一种大空腔填铜工艺的制作方法及其结构
By employing a large cavity copper filling process, which combines laser drilling, hole filling electroplating, and copper reduction treatment, the heat dissipation problem of embedded high-power components is solved, and an efficient heat conduction channel is constructed, thereby improving the heat dissipation capacity and processing precision of the components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- KUSN HULI MICROELECTRONICS
- Filing Date
- 2026-04-29
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, the heat dissipation problem of embedded high-power components is difficult to solve effectively through traditional methods, especially when there is a need for a large cavity heat conduction area, resulting in problems such as insufficient heat conduction channel area, excessive thermal resistance, processing errors, and process bottlenecks.
The large cavity copper filling process is adopted, which combines laser drilling, hole filling electroplating and copper reduction treatment to form staggered first and second blind holes, and constructs multiple sets of copper pillars in the substrate to achieve efficient heat conduction.
It achieves efficient heat dissipation, reduces component operating temperature, improves performance stability and lifespan, and avoids the impact of incomplete via filling and excessive copper accumulation on processing.
Smart Images
Figure CN122421201A_ABST