A heat dissipation system and a heat dissipation system control method

Abstract

This invention discloses a heat dissipation system and a heat dissipation system control method, applied in the field of electronic device cooling technology. The heat dissipation system includes: a heat-conducting base; a first heat exchange component and a second heat exchange component, the first heat exchange component being disposed in a central region and the second heat exchange component being disposed in an edge region; a fan assembly with its exhaust surface facing the first heat exchange component, and the first heat exchange component having an airflow gap parallel to the airflow direction, and the second heat exchange component having an airflow gap perpendicular to the airflow direction; a temperature detection component including several temperature detection units, each temperature detection unit being arrayed on the heat-conducting base; and a controller for adjusting the output power of the fan assembly based on the temperature data of each target area unit. The heat dissipation system provided by this invention has a compact and reliable overall structure, strong adaptability, and can ensure the continuous and stable operation of electronic devices under high load conditions, suppress overheating and frequency reduction of heat-generating components, and extend the service life of core components.

Description

Technical Field

[0001] This invention relates to the field of electronic device cooling technology, and in particular to a heat dissipation system and a heat dissipation system control method. Background Technology

[0002] Electronic devices are constantly evolving towards higher computing power, higher integration, and miniaturization. The operating power and heat flux density of core heat-generating components such as central processing units and graphics processors are constantly increasing, placing higher demands on the heat dissipation capacity, temperature uniformity, and operational stability of the supporting heat dissipation systems.

[0003] In related technologies, the heat dissipation structure of electronic devices often adopts a single air-cooling or a simple heat pipe combined with air cooling. The heat transfer path is long, the heat conduction and heat exchange efficiency is low, and hot spots with excessively high local temperatures are prone to appear in the heat source area. This causes core components to trigger frequency reduction protection due to overheating, affecting the server's computing performance. At the same time, in related technologies, the airflow formed by direct fan blowing is prone to generating eddies and turbulence on the top and edge of the fins, increasing airflow resistance and causing airflow loss. The proportion of effective airflow participating in heat exchange is low, and the heat dissipation effect is difficult to fully realize. Furthermore, the contact thermal resistance between the heat sink base and the heat source is relatively large, the overall installation positioning accuracy is insufficient, and the vibration generated by the fan during operation is easily transmitted to the chassis and core components, resulting in poor reliability. Moreover, there is a lack of global temperature monitoring methods, making it impossible to dynamically adjust the output power based on real-time temperature. All of the above factors make the heat dissipation system in related technologies difficult to adapt to the long-term stable heat dissipation requirements of high-density, high-load electronic devices, becoming an important factor restricting server performance and lifespan.

[0004] Therefore, how to improve the heat dissipation uniformity and efficiency of the heat dissipation system for electronic devices is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a heat dissipation system and a heat dissipation system control method to improve the heat dissipation uniformity of electronic devices, improve heat dissipation efficiency, and reduce energy consumption.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A heat dissipation system includes: a heat-conducting base for contacting and conducting heat with a heat-generating component; a first heat exchange component and a second heat exchange component, both connected to the heat-conducting base to conduct heat from the heat-conducting base, wherein the first heat exchange component is disposed in the central region of the heat-conducting base and the second heat exchange component is disposed in the edge region of the heat-conducting base; a fan assembly disposed on the heat-conducting base, with the air outlet surface of the fan assembly facing the first heat exchange component, and an airflow gap parallel to the airflow direction formed within the first heat exchange component, and an airflow gap perpendicular to the airflow direction formed within the second heat exchange component; a temperature detection component including a plurality of temperature detection units, each of the temperature detection units being arrayed on the heat-conducting base, the temperature detection units being used to acquire temperature data of each target area unit in the central region and the edge region; and a controller, wherein the temperature detection component and the fan assembly are both connected to the controller, the controller being used to adjust the output power of the fan assembly according to the temperature data of each target area unit.

[0007] A heat dissipation system control method includes the following steps: determining the temperature of each target area unit in the central region and the edge region based on the temperature data of each temperature detection unit; calculating the maximum temperature difference and average temperature of each target area unit at the current moment; when the maximum temperature difference is less than the target temperature difference and the average temperature is less than the target temperature, controlling the fan assembly to be in a low-speed energy-saving state; when the maximum temperature difference is greater than or equal to the target temperature difference, determining the absolute difference between the temperature of the edge region and the temperature of the central region; and when the absolute difference is greater than a preset difference and the temperature of the edge region is less than the temperature of the central region, controlling the fan assembly to be in a full-power strong wind mode; and when the absolute difference is greater than the preset difference and the temperature of the edge region is greater than the temperature of the central region, controlling the fan assembly to be in a pulse regulation mode.

[0008] The heat dissipation system provided by this invention has the following advantages: By using a heat-conducting base, which serves as the primary heat-absorbing component, the bottom surface of the base directly contacts the heat-generating components inside the electronic device chassis, such as high-power central processing units (CPUs) and graphics processors, enabling surface-contact heat conduction. Then, with the aid of a first heat exchange component and a second heat exchange component, located respectively in the central and edge regions of the heat-conducting base, the first heat exchange component dissipates heat from components with higher heat generation, while the second heat exchange component dissipates heat from components with lower heat generation. Furthermore, by incorporating a fan assembly with its airflow outlet facing the first heat exchange component, most of the airflow generated by the fan enters the airflow gap of the first heat exchange component, while a small portion enters the airflow gap of the second heat exchange component, thus satisfying the needs of both components with higher and lower heat generation. The heat dissipation requirements of each heat-generating component are considered. Specifically, the first heat exchange component plays a primary role in cooling, while the second heat dissipation fins on both sides of the heat-conducting base further expand the heat dissipation area, improve heat dissipation in the edge areas, and make the overall temperature field distribution more uniform. Then, through the configuration of a temperature detection component and a controller, the temperature detection component includes several temperature detection units. Both the central and edge areas are divided into multiple target area units, with one temperature detection unit configured on each target area unit, ensuring that the temperature of each target area unit can be acquired. By arraying the temperature detection units in the temperature detection component on the upper surface of the heat-conducting base (i.e., the top surface of the heat-conducting base), the temperature detection units can be arranged in a uniform distribution. The temperature detection component can collect real-time temperature data across the entire area, providing a basis for the controller to adjust the speed of the fan component, achieving on-demand heat dissipation and reducing energy consumption. The heat dissipation system provided by this invention has a compact and reliable overall structure, strong adaptability, and can ensure the continuous and stable operation of electronic equipment under high load conditions, suppress overheating and frequency reduction of heat-generating components, and extend the service life of core components.

[0009] In one embodiment, the first heat exchange assembly includes a first heat dissipation fin group and a plurality of heat pipes. Each heat pipe is arranged along the airflow direction and embedded within the first heat dissipation fin group. The evaporation section of each heat pipe is connected to the thermally conductive base, and the condensation section of each heat pipe extends from one side near the thermally conductive base to the other side, penetrating the first heat dissipation fin group. Specifically, the heat pipes can be multiple parallel copper pipes, numbering 2-4. The heat pipes are filled with a working fluid. The condensation section of the heat pipe is fixed to the first heat dissipation fin group by welding. This welding method, a metallurgical bonding method, has higher thermal conductivity. The fin thickness of the first heat dissipation fin group can be 0.3-0.5 mm, the fin spacing can be 1.5-2.5 mm, and through holes adapted to the outer diameter of the heat pipes are formed on the fins, through which the heat pipes pass. With the above configuration, the first heat dissipation fin group can dissipate heat in the central area. On the one hand, by setting up several heat pipes, a heat transfer path with low thermal resistance can be constructed. The heat pipes can quickly and evenly distribute the heat absorbed by the central area of ​​the heat-conducting base to various parts of the first heat dissipation fin group, effectively avoiding the accumulation of heat in local areas and the formation of hot spots. On the other hand, the heat pipes can also provide support for the first heat dissipation fin group. By welding the first heat dissipation fin group to the heat pipes, a gap will be formed between the first heat dissipation fin group and the heat-conducting base, which facilitates airflow.

[0010] In one embodiment, the second heat exchange component includes a plurality of second heat dissipation fin groups, which are located on both sides of the surface edge region of the heat-conducting base; the arrangement direction of the second heat dissipation fin groups is perpendicular to the airflow direction, and airflow gaps perpendicular to the airflow direction are formed in the second heat dissipation fin groups; furthermore, the extension direction of each heat dissipation fin in the first heat dissipation fin group is parallel to the surface of the heat-conducting base, and the arrangement direction is perpendicular to the surface of the heat-conducting base; the extension direction of each heat dissipation fin in the second heat dissipation fin group is perpendicular to the surface of the heat-conducting base, and the arrangement direction is parallel to the airflow direction. The above configuration, through the differentiated design of the fin directions of the first and second heat exchange components, achieves efficient utilization of airflow. For the first heat exchange fin group, the gap parallel to the airflow direction guides the main airflow generated by the fan assembly to pass quickly, reducing wind resistance. For the second heat exchange fin group, the gap perpendicular to the airflow direction allows edge airflow overflowing from both sides of the fan assembly or flowing out from the top of the first heat exchange fin group to flow through. Since the second heat exchange fin group is located at the edge of the heat-conducting base, and the extension direction of its fins is perpendicular to the airflow direction, when the airflow diffuses after passing through the first heat exchange fin group or flows out from the side, it will vertically impact the surface of the second heat exchange fin group, thereby generating strong disturbance and heat exchange. With this configuration, the second heat exchange fin group can make full use of the airflow that might otherwise leak ineffectively, thereby achieving cooling of the edge area, effectively improving the heat dissipation effect of the edge area, making the overall temperature cooling more uniform, and avoiding the problem of overheating of heat-generating components caused by edge hot spots.

[0011] In one embodiment, a flow guiding component is further included. This component is located on the side of the first heat exchange assembly facing away from the heat-conducting base and is used to gather airflow from the fan assembly. This arrangement, by placing the flow guiding component on top of the first heat dissipation fin assembly, effectively eliminates eddies and turbulence losses generated by the airflow at the top and edges of the fins. This not only reduces airflow resistance but also promotes faster airflow penetration through the airflow gaps of the first heat dissipation fin assembly. The flow guiding component effectively improves airflow utilization, maximizing the entry of airflow generated by the fan assembly into the first heat dissipation fin assembly, reducing the risk of dissipation from the top, improving heat dissipation efficiency, and helping to reduce the energy consumption of the fan assembly, thereby reducing noise.

[0012] In one embodiment, the upper surface of the heat-conducting base facing the first heat dissipation fin group and the lower surface away from the first heat dissipation fin group are both planar. The lower surface of the heat-conducting base is provided with a thermally conductive coating. The temperature sensing elements are evenly distributed on the upper surface of the heat-conducting base. On the one hand, by adding a thermally conductive coating to the lower surface of the heat-conducting base, the entire area of ​​the heat-conducting base can be covered with the thermally conductive coating. The thermally conductive coating not only improves the corrosion resistance and oxidation resistance of the base, but also fills the gap between the heat-conducting base and the heat-generating component, reduces the contact thermal resistance, and improves the efficiency of heat absorption and conduction. On the other hand, the upper surface of the heat-conducting base is also planar. By evenly distributing the temperature sensing elements on the upper surface of the heat-conducting base, the temperature of each target area unit can be accurately detected. Installing the temperature sensing elements on the upper surface of the heat-conducting base rather than the lower surface can avoid obstructing heat conduction and avoid the phenomenon of delayed or low temperature readings. The temperature sensing elements can be temperature sensors. The sensing surface of the temperature sensing elements is parallel and in direct contact with the upper surface of the heat-conducting base, so that the collected temperature data can more accurately reflect the state of the heat-generating component.

[0013] The heat dissipation system control method provided by this invention obtains the temperature of each target area unit in the central region and the edge region, and determines the maximum temperature difference and average temperature of each target area unit. When the maximum temperature difference is less than the target temperature difference and the average temperature is less than the target temperature, it indicates that the heat dissipation capacity of the heat dissipation system is sufficient to meet the operating requirements of the heat-generating components. Therefore, the fan assembly only needs to be in a low-speed energy-saving state, and the fan assembly does not need to run at full power to avoid energy waste. Simultaneously, when the maximum temperature difference is greater than or equal to the target temperature difference, it indicates that the heat dissipation capacity of the heat dissipation system is insufficient to meet the operating requirements of the heat-generating components. In this case, it is necessary to determine which region, the central region or the edge region, requires more heat dissipation. Therefore, the method determines the temperature difference between the edge region and the central region by comparing the temperature of the target area unit with that of the target area unit. The system calculates the absolute difference between the temperatures of the two regions. When this absolute difference exceeds a preset value, it determines whether the fan assembly should enter either a full-power high-speed mode or a pulsed adjustment mode based on the relative temperatures of the edge and center regions. The temperatures of the edge and center regions can be calculated using the average temperature of each target region unit or other methods, and the calculation methods for the edge and center regions should be consistent. This control method implements two determination mechanisms: uniform heat dissipation mode and differentiated heat dissipation mode. It can flexibly adjust the output power of the fan assembly according to the actual operation of the electronic equipment. The system can identify states where full-power operation is not required and can achieve on-demand heat dissipation, thereby meeting heat dissipation needs while avoiding energy waste. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of a specific embodiment of the heat dissipation system provided by the present invention.

[0016] Figure 2 for Figure 1 A schematic diagram of the heat dissipation system from another perspective.

[0017] Figure 3 for Figure 1 Top view of the heat-conducting base in the heat dissipation system shown.

[0018] Figure 4 for Figure 1 The side view of the heat-conducting base, positioning boss, and heat pipe in the heat dissipation system shown.

[0019] Figure 5 A flowchart of the heat dissipation system control method provided by the present invention.

[0020] Reference numerals: 1-Fan assembly; 2-Heat-conducting base; 3-Heat pipe; 31-Evaporation section; 32-Condensation section; 4-Arc-shaped guide plate; 5-Positioning boss; 6-First heat exchange assembly; 7-Second heat exchange assembly; 8-Temperature detection assembly; 9-Fixed bracket; 10-Mounting slot; 11-Mounting position. Detailed Implementation

[0021] The core of this invention is to provide a heat dissipation system and a heat dissipation system control method, which can significantly improve heat dissipation stability, reliability and service life.

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0023] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity, i.e., the limitations of the measurement system. For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] In this implementation, please refer to Figure 1 and Figure 2 The heat dissipation system includes: The heat-conducting base 2 is used for contacting and conducting heat with the heat-generating component; Both the first heat exchange component 6 and the second heat exchange component 7 are connected to the heat-conducting base 2 to conduct heat from the heat-conducting base 2. The first heat exchange component 6 is located in the central area of ​​the heat-conducting base 2, and the second heat exchange component 7 is located in the edge area of ​​the heat-conducting base 2. The fan assembly 1 is mounted on the heat-conducting base 2, and the air outlet of the fan assembly 1 faces the first heat exchange assembly 6. An airflow gap parallel to the airflow direction is formed in the first heat exchange assembly 6, and an airflow gap perpendicular to the airflow direction is formed in the second heat exchange assembly 7. There is a certain gap between the fan assembly 1 and the first heat exchange assembly 6 to ensure that the airflow generated by the fan assembly 1 can flow laterally from the gap and flow into the airflow gap of the second heat exchange assembly 7. Temperature detection component 8 includes several temperature detection units, which are arrayed on heat-conducting base 2. The temperature detection units are used to acquire temperature data of each target area unit in the central and edge areas. The controller, temperature detection component 8, and fan component 1 are all connected to the controller. The controller is used to adjust the output power of the fan component 1 according to the temperature data of each target area unit. The controller is not shown in the figure.

[0026] Specifically, the temperature detection unit can be a temperature sensor. All temperature detection units in the temperature detection assembly 8 are independently packaged. The fixed end of the temperature sensor is bonded and fixed to the upper surface of the heat-conducting base 2. The wiring end of the temperature sensor extends outward from the heat-conducting base 2. The sensing surface of the temperature sensor is parallel and in contact with the upper surface of the heat-conducting base 2. The heat-conducting base 2, heat pipe 3, and the heat dissipation fins of the first heat exchange assembly 6 and the second heat exchange assembly 7 can all be made of copper or aluminum alloy and have an anti-oxidation coating on the surface. The fan assembly 1 includes a fan body and a fixing bracket 9. The fan body is mounted on the heat-conducting base 2 through the fixing bracket 9, which ensures the stability of the fan body. There is a certain gap between the fixing bracket 9 and the first heat exchange assembly 6. Of course, to ensure the stability of the fixing bracket 9, the fixing bracket 9 and the first heat exchange assembly 6 can be assembled through connectors. The fan body can be an axial fan with a rated speed of 1500-3000 RPM. The frame of the fan body is provided with shock-absorbing pads. The power supply end of the fan body is electrically connected to the fan power supply interface on the motherboard of the electronic device.

[0027] Furthermore, the controller can be integrated into the BMC (Baseboard Management Controller) of the electronic device, or it can be a separate PCB (Printed Circuit Board). The controller is equipped with a zone speed control algorithm module, which is used to receive real-time data from the temperature detection component 8, and output a PWM (Pulse Width Modulation) signal to control the speed of the fan component 1 according to the preset temperature-speed mapping relationship and the spatial temperature gradient. The temperature detection component 8 and the controller work together to form a closed-loop feedback control system, realizing the transformation from passive heat dissipation to active sensing and on-demand heat dissipation.

[0028] The heat dissipation system provided by this invention utilizes a heat-conducting base 2, which serves as the primary heat-absorbing component. The bottom surface of the heat-conducting base 2 directly contacts heat-generating components within the electronic device chassis, such as high-power central processing units (CPUs) and graphics processors, for surface-contact heat conduction. Then, a first heat exchange component 6 and a second heat exchange component 7 are positioned at the center and edge of the heat-conducting base 2, respectively. The first heat exchange component 6 dissipates heat from components with higher heat generation, while the second heat exchange component 7 dissipates heat from components with lower heat generation. Furthermore, a fan assembly 1 is incorporated, with its exhaust surface directly facing the first heat exchange component 6. Most of the airflow generated by the fan assembly 1 enters the airflow gap of the first heat exchange component 6, while a smaller portion enters the airflow gap of the second heat exchange component 7, thus satisfying the needs of components with higher heat generation. The heat dissipation requirements of both heat-generating components and those with lower heat generation are considered. Specifically, the first heat exchange component 6 plays a primary role in cooling, while the second heat dissipation fins on both sides of the heat-conducting base 2 further expand the heat dissipation area, improve heat dissipation in the edge areas, and make the overall temperature field distribution more uniform. Then, through the setup of the temperature detection component 8 and the controller, the temperature detection component 8, comprising several temperature detection units, divides the central and edge areas into multiple target area units, with one temperature detection unit configured on each target area unit, ensuring that the temperature of each target area unit can be acquired. By arranging the temperature detection units in the temperature detection component 8 in an array on the upper surface of the heat-conducting base 2 (i.e., the top surface of the heat-conducting base 2), the temperature detection components can be evenly distributed. The temperature detection component 8 can collect real-time temperature data across the entire area, providing a basis for the controller to adjust the speed of the fan component 1, achieving on-demand heat dissipation and reducing energy consumption. The heat dissipation system provided by this invention has a compact and reliable overall structure, strong adaptability, and can ensure the continuous and stable operation of electronic equipment under high load conditions, suppress overheating and frequency reduction of heat-generating components, and extend the service life of core components.

[0029] In some embodiments, the first heat exchange assembly 6 includes a first heat dissipation fin group and several heat pipes 3. Each heat pipe 3 is arranged along the airflow direction and embedded inside the first heat dissipation fin group. The evaporation section 31 of the heat pipe 3 is connected to the heat-conducting base 2, and the condensation section 32 of the heat pipe 3 extends from one side near the heat-conducting base 2 to the other side, penetrating the first heat dissipation fin group. Specifically, the heat pipe 3 can be multiple parallel copper pipes, numbering 2-4. The heat pipe 3 is filled with a working fluid. The condensation section 32 of the heat pipe 3 is fixed to the first heat dissipation fin group by welding. This welding method, a metallurgical bonding method, has higher thermal conductivity. The fin thickness of the first heat dissipation fin group can be 0.3-0.5 mm, the fin spacing can be 1.5-2.5 mm, and through holes adapted to the outer diameter of the heat pipes 3 are opened on the fins, through which the heat pipes 3 pass. With the above configuration, the first heat dissipation fin group can dissipate heat in the central area. On the one hand, by setting up several heat pipes 3, a heat transfer path with low thermal resistance can be constructed. The heat pipes 3 can quickly and evenly distribute the heat absorbed by the central area of ​​the heat-conducting base 2 to various parts of the first heat dissipation fin group, effectively avoiding the accumulation of heat in local areas and the formation of hot spots. On the other hand, the heat pipes 3 can also support the first heat dissipation fin group. By welding the first heat dissipation fin group to the heat pipes 3, a gap will be formed between the first heat dissipation fin group and the heat-conducting base 2, which facilitates airflow.

[0030] In some embodiments, to ensure smooth heat transfer, a thermally conductive medium, such as thermally conductive silicone grease or liquid metal, is filled between the evaporation section 31 of the heat pipe 3 and the thermally conductive base 2 to fill the gap between the heat pipe 3 and the thermally conductive base 2 and reduce contact thermal resistance. The gap referred to here mainly refers to the gap between the evaporation section 31 of the heat pipe 3 and the mounting groove 10. As a highly efficient thermally conductive medium, the thermally conductive medium significantly improves the heat transfer rate from the base to the heat pipe 3, ensuring that the heat of the heating component is quickly absorbed and avoiding the accumulation of local hot spots. In addition, the thermally conductive medium also has a certain mechanical buffering effect, which can absorb some vibration, thereby ensuring good contact between the heat pipe 3 and the thermally conductive base 2, ensuring the stability of the sealing effect, and extending the service life of the heat dissipation system.

[0031] In some embodiments, a positioning boss 5 is also included. The heat-conducting base 2 is plate-shaped, and the positioning boss 5 is disposed on the top surface of the heat-conducting base 2. Several mounting grooves 10 are formed on the side surface of the positioning boss 5 away from the heat-conducting base 2. The heat pipe 3 has an inverted U-shaped structure. The evaporation section 31 of the heat pipe 3 is fixed in the mounting groove 10, and the condensation section 32 of the heat pipe 3 extends to the top outer side of the first heat dissipation fin assembly. The first heat dissipation fin assembly is spaced apart from the surface of the positioning boss 5. Specifically, the first heat dissipation fin assembly is fixedly connected to the heat pipe 3. Under the support of the heat pipe 3, the first heat dissipation fin assembly is suspended on the surface of the positioning boss 5. This arrangement is conducive to airflow flowing from the bottom of the first heat dissipation fin assembly, thereby better dissipating heat from the heat-conducting base 2. The evaporation section 31 and the condensation section 32 of the heat pipe 3 are arranged in a U-shape. After the condensation section 32 of the heat pipe 3 passes through the first heat dissipation fin group, the end is sealed by a plug. The U-shaped arc section of the heat pipe 3 is located on the top outer side of the first heat dissipation fin group, and each heat pipe 3 is equipped with a corresponding guide plate.

[0032] In some embodiments, the second heat exchange assembly 7 includes a plurality of second heat dissipation fin groups located on both sides of the surface edge region of the heat-conducting base 2; the arrangement direction of the second heat dissipation fin groups is perpendicular to the airflow direction, and airflow gaps perpendicular to the airflow direction are formed in the second heat dissipation fin groups; furthermore, the extension direction of each heat dissipation fin in the first heat dissipation fin group is parallel to the surface of the heat-conducting base 2, and the arrangement direction is perpendicular to the surface of the heat-conducting base 2; the extension direction of each heat dissipation fin in the second heat dissipation fin group is perpendicular to the surface of the heat-conducting base 2, and the arrangement direction is parallel to the airflow direction. That is, the heat dissipation fins in the second heat dissipation fin groups are arranged along the airflow direction, and airflow gaps perpendicular to the airflow direction are formed between adjacent heat dissipation fins in the second heat dissipation fin groups; airflow gaps parallel to the airflow direction are formed between the heat dissipation fins in the first heat dissipation fin groups. Specifically, each second heat dissipation fin group can be symmetrically fixed on both sides of the first heat dissipation fin group to ensure uniform heat dissipation. At the same time, the symmetrical structure provides better stability. Specifically, the second heat dissipation fin groups are respectively set on both sides of the first heat dissipation fin group along the direction perpendicular to the airflow. Each heat dissipation fin in the second heat dissipation fin group is arranged along the airflow direction, and an airflow gap perpendicular to the airflow direction is formed between adjacent heat dissipation fins. Furthermore, the plane on which each heat dissipation fin in the first heat dissipation fin group is located is parallel to the surface of the heat-conducting base 2, and the arrangement direction is perpendicular to the surface of the heat-conducting base 2. The plane on which each heat dissipation fin in the second heat dissipation fin group is located is perpendicular to the surface of the heat-conducting base 2, and the arrangement direction is parallel to the airflow direction.

[0033] The above configuration, through the differentiated design of the fin directions of the first heat exchange component 6 and the second heat exchange component 7, achieves efficient utilization of airflow. For the first heat dissipation fin group, the gap parallel to the airflow direction can guide the main airflow generated by the fan component 1 to pass quickly, reducing wind resistance. For the second heat dissipation fin group, the gap perpendicular to the airflow direction can allow the edge airflow overflowing from both sides of the fan component 1 or flowing out from the top of the first heat dissipation fin group to flow through. Since the second heat dissipation fin group is located at the edge of the heat-conducting base 2, and the extension direction of its fins is perpendicular to the airflow direction, when the airflow diffuses after passing through the first heat dissipation fin group or flows out from the side, it will vertically impact the surface of the second heat dissipation fin group, thereby generating strong disturbance and heat exchange. With this configuration, the second heat dissipation fin group can make full use of the airflow that might otherwise leak ineffectively, thereby achieving cooling of the edge area, effectively improving the heat dissipation effect of the edge area, making the overall temperature cooling more uniform, and avoiding the problem of overheating of the heat-generating components caused by edge hot spots.

[0034] In some embodiments, a flow guiding component is also included. This component is located on the side of the first heat exchange assembly 6 opposite to the heat-conducting base 2 and is used to gather the airflow from the fan assembly 1. This arrangement, by placing the flow guiding component on the top of the first heat dissipation fin group, effectively eliminates eddies and turbulence losses generated by the airflow at the top and edges of the fins of the first heat dissipation fin group. This not only reduces the resistance of the airflow channel but also promotes faster airflow penetration through the airflow gaps of the first heat dissipation fin group. The flow guiding component effectively improves airflow utilization, allowing the airflow generated by the fan assembly 1 to enter the interior of the first heat dissipation fin group to the maximum extent, reducing the risk of dissipation from the top, improving heat dissipation efficiency, and helping to reduce the energy consumption of the fan assembly 1, thereby reducing noise.

[0035] In some embodiments, the airflow guiding component includes several airflow guiding plates, which can be arc-shaped airflow guiding plates 4. The arc-shaped airflow guiding plates 4 are arranged adjacent to the condensation section 32 of the heat pipe 3, and the number of arc-shaped airflow guiding plates 4 is the same as that of the heat pipe 3 and they correspond one-to-one. Specifically, the airflow guiding plate is located on the side of the corresponding heat pipe 3 that is close to the fan assembly 1. In the width direction of the first heat dissipation fin group, the length of the arc-shaped airflow guiding plate 4 is consistent with the width of the first heat dissipation fin group, and the arc surface of the arc-shaped airflow guiding plate 4 is convex away from the first heat dissipation fin group. The width direction of the first heat dissipation fin group refers to the direction that is perpendicular to the heat conduction base 2 and perpendicular to the airflow direction.

[0036] In some embodiments, the upper surface of the heat-conducting base 2 facing the first heat dissipation fin group and the lower surface away from the first heat dissipation fin group are both planar. The lower surface of the heat-conducting base 2 is provided with a thermally conductive coating to reduce the contact thermal resistance between the heat-generating component and the heat-generating component. Temperature detection units are evenly distributed on the upper surface of the heat-conducting base 2, and the temperature detection units are staggered with the positioning boss 5 and the second heat dissipation fin group. On the one hand, by adding a thermally conductive coating to the lower surface of the thermally conductive base 2, the entire area of ​​the thermally conductive base 2 can be covered by the thermally conductive coating. That is to say, the thermally conductive coating is tightly attached to the lower surface of the thermally conductive base 2 and covers all exposed areas of the lower surface of the thermally conductive base 2. The thermally conductive coating not only improves the corrosion resistance and oxidation resistance of the base, but also fills the gap between the thermally conductive base 2 and the heat-generating component, reduces the contact thermal resistance, and improves the efficiency of heat absorption and conduction. On the other hand, the upper surface of the thermally conductive base 2 is also flat. By evenly distributing temperature detection units on the upper surface of the thermally conductive base 2, the temperature of each target area unit can be accurately detected. Installing the temperature detection units on the upper surface of the thermally conductive base 2 rather than the lower surface can avoid obstructing heat conduction and avoid the phenomenon of lag or low temperature detection unit readings. The temperature detection units can be temperature sensors. The sensing surface of the temperature detection units is parallel and in direct contact with the upper surface of the thermally conductive base 2, so that the collected temperature data can more accurately reflect the state of the heat-generating component.

[0037] In some embodiments, the outer peripheral edge of the heat-conducting base 2 is provided with a plurality of mounting positions 11, which match the mounting holes of the electronic device chassis. The mounting positions 11 can be through holes penetrating the thickness direction of the heat-conducting base 2. Specifically, the edge of the heat-conducting base 2 is provided with mounting positions 11 corresponding to the mounting holes of the electronic device chassis. The mounting positions 11 are hole-like structures penetrating the thickness direction of the heat-conducting base 2. The number, spacing, and size of the mounting positions 11 correspond to the number, spacing, and size of the mounting holes of the chassis.

[0038] In one specific embodiment, the heat dissipation system includes a heat-conducting base 2, a heat pipe 3, a heat dissipation fin assembly, a mounting bracket 9, and a fan body. The heat-conducting base 2 is a flat plate structure that fits into the heat-generating components of the electronic device. Please refer to [reference needed]. Figure 4The upper surface of the heat pipe 3 is provided with a positioning boss 5, and the positioning boss 5 is provided with a mounting groove 10. The heat dissipation fin group includes a first heat dissipation fin group and a second heat dissipation fin group. The evaporation section 31 of the heat pipe 3 is embedded in the mounting groove 10, and the condensation section 32 of the heat pipe 3 is fixedly inserted into the first heat dissipation fin group. The first heat dissipation fin group is composed of multiple parallel metal heat dissipation fins stacked together, and gaps are formed between the fins to allow airflow. The fixing bracket 9 is fixedly connected to the heat conduction base 2. The fan body is detachably installed on the front side of the first heat dissipation fin group through the fixing bracket 9. The air outlet direction of the fan body is directly facing the fin gap of the first heat dissipation fin group. The second heat dissipation fin group is provided on both sides of the surface of the heat conduction base 2. The top of the first heat dissipation fin group is provided with an arc-shaped guide plate 4 on one side of each heat pipe 3. The length of the arc-shaped guide plate 4 is consistent with the width of the first heat dissipation fin group. The upper surface of the heat conduction base 2 is provided with a temperature detection component 8. Each temperature detection unit of the temperature detection component 8 is evenly distributed on the upper surface of the heat conduction base 2.

[0039] The heat dissipation system provided by this invention employs a thermally conductive base 2, heat pipes 3, a first heat dissipation fin group, a second heat dissipation fin group, a fixed bracket 9, a fan body and an arc-shaped air guide plate 4, and a temperature detection component 8 working in synergy. This significantly improves the heat dissipation efficiency and temperature uniformity of the core heat source in electronic devices, solving the defects of traditional heat dissipation structures such as prominent hot spots, disordered airflow, and insufficient heat exchange efficiency. The thermally conductive base 2 adopts a flat plate structure and is equipped with a heat pipe 3 mounting groove 10 and a positioning boss 5. Combined with a thermally conductive coating covering the entire area, it effectively reduces the contact thermal resistance with the heat source, improving heat absorption and conduction efficiency. The edge mounting position 11 accurately corresponds to the chassis mounting holes, enabling rapid and stable assembly of the overall structure and improving installation and maintenance convenience. Multiple parallel U-shaped heat pipes 3 embed the evaporation section 31 within the mounting groove 10 and fill it with a heat-conducting medium. The condensation section 32 is welded and fixed to the first heat dissipation fin assembly. This allows for rapid and uniform transfer of heat from the heat-conducting base 2 to the heat dissipation fins, preventing localized heat accumulation. Combined with a fin structure of 0.3-0.5mm thickness and 1.5-2.5mm spacing, it maintains reasonable airflow resistance while ensuring sufficient heat exchange area. An arc-shaped guide plate 4 is installed on the top of the first heat dissipation fin assembly to regulate and guide the airflow generated by the fan, eliminating eddy currents and turbulent flow losses and improving air-cooling efficiency. Second heat dissipation fin assemblies are installed on both sides of the heat-conducting base 2 to further expand the heat dissipation area, improve heat dissipation in edge areas, and make the overall temperature field distribution more uniform. The heat-conducting base 2, heat pipes 3, and heat dissipation fin assemblies are made of copper or aluminum alloy and have an anti-oxidation coating to improve structural strength and service life. Temperature detection components 8 are evenly distributed on the upper surface of the heat-conducting base 2, which can collect real-time temperature data across the entire area, providing a basis for intelligent speed adjustment of the fan body, achieving on-demand heat dissipation and reducing energy consumption. The overall structure is compact, reliable, and highly adaptable, ensuring that electronic equipment can operate stably under high load conditions, suppressing chip overheating and frequency reduction, and extending the service life of core components.

[0040] In addition to the above-mentioned heat dissipation system, the present invention also provides a heat dissipation system control method, which can be implemented using the above-mentioned heat dissipation system.

[0041] Please refer to Figure 5 The heat dissipation system control method includes the following steps: Step S1: Based on the temperature data of each temperature detection unit, determine the temperature of each target area unit in the central and edge areas. This temperature data can be real-time temperature data or periodically acquired temperature data. Step S2: Calculate the maximum temperature difference and average temperature of each target area unit at the current time. When the maximum temperature difference is less than the target temperature difference and the average temperature is less than the target temperature, control the fan assembly 1 to be in a low-speed energy-saving state. Step S3: When the maximum temperature difference is greater than or equal to the target temperature difference, the absolute difference between the temperature of the edge area and the temperature of the center area is determined. When the absolute difference is greater than the preset difference and the temperature of the edge area is less than the temperature of the center area, the fan assembly 1 is controlled to be in full-power strong wind mode. When the absolute difference is greater than the preset difference and the temperature of the edge area is greater than the temperature of the center area, the fan assembly 1 is controlled to be in pulse adjustment mode.

[0042] The heat dissipation system control method provided by this invention acquires the temperature of each target area unit in the central and edge regions, and determines the maximum temperature difference and average temperature of each target area unit. When the maximum temperature difference is less than the target temperature difference and the average temperature is less than the target temperature, it indicates that the heat dissipation capacity of the heat dissipation system is sufficient to meet the operating requirements of the heat-generating components. Therefore, the fan assembly 1 only needs to be in a low-speed energy-saving state. For example, the low-speed energy-saving state can be 40% to 60% of the rated maximum speed, which can be set according to actual needs and is not limited to this value range. The fan assembly 1 does not need to operate at full power to avoid energy waste. At the same time, when the maximum temperature difference is greater than or equal to the target temperature difference, it indicates that the heat dissipation capacity of the heat dissipation system cannot meet the operating requirements of the heat-generating components, and therefore, it is necessary to... To determine which area, the central or peripheral region, requires more heat dissipation, the system calculates the absolute difference between the temperatures of the peripheral and central regions. If this absolute difference exceeds a preset value, the system determines whether fan assembly 1 should enter either a full-power high-speed mode or a pulsed adjustment mode, based on the relative temperatures of the peripheral and central regions. The temperatures of the peripheral and central regions can be calculated using the average temperature of each target area unit, the maximum value, or other methods; the calculation methods for the peripheral and central temperatures should be consistent. This control method implements two determination mechanisms: uniform heat dissipation and differentiated heat dissipation. It can flexibly adjust the output power of fan assembly 1 according to the actual operation of the electronic equipment. The system can identify states where full-power operation is not required, enabling on-demand heat dissipation and thus meeting heat dissipation needs while avoiding energy waste.

[0043] In some implementations, when fan assembly 1 is in full-power high-speed mode, fan assembly 1 is configured to increase its rotational speed to its maximum value, thereby fully utilizing its heat dissipation capacity. Specifically, when fan assembly 1 is in full-power high-speed mode, the rotational speed of fan assembly 1 is rapidly increased to its maximum value, such as 3000 RPM. Utilizing the rectifying effect of the arc-shaped air guide plate 4, the high-speed airflow is concentrated and directed towards the first heat dissipation fin group. The dense fins in this area are used for efficient heat exchange, quickly suppressing the temperature of core heat-generating components, such as the CPU (Central Processing Unit) or GPU (Graphics Processing Unit).

[0044] When the fan assembly 1 is in the pulsating adjustment mode, which may be caused by the heat generated by the memory or the IO (Input / Output) module, the fan assembly 1 is configured to: the fan assembly 1 operates at a preset rotational speed, which can be 60% to 80% of the rated maximum rotational speed, and a pulse width modulation signal is superimposed. Specifically, in the pulsating adjustment mode, the fan assembly 1 is controlled to operate at a medium-high rotational speed, such as 2000 - 2400 RPM, and a pulsating PWM (Pulse Width Modulation) signal is superimposed. By using the disturbance effect of the air flow, the cooling effect on the second heat sink fin groups on both sides of the heat conducting base 2 is enhanced, and ineffective over-cooling of the central region is avoided.

[0045] In some embodiments, it further includes the steps of: Real-time monitor the temperature change rate of each temperature detection unit. When the temperature change rate is greater than the target change rate, an early warning signal is issued, so that the electronic device pre-reduces the frequency of the heating component or adjusts the task scheduling for the heating component. Specifically, by real-time monitoring the temperature change rate dT / dt, if it is detected that the temperature shows an exponential upward trend, such as dT / dt > 2 °C / s, the controller sends an early warning signal to the main board of the electronic device in advance, requesting the CPU or GPU to pre-reduce the frequency or adjust the task scheduling, to prevent the temperature from instantly reaching the hard protection threshold and causing the system to crash.

[0046] In a specific embodiment, this heat dissipation system control method utilizes the spatial distribution characteristics of the temperature detection component 8 to achieve refined air volume control, including the following steps: Step S101: Data acquisition and spatial mapping; the controller periodically, such as every 100 ms, obtains the values of each temperature detection unit in the temperature detection component 8 on the upper surface of the heat conducting base 2. The heat conducting base 2 is divided into a central region and an edge region; the central region corresponds to the first heat sink fin group, and the edge region corresponds to the second heat sink fin group.

[0047] Step S102: Temperature gradient calculation and mode determination; the controller calculates the maximum temperature difference ΔTmax and the average temperature Tavg at the current moment. The maximum temperature difference ΔTmax is the difference between the hottest point and the coldest point among all temperature detection units; if ΔTmax < ΔTref, where ΔTref is the target temperature difference, such as 3 °C, and Tavg < Thigh, where Thigh is the target temperature, it is determined as the "uniform heat dissipation mode". At this time, the fan is controlled to maintain a low-speed energy-saving state, such as 1400 - 1600 RPM, to reduce noise and power consumption; if ΔTmax ≥ ΔTref, it is determined as the "differentiated heat dissipation mode", and step S103 is entered.

[0048] Step S103: Zoned speed adjustment based on hotspot location; Based on the data from the temperature detection component 8, identify the specific location of the hotspot and execute the corresponding control strategy: full-power strong wind mode or pulse adjustment mode.

[0049] The heat dissipation system and heat dissipation system control method provided by the present invention achieve refined on-demand heat dissipation: unlike traditional heat sinks that rely on a single sensor for simple PID (Proportional-Integral-Derivative) control, the present invention utilizes the temperature detection component 8 on the surface of the heat-conducting base 2 to achieve accurate spatial perception of the heat source distribution. By combining a zone-based speed control algorithm, the fan strategy can be dynamically adjusted according to the hot spot location, i.e., the center or the edge, avoiding a one-size-fits-all full-power operation. This significantly reduces standby noise and energy consumption of electronic devices, improving PUE (Power Usage Effectiveness). It also enhances the sensitivity of heat dissipation response: because the temperature sensor is directly attached to the upper surface of the heat-conducting base 2, close to the heat source, its thermal response speed is much faster than that of sensors traditionally mounted on the heat sink fins. Combined with a pulsed airflow strategy, it can effectively break down boundary layer thermal resistance, further improving the heat exchange efficiency of the second heat sink fin group, i.e., the edge area. Finally, it enhances system reliability: through predictive control logic, intervention occurs before the temperature reaches a dangerous threshold, avoiding thermal shock to core components caused by instantaneous high temperatures, and extending the lifespan of electronic devices.

[0050] The heat dissipation system and its control method provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of these embodiments are merely for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of this invention.

Claims

1. A heat dissipation system, characterized in that, include: The heat-conducting base (2) is used to conduct heat to the heat-generating component; The first heat exchange component (6) and the second heat exchange component (7) are both connected to the heat-conducting base (2) to conduct the heat of the heat-conducting base (2). The first heat exchange component (6) is located in the central area of ​​the heat-conducting base (2), and the second heat exchange component (7) is located in the edge area of ​​the heat-conducting base (2). A fan assembly (1) is disposed on the heat-conducting base (2), and the air outlet surface of the fan assembly (1) faces the first heat exchange assembly (6). An airflow gap parallel to the airflow direction is formed in the first heat exchange assembly (6), and an airflow gap perpendicular to the airflow direction is formed in the second heat exchange assembly (7). The temperature detection component (8) includes several temperature detection units, each of which is arranged in an array on the heat-conducting base (2). The temperature detection units are used to acquire temperature data of each target area unit in the central region and the edge region. The controller is connected to both the temperature detection component (8) and the fan component (1), and the controller is used to adjust the output power of the fan component (1) according to the temperature data of each target area unit.

2. The heat dissipation system according to claim 1, characterized in that, The first heat exchange component (6) includes a first heat dissipation fin group and a plurality of heat pipes (3). Each heat pipe (3) is arranged along the airflow direction. The heat pipe (3) is embedded inside the first heat dissipation fin group. The evaporation section (31) of the heat pipe (3) is connected to the heat-conducting base (2). The condensation section (32) of the heat pipe (3) extends from one side close to the heat-conducting base (2) to the other side and passes through the first heat dissipation fin group.

3. The heat dissipation system according to claim 2, characterized in that, It also includes a positioning boss (5), the heat-conducting base (2) is plate-shaped, the positioning boss (5) is disposed on the top surface of the heat-conducting base (2), and the positioning boss (5) has several mounting grooves (10) on the side surface away from the heat-conducting base (2); the heat pipe (3) has an inverted U-shaped structure, the evaporation section (31) of the heat pipe (3) is fixed in the mounting groove (10), and the condensation section (32) of the heat pipe (3) extends to the top outer side of the first heat dissipation fin group; the first heat dissipation fin group and the surface of the positioning boss (5) are spaced apart.

4. The heat dissipation system according to claim 2, characterized in that, The second heat exchange component (7) includes a plurality of second heat dissipation fin groups, which are located on both sides of the surface edge region of the heat-conducting base (2); the second heat dissipation fin groups are respectively disposed on both sides of the first heat dissipation fin group along the direction perpendicular to the airflow; each heat dissipation fin in the second heat dissipation fin group is arranged along the airflow direction and forms an airflow gap perpendicular to the airflow direction between adjacent heat dissipation fins. Furthermore, the plane on which each heat dissipation fin in the first heat dissipation fin group is located is parallel to the surface of the heat-conducting base (2), and the arrangement direction is perpendicular to the surface of the heat-conducting base (2); the plane on which each heat dissipation fin in the second heat dissipation fin group is located is perpendicular to the surface of the heat-conducting base (2), and the arrangement direction is parallel to the airflow direction.

5. The heat dissipation system according to claim 2, characterized in that, The upper surface of the heat-conducting base (2) facing the first heat dissipation fin group and the lower surface away from the first heat dissipation fin group are both planes. The lower surface of the heat-conducting base (2) is provided with a heat-conducting coating. The temperature detection unit is evenly distributed on the upper surface of the heat-conducting base (2).

6. The heat dissipation system according to any one of claims 2 to 5, characterized in that, It also includes a flow guide component located on the side of the first heat exchange assembly (6) away from the heat-conducting base (2), the flow guide component being used to gather the airflow from the fan assembly (1).

7. The heat dissipation system according to claim 6, characterized in that, The flow guiding component includes several arc-shaped flow guiding plates (4), which are arranged adjacent to the condensation section (32) of the heat pipe (3) and correspond one-to-one with the heat pipe (3); and in the width direction of the first heat dissipation fin group, the length of the arc-shaped flow guiding plate (4) is consistent with the width of the first heat dissipation fin group, and the arc surface of the arc-shaped flow guiding plate (4) is convex away from the first heat dissipation fin group; the width direction of the first heat dissipation fin group refers to the direction perpendicular to the heat conduction base (2) and perpendicular to the airflow direction.

8. A method for controlling a heat dissipation system, employing the heat dissipation system as described in any one of claims 1 to 7, characterized in that, Includes the following steps: Based on the temperature data of each temperature detection unit, the temperature of each target area unit in the central region and the edge region is determined; Calculate the maximum temperature difference and average temperature of each target area unit at the current time. When the maximum temperature difference is less than the target temperature difference and the average temperature is less than the target temperature, control the fan assembly (1) to be in a low-speed energy-saving state. When the maximum temperature difference is greater than or equal to the target temperature difference, the absolute difference between the temperature of the edge region and the temperature of the center region is determined. When the absolute difference is greater than a preset difference and the temperature of the edge region is less than the temperature of the center region, the fan assembly (1) is controlled to be in full-power strong wind mode. When the absolute difference is greater than a preset difference and the temperature of the edge region is greater than the temperature of the center region, the fan assembly (1) is controlled to be in pulse adjustment mode.

9. The heat dissipation system control method according to claim 8, characterized in that, When the fan assembly (1) is in full-power strong wind mode, the speed of the fan assembly (1) is controlled to increase to the maximum value; When the fan assembly (1) is in the pulse regulation mode, the fan assembly (1) is controlled to run at a preset speed and a pulse width modulation signal is superimposed.

10. The heat dissipation system control method according to claim 8 or 9, characterized in that, It also includes the following steps: The temperature change rate of each of the temperature detection units is monitored in real time. When the temperature change rate is greater than the target change rate, an early warning signal is issued so that the electronic device can pre-reduce the frequency of the heat-generating component or adjust the task scheduling for the heat-generating component.

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