Heating device and semiconductor apparatus
By using a heating device with a flexible heating garment and an elastic thermal conductive layer, combined with a repeatedly opening and closing locking mechanism and airbag adjustment, the problems of complicated installation and contact thermal resistance of heating devices in semiconductor manufacturing have been solved, achieving convenient installation and efficient heating, and improving temperature uniformity and process precision.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHENWEI EQUIP TECH (SUZHOU) CO LTD
- Filing Date
- 2026-06-01
- Publication Date
- 2026-07-17
AI Technical Summary
Existing heating devices in semiconductor manufacturing suffer from problems such as cumbersome installation, high contact thermal resistance, and inability to overcome obstacles such as protruding tubes, which affect heating efficiency and temperature uniformity.
The heating device, which uses a flexible heating garment and an elastic heat-conducting layer, combined with a repeatedly opening and closing locking mechanism and airbag adjustment, enables convenient installation and close contact. The elastic heat-conducting layer can adapt to protrusions, reducing contact thermal resistance.
It enables convenient installation and efficient heating, reduces contact thermal resistance, ensures uniform pipe temperature, and improves the temperature accuracy and heating efficiency of semiconductor processes.
Smart Images
Figure CN122421101A_ABST