一种修补方法及修补装置
By scanning and automatically repairing the non-coplanar areas of server motherboard components before insertion, the problem of poor soldering caused by the non-coplanar bottom of the inserted components was solved, improving production efficiency and quality and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- INSPUR SUZHOU INTELLIGENT TECH CO LTD
- Filing Date
- 2026-06-15
- Publication Date
- 2026-07-17
AI Technical Summary
In server motherboard manufacturing, problems such as poor soldering, tilting, floating, or skew caused by non-coplanar bottoms of plug-in components are difficult to detect and handle in a timely manner, affecting production efficiency and product yield, and resulting in high rework costs.
Before insertion, the support area on the bottom surface of the target component, excluding the pin positions, is scanned to obtain image information, determine whether there are non-coplanar areas, and perform automatic repairs when necessary, including filling repair parts and covering with cover plates, to ensure the stability of the component.
It enables automatic identification of non-coplanar issues, avoids poor soldering, reduces rework and board damage, improves production efficiency and quality, and reduces costs.
Smart Images
Figure CN122415601A_ABST