A through-hole processing apparatus for a circuit board

CN122421202BActive Publication Date: 2026-10-20HUBEI JIUXIANG ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202610586555.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-04-29
Publication Date
2026-10-20
Estimated Expiration
2046-04-29

AI Technical Summary

Technical Problem

[0004]但是在加工过程中需要使用大量的电机元件,通过电机对电路板进行定位限制,且需要配合使用大量的传感器进行控制,这显著增加了设备的制造成本和控制系统的复杂性

Benefits of technology

1、转动组件和多个放置台实现了多工位并行作业,当一个放置台在加工位进行钻孔时,另一个可以在上料位进行电路板装载,第三个在下料位进行成品卸载,大幅缩短了生产节拍,通过机械式间歇旋转即可完成工位切换,无需复杂的传感器和控制系统来追踪电路板位置;

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to the technical field of circuit board processing, and particularly relates to a via processing equipment on a circuit board, which comprises a processing table, feeding and discharging devices arranged on both sides of the processing table and a hole opening device fixedly installed on the processing table, a rotating assembly is arranged in the middle of the processing table, four placing tables are arranged in a ring shape at equal intervals on the rotating assembly, the placing table comprises a bottom frame and a placing frame, a suction assembly is arranged in the placing frame, a connecting assembly is arranged between two suction assemblies on a group of placing modules, the connecting assembly is used for adjusting the negative pressure in the suction assembly, the connecting assembly comprises a connecting rod, a fixing ring and two extrusion capsules, an adjusting opening is arranged in the middle of the rotating assembly, the connecting rod passes through the adjusting opening, and an adjusting assembly is arranged on the connecting rod. The present application can complete station switching through mechanical intermittent rotation, and does not need complex sensors and control systems to track the position of the circuit board.
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Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and in particular to a through-hole processing device for circuit boards. Background Technology

[0002] In the manufacturing process of printed circuit boards, through-hole processing is a core process that determines the reliability of electrical interconnection, integration density and manufacturing cost of products. Through-hole processing of circuit boards mainly relies on CNC mechanical drilling equipment and laser drilling equipment.

[0003] Patent CN110769604B discloses a fixing device for drilling holes in printed circuit boards, comprising a base, a bracket, a worktable, and a drilling device. The worktable is fixedly mounted on the base, the bracket is fixedly mounted on the base and is positioned above the worktable, and the drilling device is fixedly mounted on the bracket and positioned above the worktable. It also includes a positioning component and a clamping component. The positioning component is fixedly mounted on the base, the clamping component is slidably mounted on the positioning component, the worktable is located inside the clamping component, and the drilling device is positioned above the clamping component. By fixing the drilling device above the worktable and mounting the clamping component around the worktable, the movement of the clamping component is controlled by the horizontally and vertically movable positioning component. The printed circuit board is fixed and positioned by the clamping component and then drilled, thus allowing the use of a small worktable area and reducing the cost of consumable parts.

[0004] However, the processing requires a large number of motor components to position and constrain the circuit board, and also necessitates the use of numerous sensors for control. This significantly increases the manufacturing cost of the equipment and the complexity of the control system. Furthermore, its positioning and clamping mechanisms are independent of the drilling process, making it impossible to effectively handle the debris generated during processing. Debris residue may affect processing accuracy and the surface quality of the circuit board. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a through-hole processing device for circuit boards.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A through-hole processing device for a circuit board includes: a processing table, loading and unloading devices disposed on both sides of the processing table, and a hole-opening device fixedly installed on the processing table. A rotating assembly is disposed in the middle of the processing table, and four placement platforms are disposed in a ring at equal intervals on the rotating assembly, and two opposing placement platforms form a group of placement modules. The placement platform includes a base frame and a placement frame, wherein the placement frame is slidably mounted on the base frame; The placement rack is equipped with an adsorption component, which is used to adsorb and fix the circuit board placed on the placement rack. A connecting component is provided between the two adsorption components located on a set of placement modules. The connecting component is used for negative pressure adjustment inside the adsorption components. The connecting component includes a connecting rod, a fixing ring, and two squeezing bladders. An adjustment port is opened in the middle of the rotating component. The connecting rod passes through the adjustment port and is fixedly connected to the two placement frames at both ends. The fixing ring is fixedly sleeved in the middle of the connecting rod. The two squeezing bladders are symmetrically fixedly sleeved on the connecting rod, with one end fixedly connected to the fixing ring and the other end fixedly connected to the side of the adjustment port. The connecting rod has symmetrically opened air guide ports that communicate with the adsorption components. One end of the air guide port communicates with the adsorption components and the other end communicates with the squeezing bladders. An adjustment component is provided on the connecting rod, which is used to move the connecting rod, thereby adjusting the position of the placement module.

[0007] Preferably, the rotating assembly includes a rotating disk, a rotating column, and a top block. The rotating disk is rotatably mounted on the processing table, and multiple placement tables are fixedly mounted on the rotating disk. An opening is provided in the center of the rotating disk. The rotating column passes through the opening and is vertically fixedly connected to the processing table. The top block is rotatably connected to the rotating column, and the adjustment port is horizontally opened inside the top block.

[0008] Preferably, the top block has two adjustment ports, which are cross-shaped in the vertical projection plane and are arranged vertically. The two connecting components are respectively arranged inside the two adjustment ports to achieve independent control of the two sets of placement modules.

[0009] Preferably, the placement rack has an installation port on its upper side, the adsorption assembly includes a suction cup and an adsorption plate, the adsorption plate is fixedly installed on the installation port, the suction cup is fixedly installed below the adsorption plate, the adsorption plate has a plurality of adsorption holes communicating with the suction cup, and the bottom of the suction cup is connected to a connecting rod.

[0010] Preferably, the adsorption plate has an upward convex center, forming a frustum-shaped placement platform, and a plurality of adsorption holes are disposed in the center of the frustum-shaped placement platform.

[0011] Preferably, the connecting assembly further includes two spring tubes and two connecting rings. The two spring tubes are symmetrically fixedly connected to both sides of the adjustment port, and the connecting rings are fixedly sleeved on the connecting rod and fixedly connected to the other end of the spring tubes.

[0012] Preferably, the adjustment assembly includes a fixed platform, four adjustment wheels, a first adjustment block, and a second adjustment block. The fixed platform is fixedly connected to the processing table and inside the opening of the rotating disk. The two adjustment wheels are symmetrically rotatably connected below the connecting rod. The first adjustment block and the second adjustment block are fixedly connected to the upper surface of the fixed platform for changing the position of the adjustment wheels.

[0013] Preferably, both the first adjusting block and the second adjusting block are arc-shaped blocks with triangular ends. The first adjusting block is used to drive the adjusting wheel to move away from the rotating column, and the second adjusting block is used to drive the adjusting wheel to move closer to the rotating column.

[0014] Preferably, a clamping component is provided on the side of the placement frame near the rotating component. The clamping component is used to clamp the side of the circuit board. The clamping component includes two rotating shafts and a clamping frame. The two rotating shafts are rotatably mounted on the placement frame, and the two ends of the clamping frame are fixedly connected to the rotating shafts.

[0015] Preferably, a pulling assembly is provided between the clamping frame and the connecting ring. The pulling assembly includes a limiting rod and a pull bar. The limiting rod is fixedly connected between two rotating shafts. A limiting groove is formed in the middle of the limiting rod. One end of the pull bar is fixedly connected to the bottom of the clamping frame, and the other end passes through the limiting groove and is fixedly connected to the connecting ring.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. The rotating assembly and multiple placement tables enable parallel operation of multiple workstations. When one placement table is drilling at the processing station, another can load circuit boards at the loading station, and the third can unload finished products at the unloading station, which greatly shortens the production cycle. The workstation switching can be completed by mechanical intermittent rotation, without the need for complex sensors and control systems to track the position of the circuit boards. 2. The outward expansion of the placement rack and the blowing action of the adsorption component are linked through the connecting component. When the connecting rod slides outward, the compression bag is compressed, and the internal gas is ejected at high speed from the adsorption holes on the adsorption plate through the air guide and suction cup. This blowing action occurs at the same time as the placement rack expands. On the one hand, the airflow instantly breaks the negative pressure in the suction cup, causing the circuit board to separate naturally from the placement platform; on the other hand, the airflow can blow away the debris remaining during the drilling process from the surface of the circuit board and the adsorption holes, ensuring that the surface of the adsorption plate is clean and ready for the next loading. 3. Negative pressure adsorption can provide uniform and sufficiently large fixing force without damaging the circuit board surface, resisting the axial force during drilling. At the same time, the adsorption action is automatically linked to the movement of the placement rack, and automatic adsorption and release linked to displacement can be controlled without additional solenoid valves or sensors. 4. By converting the single mechanical action of connecting rod displacement into two functions simultaneously—pneumatic control and position adjustment—functional coupling is achieved, simplifying the control system. A stable negative pressure is automatically provided at the processing position to ensure processing accuracy; a positive pressure is automatically provided at the loading and unloading positions, assisting in loading and unloading while also cleaning the workpiece and tooling, achieving automatic switching between adsorption and chip removal. The existing pneumatic solenoid valves, pipelines, and corresponding electrical controls for adsorption and chip removal are optimized, significantly reducing hardware costs and system complexity, while also reducing potential failure points due to pneumatic component malfunctions. 5. By adjusting the shape and position of the two adjustment blocks, the circular motion of the rotating disk is precisely converted into the linear reciprocating motion of the connecting rod within a specific angle range, ensuring that the frame is retracted and positioned when processing and expanded for easy operation when loading and unloading materials. 6. The clamping assembly provides horizontal clamping force in addition to vertical adsorption force, forming a double fixation of the circuit board and significantly improving the ability to resist horizontal cutting forces during drilling; at the same time, the driving source of the clamping action is exactly the same as the driving source of the adsorption action, realizing synchronous enhancement of force, that is, at the processing position where the strongest fixation is required, the clamping force and the adsorption force act simultaneously. Attached Figure Description

[0017] Figure 1 This is a front view of a through-hole processing device for a circuit board according to the present invention. Figure 2 This is a schematic diagram of the back structure of a through-hole processing device for a circuit board according to the present invention; Figure 3 This is a schematic diagram of the placement platform structure of a through-hole processing equipment for a circuit board according to the present invention; Figure 4 This is a schematic diagram of the bottom structure of the loading and unloading device of a through-hole processing equipment for circuit boards proposed in this invention; Figure 5 This is a schematic diagram of the placement module structure of a through-hole processing equipment for a circuit board according to the present invention; Figure 6 This is a cross-sectional view of the placement module of a through-hole processing equipment for a circuit board according to the present invention. Figure 7 for Figure 6 Enlarged structural diagram at point A; Figure 8 This is a schematic diagram of the bottom structure of the adsorption component of a through-hole processing device for a circuit board according to the present invention; Figure 9 This is a schematic diagram of the connection component structure of a through-hole processing equipment for a circuit board according to the present invention; Figure 10This is a schematic diagram of the adjustment component structure of a through-hole processing device for a circuit board according to the present invention; Figure 11 This is a schematic diagram of the clamping assembly structure of a through-hole processing device for a circuit board proposed in this invention.

[0018] In the diagram: 1. Processing table; 2. Hole-opening device; 3. Rotating assembly; 31. Rotating disk; 32. Rotating column; 33. Top block; 4. Placement table; 41. Base frame; 42. Placement rack; 5. Adsorption assembly; 51. Suction cup; 52. Adsorption plate; 6. Connecting assembly; 61. Connecting rod; 62. Fixing ring; 63. Squeezing bladder; 64. Bourdon tube; 65. Connecting ring; 7. Adjusting assembly; 71. Fixing table; 72. Adjusting wheel; 73. First adjusting block; 74. Second adjusting block; 8. Clamping assembly; 81. Rotating shaft; 82. Clamping frame; 9. Pulling assembly; 91. Limiting rod; 92. Pull bar; 10. Adjusting port; 11. Loading and unloading device. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] The terms used in this invention, such as "upper," "lower," "left," "right," "middle," and "one," are merely for clarity of description and are not intended to limit the scope of the invention. Any changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0021] Reference Figures 1-11 A through-hole processing device for a circuit board includes: a processing table 1, a loading and unloading device 11 disposed on both sides of the processing table 1, and an opening device 2 fixedly installed on the processing table 1. A rotating component 3 is disposed in the middle of the processing table 1. Four placement platforms 4 are disposed in a ring at equal intervals on the rotating component 3, and two opposite placement platforms 4 form a group of placement modules. Loading and unloading devices 11 are located on both sides of the processing table 1. One loading and unloading device 11 is located at the loading station of the equipment. When the rotating disk 31 rotates the empty placement table 4 to the loading station, the robotic arm of the loading and unloading device 11 places the circuit board to be processed onto the placement rack 42, which has been expanded by the connecting component 6. The other loading and unloading device 11 is located at the unloading station and is used to remove the circuit board that has been processed and released by the connecting component 6 from the expanded placement rack 42.

[0022] The hole-opening device 2 is fixedly installed on the processing table 1, and its position corresponds to the processing station. When the rotating disk 31 rotates the placement table 4 carrying the circuit board to the processing station, the placement table 4 has been retracted, positioned and clamped under the action of the adjusting component 7. At this time, the drill bit of the hole-opening device 2 moves down to perform through hole processing on the circuit board.

[0023] The placement platform 4 includes a base frame 41 and a placement frame 42, wherein the placement frame 42 is slidably disposed on the base frame 41; The placement rack 42 is provided with an adsorption component 5, which is used to adsorb and fix the circuit board placed on the placement rack 42. A connecting component 6 is provided between the two adsorption components 5 located on a set of placement modules. The connecting component 6 is used for negative pressure adjustment inside the adsorption component 5. The connecting component 6 includes a connecting rod 61, a fixing ring 62, and two squeezing bladders 63. An adjustment port 10 is opened in the middle of the rotating component 3. The connecting rod 61 passes through the adjustment port 10 and is fixedly connected to the two placement racks 42 at both ends. The fixing ring 62 is fixedly sleeved in the middle of the connecting rod 61. The two squeezing bladders 63 are symmetrically fixedly sleeved on the connecting rod 61, with one end fixedly connected to the fixing ring 62 and the other end fixedly connected to the side of the adjustment port 10. The connecting rod 61 has symmetrically opened air guide ports that communicate with the adsorption component 5. One end of the air guide port communicates with the adsorption component 5, and the other end communicates with the squeezing bladders 63. An adjustment component 7 is provided on the connecting rod 61. The adjustment component 7 is used to drive the connecting rod 61 to move, thereby driving the placement module to adjust its position.

[0024] In embodiments of the above technical solutions, the processing equipment typically uses a single workstation or requires complex linear modules to move the workpiece or drill bit, resulting in the inability to simultaneously load and unload materials and process them, leading to low production efficiency. The rotating disk 31 is driven by an external drive source and rotates intermittently on the processing table 1. Four placement tables 4 are equidistantly installed on the rotating disk 31 and rotate synchronously with it to realize the cyclic switching of four work positions: loading position, processing position, unloading position and standby position. During the processing, the rotating component 3 rotates synchronously with the rotating disk 31 to ensure the continuity of the working of the connecting component 6 during the rotation process.

[0025] The rotating assembly 3 and multiple placement tables 4 enable parallel operation of multiple workstations. When one placement table 4 is drilling at the processing station, another can load circuit boards at the loading station, and the third can unload finished products at the unloading station, which greatly shortens the production cycle. The workstation switching can be completed by mechanical intermittent rotation, without the need for complex sensors and control systems to track the position of the circuit boards.

[0026] The placement and loading of circuit boards requires precise alignment by a robotic arm or operator. Inaccurate positioning can affect processing accuracy or even damage the circuit board. The fixed placement platform 4 cannot provide sufficient operating space for the robotic arm during loading and unloading, which can easily lead to interference and limit the layout flexibility of the loading and unloading device 11.

[0027] When the placement rack 42 expands outward, it provides more operating space for the robot or operator of the loading and unloading device 11. When loading, the robot can easily place the circuit board into the area between the placement racks 42 without high-precision alignment. When unloading, it is convenient for the robot to insert and remove the circuit board, effectively avoiding difficulties in picking and placing or collision risks caused by narrow space.

[0028] After the circuit board is processed, the adsorption component 5 is still under negative pressure, and the circuit board and the placement table 4 are tightly fitted. Forcibly removing or placing the circuit board may damage the surface of the circuit board or cause the adsorption holes to be blocked, affecting the quality of subsequent processing. The outward expansion of the placement rack 42 and the blowing action of the adsorption component 5 are linked through the connecting component 6. When the connecting rod 61 slides outward, the compression bladder 63 is compressed, and the internal gas is ejected at high speed from the adsorption hole on the adsorption plate 52 through the air guide port and the suction cup 51. This blowing action occurs at the same time as the placement rack 42 expands. On the one hand, the airflow instantly breaks the negative pressure in the suction cup 51, causing the circuit board to separate naturally from the placement table 4; on the other hand, the airflow can blow away the debris remaining during the drilling process from the surface of the circuit board and the adsorption hole, ensuring that the surface of the adsorption plate 52 is clean and ready for the next loading.

[0029] The preferred technical solution in this embodiment is: Reference Figure 6 The rotating assembly 3 includes a rotating disk 31, a rotating column 32, and a top block 33. The rotating disk 31 is rotatably mounted on the processing table 1, and multiple placement tables 4 are fixedly mounted on the rotating disk 31. An opening is provided in the middle of the rotating disk 31. The rotating column 32 passes through the opening and is vertically fixedly connected to the processing table 1. The top block 33 is rotatably connected to the rotating column 32. The adjustment port 10 is horizontally opened inside the top block 33. The top block 33 has two adjustment ports 10, which are cross-shaped in the vertical projection plane and are arranged vertically. The two connecting components 6 are respectively arranged inside the two adjustment ports 10 to realize independent control of the two sets of placement modules.

[0030] Two adjustable ports 10 positioned vertically ensure the normal operation of the two sets of placement modules and prevent mutual interference.

[0031] Reference Figure 6 and Figure 8The placement rack 42 has an installation port on its upper side. The adsorption assembly 5 includes a suction cup 51 and an adsorption plate 52. The adsorption plate 52 is fixedly installed on the installation port, and the suction cup 51 is fixedly installed below the adsorption plate 52. The adsorption plate 52 has multiple adsorption holes that communicate with the suction cup 51. The bottom of the suction cup 51 is connected to the connecting rod 61. The adsorption plate 52 protrudes upward in the middle and forms a frustum-shaped placement platform, with multiple adsorption holes located in the middle of the frustum-shaped placement platform.

[0032] During the drilling process, the circuit board is subjected to axial force and cutting vibration from the drill bit. If it is not securely fixed, it can lead to hole displacement, poor hole wall roughness, or even damage to the drill bit. The suction cup 51 is connected to the compression bladder 63 through the air duct inside the connecting rod 61. When the compression bladder 63 is stretched, the gas inside the suction cup 51 is transferred to the compression bladder 63 through the suction cup 51 and the air duct. A negative pressure is generated inside the suction cup 51, which firmly adsorbs the circuit board through the adsorption holes on the adsorption plate 52. The adsorption plate 52 is designed with an upward convex frustum shape in the middle, and the adsorption holes are concentrated in the middle to ensure the adsorption force of the negative pressure.

[0033] Meanwhile, the debris generated during drilling can easily remain on the surface of the adsorption plate 52, affecting subsequent processes.

[0034] The frustum-shaped design reduces the contact area and lowers the risk of debris getting stuck. During the squeezing process of the squeezing bladder 63, the gas is ejected from the suction hole through the air guide and suction cup 51. The small diameter of the suction hole ensures the impact force generated when the gas is ejected. The center blowing mode allows the airflow to spread to all sides, efficiently blowing the debris away from the center area of ​​the circuit board, achieving cleaning and solving the problem of debris residue.

[0035] Negative pressure adsorption can provide a uniform and sufficiently large fixing force without damaging the circuit board surface, resisting the axial force during drilling. At the same time, the adsorption action is automatically linked to the movement of the placement rack 42, and automatic adsorption and release linked to displacement can be controlled without additional solenoid valves or sensors.

[0036] Reference Figure 8 and Figure 9 The connecting assembly 6 also includes two spring tubes 64 and two connecting rings 65. The two spring tubes 64 are symmetrically fixedly connected to both sides of the adjustment port 10. The connecting rings 65 are fixedly sleeved on the connecting rod 61 and fixedly connected to the other end of the spring tubes 64. Adsorption fixation, air blowing to remove chips, and workstation switching are usually controlled independently, requiring complex air circuits and electrical control systems.

[0037] During rotation, the connecting rod 61 serves as both a structural connector and an air passage. The two ends of the connecting rod 61 are connected to two opposing placement frames 42, which transmit the driving force of the adjusting component 7 to the placement frames 42, thereby driving the two placement frames 42 to switch work positions.

[0038] Meanwhile, the air inlet inside forms an air passage between the suction cup 51 and the compression bladder 63. The change in the gas volume inside the compression bladder 63 is completely controlled by the displacement of the connecting rod 61 within the adjustment port 10. When the connecting rod 61 moves inward, the compression bladder 63 is stretched, its volume increases, and air is drawn from the suction cup 51 to achieve negative pressure adsorption. When the connecting rod 61 moves outward, the compression bladder 63 is compressed, its volume decreases, and air is expelled from the suction cup 51 to achieve blowing and chip removal. The spring tube 64 provides the restoring force and damping to ensure smooth operation.

[0039] By transforming the single mechanical action of displacement of the connecting rod 61 into two functions simultaneously—pneumatic control and position adjustment—functional coupling is achieved, simplifying the control system. A stable negative pressure is automatically provided at the processing position to ensure processing accuracy; a positive pressure is automatically provided at the loading and unloading positions, assisting in loading and unloading while also cleaning the workpiece and tooling, achieving automatic switching between adsorption and chip removal. The existing pneumatic solenoid valves, pipelines, and corresponding electrical controls for adsorption and chip removal are optimized, significantly reducing hardware costs and system complexity, while also minimizing potential failure points due to pneumatic component malfunctions.

[0040] Reference Figure 10 The adjustment assembly 7 includes a fixed platform 71, four adjustment wheels 72, a first adjustment block 73, and a second adjustment block 74. The fixed platform 71 is fixedly connected to the processing table 1 and is also fixedly connected inside the opening of the rotating disk 31. The two adjustment wheels 72 are symmetrically rotatably connected below the connecting rod 61. The first adjustment block 73 and the second adjustment block 74 are fixedly connected to the upper surface of the fixed platform 71 and are used to change the position of the adjustment wheels 72. The first adjusting block 73 and the second adjusting block 74 are both arc-shaped blocks with triangular ends. The first adjusting block 73 is used to drive the adjusting wheel 72 to move away from the rotating column 32, and the second adjusting block 74 is used to drive the adjusting wheel 72 to move closer to the rotating column 32.

[0041] The adjustment component 7 is a mechanical cam mechanism. The fixed table 71 is fixed on the processing table 1 and does not rotate with the rotating disk 31. The first adjustment block 73 and the second adjustment block 74 are fixed on the fixed table 71, and their positions correspond to the angles of the upper and lower material positions and the processing position, respectively. When the rotating disk 31 drives the placement table 4 to rotate, the adjustment wheel 72 fixed below the connecting rod 61 will move along the trajectory on the fixed table 71.

[0042] When the adjusting wheel 72 contacts the triangular inclined surface of the second adjusting block 74, it is pushed inward; when it contacts the inclined surface of the first adjusting block 73, it is pushed outward. The rotation angle of the rotating disk 31 determines whether the adjusting wheel 72 is in a pushed state or a free state, thereby precisely controlling the timing and amount of displacement of the connecting rod 61.

[0043] By adjusting the shape and position of the two adjustment blocks, the circular motion of the rotating disk 31 is precisely converted into the linear reciprocating motion of the connecting rod 61 within a specific angle range, ensuring that the placement frame 42 is retracted and positioned when in the processing position, and expands for easy operation when loading or unloading materials.

[0044] The entire control process does not rely on any sensors or motors, but is completed entirely by mechanical constraints, which greatly improves the reliability and durability of the process and reduces manufacturing costs.

[0045] When the rotating disk 31 drives the placement table 4 to rotate, the adjusting wheel 72, fixed below the connecting rod 61, moves along the trajectory of the two adjusting blocks on the fixed table 71. When the adjusting wheel 72 moves to the second adjusting block 74, the inclined surface of the second adjusting block 74 contacts the adjusting wheel 72, pushing the adjusting wheel 72 and the connecting rod 61 towards the rotating column 32. This action causes the placement frame 42 on one side to move closer to the base frame 41, so that the circuit board is in a precise retracted positioning state when processing. When the adjusting wheel 72 moves to the first adjusting block 73, the inclined surface of the first adjusting block 73 pushes the adjusting wheel 72 and the connecting rod 61 away from the rotating column 32. This action causes the placement frame 42 on one side to move away from the base frame 41, providing sufficient operating space for the loading and unloading device 11. In other angle ranges outside the processing position and non-loading and unloading position, the adjusting wheel 72 does not contact any adjusting block, and the connecting rod 61 remains in the neutral position or other preset state under the elastic force of the spring tube 64.

[0046] Reference Figure 11 The placement frame 42 is provided with a clamping component 8 on the side near the rotating component 3. The clamping component 8 is used to clamp the side of the circuit board. The clamping component 8 includes two rotating shafts 81 and a clamping frame 82. The two rotating shafts 81 are rotatably mounted on the placement frame 42, and the two ends of the clamping frame 82 are fixedly connected to the rotating shafts 81. A pulling component 9 is provided between the clamping frame 82 and the connecting ring 65. The pulling component 9 includes a limiting rod 91 and a pull bar 92. The limiting rod 91 is fixedly connected between the two rotating shafts 81. A limiting groove is opened in the middle of the limiting rod 91. One end of the pull bar 92 is fixedly connected to the bottom of the clamping frame 82, and the other end passes through the limiting groove and is fixedly connected to the connecting ring 65.

[0047] During high-speed drilling, the vertical suction of the adsorption component 5 alone is sometimes insufficient to completely resist the horizontal torque generated by the rotating cutting of the drill bit, which may cause the circuit board to rotate or shift slightly, affecting the hole position accuracy, especially for thicker or larger circuit boards.

[0048] When the connecting rod 61 moves inward, the connecting ring 65 moves inward accordingly, pulling the clamping frame 82 through the pull bar 92. This overcomes the elastic force of the reset torsion spring inside the rotating shaft 81, causing the clamping frame 82 to rotate around the rotating shaft 81 and press against the side of the circuit board, thus achieving horizontal clamping of the circuit board. The limiting groove on the limiting rod 91 is used to constrain the movement direction of the pull bar 92 and prevent it from deviating. When the connecting rod 61 moves outward, the connecting ring 65 moves outward, the pulling force on the pull bar 92 disappears, and the clamping frame 82 automatically rotates in the opposite direction under the action of the reset torsion spring inside the rotating shaft 81, releasing the circuit board and completing the reset.

[0049] The clamping component 8 provides a horizontal clamping force in addition to the vertical adsorption force, forming a double fixation of the circuit board and significantly improving the ability to resist horizontal cutting forces during drilling; at the same time, the driving source of the clamping action is exactly the same as the driving source of the adsorption action, realizing the synchronous enhancement of force, that is, at the processing position where the strongest fixation is required, the clamping force and the adsorption force act simultaneously.

[0050] The clamping assembly 8 and the pulling assembly 9 require no additional power source and are driven entirely by the movement of the existing mechanism, further simplifying the equipment structure.

[0051] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A through-hole processing device for a circuit board, comprising: The processing table, the loading and unloading devices arranged on both sides of the processing table, and the opening device fixedly installed on the processing table are characterized in that a rotating component is provided in the middle of the processing table, and four placement platforms are arranged in a ring at equal intervals on the rotating component, and two opposite placement platforms form a group of placement modules. The placement platform includes a base frame and a placement frame, wherein the placement frame is slidably mounted on the base frame; The placement rack is equipped with an adsorption component, which is used to adsorb and fix the circuit board placed on the placement rack. A connecting component is provided between the two adsorption components located on a set of placement modules. The connecting component is used for negative pressure adjustment inside the adsorption components. The connecting component includes a connecting rod, a fixing ring, and two squeezing bladders. An adjustment port is opened in the middle of the rotating component. The connecting rod passes through the adjustment port and is fixedly connected to the two placement frames at both ends. The fixing ring is fixedly sleeved in the middle of the connecting rod. The two squeezing bladders are symmetrically fixedly sleeved on the connecting rod, with one end fixedly connected to the fixing ring and the other end fixedly connected to the side of the adjustment port. The connecting rod has symmetrically opened air guide ports that communicate with the adsorption components. One end of the air guide port communicates with the adsorption components, and the other end communicates with the squeezing bladders. An adjustment component is provided on the connecting rod, which is used to move the connecting rod, thereby adjusting the position of the placement module.

2. The through-hole processing equipment on a circuit board according to claim 1, characterized in that, The rotating assembly includes a rotating disk, a rotating column, and a top block. The rotating disk is rotatably mounted on the processing table, and multiple placement platforms are fixedly mounted on the rotating disk. An opening is provided in the center of the rotating disk. The rotating column passes through the opening and is vertically fixedly connected to the processing table. The top block is rotatably connected to the rotating column, and the adjustment port is horizontally opened inside the top block.

3. The through-hole processing equipment on a circuit board according to claim 2, characterized in that, The top block has two adjustment ports, which are cross-shaped in the vertical projection plane and are positioned one above the other. The two connecting components are respectively located inside the two adjustment ports to achieve independent control of the two sets of placement modules.

4. The through-hole processing equipment on a circuit board according to claim 1, characterized in that, The placement rack has an installation port on its upper side. The adsorption assembly includes a suction cup and an adsorption plate. The adsorption plate is fixedly installed on the installation port, and the suction cup is fixedly installed below the adsorption plate. The adsorption plate has multiple adsorption holes that communicate with the suction cup. The bottom of the suction cup is connected to a connecting rod.

5. The through-hole processing equipment on a circuit board according to claim 4, characterized in that, The adsorption plate protrudes upward in the middle and forms a frustum-shaped placement platform, with multiple adsorption holes located in the middle of the frustum-shaped placement platform.

6. The through-hole processing equipment on a circuit board according to claim 3, characterized in that, The connecting assembly also includes two spring tubes and two connecting rings. The two spring tubes are symmetrically fixedly connected to both sides of the adjustment port, and the connecting rings are fixedly sleeved on the connecting rod and fixedly connected to the other end of the spring tubes.

7. The through-hole processing equipment on a circuit board according to claim 1, characterized in that, The adjustment assembly includes a fixed platform, four adjustment wheels, a first adjustment block, and a second adjustment block. The fixed platform is fixedly connected to the processing table and inside the opening of the rotating disk. The two adjustment wheels are symmetrically rotatably connected below the connecting rod. The first adjustment block and the second adjustment block are fixedly connected to the upper surface of the fixed platform for changing the position of the adjustment wheels.

8. The through-hole processing equipment on a circuit board according to claim 7, characterized in that, Both the first adjusting block and the second adjusting block are arc-shaped blocks with triangular ends. The first adjusting block is used to drive the adjusting wheel to move away from the rotating column, and the second adjusting block is used to drive the adjusting wheel to move closer to the rotating column.

9. The through-hole processing equipment on a circuit board according to claim 1, characterized in that, A clamping assembly is provided on the side of the placement frame near the rotating assembly. The clamping assembly is used to clamp the side of the circuit board. The clamping assembly includes two rotating shafts and a clamping frame. The two rotating shafts are rotatably mounted on the placement frame, and the two ends of the clamping frame are fixedly connected to the rotating shafts.

10. A through-hole processing device for a circuit board according to claim 9, characterized in that, A pulling assembly is provided between the clamping frame and the connecting ring. The pulling assembly includes a limiting rod and a pull bar. The limiting rod is fixedly connected between two rotating shafts. A limiting groove is opened in the middle of the limiting rod. One end of the pull bar is fixedly connected to the bottom of the clamping frame, and the other end passes through the limiting groove and is fixedly connected to the connecting ring.

Citation Information

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