Method for producing a copper-clad aluminium busbar with a zinc-nickel-tin solder joint
By constructing a copper-clad aluminum busbar with zinc-nickel-tin bonding, an Al-Zn-Ni-Sn-Cu gradient structure was built, which solved the problems of electrochemical corrosion, interfacial bonding strength and brittle phase formation in high-reliability scenarios. This resulted in improved interfacial shear strength and excellent salt spray resistance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANDONG UNIV OF TECH
- Filing Date
- 2026-05-22
- Publication Date
- 2026-07-17
AI Technical Summary
Existing copper-clad aluminum composite arrays have drawbacks in high-reliability scenarios, including potential electrochemical corrosion, low interfacial bonding strength, difficulty in controlling brittle phases, and challenges in safety and uniformity control. They are particularly deficient in terms of electrochemical corrosion, interfacial shear strength, and brittle phase formation.
A method for preparing copper-clad aluminum busbars using zinc-nickel-tin solder layers includes steps such as aluminum busbar surface pretreatment, zinc immersion treatment, nano-nickel plating, hot-dip tin treatment, copper strip preparation and precision blanking, high-frequency induction heating melting welding, deformation strengthening and finishing and annealing, to construct an Al-Zn-Ni-Sn-Cu gradient structure and form a sacrificial anode and metallurgical bond.
It achieves an interfacial shear strength of ≥50MPa, excellent salt spray resistance and conductivity, ensuring the high reliability and stability of copper-clad aluminum busbars, and solving the problems of electrochemical protection, interfacial bonding strength and brittle phase formation.
Smart Images
Figure CN122417554A_ABST