electronic devices

Abstract

This application provides an electronic device, relating to the field of communication equipment technology, for solving the problem of how to improve the reliability of the connection between a circuit board and a mid-frame. Specifically, the first mid-frame of the electronic device includes a first surface and a second surface. A first mounting groove on the first surface includes a first groove sidewall, a second groove sidewall, and a first groove bottom wall. The first groove bottom wall includes a first connection area. A portion of the surface of the first metal connecting portion of the first mid-frame forms the first connection area. A portion of the surface of the second metal connecting portion of the first metal frame segment forms a second connection area. A first circuit board is disposed in the first mounting groove, and the first groove sidewall and the second groove sidewall are located around the periphery of the first circuit board. A first metal sheet is stacked with and connected to the first circuit board and is electrically conductive thereto. The first metal sheet is also fixedly connected to the first connection area. A second metal sheet is stacked with and connected to the first circuit board and is electrically conductive thereto. The second metal sheet is also fixedly connected to the second connection area.

Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and more particularly to an electronic device. Background Technology

[0002] Electronic devices (such as mobile phones, tablets, and watches) typically incorporate antennas to transmit or receive signals, enabling communication capabilities. In related technologies, the antenna may include an antenna radiating element and a grounding circuit board. The grounding circuit board provides an electrical connection between the antenna radiating element and a reference ground component, ensuring electrical conduction between them. Tuning devices (such as inductors and capacitors) can be mounted on the grounding circuit board to tune the antenna, ensuring the received signal frequency meets requirements and thus improving the communication performance of the electronic device. While the grounding circuit board can be mounted sideways to the frame of the electronic device, this results in a less reliable connection between the circuit board and the frame, consequently reducing the overall reliability of the electronic device. Summary of the Invention

[0003] This application provides an electronic device for solving the problem of how to improve the connection reliability between the grounding circuit board and the middle frame of an antenna.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] This application provides an electronic device, which includes a first middle plate, a first metal frame segment, a first circuit board, a first metal sheet, and a second metal sheet. The first middle plate includes a first surface and a second surface arranged along its thickness direction. The first surface has a first mounting groove, which includes a first groove sidewall, a second groove sidewall, and a first groove bottom wall. The first groove bottom wall includes a first connecting region. The first middle plate includes a first metal connecting portion, a portion of which forms the first connecting region. The first metal frame segment is located on the outer periphery of the first middle plate and spaced apart from the first metal connecting portion. The first metal frame segment includes a main body segment and a second metal connecting portion. The second metal connecting portion is located on the side of the main body segment facing the first middle plate, a portion of which forms a second connecting region. The orientation of the second connecting region is the same as that of the first connecting region. The first circuit board is disposed within the first mounting groove, and the thickness direction of the first circuit board is parallel to the thickness direction of the first middle plate. The first groove sidewall and the second groove sidewall are located around the first circuit board to restrict movement of the first circuit board relative to the first middle plate. A first metal sheet is stacked on top of a first circuit board and connected to and electrically conductive with the first circuit board. The first metal sheet is also fixedly connected to a first connection area and electrically conductive with a first metal connection portion to be electrically conductive with a reference ground. A second metal sheet is spaced apart from the first metal sheet, stacked on top of the first circuit board and connected to and electrically conductive with the first circuit board. The second metal sheet is also fixedly connected to a second connection area and electrically conductive with a second metal connection portion.

[0006] The electronic device provided in this application embodiment includes a first middle plate comprising a first metal connecting portion, a first connecting area formed on a portion of the surface of the first metal connecting portion, a first metal frame segment comprising a second metal connecting portion, a second metal connecting area formed on a portion of the surface of the second metal connecting portion, a first metal sheet connected to and electrically conductively conducting with the first circuit board and the first connecting area, and a second metal sheet connected to and electrically conductively conducting with the second circuit board and the second connecting area, so that the antenna radiator formed by the first metal frame segment can be electrically conductively connected to the reference ground of the electronic device through the first metal sheet, the second metal sheet and the first circuit board and the first metal connecting portion, thereby ensuring the performance of the antenna.

[0007] By making the first connection area form part of the bottom wall of the first groove of the first mounting groove, the orientation of the second connection area is the same as that of the first connection area, the first metal sheet and the second metal sheet are both stacked with the first circuit board, the thickness direction of the first circuit board is the same as the thickness direction of the first middle plate, and the first groove sidewall and the second groove sidewall are located on the periphery of the first circuit board, so that when the tuning assembly formed by connecting the first metal sheet and the second metal sheet to the first circuit board is connected to the first connection area and the second connection area, the bottom wall of the first groove and the first groove sidewall and the second groove sidewall can restrict the movement of the tuning assembly along the thickness direction of the first middle plate and in a direction perpendicular to the thickness direction of the first middle plate, thereby reducing the difficulty of connecting the tuning assembly to the first middle plate and improving the yield of connecting the tuning assembly to the first middle plate, thereby improving the overall reliability of the electronic device.

[0008] Furthermore, by aligning the thickness of the first circuit board parallel to the thickness direction of the first intermediate board, the width of the first circuit board, the length of the first metal sheet, and the length of the second metal sheet are not limited by the thickness of the electronic device. This facilitates increasing the layout area of ​​the first circuit board, the connection area between the first metal sheet and the first connection area, and the connection area between the second metal sheet and the second connection area. This further improves the performance of the tuning component and the reliability of its connection with the first intermediate board and the first metal frame segment. Similarly, the thickness of the electronic device is not limited by the tuning component, thus saving space and contributing to a thinner and lighter design. Therefore, the assembly method of the tuning component and the first intermediate board is applicable to various types of electronic devices.

[0009] In some possible implementations, the electronic device also includes a tuning device disposed on a first circuit board, with a first metal plate and a second metal plate electrically connected to both ends of the tuning device, respectively.

[0010] In this way, impedance matching between the antenna radiator formed by the first metal frame segment and the radio frequency circuit can be achieved through the tuning device, and the resonant frequency of the antenna can be adjusted so that the frequency band of the antenna receiving signal and the frequency band of the reflected signal meet the requirements, thereby reducing signal reflection and loss and improving the communication performance of electronic equipment.

[0011] In some possible implementations, the first metal sheet includes a first part and a second part, the first part being connected to the first circuit board, the second part being located on the periphery of the first circuit board, and the second part being connected to the first connection area.

[0012] In some possible implementations, the second metal sheet includes a third part and a fourth part, the third part being connected to the first circuit board, the fourth part being located on the periphery of the first circuit board, and the fourth part being connected to the second connection area.

[0013] In some possible implementations, the first metal sheet includes a first part and a second part, the first part being connected to the first circuit board, the second part being located on the periphery of the first circuit board, and the second part being connected to the first connection area; the second metal sheet includes a third part and a fourth part, the third part being connected to the first circuit board, the fourth part being located on the periphery of the first circuit board, and the fourth part being connected to the second connection area.

[0014] In this way, the first metal sheet is connected to the first connection area through the second part located on the outer periphery of the first circuit board, and the second metal sheet is connected to the second connection area through the fourth part located on the outer periphery of the first circuit board. This facilitates the welding and fixing of the tuning component to the first middle plate and the first metal frame segment by welding (especially spot welding), thereby further improving the connection yield between the tuning component and the first middle plate and the first metal frame segment, and improving the overall reliability of the electronic device.

[0015] In some possible implementations, the second and fourth portions are located on the same side of the first circuit board and are both located between the first circuit board and the first metal frame segment.

[0016] In this way, the overall length of the tuning assembly in the arrangement direction of the first and second parts of the first metal sheet is relatively small, making the structure of the tuning assembly more compact and facilitating the placement of other components of the electronic device. At the same time, the length of the second metal connecting part of the first metal frame segment extending towards the first middle plate is also relatively small, making it easier to manufacture the first metal frame segment.

[0017] In some possible implementations, the tuning device, the first metal plate, and the second metal plate are all located on the side of the first circuit board facing the bottom wall of the first slot. The bottom wall of the first slot has a first groove, the tuning device is located in the first groove, and the first metal plate and the second metal plate are located on the periphery of the first groove.

[0018] In this way, the bottom wall of the first mounting groove can be flat on the periphery of the first recess, allowing the first and second metal sheets to be supported on the flat area. When the first and second metal sheets are welded to the first and second connection areas respectively, they are less likely to lift up, ensuring a high welding yield. Furthermore, the first recess can protect the tuning device, preventing damage from collisions with other components during the assembly of the electronic device.

[0019] In some possible implementations, the first surface has a second mounting groove located around the periphery of the first mounting groove, and the first groove penetrates the sidewall of the second mounting groove.

[0020] In this way, the tuning device can be functionally tested through the opening on the side wall of the second mounting groove in the first groove, thereby ensuring the overall ease of maintenance and reliability of the electronic equipment.

[0021] In some possible implementations, the tuning device and the first and second metal sheets are all located on the side of the first circuit board facing away from the second surface. The bottom wall of the first groove has a second recess, the first connection area and the second connection area are located on the periphery of the second recess, and the first circuit board is located within the second recess.

[0022] In this way, the bottom wall of the second groove can be a continuous plane, which can provide continuous support for the first circuit board and the tuning device, and prevent the first circuit board from being partially suspended and easily deformed, which would cause the tuning device to easily fall off the first circuit board and fail.

[0023] In some possible implementations, the electronic device also includes an elastic adhesive layer bonded between the first circuit board and the bottom wall of the second recess.

[0024] This increases the reliability of fixing the tuning component to the first intermediate plate. It also compensates for the thickness difference between the depth of the second groove and the thickness of the first circuit board when the depth of the second groove is greater than the thickness of the first circuit board due to manufacturing tolerances. This allows the first metal sheet and the second metal sheet to fit into the first connection area and the second connection area respectively when they are soldered to the first connection area and the second connection area, reducing the soldering difficulty and improving the soldering yield.

[0025] In some possible implementations, the first circuit board has a first through hole. The first portion has a first limiting protrusion that is fitted and received within the first through hole.

[0026] In this way, before the first metal sheet is welded and fixed to the first circuit board, it can be pre-positioned by the cooperation between the first limiting protrusion and the first through hole, which can prevent the first metal sheet from rotating relative to the first circuit board during the welding process, thus preventing a decrease in welding yield.

[0027] In some possible implementations, the first circuit board is a flexible circuit board. The electronic device also includes a reinforcing plate attached to the surface of the first circuit board opposite to the tuning device.

[0028] In this way, the reinforcing plate can enhance the mechanical strength and stability of the first circuit board, especially the mechanical strength and stability of the soldering area of ​​the first circuit board, and prevent problems such as bending and tensile loss caused by the thinness and flexibility of the first circuit board itself, which would lead to a low connection yield of the tuning device, the first metal sheet, the second metal sheet and the first circuit board.

[0029] In some possible implementations, the reinforcing plate has a second through hole, which is disposed opposite to the first through hole, and the first limiting protrusion passes through the second through hole.

[0030] This increases the height of the first limiting protrusion along the thickness direction of the first circuit board, improves the overall strength of the first metal sheet, and thus improves the reliability of pre-positioning.

[0031] In some possible implementations, the inner wall of the second through hole is located on the outer periphery of the first through hole. The electronic device also includes a first filler, a portion of which is located between the inner wall of the first through hole and the first limiting protrusion, and is connected to both the inner wall of the first through hole and the first limiting protrusion.

[0032] In this way, before the first part of the first metal sheet is soldered to the first circuit board, the first part can be initially connected to the first circuit board through the first filler. This ensures that the first metal sheet will not fall off the first circuit board during the movement of the tuning assembly, and also improves the reliability of the connection between the first metal sheet and the first circuit board.

[0033] In some possible implementations, the first circuit board includes a first metal layer that covers the inner wall of the first through-hole. The first filler is solder, and the first filler is connected to both the first metal layer and the first limiting protrusion.

[0034] This further ensures the reliability of the connection between the first part and the first circuit board. Furthermore, when the inner wall of the second through-hole of the reinforcing plate is located on the outer periphery of the inner wall of the first through-hole, it provides overflow space when the solder melts and expands due to heat, preventing the solder expansion from squeezing the first circuit board and causing it to warp, thus affecting the reliability of the connection between the tuning device and the first circuit board.

[0035] In some possible implementations, the first circuit board includes a first side surface, and the second part includes a second side surface, the second side surface facing the same direction as the first side surface. The first groove sidewall includes a first region and a second region, the first region facing the first side surface; the second region is located on the side of the first region opposite to the first side surface.

[0036] In this way, the first region can cooperate with the first side to restrict the movement of the tuning component relative to the first middle plate, thereby improving the yield of the tuning component connecting to the first middle plate and the first metal frame segment. The second side allows for a longer extension length of the protrusion forming the first groove sidewall, resulting in a thicker local portion of the first middle plate, ensuring the strength of the first middle plate, and thus ensuring the overall strength of the electronic device. Based on this, by positioning the second region on the side of the first region opposite to the first side, it is possible to prevent the second region from jamming against the second part when the welding tolerance between the first metal sheet and the first circuit board causes an angle between the second side and the first side, thus preventing the tuning component from being connected to the first middle frame.

[0037] In some possible implementations, the first mounting slot also has a third slot sidewall, which is located on opposite sides of the first slot sidewall and the first slot sidewall. There is a mating clearance between the first circuit board and both the first slot sidewall and the third slot sidewall. The second slot sidewall is located between the first slot sidewall and the third slot sidewall.

[0038] In some possible implementations, the first surface also has a fourth groove sidewall, which is located on opposite sides of the second groove sidewall and the first circuit board. There is a mating gap between the first circuit board and the second groove sidewall and the fourth groove sidewall. At least a portion of the first groove sidewall is located between the second groove sidewall and the fourth groove sidewall.

[0039] In some possible implementations, the first mounting groove also has a third groove sidewall, which is located on opposite sides of the first groove sidewall and the first groove sidewall, and there is a fitting clearance between the first circuit board and both the first groove sidewall and the third groove sidewall; the second groove sidewall is located between the first groove sidewall and the third groove sidewall; the first surface also has a fourth groove sidewall, which is located on opposite sides of the first circuit board and the second groove sidewall, and there is a fitting clearance between the first circuit board and both the second groove sidewall and the fourth groove sidewall; at least a portion of the first groove sidewall is located between the second groove sidewall and the fourth groove sidewall.

[0040] In this way, the movement of the tuning component relative to the first middle plate along the arrangement direction of the first groove sidewall, the third groove sidewall, and the second groove sidewall, and the fourth groove sidewall can be restricted. The corresponding fit clearance can also prevent the groove sidewall of the first mounting groove from squeezing the first circuit board due to manufacturing tolerances, thus reducing the reliability of the tuning component.

[0041] In some possible implementations, the first surface has a raised portion, and a fourth groove sidewall is formed in the raised portion; the first middle plate also has a third through hole, which is spaced apart from the first mounting groove. The first middle plate also has a first mounting hole, the opening of which is located on the second surface, and a portion of which is formed in the raised portion. The electronic device also includes a first cover plate and a first connector. The first cover plate is located on the side of the second surface opposite to the first surface and covers the third through hole to enclose a battery mounting groove for accommodating a battery; the first connector passes through the first cover plate and is fixedly connected to the first mounting hole.

[0042] In this way, the protruding part of the first surface can limit the position of the tuning component and also be used to fix the first cover plate and other disassembled structures. It makes full use of the area with high strength of the first middle plate, making the overall structure of the first middle frame more compact and reliable.

[0043] In some possible implementations, the first middle plate includes a first main body and a plastic insert. The first main body is a metal structural component. A portion of the first main body forms a second metal connecting portion. The plastic insert is connected between the first main body and the first metal frame segment. A portion of the surface of the plastic insert forms a portion of the bottom wall of the first groove.

[0044] In this way, the plastic insert, being an insulating structure, allows the antenna to have a larger clearance height, improving its radiation efficiency and thus enhancing the wireless communication performance of the electronic device. Furthermore, the plastic insert can reduce the weight of the electronic device, contributing to its lightweight design.

[0045] In some possible implementations, along the thickness direction of the first middle plate, the projection of the third part on the bottom wall of the first groove is located on the plastic insert.

[0046] In this way, the third part of the second metal sheet can be insulated from the bottom wall of the first mounting groove, preventing the second metal sheet from short-circuiting with the first main body of the first middle plate, so that the tuning device cannot play the role of tuning the antenna frequency band. Attached Figure Description

[0047] Figure 1 Perspective views of electronic devices provided in some embodiments of this application in an unfolded state;

[0048] Figure 2 for Figure 1 A partial exploded view of the electronic device shown.

[0049] Figure 3 for Figure 1 The diagram shows the structure of the electronic device in a folded state.

[0050] Figure 4 for Figure 2A schematic diagram of the structure of the first middle frame of the electronic device shown;

[0051] Figure 5 for Figure 4 The exploded structure diagram of the first middle frame shown;

[0052] Figure 6 for Figure 4 Enlarged view of point A in the middle;

[0053] Figure 7 for Figure 4 A schematic diagram of the structure of the first metal frame segment of the first middle frame shown;

[0054] Figure 8 for Figure 4 A schematic diagram of an assembly structure of the first middle frame and the tuning component is shown.

[0055] Figure 9 for Figure 8 The diagram shows the structure of the tuning component.

[0056] Figure 10 for Figure 2 A schematic diagram of another assembly structure of the first middle frame and the tuning component of the electronic device shown.

[0057] Figure 11 for Figure 10 An exploded view of the first middle block of the electronic device shown.

[0058] Figure 12 for Figure 10 A partial structural diagram of the first middle frame shown;

[0059] Figure 13 for Figure 10 A schematic diagram of a tuning component of the electronic device shown.

[0060] Figure 14 for Figure 13 A schematic diagram of the structure of the tuning component as viewed from another perspective;

[0061] Figure 15 for Figure 13 The exploded structure diagram of the tuning component is shown.

[0062] Figure 16 for Figure 9 Another schematic diagram of the tuning component of the electronic device shown;

[0063] Figure 17 for Figure 16 The cross-sectional structure of the tuning component shown is located at the BB line.

[0064] Figure 18 for Figure 10A top view of a portion of the structure of the electronic device shown.

[0065] Figure 19 for Figure 10 Another top view of a portion of the structure of the electronic device shown;

[0066] Figure 20 for Figure 18 The cross-sectional view of the electronic device shown at the CC line;

[0067] Figure 21 for Figure 18 The cross-sectional structure of the electronic device shown is located at the DD line.

[0068] Figure 22 for Figure 2 A schematic diagram of another assembly structure of the first middle frame and the tuning component of the electronic device shown.

[0069] Figure 23 for Figure 22 The diagram shows the cross-sectional structure of the electronic device at line EE.

[0070] Figure label:

[0071] 100 - Electronic devices;

[0072] 10 - Foldable screen; 11 - First screen section; 12 - Second screen section; 13 - Third screen section;

[0073] 20 - Support device; 21 - First housing; 211 - First middle frame; 211a - Battery mounting slot; 2111 - First frame; 2111a - Gap; 2111b - Second connecting area; 2111c - Third connecting area; 21111 - First metal frame segment; 21111a - Main body segment; 21111b - Second metal connecting part; 21111c - Third metal connecting part; 2112 - First middle plate; 2112a - First surface; 2112a1 - First connecting area; 2112a2 - First groove; 2112a3 - First groove sidewall; A1 - First area; A2 - Second area; 2112a4 - Second groove sidewall; 2112a5 - Third groove sidewall; A3 - Third area; A4 - Fourth area Domain; 2112a6 - Fourth groove sidewall; 2112a7 - Fifth groove sidewall; 2112a8 - Sixth groove sidewall; 2112a9 - Second groove; 2112b - Second surface; 2112d - Second mounting groove; 2112c - First mounting groove; 2112e - Protrusion; 2112f - Third through hole; 2112g - First mounting hole; 21121 - First main body; 21122 - Plastic insert; 21122a - Protrusion; 2113 - First cover plate; 2113a - Second mounting hole; 2114 - First connector; 212 - First back cover; 22 - Second housing; 221 - Second middle frame; 2211 - Second frame; 2212 - Second middle plate; 222 - Second back cover; 23 - Rotating shaft mechanism;

[0074] 30 - Tuning component; 31 - First circuit board; 31a - Third surface; 31b - Fourth surface; 31c - First side surface; 31d - Third side surface; 31e - Fourth side surface; 31f - Fifth side surface; 31g - First through hole; 31h - Fourth through hole; 32 - Reinforcing plate; 32a - Second through hole; 32b - Fifth through hole; 33 - First metal sheet; 331 - First part; 331a - First limiting protrusion; 332 - Second part; 3321 - Second side surface; 34 - Second metal sheet; 341 - Third part; 341a - Second limiting protrusion; 342 - Fourth part; 3421 - Sixth side surface; 35 - Tuning device; 36 - First filler; 37 - Second filler; 38 - Elastic adhesive layer. Detailed Implementation

[0075] In the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0076] In the embodiments of this application, it should be understood that the directional terms mentioned, such as "up", "down", "left", "right", "inner", "outer", etc., are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0077] In the embodiments of this application, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," "fourth," "fifth," and "sixth" may explicitly or implicitly include one or more of that feature.

[0078] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0079] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0080] In the embodiments of this application, it should be noted that the descriptions of "vertical" and "parallel" respectively indicate approximately vertical and approximately parallel within a certain error range. The error range can be a range with a deviation angle of less than or equal to 5°, 8°, 10° or 15° relative to absolute verticality and absolute parallelism, respectively, and is not specifically limited here.

[0081] This application provides an electronic device, which can be an electronic device with wireless communication capabilities. This electronic device includes, but is not limited to, mobile phones, tablet personal computers, personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices, in-vehicle devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical care, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, and wireless terminals in smart homes, etc., as well as other mobile or fixed terminals.

[0082] This application uses an electronic device as an example to illustrate a handheld device with wireless communication capabilities, such as a mobile phone, which may be a foldable screen phone.

[0083] Please see Figure 1 and Figure 2 , Figure 1 This is a perspective view of the electronic device 100 provided in some embodiments of this application in its unfolded state. Figure 2 for Figure 1 The diagram shows a partially exploded view of the electronic device 100. In its unfolded state, the electronic device 100 is approximately rectangular flat. For ease of description in the following embodiments, an XYZ coordinate system is established for the electronic device 100 in its unfolded state, defining the length direction of the electronic device 100 as the X-axis, the width direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system setting of the electronic device 100 can be flexibly configured according to actual needs and is not specifically limited here. In other embodiments, the shape of the electronic device 100 may also be a square flat plate, a circular flat plate, an elliptical flat plate, etc.

[0084] The electronic device 100 includes a folding screen 10 and a support device 20.

[0085] The foldable screen 10 is the screen of the electronic device 100, used to display images, videos, and other information. The foldable screen 10 can be an organic light-emitting diode (OLED) screen, a micro-organic light-emitting diode (microorganic light-emitting diode) screen, a quantum dot light-emitting diode (QLED) screen, a liquid crystal display (LCD), etc.

[0086] The foldable screen 10 has a display area for displaying image information, and the display area of ​​the foldable screen 10 is exposed to facilitate the presentation of images, videos, and other information to the user. The foldable screen 10 includes a first screen portion 11, a second screen portion 12, and a third screen portion 13 connected in sequence. Figure 1 and Figure 2 In the illustrated embodiment, the foldable screen 10 is in the unfolded state, with the first screen portion 11, the second screen portion 12, and the third screen portion 13 arranged sequentially along the X-axis, thus the electronic device 100 folds laterally. In other embodiments, when the foldable screen 10 is in the unfolded state, the first screen portion 11, the second screen portion 12, and the third screen portion 13 may also be arranged sequentially along the Y-axis, thus the electronic device 100 folds vertically. When the foldable screen 10 is in the unfolded state, a large-screen display can be achieved, providing users with richer information and a better user experience.

[0087] At least the second screen portion 12 of the foldable screen 10 is a flexible screen structure. Thus, the second screen portion 12 can bend and deform under external force, allowing the foldable screen 10 to... Figure 1 The unfolded state is folded to the folded state. The first screen portion 11 and the third screen portion 13 of the foldable screen 10 can be flexible screen structures, rigid screen structures, or a combination of both. No specific limitations are made here.

[0088] Please see Figure 3 , Figure 3 for Figure 1The diagram shows the structure of the electronic device 100 in a folded state, where the foldable screen 10 is also folded. Specifically, when the foldable screen 10 is folded, the first screen portion 11 and the third screen portion 13 are approximately parallel and opposite to each other. It should be noted that the angle between the first screen portion 11 and the third screen portion 13 is within 30°, and they can be considered approximately parallel. The first screen portion 11 and the third screen portion 13 being opposite to each other means that the display surface of the first screen portion 11 faces the display surface of the third screen portion 13.

[0089] Please continue reading. Figure 3 The support device 20 is used to support the folding screen 10. When the electronic device 100 is in the folded state, the support device 20 protects the folding screen 10 from the outside, and the folding screen 10 is not visible to the user. That is, the electronic device 100 is an inward-folding electronic device, which can prevent the folding screen 10 from being scratched by hard objects. In some other embodiments, when the electronic device 100 is in the folded state, the folding screen 10 can also be located outside the support device 20, and the folding screen 10 is visible to the user. That is, the electronic device 100 is an outward-folding electronic device, which can realize the display of video and images in the folded state.

[0090] The support device 20 includes a first housing 21, a second housing 22, and a pivot mechanism 23. The first housing 21 supports the first screen portion 11, and the second housing 22 supports the third screen portion 13. The pivot mechanism 23 connects the first housing 21 and the second housing 22 and supports the second screen portion 12, meaning the second screen portion 12 of the foldable screen 10 is supported on the pivot mechanism 23. The pivot mechanism 23 is used to enable rotation between the second housing 22 and the first housing 21 to support the folding of the foldable screen 10 between the unfolded and folded states.

[0091] Please return to the reference. Figure 2 The first housing 21 may include a first middle frame 211 and a first back cover 212. The first middle frame 211 may include a first edge frame 2111 and a first middle plate 2112, with the first edge frame 2111 surrounding the outer peripheral edge of the first middle plate 2112. Based on this, the first screen portion 11 of the foldable screen 10 can be glued and fixed to the first middle plate 2112, that is, the first screen portion 11 and the first middle plate 2112 are stacked and located on one side of the first middle plate 2112.

[0092] The first back cover 212 is located on the side of the first middle plate 2112 opposite to the first screen portion 11. The first back cover 212 is fixed to the first frame 2111 and can be replaced with a display screen (such as an LCD display screen). In some examples, the first back cover 212 can be fixed to the first frame 2111 by means of adhesive, snap-fit, etc. In other examples, the first back cover 212 can also be integrally formed with the first frame 2111, that is, the first back cover 212 and the first frame 2111 are a single structural component. The first back cover 212, the first frame 2111, and the first middle plate 2112 enclose a first receiving cavity. Based on this, the first housing 21 can be connected to the rotating shaft mechanism 23 through the first middle frame 211.

[0093] Please continue reading. Figure 2 The second housing 22 may include a second middle frame 221 and a second back cover 222. The second middle frame 221 may include a second side frame 2211 and a second middle plate 2212. The second side frame 2211 surrounds the outer peripheral edge of the second middle plate 2212, that is, the second middle plate 2212 is located inside the second side frame 2211. Based on this, the third screen portion 13 of the folding screen 10 can be glued and fixed to the second middle plate 2212, that is, the third screen portion 13 is stacked with the second middle plate 2212 and located on one side of the second middle plate 2212. The pivot mechanism 23 can be connected between the first middle frame 211 and the second middle frame 221.

[0094] The second back cover 222 is located on the side of the second middle plate 2212 opposite to the third screen portion 13. The second back cover 222 is fixed to the second frame 2211 and can be replaced with a display screen (such as an LCD display). In some examples, the second back cover 222 can be fixed to the second frame 2211 by adhesive, snap-fit, or other means. In other examples, the second back cover 222 can also be integrally formed with the second frame 2211, that is, the second back cover 222 and the second frame 2211 are a single structural component. The second back cover 222, the second frame 2211, and the second middle plate 2212 enclose a second receiving cavity. This second receiving cavity and the aforementioned first receiving cavity are used to accommodate electronic components such as the main circuit board, the sub-circuit board, the speaker module, the camera module, and the battery.

[0095] Please see Figures 4-6 , Figure 4 for Figure 2 A schematic diagram of the structure of the first middle frame 211 of the electronic device 100 shown. Figure 5 for Figure 4 The diagram shows the exploded structure of the first middle frame 211. Figure 6 for Figure 4Enlarged view at point A. The first middle frame 211 includes a first side frame 2111, a first middle plate 2112, and a first cover plate 2113. The first middle plate 2112 includes a first main body portion 21121 and a plastic insert 21122, which connects the first main body portion 21121 and the first side frame 2111. Both the first main body portion 21121 and the first side frame 2111 can be metal structural components, and the first main body portion 21121 can form a reference ground structural component of the electronic device 100. For example, the first main body portion 21121 can be an aluminum structural component, an aluminum alloy structural component, a magnesium structural component, a magnesium alloy structural component, or a stainless steel structural component; the first side frame 2111 can be an aluminum structural component, an aluminum alloy structural component, a magnesium structural component, a magnesium alloy structural component, or a stainless steel structural component. The material of the first side frame 2111 can be the same as or different from the material of the first main body portion 21121.

[0096] In this way, the first frame 2111 and the first middle plate 2112 have high strength and toughness as well as good aesthetics, giving the first middle frame 211 good strength and toughness as well as good aesthetics. In addition, the first middle plate 2112 has good thermal conductivity, which is beneficial to the heat dissipation of the electronic device 100. At the same time, when the first main body 21121 can form a reference ground structure of the electronic device 100, the plastic insert 21122 can make a part of the first middle plate 2112 have insulating properties.

[0097] The first middle plate 2112 includes a first surface 2112a and a second surface 2112b (not shown in the figure) arranged along the thickness direction (Z-axis direction). A portion of the surface of the first main body 21121 forms a part of the first surface 2112a, and a portion of the surface of the plastic insert 21122 forms a part of the first surface 2112a; a portion of the surface of the first main body 21121 forms a part of the second surface 2112b, and a portion of the surface of the plastic insert 21122 forms a part of the second surface 2112b. The aforementioned first screen portion 11 is fixed to the second surface 2112b, and the first back cover 212 faces the first surface 2112a. Based on this, a portion of the first main body 21121 forms a first metal connection portion, that is, the first middle plate 2112 includes the first metal connection portion. Based on this, the first surface 2112a has a first mounting groove 2112c, the first mounting groove 2112c includes a first groove bottom wall, the first groove bottom wall is the wall of the first mounting groove 2112c facing away from the second surface 2112b, the first groove bottom wall includes a first connection area 2112a1, and a portion of the surface area of ​​the first metal connection portion forms the first connection area 2112a1.

[0098] Please continue reading. Figures 4-6The first frame 2111 includes multiple spaced-apart frame segments, with gaps 2111a between adjacent frame segments, allowing the first frame 2111 to form multiple antenna radiators. This eliminates the need for additional antenna radiators, simplifying the structure of the electronic device 100. Based on this, the plastic insert 21122 has protrusions 21122a that extend towards the outer side of the first frame 2111. These protrusions correspond one-to-one with and fill the gaps 2111a, improving the overall aesthetics of the electronic device 100. Furthermore, the plastic insert 21122 is an insulating structure, ensuring a sufficiently large distance between the radiating element of the antenna radiator and the first main body 21121. This guarantees a large headroom for the antenna, improving its radiation efficiency and thus enhancing the wireless communication performance of the electronic device 100.

[0099] Specifically, please refer to Figure 4 , Figure 5 and Figure 7 , Figure 7 for Figure 4 The diagram shows the structure of the first metal frame segment 21111 of the first middle frame 211. The first frame 2111 includes the first metal frame segment 21111, which is located on the outer periphery of the first middle plate 2112. A portion of the first metal frame segment 21111 can extend along the X-axis direction, and another portion can extend along the Y-axis direction. In some other embodiments, the first metal frame segment 21111 may extend only along the X-axis direction or the Y-axis direction. The first metal frame segment 21111 is spaced apart from the first main body portion 21121, that is, the first metal frame segment 21111 is spaced apart from the first metal connecting portion.

[0100] The first metal frame segment 21111 includes a main body segment 21111a, a second metal connecting portion 21111b, and a third metal connecting portion 21111c. The main body segment 21111a extends circumferentially along the first middle plate 2112. The second metal connecting portion 21111b and the third metal connecting portion 21111c are located on the side of the main body segment 21111a facing the first middle plate 2112, and are spaced apart. Based on this, the plastic insert 21122 can cover a portion of the surface of the second metal connecting portion 21111b and a portion of the surface of the third metal connecting portion 21111c. A portion of the surface of the second metal connecting portion 21111b is exposed to form a second connecting region 2111b, and a portion of the surface of the third metal connecting portion 21111c is exposed to form a third connecting region 2111c. The third connecting region 2111c has the same orientation as the first connecting region 2112a1 and is opposite to the second surface 2112b. The orientation of the second connecting region 2111b is perpendicular to the orientation of the first connecting region 2112a1.

[0101] In this way, the main body segment 21111a of the first metal frame segment 21111 can form a radiating unit for radiating signals to the outside of the electronic device 100 and receiving signals from the outside of the electronic device. The third metal connection portion 21111c can form a feed terminal. The radio frequency circuit of the main circuit board can be connected to the third connection area 2111c via a feed wire to feed radio frequency signals, or it can couple energy to the third connection area 2111c via electrical coupling or magnetic coupling to feed radio frequency signals. The second metal connection portion 21111b can form a tuning terminal for conducting to the reference ground of the electronic device 100 through a tuning device (such as an inductor and / or capacitor) to form a loop. In this way, by adjusting the inductance, capacitance and topology of the tuning device, impedance matching between the first metal frame segment 21111 and the radio frequency circuit can be achieved, the resonant frequency of the first metal frame segment 21111 can be adjusted so that it operates in the required frequency band, and the resonant bandwidth and reflection coefficient depth can be changed. Within the effective operating bandwidth, signal reflection and loss can be minimized, thereby improving the wireless communication performance of the electronic device 100. In addition, electromagnetic interference can be reduced and the stability and reliability of the antenna can be improved.

[0102] Please return to the reference. Figure 5 and Figure 6 The first middle plate 2112 has a third through hole 2112f, which penetrates the first surface 2112a and the second surface 2112b. The third through hole 2112f is located on the periphery of the first mounting groove 2112c and is spaced apart from the first mounting groove 2112c. The first cover plate 2113 is located on the side of the second surface 2112b opposite to the first surface 2112a and covers the third through hole 2112f. The first cover plate 2113 is fixedly connected to the first middle plate 2112 and forms a battery mounting groove 211a with the inner wall of the third through hole 2112f. The battery (not shown in the figure) is accommodated and fixed in the battery mounting groove 211a, that is, the battery mounting groove 211a is used to accommodate the battery. Specifically, the first cover plate 2113 can be fixedly connected to the first middle plate 2112 by means of snap-fit, threaded connection, etc.

[0103] Please see Figure 8 and Figure 9 , Figure 8 for Figure 4 The diagram shows an assembly structure of the first middle frame 211 and the tuning component 30. Figure 9 for Figure 8The diagram shows the structure of the tuning component 30. The electronic device 100 also includes the tuning component 30. The tuning component 30 includes a first circuit board 31, a reinforcing plate 32, a first metal sheet 33, a second metal sheet 34, and a tuning device 35. The first circuit board 31 is a flexible printed circuit (FPC), whose shape can be changed to flexibly fit inside the electronic device 100 according to its overall layout. Even in situations where the internal space of the electronic device 100 is limited, it can be assembled and fixed with the first middle frame 211 to achieve electrical connection between components.

[0104] The first circuit board 31 is generally rectangular in shape and has a third surface 31a and a fourth surface 31b arranged along its thickness direction. A tuning device 35 is disposed on the first circuit board 31. Specifically, the tuning device 35 can be fixed to the third surface 31a of the first circuit board 31 by adhesive bonding or surface mount technology (SMT) and is electrically connected to the metal traces on the first circuit board 31. The tuning device 35 may include at least one of an inductor and a capacitor. There may be one or more tuning devices 35. When there are multiple tuning devices 35, they can form a tuning network through the metal traces on the first circuit board 31, consisting of series, parallel, or series-parallel combinations.

[0105] The reinforcing plate 32 is attached to the fourth surface 31b, that is, the reinforcing plate 32 is attached to the surface of the first circuit board 31 opposite to the tuning device 35. The reinforcing plate 32 can enhance the mechanical strength and stability of the first circuit board 31, especially the mechanical strength and stability of the soldering area of ​​the first circuit board 31, preventing problems such as bending and tensile loss due to the thinness and flexibility of the first circuit board 31, which would lead to a low connection yield between the tuning device 35 and the first circuit board 31. The reinforcing plate 32 can be an epoxy glass cloth laminate or a metal plate. In some other embodiments, the first circuit board 31 can also be a rigid circuit board or a rigid-flex circuit board. In this case, the tuning assembly 30 may not include the reinforcing plate 32.

[0106] The first metal sheet 33 is connected to and electrically conductive with the first circuit board 31. Specifically, the first metal sheet 33 includes a first portion 331 and a second portion 332. The first portion 331 is located on the side facing the third surface 31a of the first circuit board 31. The first portion 331 can be soldered and fixed to the third surface 31a of the first circuit board 31 and electrically conductive with the metal lines on the first circuit board 31 to achieve electrical conductivity with one end of the tuning device 35, that is, the first portion 331 is connected to the first circuit board 31. The second portion 332 is located on the outer periphery of the first circuit board 31. The second portion 332 extends from the edge of the first portion 331 along the thickness direction of the first circuit board 31 towards the side facing the fourth surface 31b.

[0107] The second metal sheet 34 is generally rectangular in shape and is connected to and electrically conductive to the first circuit board 31. Specifically, the second metal sheet 34 is located on the side facing the third surface 31a of the first circuit board 31 and is spaced apart from the first metal sheet 33 along the length of the first circuit board 31. The second metal sheet 34 includes a third part 341 and a fourth part 342. The third part 341 can be soldered and fixed to the third surface 31a of the first circuit board 31 and is electrically conductive to the metal lines on the first circuit board 31 to achieve electrical conductivity with the other end of the tuning device 35. That is, the third part 341 is connected to the first circuit board 31, and the first metal sheet 33 and the second metal sheet 34 are electrically conductive to both ends of the tuning device 35, respectively. The fourth part 342 is located on the outer periphery of the first circuit board 31 and extends from the edge of the third part 341 along the length of the first circuit board 31. It should be noted that when there are multiple tuning devices 35, the first metal plate 33 and the second metal plate 34 are electrically connected to the two ends of the tuning device 35, respectively, meaning that the first metal plate 33 and the second metal plate 34 are electrically connected to the two ends of the aforementioned tuning network.

[0108] The second portion 332 of the first metal sheet 33 is connected to the first connection area 2112a1 of the first middle plate 2112 and is electrically connected to the first metal connection part to achieve electrical connection with the reference ground of the electronic device 100. The fourth portion 342 of the second metal sheet 34 is connected to the second connection area 2111b of the first metal frame segment 21111 and is electrically connected to the second metal connection part 21111b. Specifically, the second portion 332 can be connected to the first connection area 2112a1 by welding. In some examples, the second portion 332 can be connected to the first connection area 2112a1 by welding material disposed between the second portion 332 and the first connection area 2112a1. In other examples, the second portion 332 can also be connected to the first connection area 2112a1 by spot welding. The way the fourth portion 342 is connected to the second connection area 2111b can be the same as the way the second portion 332 is connected to the first connection area 2112a1, and will not be described again here.

[0109] This enables a fixed connection and electrical conduction between the first metal sheet 33 and the first metal connecting part, as well as between the second metal sheet 34 and the second metal connecting part 21111b. Furthermore, the first metal sheet 33 is connected to the first connecting area 2112a1 via a second portion 332 located on the outer periphery of the first circuit board 31, and the second metal sheet 34 is connected to the second connecting area 2111b via a fourth portion 342 located on the outer periphery of the first circuit board 31, facilitating the welding and fixing of the tuning assembly 30 to the first middle frame 211. In other embodiments, the first metal sheet 33 can also be bonded to the first connecting area 2112a1 with conductive adhesive, and the second metal sheet 34 can also be bonded to the second connecting area 2111b with conductive adhesive.

[0110] Figure 8 and Figure 9 In the illustrated embodiment, the length direction of the first circuit board 31 is parallel to the extension direction of the first metal frame segment 21111, the width direction is parallel to the thickness direction of the first middle plate 2112, and the thickness direction is perpendicular to the thickness direction of the first middle plate 2112. The third surface 31a of the first circuit board 31 faces the first metal frame segment 21111. Based on this, the groove sidewall of the first mounting groove 2112c facing the third surface 31a has a first groove 2112a2. The first groove 2112a2 penetrates the portion of the first surface 2112a around the first mounting groove 2112c, and the tuning device 35 is located within the first groove 2112a2.

[0111] As a result, since the first metal sheet 33 has a three-dimensional structure, it is difficult to weld the first part 331 and the second part 332 of the first metal sheet 33 to the first circuit board 31 and the first connection area 2112a1 respectively, which leads to low welding accuracy between the first metal sheet 33 and the first circuit board 31 and the first middle frame 211. Since the orientation of the second connection area 2111b is perpendicular to the thickness direction of the first middle plate 2112 and the first middle frame 211 has no limiting structure, the first circuit board 31, the reinforcing plate 32 and the second metal sheet 34 are suspended in the air during welding. Therefore, it is difficult and the accuracy is low to weld the fourth part 342 of the second metal sheet 34 to the second connection area 2111b. As a result, the risk of desoldering and cold solder joint between the tuning component 30 and the first middle frame 211 is high, the assembly yield is low, and the risk of solder joint failure is high when the electronic device 100 is subjected to drop test. Finally, as the electronic device 100 becomes thinner and lighter, the width of the first circuit board 31 becomes smaller and smaller, the area of ​​the components on the first circuit board 31 becomes smaller and smaller, the design and layout of the tuning device 35 becomes more and more difficult, and the performance of the tuning device 35 is increasingly limited.

[0112] To resolve the above issues, please refer to Figures 10-12 , Figure 10 for Figure 2 This is a schematic diagram of another assembly structure of the first middle frame 211 and the tuning component 30 of the electronic device 100 shown. Figure 11 for Figure 10 An exploded view of the first middle frame 211 of the electronic device 100 shown. Figure 12 for Figure 10 A partial structural diagram of the first middle frame 211 is shown. Figures 10-12 The illustrated embodiments and Figures 5-7 The difference in the illustrated embodiment is that a portion of the surface of the first main body 21121 forms part of the bottom wall of the first mounting groove 2112c, and a portion of the surface of the plastic insert 21122 forms another portion of the bottom wall of the first mounting groove 2112c. The first surface 2112a of the first middle frame 211 also has a second mounting groove 2112d, located around the periphery of the first mounting groove 2112c. The bottom wall of the second mounting groove 2112d is located between the bottom wall of the first mounting groove 2112c and the second surface 2112b. The second mounting groove 2112d is used to assemble functional modules of the electronic device 100. These functional modules may include, but are not limited to, vibration modules, speaker modules, etc.

[0113] The first mounting groove 2112c includes a first groove sidewall 2112a3, a second groove sidewall 2112a4, a third groove sidewall 2112a5, and a fourth groove sidewall 2112a6. The bottom wall of the first groove has a first recess 2112a2, which penetrates the sidewall of the second mounting groove 2112d in a direction perpendicular to the thickness direction of the first middle plate 2112, thereby connecting the first recess 2112a2 and the second mounting groove 2112d. The second connecting region 2111b of the second metal connecting portion 21111b faces the same direction as the first connecting region 2112a1. Specifically, the second connecting region 2111b and the bottom wall of the first mounting groove 2112c are located in the same plane, that is, the second connecting region 2111b and the first connecting region 2112a1 are located in the same plane.

[0114] The first groove sidewall 2112a3 includes a first region A1 and a second region A2 arranged along the X-axis direction. The second region A2 is located between the first region A1 and the first metal frame segment 21111. The second region A2 is located on the side opposite to the first region A1. Figure 10 and Figure 12 In the embodiment shown, the second region A2 is connected to the first region A1 through a rounded corner surface, and the second region A2 is parallel to the first region A1.

[0115] The second groove sidewall 2112a4 extends parallel to the Y-axis direction. The second groove sidewall 2112a4 and the first groove sidewall 2112a3 restrict the movement of the tuning assembly 30 relative to the first middle plate 2112 along the X-axis and Y-axis directions before the tuning assembly 30 is fixed to the first middle frame 211. Specifically, they restrict the movement of the tuning assembly 30 relative to the first middle plate 2112 along the arrangement directions of the first region A1 and the second region A2, and along the extension direction of the second groove sidewall 2112a4. In other embodiments, the arrangement directions of the first region A1 and the second region A2 of the first groove sidewall 2112a3 may also intersect with the X-axis direction, and the extension direction of the second groove sidewall 2112a4 may also intersect with the Y-axis direction.

[0116] The third groove sidewall 2112a5 is disposed opposite to the first groove sidewall 2112a3, and the second groove sidewall 2112a4 is located between the first groove sidewall 2112a3 and the third groove sidewall 2112a5. The third groove sidewall 2112a5 includes a third region A3 and a fourth region A4 extending along the X-axis direction. The fourth region A4 is located between the third region A3 and the first metal frame segment 21111. The shapes of the third region A3 and the fourth region A4 can be referenced to the shapes of the first region A1 and the second region A2, and will not be described in detail here.

[0117] The fourth groove sidewall 2112a6 is disposed opposite to the second groove sidewall 2112a4, and at least a portion of the first groove sidewall 2112a3 and at least a portion of the third groove sidewall 2112a5 are located between the second groove sidewall 2112a4 and the fourth groove sidewall 2112a6. Figure 10 and Figure 12 In the illustrated embodiment, the second groove sidewall 2112a4 is spaced apart from the first groove sidewall 2112a3 and connected to the third groove sidewall 2112a5, and the fourth groove sidewall 2112a6 is spaced apart from both the first groove sidewall 2112a3 and the third groove sidewall 2112a5. In other embodiments, the second groove sidewall 2112a4 may also be connected to the first groove sidewall 2112a3, and / or, the second groove sidewall 2112a4 may also be spaced apart from the third groove sidewall 2112a5.

[0118] Please see Figures 13-15 , Figure 13 for Figure 10 A schematic diagram of a structure of the tuning component 30 of the electronic device 100 shown. Figure 14 for Figure 13 The diagram shows the structure of the tuning component 30 as viewed from another angle. Figure 15 for Figure 13 The exploded view of the tuning component 30 is shown. Figures 13-15 The illustrated embodiments and Figure 8 The difference in the illustrated embodiment is that the shape of the reinforcing plate 32 is approximately the same as that of the first circuit board 31, i.e., the peripheral side surface of the reinforcing plate 32 is flush with the peripheral side surface of the first circuit board 31. The first circuit board 31 includes a first side surface 31c and a third side surface 31d facing each other, and a fourth side surface 31e and a fifth side surface 31f facing each other. The first circuit board 31 has a first through hole 31g and a fourth through hole 31h. The first through hole 31g and the fourth through hole 31h can be strip-shaped holes extending along the width direction of the first circuit board 31. In this way, the area between the first through hole 31g and the fourth through hole 31h for arranging the tuning device 35 can be larger. The reinforcing plate 32 has a second through hole 32a and a fifth through hole 32b, the second through hole 32a being disposed opposite to the first through hole 31g, and the fifth through hole 32b being disposed opposite to the fourth through hole 31h.

[0119] The first metal sheet 33 is generally rectangular in shape and is stacked on top of the first circuit board 31. The first portion 331 of the first metal sheet 33, along the thickness direction of the first circuit board 31, has its orthographic projection onto the first circuit board 31 within the first circuit board 31. The second portion 332 is located on the side facing the fifth side surface 31f, and includes a second side surface 3321. The second side surface 3321 faces the same direction as and is parallel to the first side surface 31c. Furthermore, the first portion 331 has a first limiting protrusion 331a. Figures 13-15In the illustrated embodiment, the first limiting protrusion 331a is a flanged structure formed by bending the edge portion of the first part 331 towards the thickness direction of the first part 331. Thus, the first metal sheet 33 can be a one-piece molded structure, simplifying both design and manufacturing. In other embodiments, the first limiting protrusion 331a can also be fixed to the first part 331 by welding, snap-fitting, threaded connection, or other methods.

[0120] Based on this, the first limiting protrusion 331a is fitted and accommodated in the first through hole 31g, and passes through the second through hole 32a. Figures 13-15 In the illustrated embodiment, the inner wall of the second through hole 32a is located on the outer periphery of the inner wall of the first through hole 31g. In other embodiments, the shape and size of the second through hole 32a may also be consistent with the first through hole 31g, and the first limiting protrusion 331a is fitted and accommodated within the second through hole 32a. In this way, before the first metal sheet 33 is soldered and fixed to the first circuit board 31, pre-positioning can be achieved through the cooperation between the first limiting protrusion 331a and the first through hole 31g, preventing the first metal sheet 33 from rotating relative to the first circuit board 31 around the thickness direction of the first circuit board 31 during the soldering process, which would lead to a decrease in soldering yield. Furthermore, the first limiting protrusion 331a passing through the second through hole 32a increases the height of the first limiting protrusion 331a along the Z-axis, improving the overall strength of the first metal sheet 33 and thus enhancing the reliability of pre-positioning.

[0121] The second metal sheet 34 is stacked on top of the first circuit board 31. The third portion 341 of the second metal sheet 34, projected onto the first circuit board 31 along its thickness direction, lies within the first circuit board 31. The fourth portion 342 is located on the side facing the fifth side surface 31f. That is, the length directions of both the first metal sheet 33 and the second metal sheet 34 are parallel to the width direction of the first circuit board 31. The second portion 332 of the first metal sheet 33 and the fourth portion 342 of the second metal sheet 34 are located on the same side of the first circuit board 31. The fourth portion 342 includes a sixth side surface 3421, which faces the same direction as and is parallel to the third side surface 31d. Furthermore, the third portion 341 of the second metal sheet 34 has a second limiting protrusion 341a.

[0122] Based on this, the second limiting protrusion 341a is accommodated within the fourth through hole 31h and passes through the fifth through hole 32b. The formation of the second limiting protrusion 341a and its connection with the fourth through hole 31h and the fifth through hole 32b can be referenced to the formation of the first limiting protrusion 331a and its connection with the first through hole 31g and the second through hole 32a, and will not be repeated here. In some other embodiments, the reinforcing plate 32 may not have the second through hole 32a and the fifth through hole 32b. In still other embodiments, the first circuit board 31 may not have the first through hole 31g and the fourth through hole 31h, the first portion 331 may not have the first limiting protrusion 331a, and the third portion 341 may not have the second limiting protrusion 341a.

[0123] In some other embodiments, please refer to Figure 16 and Figure 17 , Figure 16 for Figure 9 Another schematic diagram of the tuning component 30 of the electronic device 100 shown. Figure 17 for Figure 16 The diagram shows the cross-sectional structure of the tuning component 30 at the BB line. Figure 16 and Figure 17 The illustrated embodiments and Figures 13-15 The difference in the illustrated embodiment is that the tuning assembly 30 further includes a first filler 36 and a second filler 37. A portion of the first filler 36 is located between the inner wall of the first through hole 31g and the first limiting protrusion 331a, and is connected to both the inner wall of the first through hole 31g and the first limiting protrusion 331a. A portion of the first filler 36 is also located between the inner wall of the second through hole 32a and the first limiting protrusion 331a, and is connected to both the inner wall of the second through hole 32a and the first limiting protrusion 331a. In this way, before soldering the first part 331 to the first circuit board 31, the first part 331 can be initially connected to the first circuit board 31 through the first filler 36, which ensures that the first metal sheet 33 will not fall off the first circuit board 31 during the movement of the tuning assembly 30, and also improves the reliability of the connection between the first metal sheet 33 and the first circuit board 31.

[0124] In some examples, the first circuit board 31 includes a first metal layer (not shown) covering the inner wall of the second first through-hole 31g. The first filler 36 is solder, and the first filler 36 is connected to both the first metal layer and the first limiting protrusion 331a. That is, the inner wall of the first through-hole 31g is connected to the first filler 36 through the first metal layer covering it. This further ensures the reliability of the connection between the first portion 331 and the first circuit board 31. Furthermore, when the inner wall of the second through-hole 32a of the reinforcing plate 32 is located on the outer periphery of the inner wall of the first through-hole 31g, it provides overflow space when the solder expands due to heat, preventing the solder expansion from squeezing the first circuit board 31 and causing it to warp, thus affecting the reliability of the connection between the tuning device 35 and the first circuit board 31. In other examples, the first filler 36 can also be an adhesive, i.e., the first limiting protrusion 331a is bonded to the first circuit board 31 and the reinforcing plate 32.

[0125] Similarly, the material of the second packing 37 can be referenced to the material of the first packing 36, and the connection relationship between the second packing 37 and the fourth through hole 31h, the fifth through hole 32b, and the second limiting protrusion 341a can be referenced to the connection relationship between the first packing 36 and the first through hole 31g, the second through hole 32a, and the first limiting protrusion 331a, which will not be elaborated here.

[0126] Based on the above, please refer to Figure 10 , Figure 12 and Figure 18 , Figure 18 for Figure 10 The diagram shows a top view of a portion of the structure of the electronic device 100. A first circuit board 31 is disposed within a first mounting groove 2112c, with the thickness direction of the first circuit board 31 parallel to the thickness direction of the first intermediate plate 2112. The first groove sidewalls 2112a3, 2112a4, 2112a5, and 2112a6 of the first mounting groove 2112c are located around the periphery of the first circuit board 31 to restrict movement of the first circuit board 31 relative to the first intermediate plate 2112 along the X-axis and Y-axis directions. Specifically, the first region A1 of the first groove sidewall 2112a3 faces the first side surface 31c, with a clearance between them greater than or equal to 0.05 mm and less than or equal to 0.1 mm. That is, the second region A2 is located on the side of the first region A1 that faces away from the first side surface 31c. For example, the fitting gap between the first region A1 and the first side surface 31c can be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, etc. The second region A2 faces the second side surface 3321 of the second part 332 of the first metal sheet 33, and there is a gap between them greater than or equal to 0.2 mm.

[0127] The second slot sidewall 2112a4 faces the fourth sidewall 31e and there is a fitting gap between them; the third region A3 of the third slot sidewall 2112a5 faces the third sidewall 31d and there is a fitting gap between them, and the fourth region A4 faces the sixth sidewall 3421 and there is a gap between them, that is, the third slot sidewall 2112a5 and the first slot sidewall 2112a3 are located on opposite sides of the first circuit board 31; the fourth slot sidewall 2112a6 is located between the second part 332 and the fourth part 342, and the fourth slot sidewall 2112a6 faces the fifth sidewall 31f and there is a fitting gap between them, that is, the fourth slot sidewall 2112a6 and the second slot sidewall 2112a4 are located on opposite sides of the first circuit board 31. The values ​​of the fitting clearance between the second groove sidewall 2112a4 and the fourth sidewall 31e, the fitting clearance between the third region A3 and the third sidewall 31d, and the fitting clearance between the fourth groove sidewall 2112a6 and the fifth sidewall 31f can all be referenced from the value of the fitting clearance between the first region A1 and the first sidewall 31c. The value of the clearance between the fourth region A4 and the sixth sidewall 3421 can be referenced from the value of the clearance between the second region A2 and the second sidewall 3321. These will not be elaborated further here.

[0128] In this way, both the first metal sheet 33 and the second metal sheet 34 are roughly flat. The first metal sheet 33 and the second metal sheet 34 can be connected to the first circuit board 31 by SMT to form a tuning assembly 30. Then, the tuning assembly 30 is placed in the first mounting slot 2112c. The second part 332 of the first metal sheet 33 is connected to the first connection area 2112a1 by spot welding, and the fourth part 342 of the second metal sheet 34 is connected to the second connection area 2111b, so that the antenna radiating element is electrically connected to the reference ground of the electronic device 100, thus ensuring the performance of the antenna.

[0129] During this process, the bottom wall of the first mounting groove 2112c restricts the tuning assembly 30 from moving relative to the first middle plate 2112 along the Z-axis. The first groove sidewalls 2112a3, 2112a4, 2112a5, and 2112a6 have mating gaps with the sides of the first circuit board 31, which restricts the movement of the tuning assembly 30 relative to the first middle plate 2112 along the X-axis and Y-axis. This achieves precise positioning of the tuning assembly 30 and prevents the first circuit board 31 from being squeezed due to manufacturing tolerances. The circuit board 31 reduces the reliability of the tuning component 30, thus ensuring the accuracy of connecting the first metal piece 33 and the second metal piece 34 to the first connection area 2112a1 and the second connection area 2111b respectively. This ensures the reliability of the structural connection between the first metal piece 33 and the second metal piece 34 and the first middle plate 2112 and the first metal frame segment 21111, as well as the reliability of electrical conduction. In other words, while ensuring the performance of the antenna, the yield of the tuning component 30 soldered to the first middle frame 211 is improved, thereby improving the overall reliability of the electronic device 100.

[0130] Based on this, by making the second region A2 of the first groove sidewall 2112a3 face the second side surface 3321 of the second part 332, the extension length of the protrusion forming the first groove sidewall 2112a3 can be made longer, so that the local thickness of the first middle plate 2112 along the thickness direction is thicker, thus ensuring the strength of the first middle plate 2112, and thus ensuring the overall strength of the electronic device 100. By making the second region A2 located on the side of the first region A1 that is opposite to the first side surface 31c of the first circuit board 31, it is possible to prevent the second region A2 from abutting and jamming with the second part 332 when the welding tolerance between the first metal sheet 33 and the first circuit board 31 causes an angle between the second side surface 3321 and the first side surface 31c, which would prevent the tuning component 30 from being connected to the first middle frame 211.

[0131] Based on this, the second portion 332 of the first metal sheet 33 and the fourth portion 342 of the second metal sheet 34 are located on the same side of the first circuit board 31, and both are located on the side of the first circuit board 31 facing the first metal frame segment 21111. This makes the overall length of the tuning assembly 30 smaller in the direction of the arrangement of the first portion 331 and the second portion 332 of the first metal sheet 33, which makes the structure of the tuning assembly 30 more compact and facilitates the placement of other components of the electronic device 100. At the same time, it makes the length of the second metal connecting portion 21111b of the first metal frame segment 21111 extending from the main body segment 21111a towards the first middle plate 2112 smaller, which facilitates the fabrication of the first metal frame segment 21111 and the connection of the first metal frame segment 21111 to the first middle plate 2112 by means of the plastic insert 21122.

[0132] Furthermore, the thickness direction of the first circuit board 31 is parallel to the thickness direction of the first middle plate 2112. This allows the width of the first circuit board 31, the length of the first metal sheet 33, and the length of the second metal sheet 34 to be unrestricted by the thickness of the electronic device 100. This increases the layout area of ​​the first circuit board 31, the connection area between the second part 332 of the first metal sheet 33 and the first connection area 2112a1, and the connection area between the fourth part 342 of the second metal sheet 34 and the second connection area 2111b. This further improves the performance of the tuning component 30 and the connection reliability with the first middle plate 2112 and the first metal frame segment 21111. Similarly, the thickness of the electronic device 100 is not limited by the tuning component 30, thus saving space and contributing to the thinner and lighter design of the electronic device 100. Therefore, the assembly method of the tuning component 30 and the first middle frame 211 can be applied to various models of electronic devices 100.

[0133] Based on the above, please continue to refer to... Figure 10 and Figure 18 The first mounting groove 2112c also includes a fifth groove sidewall 2112a7 and a sixth groove sidewall 2112a8, both of which are connected to the fourth groove sidewall 2112a6. The fourth groove sidewall 2112a6, the fifth groove sidewall 2112a7, and the sixth groove sidewall 2112a8 are formed on the protrusion 2112e of the first surface 2112a. The fifth groove sidewall 2112a7 and a portion of the second region A2 of the first groove sidewall 2112a3 are symmetrically arranged on opposite sides of the second part 332. The distance between the sixth groove sidewall 2112a8 and the fourth part 342 is greater than the distance between the fourth region A4 and the fourth part 342. In this way, the cooperation between the fifth groove sidewall 2112a7 and the first groove sidewall 2112a3 can restrict the movement of the tuning assembly 30 relative to the first middle plate 2112 along the Y-axis.

[0134] In some other embodiments, the distance between the fifth slot sidewall 2112a7 and the second portion 332 is greater than the distance between the second region A2 and the second portion 332, and a portion of the fourth region A4 of the sixth slot sidewall 2112a8 and the third slot sidewall 2112a5 are symmetrically arranged on opposite sides of the fourth portion 342. In this way, the cooperation between the sixth slot sidewall 2112a8 and the third slot sidewall 2112a5 can restrict the movement of the tuning assembly 30 relative to the first middle plate 2112 along the Y-axis.

[0135] In some other embodiments, please refer to Figure 19 , Figure 19 for Figure 10 Another top view of a portion of the structure of the electronic device 100 shown. Figure 19 The illustrated embodiments and Figure 18The difference in the illustrated embodiment is that the second region A2 intersects with the first region A1, and the included angle between the second region A2 and the first region A1 can be less than or equal to 20°. For example, the included angle between the second region A2 and the first region A1 can be 5°, 8°, 10°, 13°, 15°, 18°, 20°, etc. A portion of the second region A2 of the fifth slot sidewall 2112a7 and the first slot sidewall 2112a3 are symmetrically arranged on opposite sides of the second part 332, and a portion of the fourth region A4 of the sixth slot sidewall 2112a8 and the third slot sidewall 2112a5 are symmetrically arranged on opposite sides of the fourth part 342. In this way, the tuning assembly 30 can be auxiliaryly limited.

[0136] In some other embodiments, the first groove sidewall 2112a3 may not include the second region A2; and / or, the third groove sidewall 2112a5 may not include the fourth region A4. In still other embodiments, the first region A1 may be located between the second region A2 and the first metal frame segment 21111, and the second portion 332 of the first metal sheet 33 may be located on the side of the first circuit board 31 facing away from the first metal frame segment 21111; and / or, the third region A3 may be located between the fourth region A4 and the first metal frame segment 21111, and the fourth portion 342 of the second metal sheet 34 may be located on the side of the first circuit board 31 facing away from the first metal frame segment 21111.

[0137] In other embodiments, the first mounting groove 2112c may also include only the first groove sidewall 2112a3 and the second groove sidewall 2112a4. Before the tuning assembly 30 is soldered to the first middle frame 211, the first side 31c of the first circuit board 31 may abut against the first region A1 of the first groove sidewall 2112a3, and the fourth side 31e of the first circuit board 31 may abut against the second groove sidewall 2112a4 to restrict the movement of the first circuit board 31 relative to the first middle plate 2112. In other embodiments, the first mounting groove 2112c may also include only the first groove sidewall 2112a3 and the second groove sidewall 2112a4. The first groove sidewall 2112a3 and the second groove sidewall 2112a4 are located on opposite sides of the first circuit board 31 and have a mating gap with the first circuit board 31 to restrict the movement of the first circuit board 31 relative to the first middle plate 2112 along the arrangement direction of the first groove sidewall 2112a3 and the second groove sidewall 2112a4.

[0138] Based on the above, please refer to Figure 10 and Figure 20 , Figure 20 for Figure 18The diagram shows a cross-sectional view of the electronic device 100 at the CC line. The third surface 31a of the first circuit board 31 faces the bottom wall of the first mounting groove 2112c, meaning that the tuning device 35, the first metal plate 33, and the second metal plate 34 are all located on the side of the first circuit board 31 facing the bottom wall of the first mounting groove 2112c. The tuning device 35 is located within the first recess 2112a2, and the first metal plate 33 and the second metal plate 34 are located on the periphery of the first recess 2112a2.

[0139] In this way, the bottom wall of the first mounting groove 2112c, located on the periphery of the first recess 2112a2, can be planar. The first metal sheet 33 and the second metal sheet 34 can be supported on the planar area. When the second part 332 of the first metal sheet 33 and the fourth part 342 of the second metal sheet 34 are respectively welded to the first connecting area 2112a1 and the second connecting area 2111b, the first metal sheet 33 and the second metal sheet 34 are less likely to lift, ensuring the reliability of the connection between the first metal sheet 33, the second metal sheet 34 and the first middle frame 211. Furthermore, the first recess 2112a2 can protect the tuning device 35, preventing damage to the tuning device 35 from collisions when other components of the electronic device 100 are assembled onto the first middle frame 211. In addition, functional testing of the tuning device 35 can be performed through the opening on the side wall of the second mounting groove 2112d of the first recess 2112a2, thereby ensuring the overall ease of maintenance and reliability of the electronic device 100.

[0140] Please continue reading. Figure 10 and Figure 20 Along the thickness direction of the first middle plate 2112, the projection of the first part 331 of the first metal sheet 33 on the bottom wall of the first groove of the first mounting groove 2112c is located on the plastic insert 21122, and the projection of the third part 341 of the second metal sheet 34 on the bottom wall of the first groove of the first mounting groove 2112c is located on the plastic insert 21122.

[0141] In this way, while ensuring the clearance height of the antenna and the lightweight of the electronic device 100, it also ensures that the first part 331 of the first metal sheet 33 is insulated from the bottom wall of the first mounting groove 2112c, and the third part 341 of the second metal sheet 34 is insulated from the bottom wall of the first mounting groove 2112c, preventing the second metal sheet 34 from short-circuiting with the first main body 21121 of the first intermediate plate 2112, so that the tuning device 35 cannot play the role of tuning the antenna frequency band.

[0142] Based on the above, please refer to Figure 21 , Figure 21 for Figure 18The diagram shows a cross-sectional view of the electronic device 100 at the DD line. The first middle plate 2112 has a first mounting hole 2112g, the opening of which is located on the second surface 2112b, and a portion of which is formed in the protrusion 2112e. The first cover plate 2113 has a second mounting hole 2113a. The first middle frame 211 also includes a first connector 2114. The first connector 2114 passes through the second mounting hole 2113a of the first cover plate 2113 and is fixedly connected to the first mounting hole 2112g. Figure 21 In the illustrated embodiment, the first mounting hole 2112g is a threaded hole, and the first connector 2114 is a screw, which is threaded into the first mounting hole 2112g. In other examples, the first mounting hole 2112g is a smooth hole, and the first connector 2114 is a rivet, which is riveted and fixed into the first mounting hole 2112g.

[0143] In this way, the protruding portion 2112e of the first surface 2112a can limit the position of the tuning component 30, and can also be used to fix the first cover plate 2113 and other disassembled structures. This makes full use of the area with high strength of the first middle plate 2112, making the overall structure of the first middle frame 211 more compact and reliable.

[0144] In some other embodiments, please refer to Figure 22 and Figure 23 , Figure 22 for Figure 2 This is a schematic diagram of another assembly structure of the first middle frame 211 and the tuning component 30 of the electronic device 100 shown. Figure 23 for Figure 22 The cross-sectional view of the electronic device 100 at line EE is shown. Figure 22 and Figure 23 The illustrated embodiments and Figure 10 The difference in the illustrated embodiment is that the tuning device 35, the first metal sheet 33, and the second metal sheet 34 are all connected to the fourth surface 31b of the first circuit board 31, and the reinforcing plate 32 is attached to the third surface 31a of the first circuit board 31. The tuning device 35, the first metal sheet 33, and the second metal sheet 34 are all located on the side of the first circuit board 31 opposite to the second surface 2112b. The bottom wall of the first mounting groove 2112c has a second groove 2112a9. The bottom wall of the second groove 2112a9 is a wall opposite to the second surface 2112b. The first connecting area 2112a1 and the second connecting area 2111b are located on the periphery of the second groove 2112a9, and the first circuit board 31 and the reinforcing plate 32 are located within the second groove 2112a9.

[0145] In this way, the bottom wall of the second groove 2112a9 can be a continuous plane, providing continuous support for the tuning assembly 30. This prevents the first circuit board 31 and the reinforcing plate 32 from being partially suspended and easily deformed, which could lead to the tuning device 35 easily detaching from the first circuit board 31 and failing. In addition, the tuning device 35 is farther away from the reference ground of the electronic device 100, resulting in a larger overall clearance height for the antenna, which is beneficial to improving the antenna's radiation efficiency.

[0146] Based on this, the tuning assembly 30 also includes an elastic adhesive layer 38 and a protective adhesive layer (not shown in the figure). The elastic adhesive layer 38 is bonded between the reinforcing plate 32 and the bottom wall of the second groove 2112a9, that is, the elastic adhesive layer 38 is bonded to the first circuit board 31 through the reinforcing plate 32. The protective adhesive layer covers at least a portion of the tuning device 35 and the fourth surface 31b. In some examples, the elastic adhesive layer 38 can be a silicone layer, and the protective adhesive layer can be a silicone layer. In other examples, the elastic adhesive layer 38 can be a foam adhesive layer.

[0147] In this way, the elastic adhesive layer 38 can increase the reliability of fixing the tuning component 30 to the first middle frame 211. It can also compensate for the thickness difference between the depth of the second groove 2112a9 and the total thickness of the first circuit board 31 and the reinforcing plate 32 when the depth of the second groove 2112a9 is greater than the total thickness of the first circuit board 31 and the reinforcing plate 32 due to manufacturing tolerances. This allows the first metal sheet 33 and the second metal sheet 34 to fit snugly against the first connection area 2112a1 and the second connection area 2111b when they are respectively welded to them, reducing welding difficulty and improving welding yield. The protective adhesive layer can protect the tuning device 35 from collision damage during the assembly of other components of the electronic device 100.

[0148] In some other embodiments, the tuning assembly 30 does not include the reinforcing plate 32. In this case, the elastic adhesive layer 38 is directly bonded to the first circuit board 31. This allows the first circuit board 31 to partially deform to fit the sidewall of the first groove 2112c when the welding tolerance between the first metal sheet 33 and the second metal sheet 34 and the first circuit board 31 is large. This absorbs the welding tolerance and prevents the tuning assembly 30 from failing to fit the first mounting groove 2112c and thus being difficult to connect to the first middle frame 211.

[0149] Based on the above, the tuning assembly 30 may further include a third metal sheet (not shown in the figure). The third metal sheet, the first metal sheet 33, and the second metal sheet 34 are arranged along the length of the first circuit board 31. The connection structure between the third metal sheet and the first circuit board 31, the reinforcing plate 32, and the first intermediate plate 2112 can be referenced from the connection structure between the first metal sheet 33 and the first circuit board 31, the reinforcing plate 32, and the first intermediate plate 2112, and will not be described again here. In this way, the connection reliability between the tuning assembly 30 and the first intermediate plate 2112 can be improved.

[0150] In the above embodiments, a foldable mobile phone is used as an example for illustration. In other embodiments, the electronic device may also be a candybar mobile phone.

[0151] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0152] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, include: The first middle plate includes a first surface and a second surface arranged along the thickness direction. The first surface has a first mounting groove, which includes a first groove sidewall, a second groove sidewall, and a first groove bottom wall. The first groove bottom wall includes a first connecting area. The first middle plate includes a first metal connecting portion, and a portion of the surface of the first metal connecting portion forms the first connecting area. The first metal frame segment is located on the outer periphery of the first middle plate and is spaced apart from the first metal connecting part. The first metal frame segment includes a main body segment and a second metal connecting part. The second metal connecting part is located on the side of the main body segment facing the first middle plate. A portion of the surface of the second metal connecting part forms a second connecting area. The orientation of the second connecting area is the same as that of the first connecting area. A first circuit board is disposed in the first mounting groove, and the thickness direction of the first circuit board is parallel to the thickness direction of the first middle plate; the sidewalls of the first groove and the second groove are located on the periphery of the first circuit board to restrict the movement of the first circuit board relative to the first middle plate. A first metal sheet is stacked on top of the first circuit board and connected to the first circuit board and electrically conductive. The first metal sheet is also fixedly connected to the first connection area and electrically conductive with the first metal connection part so as to be electrically conductive with the reference ground. The second metal sheet is spaced apart from the first metal sheet. The second metal sheet is stacked on top of the first circuit board and connected to the first circuit board and electrically conductive. The second metal sheet is also fixedly connected to the second connection area and electrically conductive with the second metal connection part.

2. The electronic device according to claim 1, characterized in that, The electronic device further includes a tuning device disposed on the first circuit board, wherein the first metal sheet and the second metal sheet are electrically connected to both ends of the tuning device.

3. The electronic device according to claim 2, characterized in that, The first metal sheet includes a first part and a second part. The first part is connected to the first circuit board, and the second part is located on the periphery of the first circuit board and connected to the first connection area. And / or, The second metal sheet includes a third part and a fourth part. The third part is connected to the first circuit board, and the fourth part is located on the periphery of the first circuit board and connected to the second connection area.

4. The electronic device according to claim 3, characterized in that, The second and fourth portions are located on the same side of the first circuit board, and both are located between the first circuit board and the first metal frame segment.

5. The electronic device according to claim 3 or 4, characterized in that, The tuning device, the first metal sheet, and the second metal sheet are all located on the side of the first circuit board facing the bottom wall of the first slot; The bottom wall of the first groove has a first groove, the tuning device is located in the first groove, and the first metal sheet and the second metal sheet are located on the periphery of the first groove.

6. The electronic device according to claim 5, characterized in that, The first surface has a second mounting groove, which is located on the periphery of the first mounting groove, and the first groove penetrates the sidewall of the second mounting groove.

7. The electronic device according to claim 3 or 4, characterized in that, The tuning device, the first metal sheet, and the second metal sheet are all located on the side of the first circuit board that faces away from the second surface. The bottom wall of the first groove has a second groove, the first connecting area and the second connecting area are located on the periphery of the second groove, and the first circuit board is located in the second groove.

8. The electronic device according to claim 7, characterized in that, The electronic device further includes an elastic adhesive layer, which is bonded between the first circuit board and the bottom wall of the second groove.

9. The electronic device according to any one of claims 3-8, characterized in that, The first circuit board has a first through hole; The first part has a first limiting protrusion, which is fitted and accommodated within the first through hole.

10. The electronic device according to claim 9, characterized in that, The first circuit board is a flexible circuit board; The electronic device also includes a reinforcing plate, which is attached to the surface of the first circuit board opposite to the tuning device.

11. The electronic device according to claim 10, characterized in that, The reinforcing plate has a second through hole, which is disposed opposite to the first through hole, and the first limiting protrusion passes through the second through hole.

12. The electronic device according to claim 11, characterized in that, The inner wall of the second through hole is located on the outer periphery of the first through hole; The electronic device further includes a first filler, a portion of which is located between the inner wall of the first through hole and the first limiting protrusion, and is connected to both the inner wall of the first through hole and the first limiting protrusion.

13. The electronic device according to claim 12, characterized in that, The first circuit board includes a first metal layer that covers the inner sidewall of the first through hole; The first filler is solder, and the first filler is connected to the first metal layer and the first limiting protrusion.

14. The electronic device according to any one of claims 3-13, characterized in that, The first circuit board includes a first side surface, and the second part includes a second side surface, the second side surface having the same orientation as the first side surface; The first groove sidewall includes a first region and a second region, wherein the first region faces the first side. The second region is located on the side of the first region that is opposite to the first side.

15. The electronic device according to any one of claims 3-13, characterized in that, The first mounting groove also has a third groove sidewall, which is located on opposite sides of the first groove sidewall and the first groove sidewall, and there is a fitting clearance between the first circuit board and both the first groove sidewall and the third groove sidewall; the second groove sidewall is located between the first groove sidewall and the third groove sidewall; and / or, The first surface also has a fourth groove sidewall, which is located on opposite sides of the second groove sidewall. The first circuit board has a fitting gap with both the second groove sidewall and the fourth groove sidewall. At least a portion of the first groove sidewall is located between the second groove sidewall and the fourth groove sidewall.

16. The electronic device according to claim 15, characterized in that, The first surface has a raised portion, and the fourth groove sidewall is formed on the raised portion; the first middle plate also has a third through hole, which is spaced apart from the first mounting groove; The first middle plate also has a first mounting hole, the opening of the first mounting hole is located on the second surface, and a portion of the first mounting hole is formed in the protrusion; The electronic device further includes a first cover plate and a first connector. The first cover plate is located on the side of the second surface opposite to the first surface and covers the third through hole to form a battery mounting groove for accommodating a battery. The first connector passes through the first cover plate and is fixedly connected to the first mounting hole.

17. The electronic device according to any one of claims 3-16, characterized in that, The first middle plate includes a first main body and a plastic insert. The first main body is a metal structural component. A portion of the first main body forms a second metal connecting portion. The plastic insert is connected between the first main body and the first metal frame segment. A portion of the surface of the plastic insert forms a portion of the bottom wall of the first groove.

18. The electronic device according to claim 17, characterized in that, Along the thickness direction of the first middle plate, the projection of the third part on the bottom wall of the first groove is located on the plastic insert.

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