Tilt exposure apparatus, tilt exposure method, and semiconductor device

Abstract

The application provides a tilt exposure machine, a tilt exposure method and a semiconductor device, and belongs to the technical field of imaging of semiconductor devices. The tilt exposure machine comprises a light source module for providing tilt exposure, a light source adjusting module, a photolithography alignment module, a photolithography plate placing module located below the light path of the photolithography alignment module, and a carrier disc adjusting module. The light source adjusting module is used for supporting and adjusting the incident angle of the light source module, and comprises a tilt platform and a light source adjusting unit connected to the tilt platform. The tilt angle of the tilt platform can be adjusted by the light source adjusting unit. The light source module is detachably connected to the tilt platform. When the tilt platform is in an initial position, the exposure light source emitted by the light source module is at a first tilt angle under the support of the tilt platform. When the tilt angle of the tilt platform is changed by the light source adjusting unit, the angle of the exposure light source emitted by the light source module is synchronously adjusted. The application can improve the flexibility and accuracy of tilt exposure.

Description

Technical Field

[0001] This application relates to the field of semiconductor device imaging technology, and more particularly to a tilt exposure machine, a tilt exposure method, and a semiconductor device. Background Technology

[0002] In the manufacturing process of semiconductor devices, photolithography is one of the core processes, and its precision directly determines the performance and integration level of the devices. As semiconductor technology develops towards higher integration and more complex three-dimensional structures, the need for precise patterning of device sidewalls, especially vertical sidewalls, is becoming increasingly urgent.

[0003] However, achieving high-precision exposure of vertical sidewalls in existing semiconductor processing technologies faces numerous challenges. Traditional tilt exposure equipment typically uses a light source with a fixed tilt angle to pattern the sidewalls of semiconductor devices.

[0004] Some improved devices, in order to enhance the flexibility of sidewall patterning and enable patterning at different positions on the sidewall, design the carrier unit used to place the photomask / disk to be adjustable in position and angle, changing the exposure angle of the light source relative to the sidewall, thereby achieving adjustment of the exposure position on the sidewall of the photomask for better optimization.

[0005] In existing exposure apparatuses, tilt controllers are commonly used to adjust the tilt angle of the platform containing the mask and substrate within a range of -45° to 45°. However, this adjustment method, in order to achieve a wide range of angle adjustments, often results in insufficient adjustment precision. Furthermore, this method typically involves synchronously rotating the mask and semiconductor sample as a whole for angle adjustment. This angle adjustment significantly alters the viewing angle of the microscopic observation optical path, making it difficult to clearly observe the alignment marks between the mask and the sample, causing the alignment reference to shift. This greatly increases the difficulty of accurately aligning the mask and the sample, making it difficult to control the alignment precision, and resulting in a complex alignment process with poor repeatability. Summary of the Invention

[0006] Based on this, the purpose of this application is to provide a new tilt exposure machine, tilt exposure method and semiconductor device to solve at least one technical problem in the prior art.

[0007] In a first aspect, this application provides a tilting exposure machine, comprising: a light source module for providing tilting exposure, a light source adjustment module, a photolithography alignment module, a photolithography plate placement module located below the optical path of the photolithography alignment module, and a carrier plate adjustment module; The light source adjustment module is used to support and adjust the incident angle of the light source module, and includes an inclined platform and a light source adjustment unit connected to the inclined platform. The tilt angle of the inclined platform can be adjusted by the light source adjustment unit. The light source module is detachably connected to the tilting platform. When the tilting platform is in its initial position, the exposure light source emitted by the light source module under the support of the tilting platform is at a first tilt angle. When the tilt angle of the tilting platform is changed by the light source adjustment unit, the angle of the exposure light source emitted by the light source module is adjusted synchronously.

[0008] Optionally, the light source adjustment unit includes a load-bearing platform and an angle adjuster mounted on the load-bearing platform; The tilting platform is fixed to the load-bearing platform by a support, and the angle adjuster adjusts the tilt angle of the tilting platform synchronously by adjusting the angle of the load-bearing platform.

[0009] Optionally, the inclined platform includes an inclined angle support plate and an inclined panel, the bottom edge of the inclined angle support plate is fixed to the support part, and the inclined panel is fixed to the inclined side of the inclined angle support plate. The exposure light source emitted by the light source module is perpendicular to the plane where the inclined panel is located.

[0010] Optionally, the bottom edge is provided with a first alignment portion, and the inclined edge is provided with a second alignment portion; The horizontal bracket of the support part is provided with a first connecting part that matches the first alignment part. By aligning and connecting the first alignment part with the first connecting part, the bottom edge of the inclined angle support plate is fixed on the support part. The inclined panel is provided with a second connecting part that matches the second alignment part. The inclined panel is fixed to the inclined side of the inclined angle support plate by aligning and connecting the second alignment part and the second connecting part. The upper surface of the inclined panel is also provided with a third connecting part that connects to the light source module, and the third connecting part is used to align and fix the light source module.

[0011] Optionally, the tilt angle of the tilting platform is between 30° and 60°; The tilting platform includes multiple tilting platforms, each with a different tilt angle. The first tilt angle formed by connecting different tilting platforms with the light source module is also different.

[0012] Optionally, the photolithography alignment module includes: At least one microscope is fixed to the body by a column; A focusing knob, connected to the at least one microscope drive, is used to adjust the microscope focal length; An angled prism, positioned in front of the lens of at least one microscope, is used to change the direction of light propagation so that the illumination light is projected perpendicularly onto the photomask.

[0013] Optionally, the microscope is vertically mounted on a column and can be rotated horizontally around the column to adjust the observation angle.

[0014] Optionally, the tray adjustment module includes a tray angle adjustment section, a tray fine-tuning section, a tray horizontal rotation section, and a sample tray; The tray angle adjustment unit is used to adjust the tilt angle of the sample supported on the sample tray in the X and Y directions; The carrier plate fine-tuning part is located above the carrier plate angle adjustment part, and is used to achieve precise positioning and fine-tuning of the sample in three-dimensional space; The horizontal rotation section of the carrier disk is located above the fine-tuning section of the carrier disk, and is used to realize the horizontal rotation of the sample. The sample carrier is positioned above the horizontal rotating part of the carrier and is used to directly support the sample to be photolithographically etched.

[0015] Optionally, the bearing surface of the photomask placement module and / or the carrier plate adjustment module has a honeycomb structure and is provided with a vacuum interface, so as to form a negative pressure by vacuuming to adsorb and fix the photomask or sample.

[0016] Optionally, the bearing surface of the photomask placement module is provided with an alignment and positioning structure to place the photomask in a predetermined position.

[0017] A second aspect of this application provides a method for performing tilt exposure using the tilt exposure machine described in any embodiment of this application, the method comprising: Adjust the incident angle between the light source module and the horizontal plane to a preset angle; Adjust the sample tray to a horizontal position; The photomask is placed on the photomask placement system and fixed in place; The photolithography alignment module precisely aligns the photomask with the sample. Remove the photolithography alignment module to avoid the exposure optical path; Turn on the light source module to complete the exposure of the sample.

[0018] In a third aspect, this application provides a semiconductor device having at least one sidewall on which a metallization pattern is formed, the metallization pattern being formed by tilting the sidewall through a tilting exposure machine as described in any embodiment of this application.

[0019] The tilt exposure machine, tilt exposure method, and semiconductor device of this application have the following technical effects: 1. The angle can be flexibly and precisely adjusted: The light source module of this application is set on the tilting stage, so that the exposure light source emitted under the support of the tilting stage itself has a first tilt angle, and the tilt angle of the tilting stage can be adjusted by the light source adjustment unit, thereby adjusting the first tilt angle of the emitted light source accordingly. Furthermore, the light source module and the tilting stage are detachable, so that the tilting stage adapted to the required tilt angle can be flexibly selected according to the actual required tilt angle of exposure, thereby reducing the angle that needs to be adjusted by the light source adjustment unit, reducing the adjustment amount, and improving the adjustment flexibility and accuracy. Moreover, the tray adjustment module of the tilt exposure machine of this application also... It can also adjust the position and angle of the carrier / photomask within a certain range, further improving the flexibility and accuracy of exposure angle adjustment and adapting to the processing needs of different sidewall structures; 2. Reliable support and stable optical path: The inclined table rigidly supports the light source module, which can adjust the incident angle of the light source without shaking or offset under the adjustment of the angle adjuster, ensuring the stability of the exposure beam and improving the pattern consistency; 3. Precise alignment and simple operation: The photolithography alignment module, together with the multi-dimensional adjustable carrier disk adjustment module, achieves high-precision alignment between the photomask and the sample, reduces alignment error, and improves the accuracy of the sidewall pattern; 4. Firm fixation and high yield: Both the photomask and the sample adopt vacuum honeycomb adsorption to ensure flatness and no warping, avoid displacement and deformation, and significantly improve the exposure yield. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation on the scope of this application.

[0021] Figure 1 This is a schematic diagram of the overall structure of the tilting exposure machine in one embodiment; Figure 2 This is a schematic diagram of the structure of the light source adjustment unit in one embodiment; Figure 3 This is a schematic diagram of the photomask placement module in one embodiment; Figure 4 This is a schematic diagram of the sample carrier disk in one embodiment; Figure 5 This is a schematic diagram of the carrier disk adjustment module in one embodiment; Figure 6 This is a schematic diagram of the inclined angle support plate in one embodiment; Figure 7 This is a schematic diagram of the inclined panel in one embodiment; Figure 8This is a schematic diagram illustrating the relationship between the exposure angle of the exposure light source and the tilt angle of the tilting platform in one embodiment. Figure 9 This is a schematic diagram illustrating tilted exposure of a target exposure area of ​​a semiconductor device in one embodiment; Figure 10 This is a schematic diagram illustrating tilted exposure of a target exposure area of ​​a semiconductor device in another embodiment; Figure 11 This is a flowchart illustrating a tilt exposure method in one embodiment.

[0022] The above figures include the following reference numerals: 10. Light source adjustment module; 20. Light source module; 30. Photolithography alignment module; 40. Photolithography plate placement module; 50. Carrier tray adjustment module; 11. Inclined platform; 111. Inclined angle support plate; 111-1. Bottom edge; 111-2. Beveled edge; 111-11. First alignment part; 111-21. Second alignment part; 112. Inclined panel; 112-1. Second connecting part; 112-2. Third connecting part; 112-3. Screw hole; 12. Light source adjustment unit; 12 1. Load-bearing platform; 121-1. Upper load-bearing surface; 121-2. Lower load-bearing surface; 122. Angle adjuster; 122-1. Tilting angle adjustment slide; 122-2. Slide knob; 13. Support part; 131. Vertical bracket; 132. Horizontal bracket; 31. Microscope; 32. Focusing knob; 33. Corner prism; 34. Column; 41. Support bracket; 42. First vacuum port; 43. First honeycomb structure; 44. Alignment and positioning structure; 51. Sample tray; 511. Second honeycomb structure; 512. Second vacuum port; 52. Horizontal rotating part of the tray; 531. X-axis displacement adjustment knob; 532. Y-axis displacement adjustment knob; 533. Z-axis height adjustment knob; 541. X-axis tilting slide adjustment knob; 542. Y-axis tilting slide adjustment knob. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0024] All terms used in this application (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0025] For example, the terms "first," "second," etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For instance, without departing from the scope of this application, a first analytical result may be referred to as a second analytical result, and similarly, a second analytical result may be referred to as a first analytical result. Both the first analytical result and the second analytical result are analytical results, but they are not the same analytical result.

[0026] For example, the terms "comprising" or "including" used in this application indicate the presence of features, steps, operations and / or components, but do not exclude the presence or addition of one or more other features, steps, operations or components.

[0027] In one embodiment, a tilting exposure machine is provided, such as Figures 1 to 10 As shown, the tilting exposure machine includes: a light source adjustment module 10, a light source module 20, a photolithography alignment module 30, a photomask placement module 40, and a carrier plate adjustment module 50. The light source adjustment module 10 provides support and angle control; the light source module 20 is fixed to the light source adjustment module and provides a tilted exposure light source; the photolithography alignment module 30 is located at the optical path output end and is used for alignment observation; the photomask placement module 40 is horizontally arranged below the photolithography alignment module 30 and is used to horizontally support and fix the photomask; the carrier plate adjustment module 50 is located directly below the photomask placement module 40, supports the sample to be exposed, and performs multi-dimensional precise adjustments.

[0028] Specifically, the light source adjustment module 10 provides stable support for the entire device and enables continuous adjustment of the exposure angle. It supports and adjusts the incident angle of the light source module 20. Specifically, it includes a tilting platform 11 and a light source adjustment unit 12 connected to the tilting platform 11. The tilt angle of the tilting platform 11 can be adjusted by the light source adjustment unit 12. The light source module 20 is mounted on the tilting platform 11, and the angle of the emitted exposure light source is adjusted as the tilt angle of the tilting platform 11 changes.

[0029] The inclined platform 11 is located above the light source adjustment unit 12, and is specifically fixed to the upper part of the light source adjustment unit 12 by the support part 13 of the light source adjustment module 10. The inclined platform 11 is detachably connected to the light source module 20, and the connecting part (inclined plate 112) is an inclined plane. The angle between the plane of the connecting part and the horizontal plane is the inclination angle.

[0030] When the tilting platform is in its initial position, the exposure light emitted by the light source module, supported by the tilting platform, is at the first tilt angle. When the tilt angle of the tilting platform is changed by the light source adjustment unit, the angle of the exposure light emitted by the light source module is adjusted synchronously. This initial position can be the position of the tilting platform when it is not adjusted by the light source adjustment unit, for example, the initial position is when the tilting platform is horizontal and positioned at the light source adjustment unit.

[0031] Because the inclined platform 11 has an inclination angle, the light source emitted by the light source module 20 supported on the inclined platform 11 is also inclined. The incident angle of the light source module 20 is the angle between the ray emitted by the light source and the horizontal plane. The size of this inclination angle can be the same as or different from the size of the incident angle of the light source module 20.

[0032] For example, such as Figure 6 and Figure 8 As shown, the inclined angle support plate 111 is a right-angled triangle plate. The light source emitted by the light source module 20 is perpendicular to the hypotenuse 111-2 of the inclined angle support plate 111. Then the sum of the incident angle of the light source (e.g., the first tilt angle θ1) and the tilt angle of the inclined platform (e.g., the angle θ2) is 90°.

[0033] Optionally, the tilt angle of the tilting table 11 is between 30° and 60°. For example, the tilt angle support plate 111 / tilting table 11 can be set to standard angles such as 30°, 35°, 40°, 45°, 50°, and 60°. For example, a 45° tilt angle support plate 111 can be used to facilitate angle calculation and process matching.

[0034] Correspondingly, the tilting exposure machine can be equipped with multiple tilting stages, each with a different tilt angle. The resulting initial tilt angle formed by connecting different tilting stages to the light source module will also differ. Operators can assemble tilting stages with appropriate tilt angles according to actual needs, ensuring that the initial tilt angle θ1 of the tilting exposure machine is close to the target tilt angle required during actual operation (e.g., ...). Figure 9 The tilt angle θ3 and Figure 10 The tilt angle θ4 in the image can reduce the amount of subsequent adjustment required for the incident angle of the light source and / or the position and angle of the carrier / photoplate.

[0035] Taking the sum of the first tilt angle θ1 and the tilt angle of the tilted platform as 90° as an example, referencing... Figure 9 For the target area to be exposed, if the target tilt angle θ3 is set to 30°, then a tilting platform with a standard angle of 60° can be selected; refer to Figure 10 If the target tilt angle θ4 is set to 45° for the target area to be exposed, then a tilting platform with a standard angle of 45° can be selected.

[0036] The light source adjustment unit 12 can adjust the tilt angle of the tilting platform 11, thereby adjusting the incident angle of the light source. Specifically, as shown... Figure 1 and Figure 2 As shown, the light source adjustment unit 12 includes a support platform 121 and an angle adjuster 122 mounted on the support platform 121. The tilting platform 11 is fixedly mounted on the support platform 121 by the support part 13 of the light source adjustment module 10, and the angle adjuster 122 adjusts the tilt angle of the tilting platform 11 synchronously by adjusting the angle of the support platform 121.

[0037] The load-bearing platform 121 is used to support the inclined platform 11. Specifically, it may include a lower load-bearing surface 121-2 and an upper load-bearing surface 121-1. Both the lower load-bearing surface 121-2 and the upper load-bearing surface 121-1 are rigid flat plates. An angle adjuster 122 is installed between the lower load-bearing surface 121-2 and the upper load-bearing surface 121-1. The support part 13 is a rigid connection structure to ensure the relative position stability between the inclined platform 11 and the load-bearing platform 121. The support part 13 may include a vertical bracket 131 and a horizontal bracket 132. The vertical bracket 131 may be a column vertically installed on each edge of the upper load-bearing surface 121-1. For example, the vertical bracket 131 includes columns installed at the four corners of the upper load-bearing surface 121-1 by screws. The four columns are of the same height. The horizontal bracket 132 may include two parallel and horizontal columns, which are respectively installed on the tops of two adjacent columns.

[0038] In one embodiment, such as Figure 1 As shown, the inclined platform 11 includes an inclined angle support plate 111 and an inclined panel 112. The bottom edge of the inclined angle support plate 111 is fixed on the support part 13, and the inclined panel 112 is fixed on the inclined side of the inclined angle support plate 111. The exposure light source emitted by the light source module 20 is perpendicular to the plane where the inclined panel 112 is located.

[0039] The bottom edge of the inclined angle support plate 111 is fixed on the support part 13 and is rigidly connected to the support part 13. It can rotate synchronously with the support part 13. The inclined plate 112 is fixedly installed on the inclined side of the inclined angle support plate 111. The two are detachably connected or fixedly connected, which makes it easy to replace the inclined angle support plate 111 with different angle specifications according to process requirements.

[0040] The tilt angle support plate 111 can be a triangular plate, such as a right-angled triangular plate, and can also include two plates, each tilt angle support plate 111 being fixedly mounted on a horizontal bracket 132. The inclined plate 112 can be a flat plate, which is fixed on the inclined sides of the two tilt angle support plates 111, thereby forming an inclined surface. The angle between the inclined side and the bottom side of the tilt angle support plate 111 is the tilt angle of the tilt platform 11. When the tilt platform is not adjusted by the light source adjustment unit, its bottom side is usually parallel to the horizontal plane. At this time, the tilt platform is in its initial position, and its tilt angle is the initial tilt angle (denoted as the second tilt angle θ2). The corresponding exposure light source is in the first tilt angle θ1, which is also the initial incident angle of the light source module 20.

[0041] In one embodiment, such as Figure 6 and Figure 7 As shown, the bottom edge 111-1 of the inclined angle support plate 111 is provided with a first alignment part 111-11, and the inclined side 111-2 of the inclined angle support plate 111 is provided with a second alignment part 111-21; the horizontal bracket 132 of the support part 13 is provided with a first connecting part that matches the first alignment part, and the bottom edge of the inclined angle support plate is fixed on the support part by aligning and connecting the first alignment part and the first connecting part; the inclined panel 112 is provided with a second connecting part 112-1 that matches the second alignment part 111-21, and the inclined panel is fixed on the inclined side of the inclined angle support plate by aligning and connecting the second alignment part and the second connecting part; the upper surface of the inclined panel 112 is also provided with a third connecting part 112-2 that connects to the light source module, and the third connecting part 112-2 is aligned and fixed to the light source module.

[0042] Specifically, the inclined angle support plates can be arranged in pairs, with each inclined angle support plate connected to a horizontal bracket of the support portion. The first aligning portion on the bottom edge can have multiple (e.g., Figure 6 The three holes shown can be screw holes or any other suitable holes. The horizontal support has a first connecting part at the corresponding position. The number of the first connecting parts is the same as the number of the first alignment parts. The first connecting part can be a protruding post. The two structures are coupled together. The first connecting part can be inserted into the corresponding first alignment part, thereby realizing the detachable connection between the tilt angle support plate and the support part.

[0043] The second aligning part of the hypotenuse is similar to the first aligning part; it can also have multiple parts (e.g., ...). Figure 6The three holes shown can specifically be screw holes. The inclined panel has a second connecting part at the corresponding position. The number of second connecting parts is the same as the number of second aligning parts. The second connecting parts and the screw holes have matching protrusions, and their structures are coupled. The first connecting part can be inserted into the corresponding first aligning part, thereby achieving a detachable connection between the inclined angle support plate and the inclined panel. Alternatively, the second aligning part can also be a screw hole, and a matching screw passes through the second connecting part and the second aligning part to achieve a fixed connection between the inclined angle support plate and the inclined panel.

[0044] The third connecting part 112-2 of the inclined panel 112 can be a groove or a through hole. The bottom of the light source module is provided with a protrusion into which the third connecting part can be inserted, thereby realizing the alignment and connection between the two. Multiple screw holes 112-3 can be provided around the third connecting part 112-2, and the light source module can be fixed by screws.

[0045] like Figure 2 As shown, the angle adjuster 122 adopts a structure in which a tilt angle adjustment slide 122-1 and a slide knob 122-2 cooperate. By manually rotating the knob, the slide is moved, thereby adjusting the angle of the load-bearing platform 121. This allows the tilted platform 11 to adjust its angle synchronously with the load-bearing platform 121, with no lag or slippage during the adjustment process and precise angle transmission. The upper load-bearing surface 121-1 has a hollowed-out notch, which allows for manual adjustment of the angle adjuster 122 through the notch, thereby adjusting the tilt angle of the upper load-bearing surface 121-1 and consequently adjusting the incident angle of the light source module 20.

[0046] The angle adjuster 122 can adjust the angle range to any suitable range, such as -10° to 10°. For example, if the initial incident angle of the light source module 20 is 45°, the angle adjuster 122 can adjust the incident angle of the light source to any angle range between 35° and 55°.

[0047] The light source module 20 is fixedly mounted on the inclined panel. The exposure light source emitted by the light source module 20 is perpendicular to the plane of the inclined panel, which makes the exposure beam direction stable and the optical path highly consistent. When the angle of the inclined angle support plate 111 changes, the angle of the inclined panel changes synchronously, and the emission angle of the light source module 20 changes precisely accordingly, thereby realizing exposure of the semiconductor sidewall at different angles.

[0048] Specifically, in the light source adjustment unit 12: the vertical support 131 and the horizontal support 132 are connected to each other to form the basic support frame of the device; the upper load-bearing surface 121-1 is fixed on the vertical support 131, forming a layered load-bearing structure with the lower load-bearing surface 121-2; the tilt angle adjustment slide 122-1 is installed on the lower load-bearing surface 121-2, and a slide knob 122-2 is provided. Relevant personnel can adjust the slide knob 122-2 from the notch of the upper load-bearing surface 121-1 to drive the slide to achieve displacement adjustment, thereby changing the tilt angle of the upper load-bearing surface 121-1; the tilt angle of the tilting platform 11 changes with the angle of the upper load-bearing surface 121-1, thereby causing the incident angle of the light source to change.

[0049] In one embodiment, the light source module 20 is fixedly mounted on the inclined stage 11 and deflects synchronously with the inclined stage 11 to adjust the incident angle of the exposure light source. The light source module 20 includes a protective housing and a built-in light source; the protective housing is a closed protective structure, fixed to the inclined stage 11 to prevent dust and vibration interference; the built-in light source is encapsulated in the housing, with its light output end facing the photolithography alignment module 30, enabling it to output a uniform and stable parallel exposure beam. When the angle of the inclined stage 11 changes, the built-in light source tilts synchronously, thereby changing the incident angle of the exposure light relative to the horizontal plane.

[0050] In one implementation, the photolithography alignment module 30 is used to achieve high-precision optical alignment between the photomask and the sample, ensuring the positional accuracy of the exposure pattern. The photolithography alignment module 30 is located at the optical path output end of the light source module 20 and is used for optical alignment observation between the photomask and the sample. Figure 1 As shown, it includes a microscope assembly, a focusing knob 32, and a corner prism 33. The microscope assembly includes at least one microscope 31, which is fixed to the body by a column 34 and used to observe alignment marks; the focusing knob 32 is connected to the microscope assembly for driving and adjusting the focal length; the corner prism 33 is arranged in front of the lens of the microscope 31 to change the direction of light propagation, so that the illumination light is projected perpendicularly onto the photoresist plate, thereby improving the alignment clarity.

[0051] The microscope assembly specifically includes a first microscope and a second microscope, each fixed to the main body by a column. Each microscope is fixedly mounted on the main body by a column to maintain a stable observation height and position. A focusing knob 32 is located below the lens of microscope 31, and the focusing knob 32 is drivenly connected to the microscope barrel of microscope 31. By rotating the focusing knob 32, the focal length of microscope 31 can be continuously adjusted, enabling microscope 31 to clearly image the alignment marks on the photoresist plate and the alignment reference on the sample surface. A corner prism 33 is located in front of the lens of microscope 31. The incident surface of the corner prism 33 is set at a predetermined angle to the optical axis of microscope 31, used to change the propagation direction of the illumination light, so that the light is projected vertically downwards onto the surface of the photoresist plate and the sample surface, thereby achieving vertical illumination alignment, avoiding imaging deviations caused by oblique illumination, and shortening the optical path distance between the light source output port and the photoresist plate carrier, improving the compactness of the equipment structure.

[0052] Specifically, each microscope 31 is vertically mounted on a column 34 and can rotate horizontally around the column 34 to adjust the observation angle. The microscope 31 is vertically mounted on the column 34 via a sliding or snap-fit ​​structure, and its height can be finely adjusted up and down along the column 34 to accommodate photolithography plates and samples of different thicknesses. Simultaneously, the mounting base of the microscope 31 can rotate 360° horizontally around the column 34, allowing free adjustment of the observation orientation and angle. This enables alignment with the alignment marks on the photolithography plate and sample from different directions, meeting the needs of multi-angle and multi-position alignment observation and improving the flexibility and adaptability of photolithography alignment. After alignment, the microscope 31 can be horizontally rotated out of the exposure light path to avoid blocking the exposure light.

[0053] In one embodiment, the photomask placement module 40 is located directly below the optical path of the photolithography alignment module 30, and is used to horizontally support and fix the photomask. The supporting surface of the photomask placement module 40 has a honeycomb structure and is provided with a first vacuum port 42, which forms a negative pressure by evacuating to adsorb and fix the photomask.

[0054] Among them, such as Figure 3 As shown, the photomask placement module 40 includes a support bracket 41 and a first vacuum interface 42. The lower end of the support bracket 41 is fixed to the carrier plate adjustment module 50, and the upper end is used to place the photomask. The middle area of ​​the support bracket 41 is the bearing surface of the photomask, which has a first honeycomb structure 43. The internal flow channels are connected to the first vacuum interface 42, and the photomask is flattened and firmly fixed by negative pressure adsorption. The edge of the bearing surface of the support bracket 41 is provided with one or more alignment and positioning structures 44 for abutting against the photomask, so that the photomask is in a predetermined position. For example, the alignment and positioning structure 44 specifically includes two alignment angles and one alignment protrusion.

[0055] In one embodiment, the carrier plate adjustment module 50 is located directly below the photomask placement module 40, and is used to support the sample and perform multi-degree-of-freedom precision adjustments. Figure 4 and Figure 5 As shown, the tray adjustment module 50 adopts a multi-layered, step-by-step adjustment structure, including: a tray angle adjustment section, a tray fine-tuning section, a tray horizontal rotation section 52, and a sample tray 51. The tray angle adjustment section, tray fine-tuning section, tray horizontal rotation section, and sample tray can be stacked sequentially from bottom to top, or any other suitable assembly. Taking the bottom-to-top stacking as an example: The tray angle adjustment unit is located at the bottom layer. It is used to independently adjust the X-axis angle tilt slide adjustment knob 541 for tilting the sample plane in the X direction and the Y-axis angle tilt slide adjustment knob 542 for tilting the sample plane in the Y direction, so that the sample surface is kept parallel to the photomask and the tilt deviation caused by installation error is eliminated.

[0056] A carrier plate fine-tuning part is stacked above the carrier plate angle adjustment part. The carrier plate fine-tuning part is equipped with an X-axis displacement adjustment knob 531, a Y-axis displacement adjustment knob 532, and a Z-axis height adjustment knob 533, which can respectively realize the horizontal displacement adjustment of the X-axis and Y-axis and the height adjustment of the Z-axis, thereby accurately positioning the sample to the preset alignment position in three-dimensional space.

[0057] A horizontal rotating part 52 for the carrier disk is provided above the carrier disk fine-tuning part. It can drive the sample carrier disk to rotate and adjust in the horizontal plane to correct the rotation deviation of the sample and make the pattern direction on the sample completely consistent with the photomask.

[0058] The sample carrier tray 51 is fixedly installed on the upper end of the carrier tray horizontal rotation part 52, and is used to directly support and fix the sample to be photolithographic, so as to ensure that the sample maintains a stable position during adjustment and exposure.

[0059] The carrier surface of the carrier plate adjustment module (i.e., the carrier surface of the sample carrier plate) also has a second honeycomb structure 511 and is provided with a second vacuum port 512. A negative pressure is formed by vacuuming to adsorb and fix the sample. The carrier plate angle adjustment is used to adjust the carrier plate to a horizontal position; the carrier plate fine adjustment part realizes three-dimensional displacement fine adjustment; the carrier plate horizontal rotation part 52 realizes the fine adjustment of the horizontal angle of the sample, ensuring precise alignment with the photomask.

[0060] For tray leveling: Place the level on the sample tray and adjust the X-axis tilt slide adjustment knob 541 and the Y-axis tilt slide adjustment knob 542 to keep the sample tray level. For photomask fixation: Place the photomask in the photomask placement module 40 and activate vacuum adsorption fixation; align the photomask alignment marks with the microscope group and corner prism 33 in the photolithography alignment module 30 and focus clearly. For sample clamping and alignment: Place the sample to be exposed on the sample tray and activate vacuum adsorption fixation; use the tray fine-tuning part and the tray horizontal rotation part 52 to precisely align the sample marks with the photomask marks. For exposure: Remove the microscope group to avoid the light path, turn on the built-in light source, and expose the vertical sidewall of the sample at the set tilt angle to complete the sidewall pattern creation.

[0061] The tilting exposure machine in this application has the following technical advantages: 1. Adjustable and Precise Angle Adjustment: The light source adjustment module can precisely and continuously adjust the angle of the tilting stage, allowing the incident angle of the exposure light source to be set as needed. This solves the problem that traditional equipment cannot achieve controllable tilt exposure and adapts to the processing requirements of different sidewall structures. Specifically, the light source module in this application is set on the tilting stage, so that the exposure light source emitted under the support of the tilting stage itself has a first tilt angle. The tilt angle of the tilting stage can be adjusted by the light source adjustment unit, thereby adjusting the first tilt angle of the emitted light source accordingly. Furthermore, the light source module and the tilting stage are detachable, allowing for flexible selection of a tilting stage that matches the required tilt angle according to the actual exposure tilt angle. This reduces the angle that needs to be adjusted by the light source adjustment unit, decreases the adjustment amount, and improves the flexibility and accuracy of adjustment. Moreover, the tray adjustment module of the tilting exposure machine in this application can also adjust the position and angle of the tray / photomask within a certain range, further improving the flexibility and accuracy of exposure angle adjustment.

[0062] 2. Reliable support and stable optical path: The inclined platform rigidly supports the light source module, which can adjust the incident angle of the light source without shaking or offset under the adjustment of the angle adjuster, ensuring the stability of the exposure beam and improving the consistency of the pattern.

[0063] 3. Precise alignment and easy operation: The photolithography alignment module, together with the multi-dimensional adjustable carrier disk adjustment module, achieves high-precision alignment between the photolithography plate and the sample, reduces alignment error, and improves the accuracy of the sidewall pattern.

[0064] 4. Securely fixed and high yield: Both the photomask and the sample are vacuum honeycomb adsorption to ensure flatness and no warping, avoid displacement and deformation, and significantly improve the exposure yield.

[0065] In one embodiment, a method for performing tilt exposure using a tilt exposure machine is provided, such as... Figure 11As shown, it includes the following steps: S1: Adjust the incident angle between the light source module and the horizontal plane to a preset angle.

[0066] The operator adjusts the light source adjustment unit of the light source adjustment module to drive the tilting platform to deflect at an angle, so that the exposure beam output by the light source module illuminates the sample area at a set incident angle, thus establishing the tilted exposure light path.

[0067] For example, if the preset angle is 45°, a tilting platform suitable for that preset angle can be selected. For instance, a tilting platform with a default tilt angle (second tilt angle θ2) of 45° can be selected for assembly, and the tilt angle adjustment slide can be adjusted to 0° to achieve the preset angle adjustment. If the preset angle is 46°, the same 45° tilting platform can still be selected. By adjusting the light source adjustment unit, the angle of the tilting platform can be changed by 1°, thereby changing the incident angle of the light source to 46°.

[0068] S2: Adjust the sample tray to a horizontal position.

[0069] The level measuring instrument is placed on the bearing surface of the tray adjustment module. By adjusting the X-axis angle tilt slide adjustment knob and the Y-axis angle tilt slide adjustment knob on the tray angle adjustment unit, and in conjunction with the adjustment of the tray fine adjustment unit, the tray horizontal rotation unit and other components, the level of the sample tray can be adjusted.

[0070] S3: Place the photomask on the photomask placement system and fix it in place.

[0071] Place the photomask on the support bracket and align it. Open the valve connected to the vacuum port to create negative pressure adsorption, which firmly and flattens the photomask, preventing displacement or warping.

[0072] S4: The photolithography alignment module is used to precisely align the photolithography plate with the sample.

[0073] Position the microscope directly above the alignment mark on the photomask and adjust the focusing knob to clearly image the alignment mark on the photomask. Use the corner prism for vertical illumination, and in conjunction with the carrier plate fine-tuning and horizontal rotation parts of the carrier plate adjustment module, precisely align the alignment reference of the sample with the alignment mark on the photomask to complete the photolithographic alignment.

[0074] Close the valve connected to the vacuum port, remove the photolithography plate, and keep the positions of the two microscopes unchanged. Place the sample on the support surface of the carrier plate adjustment module, open the valve connected to the vacuum port, and fix the sample in place.

[0075] Rotate the Z-axis height adjustment knob of the tray fine-tuning unit to adjust the height of the sample tray surface to the preset height position. The preset height position is determined by ensuring the sample tray surface is as close as possible to the photomask, and that the sample tray surface does not contact the photomask during movement. Then, rotate the X-axis and Y-axis displacement adjustment knobs of the tray fine-tuning unit to precisely align the photolithographic marks on the sample with the marks on the photomask.

[0076] S5: Remove the photolithography alignment module to avoid the exposure optical path.

[0077] Rotate the microscope horizontally or move it laterally along the column to completely remove the microscope and corner prism from the propagation path of the exposure beam, preventing optical elements from blocking the light path or causing light intensity loss.

[0078] Optionally, the execution order of one or more of the above steps S1 to S5 may not be limited, or the execution order may be adjusted as needed.

[0079] S6: Turn on the light source module to complete the exposure of the sample.

[0080] The exposure beam is projected onto the surface of the sample coated with photoresist at a preset tilt angle, and the vertical sidewalls of the sample are exposed in a directional manner to form the photoresist latent image required for the sidewall pattern, thus completing this tilt exposure process.

[0081] The above method can accurately and conveniently achieve tilted exposure of the sidewalls of the photomask, resulting in more accurate and uniform metallized patterns.

[0082] In one embodiment, a semiconductor device is provided having at least one sidewall on which a metallization pattern is formed, the metallization pattern being formed by tilting the sidewall using a tilting exposure machine as described in this application.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0084] Furthermore, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. The information disclosed in this background section is intended only to enhance the understanding of the general background of this application and should not be construed as an admission or in any way implying that such information constitutes prior art known to those skilled in the art.

Claims

1. A tilting exposure machine, characterized in that, include: The light source module, light source adjustment module, photolithography alignment module, photolithography plate placement module located below the optical path of the photolithography alignment module, and carrier plate adjustment module are used to provide tilted exposure. The light source adjustment module is used to support and adjust the incident angle of the light source module, and includes an inclined platform and a light source adjustment unit connected to the inclined platform. The tilt angle of the inclined platform can be adjusted by the light source adjustment unit. The light source module is detachably connected to the tilted platform. When the tilted platform is in its initial position, the exposure light source emitted by the light source module under the support of the tilted platform is at a first tilt angle. When the tilt angle of the tilted platform is changed by the light source adjustment unit, the angle of the exposure light source emitted by the light source module is adjusted synchronously. The light source adjustment unit includes a load-bearing platform and an angle adjuster installed on the load-bearing platform; The tilting platform is fixed to the load-bearing platform by a support, and the angle adjuster adjusts the tilt angle of the tilting platform synchronously by adjusting the angle of the load-bearing platform.

2. The tilting exposure machine according to claim 1, characterized in that, The inclined platform includes an inclined angle support plate and an inclined panel. The bottom edge of the inclined angle support plate is fixed to the support part, and the inclined panel is fixed to the inclined edge of the inclined angle support plate. The exposure light source emitted by the light source module is perpendicular to the plane where the inclined panel is located.

3. The tilting exposure machine according to claim 2, characterized in that, The bottom edge is provided with a first alignment portion, and the inclined edge is provided with a second alignment portion; The horizontal bracket of the support part is provided with a first connecting part that matches the first alignment part. By aligning and connecting the first alignment part with the first connecting part, the bottom edge of the inclined angle support plate is fixed on the support part. The inclined panel is provided with a second connecting part that matches the second alignment part. The inclined panel is fixed to the inclined side of the inclined angle support plate by aligning and connecting the second alignment part and the second connecting part. The upper surface of the inclined panel is also provided with a third connecting part that connects to the light source module, and the third connecting part is used to align and fix the light source module.

4. The tilting exposure machine according to claim 1, characterized in that, The tilt angle of the inclined platform is between 30° and 60°; The tilting platform includes multiple tilting platforms, each with a different tilt angle. The first tilt angle formed by connecting different tilting platforms with the light source module is also different.

5. The tilting exposure machine according to claim 1, characterized in that, The photolithography alignment module includes: At least one microscope is fixed to the body by a column; A focusing knob, connected to the at least one microscope drive, is used to adjust the microscope focal length; An angled prism, positioned in front of the lens of at least one microscope, is used to change the direction of light propagation so that the illumination light is projected perpendicularly onto the photomask.

6. The tilting exposure machine according to claim 5, characterized in that, The microscope is vertically mounted on the column and can rotate horizontally around the column to adjust the observation angle.

7. The tilting exposure machine according to any one of claims 1 to 6, characterized in that, The tray adjustment module includes a tray angle adjustment section, a tray fine-tuning section, a tray horizontal rotation section, and a sample tray. The tray angle adjustment unit is used to adjust the tilt angle of the sample supported on the sample tray in the X and Y directions; The carrier plate fine-tuning part is located above the carrier plate angle adjustment part, and is used to achieve precise positioning and fine-tuning of the sample in three-dimensional space; The horizontal rotation section of the carrier disk is located above the fine-tuning section of the carrier disk, and is used to realize the horizontal rotation of the sample. The sample carrier is positioned above the horizontal rotating part of the carrier and is used to directly support the sample to be photolithographically etched.

8. The tilting exposure machine according to any one of claims 1 to 6, characterized in that, The bearing surface of the photomask placement module and / or the carrier plate adjustment module has a honeycomb structure and is provided with a vacuum interface. A negative pressure is formed by vacuuming to adsorb and fix the photomask or sample. And / or, the bearing surface of the photomask placement module is provided with an alignment and positioning structure to place the photomask in a predetermined position.

9. A method for tilt exposure using the tilt exposure machine according to any one of claims 1 to 8, characterized in that, include: Adjust the incident angle between the light source module and the horizontal plane to a preset angle; Adjust the sample tray to a horizontal position; The photomask is placed on the photomask placement system and fixed in place; The photolithography alignment module precisely aligns the photomask with the sample. Remove the photolithography alignment module to avoid the exposure optical path; Turn on the light source module to complete the exposure of the sample.

10. A semiconductor device, characterized in that, The semiconductor device has at least one sidewall on which a metallization pattern is formed, the metallization pattern being formed by tilting exposure of the sidewall using a tilting exposure machine according to any one of claims 1 to 8.

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