Method for predicting lodging resistance of sesame and application thereof

CN122409955APending Publication Date: 2026-07-17HENAN SESAME RES CENT HENAN ACADEMY OF AGRI SCI +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HENAN SESAME RES CENT HENAN ACADEMY OF AGRI SCI
Filing Date
2026-04-10
Publication Date
2026-07-17

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Abstract

本发明公开了一种预测芝麻抗倒伏性的方法及应用，旨在解决芝麻抗倒伏性鉴定缺乏可靠方法的问题。该方法先搭建封闭玻璃温室并处理土壤，模拟自然风雨环境，再按规范播种芝麻种质并进行风雨模拟处理；于芝麻终花期调查统计倒伏率，按五级标准分级后筛选出无倒伏和轻度倒伏的品系，随后测定其茎秆特定节间的弯拉、抗压强度及第二节间长度、株高等核心指标，通过多指标综合评价筛选高抗倒伏芝麻种质。本方法操作便捷、结果准确，能客观评价芝麻种质抗倒伏性，高效筛选优异抗倒伏种质，为抗倒伏芝麻新品种培育提供重要技术支撑。
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