer is less than the minimum design thickness of the shielding layer. The processor calculates the temperature compensation operator λ, which characterizes the impact of heat accumulation, according to the following rules: Where λ is the temperature compensation operator. The induced phase angle is generated by the excitation of a high-frequency surface-induced magnetic field. The phase angle is generated by the low-frequency penetrating magnetic field excitation, and β is the preset phase-sensitive conversion coefficient for the shielding layer material. The processor uses the temperature compensation operator λ to correct the original phase offset Δθ, eliminating the phase interference component caused by the material temperature rise, so that the final output thickness parameter is controlled by the physical dimensions of the shielding layer. The edge area of ​​the shielding layer may have surface physical continuity defects in the cold stamping process, which leads to a decrease in the high-frequency carrier impedance matching accuracy. The quality evaluation procedure for the edge area includes: extracting the third harmonic phase hysteresis characteristics in the inductive signal. Simultaneously, the processor monitors the distortion characteristics of eddy currents around the edge region of the shielding layer under rotating alternating magnetic field excitation, and integrates the third-order harmonic phase lag characteristics. Based on the distortion characteristics of eddy current flow, determine whether there are physical continuity defects at the shielding layer interface, when the third harmonic phase lag angle When the deviation from the preset continuous interface model exceeds a preset threshold, the system outputs a warning command for interlayer bonding defects between the shielding layer and the substrate. During high-speed material transport, geometric tilt may occur, causing changes in the magnetic flux linkage area. To achieve adaptive correction, the induction detection circuit extracts the transient voltage rise waveform at the initial stage of excitation. Based on the asymmetry of the leading and trailing edges of the transient voltage rise waveform, the processor calculates the geometric tilt angle α of the shielding layer relative to the induction detection unit. The processor compensates for the phase gain value of the target phase angle offset based on the geometric tilt angle α. This nonlinear weighted correction compensates for the signal deviation caused by the lift-off height fluctuation and reduces the dependence on the accuracy of the mechanical positioning fixture.

[0029] The processor maps the target phase angle offset to the uniformity control parameters of the shielding layer of the electronic configuration under test according to the preset parameter mapping model. These parameters include the physical thickness of the shielding layer and the surface resistivity distribution index. The formula for calculating the real-time thickness parameter d is as follows: Where d is the real-time thickness parameter, k is a proportionality coefficient related to the magnetic permeability of the shielding layer material, and Δθ is the induced phase angle offset. The system uses the impedance imaginary part change rate corresponding to the induced phase angle offset Δθ to characterize the degree of work hardening inside the shielding layer, and corrects the proportional coefficient k according to this degree of hardening. Based on the fluctuation trend of the real-time thickness parameter d, the system adjusts the pressing displacement compensation amount of the subsequent packaging station in real time. The induction detection unit is integrated inside the vacuum holding assembly of the manufacturing station. The metal wall of the vacuum holding assembly serves as the electromagnetic boundary of the induced magnetic field, increasing the measured magnetic flux density. The shielding layer is made of a conductive polymer substrate. The parameter mapping model includes an effective permeability constant correction term for the conductive polymer substrate under manufacturing packaging pressure. Mutual inductance reduction structures are set between each group of planar spiral coils to suppress electromagnetic interference between adjacent detection units. A 0.5mm thick high-permeability alloy sheet with a permeability of not less than 80000 is vertically embedded between each planar spiral coil in the induction detection circuit, reducing the electromagnetic mutual inductance coupling of adjacent detection units to below -40dB. An electromagnetic potential well effect is generated by the fixed gap g formed between the metal wall of the vacuum holding assembly and the planar spiral coils. The processor calculates the electromagnetic potential well effect based on the geometric gain coefficient. The amplitude of the induced voltage is normalized and corrected, where r is the average radius of the coil. Before the material enters the gap, the zero-point self-calibration command of the magnetic balance reference circuit is triggered, and the initial phase difference of the current ambient temperature is collected. And it is removed from subsequent load signals so that the target phase angle offset drift is less than 0.1% during a continuous 24-hour operation.

[0030] Example 1: In a high-speed automated manufacturing scenario targeting the shielding layer of a Beidou intelligent electronic module, the manufacturing environment is subject to electromagnetic pulse interference generated by a high-power inverter welding power supply, causing irregular phase distortion in the signal envelope received by the measuring equipment. The induction detection unit is deployed along the manufacturing path of the component carrier. It uses a symmetrical physical structure composed of a measurement induction branch and a balance compensation branch to receive high-frequency electromagnetic excitation with a center frequency of 400kHz. The measurement induction branch is used to couple the induced magnetic field generated by the shielding layer under test. The balance compensation branch synchronously collects common-mode stray electromagnetic characteristics in the environment under no-load conditions. The processor extracts the original phase offset Δθ of the loaded induction signal output by the measurement induction branch relative to the excitation source and continuously monitors the energy loss slope difference between the induction detection circuit and the magnetic balance reference circuit under the operating environment.

[0031] Because the external electromagnetic pulse modulates the symmetrically distributed measurement induction branch and the balance compensation branch in the same direction, the processor uses the energy loss slope difference as a real-time gain adjustment factor. It performs a normalized ratio operation between the original phase offset Δθ and this slope difference, and calculates the instantaneous phase correlation factor between the two branches. This achieves the cancellation of environmental interference components, including the instantaneous phase correlation factor. The calculation formula is as follows: ,in, For instantaneous phase correlation factor, To measure the phase of the output current of the induction branch, To balance the output current phase of the compensation branch; since the amplitude-frequency fluctuation of the excitation source is stripped as a common-mode component in the ratio calculation, the phase angle disturbance generated by the shielding layer to the electromagnetic field can be isolated from environmental noise, so that the system can control the phase measurement deviation caused by environmental noise within 0.1% without changing the physical shielding strength of the manufacturing environment; the system uses the corrected target phase angle offset to map the consistency control parameters of the shielding layer, and calculates the physical thickness parameter d of the shielding layer in real time according to the preset parameter mapping model. The calculation formula of the physical thickness parameter d is as follows: Where d is the physical thickness parameter, k is a proportionality coefficient related to the shielding layer material and work hardening degree, and Δθ is the target phase angle offset. The reference phase angle is the standard thickness; the calculated physical thickness parameter d is fed back to the press-fit stroke controller at the packaging station in real time to dynamically adjust the feed amount of the servo motor, so that the thickness deviation of the shielding layer in a strong electromagnetic interference environment is maintained within the process tolerance of 5μm, ensuring that the RF shielding performance of the Beidou intelligent electronic module meets the preset impedance matching standard.

[0032] Example 2: In the experimental verification of the controlled parameters for the consistency of shielding layer thickness during the manufacturing process of Beidou intelligent electronic modules, a high-speed conveyor line built on the component carrier was used. The original input data used in the experiment was collected from the induction detection unit deployed below the conveyor path. The inductance of the induction detection circuit and the magnetic balance reference circuit were both set to 10μH, the magnetic isolation of the mutual inductance weakening structure was set to 40dB, and the sampling frequency of the signal acquisition system was set to 10MHz. This parameter setting takes into account the balance between the phase resolution requirement and the real-time calculation load of the back-end processor. When the center frequency of the high-frequency electromagnetic excitation source is at a typical operating condition of 400kHz, in order to ensure that the phase angle offset measurement accuracy is better than 0.01rad, the sampling frequency tends to be 25 times the excitation frequency to ensure the capture of the phase characteristics of the high-frequency waveform. The test environment was injected with Gaussian white noise with a signal-to-noise ratio of 20dB by the signal generator, and superimposed with power frequency harmonic interference with a frequency of 50Hz and an amplitude of 15% of the excitation signal. The test groups included the test group, control group A, control group B, and control group C. The experimental group adopted the symmetrical loop quotient compensation method provided in the aforementioned specific implementation method. Control group A removed the magnetic balance reference loop and used single-loop measurement. Control group B used the same symmetrical structure, but set the excitation frequency to 200kHz, which is lower than the lower limit specified in this invention. Control group C used the complete loop, but increased the material temperature from 25℃ to 95℃ without temperature compensation. During the simulated welding pulse interference stage, the original phase offset obtained by control group A showed that its measurement standard deviation increased from 0.002rad under static conditions to 0.085rad, corresponding to a thickness discrimination deviation of 15.2%. The experimental group used the magnetic balance reference loop to monitor the energy loss slope difference and performed a normalized ratio calculation between the original phase offset Δθ and the slope difference. The obtained target phase angle offset fluctuation standard deviation converged to 0.005rad. This data proves that the common-mode suppression effect generated by the symmetrical loop eliminates the physical layer interference of electromagnetic noise on thickness feature extraction, keeping the deviation of the measurement results within 0.9% under strong interference environment.

[0033] Gradient temperature rise verification showed that as the temperature of the shielding layer material linearly increased from 25℃ to 85℃, the thermal fluctuation of conductivity in control group C caused a positive drift of 18.4% in the thickness parameter d, reflecting the nonlinear coupling between the thickness parameter and the temperature effect. The experimental group initiated a dual-frequency time-sharing reuse procedure and calculated the phase angle generated by the high-frequency surface induced magnetic field. Phase angle generated by low-frequency penetrating induced magnetic field The difference is used to extract the temperature compensation operator λ. The formula for calculating the temperature compensation operator λ is as follows: Where λ is the temperature compensation operator. For the reason The induced phase angle generated by the kHz excitation source For the reason The induced phase angle generated by the kHz excitation source, β being the phase-sensitive conversion coefficient, after executing the compensation logic, the thickness deviation of the experimental group at 85℃ converged to 1.1%, confirming that the operator stripped away the pseudo-impedance signal caused by the thermal motion of the metal. When the thickness of the shielding layer material deviates from the standard value by more than 30%, the growth slope of the phase angle offset shows a saturation trend. The experimental group introduced the rate of change of the imaginary part of impedance into the parameter mapping model, corrected the proportional coefficient k, and the calculation formula for the physical thickness parameter d is as follows: Where d is the physical thickness parameter in mm, k is the scaling factor, and Δθ is the target phase angle offset. Using the reference phase angle corresponding to the standard thickness, test data shows that within the range of 0.1 mm to 1.0 mm, the measurement linearity of the test group is [missing information]. The deviation reached 0.998. In the control group B, at a frequency of 200kHz, the measurement deviation surged from 0.8% in the experimental group to 9.4% because the skin depth exceeded the physical size of the shielding layer.

[0034] Example 3: This example combines Figures 1 to 2 The method for measuring parameters used in the manufacturing of Beidou intelligent electronic modules is explained, such as... Figure 1 As shown, the logical flow of the parameter measurement method begins with driving an induction detection unit using a high-frequency electromagnetic excitation source, which is marked as being placed below the manufacturing process path. The process is divided into two parallel signal acquisition and processing paths. The left path, through the induction detection loop located in the shielding layer region of the electronic configuration under test, synchronously acquires the loaded induction signal and extracts the original phase offset relative to the excitation source. The right path, through a symmetrically arranged or mirrored inductance matrix magnetic balance reference loop, synchronously acquires the no-load balance reference signal and monitors the energy loss slope difference including real-time common-mode rejection. The two paths converge in the quotient calculation step to eliminate the phase angle jump caused by excitation envelope distortion, thereby obtaining the target phase angle offset characterizing the physical thickness of the shielding layer. Finally, through a parameter mapping model including a dielectric constant correction term, consistent controlled parameters such as the physical thickness of the shielding layer and surface resistivity are output.

[0035] like Figure 2 As shown, the system functional architecture of this method is centered on the processing logic connected to the terminal of the automated production line. The core logic includes two main nodes: performing shielding layer parameter measurement and calculating the target phase angle offset to eliminate excitation distortion. To the right of the core logic, five basic operation modules are connected by dashed lines: synchronously acquiring loaded and unloaded reference signals, generating an induced magnetic field using an induction detection unit, monitoring the energy loss slope difference, controlling parameters for image consistency, and extracting the original phase offset. Above the core logic, a third-order harmonic detection function for evaluating the quality of the folded edge area is extended. Below the core logic, a material attitude correction function based on waveform asymmetry and a temperature compensation function based on frequency domain response are connected respectively.

[0036] Example 4: In the manufacturing monitoring of the shielding layer consistency of high-precision Beidou intelligent electronic modules, the difference in extrusion stress experienced by the conductive polymer substrate during the cold stamping stage causes irregular fluctuations in the degree of work hardening within the material. This change in surface structure alters the effective magnetic permeability of the material, causing a drift in the proportional coefficient in the thickness calculation path, resulting in a systematic deviation of more than 8% in the physical thickness parameters. To handle the fluctuations in the material's physical properties, the system executes a parameter calibration procedure at the initial stage when the material enters the sensing area of ​​the sensing unit. A high-frequency electromagnetic excitation source applies pulse excitation to the shielding layer, and the processor captures the impedance response curve output by the sensing detection circuit. The processor then extracts the slope of the imaginary part of the impedance response curve as a function of frequency, i.e., the rate of change of the imaginary part of the impedance. The slope is used to characterize the work hardening degree of the current material; the processor calculates the real-time correction operator η based on the preset material-effect correlation model, and the calculation formula of the correction operator η is as follows: Where η is the real-time correction operator, and α is the material stress sensitivity coefficient, obtained by offline comparison of standard samples with known hardness gradients, with a value ranging from 0.15 to 0.25. This represents the rate of change of the imaginary part of the measured impedance. Using the baseline imaginary response slope, the initial scaling factor is weighted by the real-time correction operator η to obtain the real-time scaling factor under the current working condition, so that the thickness calculation path internalizes the changes in the physical state of the material surface.

[0037] To address the stability requirements of the measurement reference in dynamic environments, the system employs an in-situ zero-point acquisition procedure to determine the reference phase angle. At the beginning of each production cycle in the manufacturing process, before the component carrier has carried the material into the inspection station, the processor initiates the self-calibration command of the magnetic balance reference circuit to collect the initial phase difference between the magnetic balance reference circuit and the induction detection circuit under no-load conditions. Retrieve the impedance vector characteristics corresponding to the preset standard thickness sample and compare it with the initial phase difference. Perform vector superposition operations to dynamically update the reference phase angle in the current manufacturing environment. This eliminates the change in inductance of the detection coil caused by temperature drift inside the vacuum holding assembly, locking the starting anchor point of the thickness inversion logic on the current physical baseline. The sensing unit is integrated inside the vacuum holding assembly. Utilizing the electromagnetic boundary effect generated by the metal wall, the system introduces a geometric gain coefficient γ to compensate for the measurement of magnetic flux density. Since the spatial gap g between the metal wall of the vacuum holding assembly and the induction coil is a fixed value, the processor calculates the magnetic flux density according to the formula... The geometric gain coefficient γ is determined, where e is the natural constant, g is the spatial gap, and r is the average radius of the induction coil. The processor normalizes the target phase angle offset by dividing it by the geometric gain coefficient γ, thus eliminating the influence of external mechanical structures on the amplitude enhancement of the induction signal. This is achieved through dynamic correction of the scaling factor and the reference phase angle. With real-time updates, the system reduces the physical thickness perception error of the shielding layer to within 0.5% under fluctuating material properties, ensuring that the radio frequency impedance characteristics of the Beidou intelligent electronic module are physically consistent during assembly.

[0038] Example 5: In a manufacturing scenario where the conductive polymer substrate model is changed, the system executes an offline calibration process to establish a complex impedance gradient model. Twelve test samples with gradient thicknesses are selected, covering a physical thickness range of 0.1mm to 1.2mm with a step size of 0.1mm. Under controlled conditions where the ambient temperature is maintained at 25℃ and there is no external electromagnetic pulse interference, the sensing unit collects the original phase shift data of each sample at an excitation frequency of 400kHz. A nonlinear regression algorithm is used to fit the original phase shift to a known physical thickness, establishing a complex impedance gradient model stored in the processor's memory unit. The measured phase value corresponding to the standard design thickness is extracted as a reference phase angle for real-time calculation in subsequent production cycles. .

[0039] When the manufacturing system changes the batch of conductive polymer substrate or adjusts the cold stamping die process parameters, the system initiates a pre-calibration process to determine the material stress sensitivity coefficient α. Standard annealed samples and stamped samples from the same batch are selected as a comparison calibration group. The inductive detection unit captures the impedance response curves of the two types of samples under the same high-frequency electromagnetic excitation and extracts the rate of change of the imaginary part of the impedance. The rate of change of the imaginary part of the impedance of the stamped sample is then calculated. The slope of the imaginary part response relative to the standard annealed material reference The normalized deviation, the processor according to the formula Calculate the real-time correction operator η, where η is the real-time correction operator and α is the material stress sensitivity coefficient. This represents the rate of change of the imaginary part of the measured impedance. As the reference imaginary response slope, the initial phase difference of the current manufacturing station is acquired using a magnetic balance reference loop. This is then superimposed on the target phase angle offset to eliminate thermal drift of the manufacturing equipment, keeping the measurement deviation of the physical thickness of the shielding layer within 5μm.

[0040] Example 6: In the on-site deployment scenario of the induction detection unit in the Beidou intelligent electronic module production line, the vertical displacement fluctuation within a range of 0.2mm caused by mechanical wear of the conveyor track changes the spatial gap between the shielding layer and the induction detection unit, causing nonlinear disturbances in the magnetic flux coupling gain. The processor executes a geometric attitude self-calibration procedure to determine the permeability gain compensation matrix. This procedure drives the calibration bracket to perform a vertical displacement with a step amount of 0.5mm within a gap range of 2.0mm to 5.0mm under the unloaded state of the conveyor track, simultaneously collecting the reference induced electromotive force amplitude output by the induction detection unit at each position, and establishing a compensation model based on the exponential decay relationship between the measured electromotive force and the spatial gap g. This model is used to calculate the gain correction operator for lift-off height fluctuations. Gain correction operator The calculation formula is as follows: ,in, This is the gain correction operator, where g is the current measured spatial clearance in mm. To design a standard gap, the unit is mm, and τ is an attenuation constant related to the coil geometry; the processor will calculate the obtained gain correction operator. The data is stored in memory for real-time amplitude gain offsetting during online measurement, thus separating the gain coupling effect of height fluctuations on the thickness inversion path.

[0041] When transient magnetic pulse interference generated by servo motors in the manufacturing workshop causes the background noise amplitude to exceed 10% of the excitation signal, the processor executes a logic switching program based on the signal-to-noise ratio (SNR) threshold to handle the abnormal operating condition. This program extracts the instantaneous SNR of the load-inducing signal in real time and compares it with a preset signal quality threshold. The comparison is made, where the signal quality threshold is... The value was set to 15dB, determined by measuring three times the standard deviation of the noise floor variance of the inductive branch under electromagnetic interference shielding conditions; if the detected SNR is lower than... The processor automatically switches the signal acquisition mode from wideband acquisition to narrowband tracking and filtering mode, sets the cutoff frequency of the digital filter within ±50Hz of the center point of the excitation frequency, and increases the cumulative sampling period of pulse excitation from 512 to 2048 to suppress random noise through time integration effect. In this mode, if the standard deviation of the phase angle offset still exceeds 0.01rad in 5 consecutive production cycles, it is determined that there is physical edge damage to the shielding layer, and an abnormal identification code is sent to the subsequent workstation and the feed stroke of the servo motor is locked, so that the system maintains the stability of the parameter sensing path through adaptive adjustment of algorithm weights.

[0042] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A parameter measurement method for manufacturing BeiDou intelligent electronic modules, characterized in that, Includes the following steps: Step S101: In the manufacturing process of the component carrier, a high-frequency electromagnetic excitation source is used to drive an induction detection unit arranged below the manufacturing process to generate an induction magnetic field in the shielding layer area of ​​the electronic configuration to be tested; the induction detection unit includes an induction detection circuit and a magnetic balance reference circuit arranged symmetrically with the induction detection circuit. Step S102: Simultaneously acquire the loaded induction signal output by the induction detection circuit and the unloaded balance reference signal output by the magnetic balance reference circuit. Step S103: Extract the original phase offset of the loaded induction signal relative to the high-frequency electromagnetic excitation source, and monitor in real time the energy loss slope difference between the loaded induction signal and the unloaded balance reference signal under the high-frequency electromagnetic excitation source operating environment. Step S104: Calculate the quotient of the original phase offset and the energy loss slope difference to eliminate the phase angle jump caused by the excitation envelope distortion and obtain the target phase angle offset characterizing the physical thickness of the shielding layer. Step S105: Based on the preset parameter mapping model, the target phase angle offset is mapped to the consistency control parameter of the shielding layer of the electronic configuration under test.

2. The parameter measurement method for manufacturing Beidou intelligent electronic modules according to claim 1, characterized in that, The induction detection circuit and the magnetic balance reference circuit are arranged in a mirror inductor matrix. When the high-frequency electromagnetic excitation source generates transient power jitter, the energy loss slope difference is obtained by comparing the rate of change of the current envelope of the induction detection circuit and the magnetic balance reference circuit in the same excitation pulse period, so as to realize real-time common-mode suppression of the target phase angle offset.

3. The parameter measurement method for manufacturing Beidou intelligent electronic modules according to claim 1, characterized in that, The temperature compensation step based on frequency domain response difference is included: Step S301, using time-division reusability, high-frequency surface induced magnetic field and low-frequency penetration induced magnetic field are alternately emitted to detect the induced current response of the shielding layer at different skin depths. Step S302: Calculate the temperature compensation operator used to characterize the effect of heat accumulation. The calculation rules are as follows: ,in, The induced phase angle is generated by the excitation of a high-frequency surface-induced magnetic field. β is the induced phase angle generated by the low-frequency penetrating induced magnetic field excitation, and β is the preset phase sensitivity conversion coefficient for the shielding layer material; in step S303, the target phase angle offset is corrected by the temperature compensation operator λ to eliminate parameter drift caused by heat accumulation in the manufacturing environment during the electronic packaging process.

4. The parameter measurement method for manufacturing Beidou intelligent electronic modules according to claim 1, characterized in that, It also includes a quality evaluation step performed on the edge region of the shielding layer of the electronic configuration under test: Step S401, extract the third harmonic phase hysteresis characteristics in the load-inducing signal; Step S402: Monitor the distortion characteristics of eddy currents around the edge region of the shielding layer under the excitation of a rotating alternating magnetic field; Step S403: Combine the phase lag characteristics of the third harmonic with the distortion characteristics of the eddy current flow to determine whether there are physical continuity defects at the shielding layer interface.

5. The parameter measurement method for manufacturing Beidou intelligent electronic modules according to claim 1, characterized in that, While performing step S101, material attitude correction is performed through the sensing detection circuit: Step S501, extract the transient voltage rise waveform of the sensing detection circuit at the initial stage of excitation; Step S502, based on the asymmetry of the leading and trailing edges of the transient voltage rise waveform, invert the geometric tilt angle of the shielding layer relative to the sensing detection unit; Step S503, compensate the phase gain value of the target phase angle offset according to the geometric tilt angle.

6. The parameter measurement method for manufacturing Beidou intelligent electronic modules according to claim 1, characterized in that, The center frequency of the high-frequency electromagnetic excitation source is 300kHz to 500kHz; when the fluctuation value of the no-load balance reference signal exceeds 5%, the output ratio of the locking induction detection circuit is in fixed gain mode.

7. The parameter measurement method for manufacturing Beidou intelligent electronic modules according to claim 1, characterized in that, The shielding layer is made of a conductive polymer substrate; the parametric mapping model includes effective permeability constant correction terms for the conductive polymer substrate under manufacturing packaging pressure.

8. The parameter measurement method for manufacturing Beidou intelligent electronic modules according to claim 1, characterized in that, The inductive detection circuit includes a detection array composed of multiple sets of planar spiral coils. Mutual inductance reduction structures are provided between each set of planar spiral coils to suppress electromagnetic interference between adjacent detection units.

9. A parameter measurement method for manufacturing Beidou intelligent electronic modules according to claim 1, characterized in that, The sensing and detection unit is integrated inside the vacuum holding assembly at the manufacturing station. The metal wall of the vacuum holding assembly is used as the electromagnetic boundary of the sensing magnetic field to improve the measurement of magnetic flux density.

10. A parameter measurement method for manufacturing BeiDou intelligent electronic modules according to claim 1, characterized in that, Consistency-controlled parameters include the physical thickness of the shielding layer and the surface resistivity distribution index.

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