Circuit board processing control method and circuit board processing apparatus
Patent Information
- Application Number
- CN202610894246.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-22
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2046-06-22
AI Technical Summary
上述工序步骤繁琐,所需设备复杂,导致生产成本高、加工效率低
[0023]这种电路板加工控制方法及电路板加工设备,其技术效果在于:定位精准一致,通过一侧基准、三侧夹紧的定位部结构,确保不同尺寸电路板统一基准定位,端盖压紧板边实现多向约束,提高多板加工一致性和精度。锁定牢固可靠,利用第一定位销穿过电路板定位孔,由气夹组件水平夹紧销钉,将电路板刚性锁定在工作台上,有效抑制加工振动,提升加工稳定性。插销无损伤,搬运组件分阶段插销,先按压电路板再插入销钉,避免薄板因局部受力变形,保护易损电路板。大板平稳分离,多点同步顶升组件整体抬升电路板,使定位孔均匀脱离销钉,防止大尺寸电路板弯曲或损伤,保障成品率。全流程自动化,销钉自动拾取、插入、锁定、释放及回收,无需人工干预,提高效率,降低人力成本。结构紧凑成本低。气夹组件内嵌工作台,销钉可重复使用,机构简单可靠,制造成本和维护成本低。卡滞智能处理,第一定位销卡滞时,自动用同规格第二定位销对向挤出,避免拉扯损伤电路板,保障加工连续性,系统兼容性好。
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Figure CN122421216B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of equipment and methods for processing circuit boards, and more precisely, this application relates to a circuit board processing control method and circuit board processing equipment. Background Technology
[0002] Currently, in the circuit board drilling process, to improve equipment utilization, drilling machines require steps such as installing locating pins, drilling locating pin holes in the board material, stacking the boards, and applying adhesive before drilling. After drilling, steps such as removing locating pins, disassembling locating pins, and separating the boards are also necessary. These steps are cumbersome and require complex equipment, resulting in high production costs and low processing efficiency. Therefore, there is an urgent need in this field to provide a new type of circuit board processing equipment that can directly place pulp boards, copper-clad laminates, and aluminum sheets onto the drilling machine's worktable after stacking them sequentially, completing the drilling process without the need for upper and lower locating pins, thereby simplifying the processing flow, reducing costs, and improving production efficiency. Summary of the Invention
[0003] In order to solve the problems existing in the prior art, this application provides a circuit board processing control method and circuit board processing equipment.
[0004] According to a first aspect of this application, a circuit board processing control method is provided, comprising the following steps: positioning the circuit board on a worktable; controlling a spindle assembly to process positioning holes on the circuit board; controlling a transport assembly to pick up a first positioning pin and insert the first positioning pin through the positioning hole into a pneumatic clamp assembly on the worktable; controlling the pneumatic clamp assembly to clamp the first positioning pin to lock the circuit board on the worktable; controlling the spindle assembly to process the circuit board; controlling a first lifting assembly to move up and down to lift the circuit board and disengage it from the first positioning pin; removing the circuit board; controlling the pneumatic clamp assembly to release the first positioning pin; and controlling the transport assembly to retract the first positioning pin.
[0005] In some embodiments of this application, controlling the pneumatic clamp assembly to clamp or release the first positioning pin includes driving the clamping part of the pneumatic clamp assembly to move in a horizontal direction, so that the clamping part switches between a released state and a clamped state.
[0006] In some embodiments of this application, controlling the first lifting component to perform lifting and lowering movements to lift the circuit board includes the first lifting component rising to the bottom surface of the circuit board that abuts the periphery of the positioning hole, and continuing to push the circuit board upward, so that the positioning hole of the circuit board disengages from the first positioning pin.
[0007] In some embodiments of this application, a second lifting component is also provided on the workbench. The second lifting component is evenly distributed on the workbench surface. The second lifting component moves up and down synchronously with the first lifting component, causing the circuit board to detach from the workbench as a whole.
[0008] In some embodiments of this application, a positioning part for positioning the circuit board is provided on the workbench, and the positioning part switches between an upward positioning state and a downward pressing state; controlling the first lifting component to perform lifting and lowering movements to lift the circuit board further includes: switching the positioning part to the upward positioning state.
[0009] In some embodiments of this application, before controlling the lifting movement of the first lifting component to lift the circuit board, the method further includes controlling the transport component to pick up the second positioning pin and insert the second positioning pin into the positioning hole to push the first positioning pin out of the positioning hole.
[0010] In some embodiments of this application, removing the circuit board includes: controlling the grippers of the conveying device to grip the edge of the circuit board near the positioning hole, and driving the circuit board to perform lifting and translation movements to lift and remove the circuit board.
[0011] In some embodiments of this application, controlling the conveying assembly to insert the first positioning pin into the positioning hole includes controlling the conveying assembly to insert the first positioning pin into the positioning hole in two stages; in the first stage, guiding the first positioning pin through the positioning hole to align it with the positioning groove of the air clamp assembly; and in the second stage, extending at least a portion of the first positioning pin into the positioning groove.
[0012] In some embodiments of this application, controlling the transport assembly to retrieve the first positioning pin includes: controlling the gripper of the transport assembly to hold the portion of the first positioning pin exposed in the pneumatic clamp assembly; controlling the pneumatic clamp assembly to switch from a clamping state to a releasing state to release the first positioning pin; and controlling the gripper to remove the first positioning pin from the reference hole and transfer it to the cutter head on the worktable.
[0013] In some embodiments of this application, positioning the circuit board on the worktable includes: controlling the clamping member of the positioning part to push the circuit board in the horizontal direction so that the side of the circuit board abuts against the positioning member on the worktable; controlling the positioning part to move in the vertical direction to press the circuit board firmly on the worktable.
[0014] In some embodiments of this application, controlling the spindle assembly to process positioning holes on the circuit board includes: acquiring position information of a reference hole preset on the worktable; and controlling the spindle assembly to process positioning holes concentric with the reference hole on the circuit board.
[0015] According to the second invention of this application, a circuit board processing device is provided, comprising: a worktable for carrying a circuit board; a positioning part disposed on the worktable for positioning and pressing the circuit board onto the worktable surface; a pneumatic clamp assembly disposed on the worktable, wherein a reference hole is provided in the positioning groove of the pneumatic clamp assembly for guiding the spindle assembly to process the positioning hole on the circuit board; the pneumatic clamp assembly has a switchable release state and a clamping state; a first positioning pin configured to be picked up by a transport assembly and inserted into the reference hole through the positioning hole after the positioning hole is processed on the circuit board; when the first positioning pin extends into the reference hole, the pneumatic clamp assembly can switch from the release state to the clamping state to clamp the first positioning pin, thereby locking the circuit board on the worktable; and a first lifting assembly disposed on the worktable and located in the grooves on both sides of the reference hole; the first lifting assembly is used to lift the circuit board, so that the circuit board is freed from the constraint of the first positioning pin.
[0016] In some embodiments of this application, the pneumatic clamp assembly includes a clamping part and a driving part; the driving part is used to drive the clamping part to move in the horizontal direction, so as to switch it between a clamping state and a releasing state; in the clamping state, the clamping part clamps the first positioning pin in the horizontal direction.
[0017] In some embodiments of this application, the positioning groove of the air clamp assembly has a predetermined depth, and when the first positioning pin extends into the positioning groove and is clamped, a gap is left between the bottom end of the first positioning pin and the bottom of the positioning groove.
[0018] In some embodiments of this application, the first lifting assembly includes a top plate and a fifth driving member. The fifth driving member is used to drive the top plate to switch between a rising state and a falling state. In the rising state, the top plate lifts the circuit board, causing the positioning hole of the circuit board to disengage from the first positioning pin.
[0019] In some embodiments of this application, both the top plate and the groove extend along the extension direction of the air clamp assembly, and the top plate is parallel to the central axis of the air clamp assembly; the first lifting assembly also includes a plurality of guide members arranged in a direction parallel to the central axis for supporting and guiding the top plate.
[0020] In some embodiments of this application, a second lifting component is also provided on the workbench. Multiple second lifting components are evenly distributed on the workbench surface and are configured to move up and down synchronously with the first lifting component to lift the circuit board as a whole.
[0021] In some embodiments of this application, a transport assembly is disposed on a spindle assembly for picking up, inserting, and retrieving a first positioning pin; the transport assembly includes a gripper and a pressing member; the gripper is used to pick up, insert, or retrieve the first positioning pin; the pressing member is used to press the circuit board from above when the first positioning pin is inserted; the gripper and the pressing member are driven by their respective independent drive mechanisms to move independently in the vertical direction.
[0022] In some embodiments of this application, there are two reference holes, which are located near the edge of the circuit board, and the distance between them is determined based on the length and width dimensions of the circuit board.
[0023] The technical advantages of this circuit board processing control method and equipment are as follows: Precise and consistent positioning: A positioning structure with a one-sided reference and three-sided clamping ensures consistent reference positioning for circuit boards of different sizes. End caps press against the board edges to achieve multi-directional constraint, improving the consistency and accuracy of multi-board processing. Secure and reliable locking: A first positioning pin passes through the circuit board's positioning hole, and the pneumatic clamping assembly horizontally clamps the pin, rigidly locking the circuit board to the worktable, effectively suppressing processing vibration and improving processing stability. Damage-free pin insertion: The transport assembly inserts the pin in stages, pressing the circuit board first and then inserting the pin, avoiding deformation of thin boards due to localized stress and protecting vulnerable circuit boards. Smooth separation of large boards: A multi-point synchronous lifting assembly lifts the circuit board as a whole, ensuring the positioning holes are evenly disengaged from the pins, preventing bending or damage to large-sized circuit boards and ensuring a high yield. Fully automated process: Pins are automatically picked up, inserted, locked, released, and retrieved without manual intervention, improving efficiency and reducing labor costs. Compact structure and low cost: The pneumatic clamping assembly is embedded in the worktable, pins are reusable, the mechanism is simple and reliable, and manufacturing and maintenance costs are low. The system features intelligent jamming handling. When the first positioning pin gets stuck, a second positioning pin of the same specification is automatically used to push it out from the opposite direction, avoiding pulling and damaging the circuit board, ensuring continuous processing, and providing good system compatibility.
[0024] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description
[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.
[0026] Figure 1 This is a schematic diagram of a portion of the circuit board processing equipment provided in an embodiment of this application.
[0027] Figure 2 This is a schematic diagram of the workbench structure provided in one embodiment of this application.
[0028] Figure 3 This is a partial structural schematic diagram of the positioning part provided in an embodiment of this application.
[0029] Figure 4 This is a partial structural schematic diagram of the first lifting component provided in an embodiment of this application.
[0030] Figure 5 This is a partial structural schematic diagram of a workbench provided in one embodiment of this application.
[0031] Figure 6 This is a partial structural schematic diagram of an air clamp assembly provided in one embodiment of this application.
[0032] Figure 7 This is a partial structural schematic diagram of a transport component provided in one embodiment of this application.
[0033] Figure 8 This is a partial structural schematic diagram of a transport component provided in one embodiment of this application.
[0034] Figures 1 to 8 The one-to-one correspondence between the component names and the reference numerals in the figures is as follows:
[0035] 10. Spindle assembly; 20. Worktable; 30. Crossbeam; 40. Base; 28. Circuit board; 291. First locating pin;
[0036] 11. Conveying assembly; 112. Gripper; 113. First drive component; 114. Pressing component; 115. Second drive component; 116. Guide channel; 117. Gripper drive component;
[0037] 21. Positioning part; 211. Clamping element; 212. Positioning element; 2110. Guide groove; 2111. End cap; 2112. Third driving element; 2113. Fourth driving element;
[0038] 22. Reference hole; 23. Positioning hole;
[0039] 24. Pneumatic clamp assembly; 241. Clamping part; 242. Drive part; 243. Positioning groove; 2410. Clamping component;
[0040] 25. First lifting assembly; 251. Top plate; 252. Fifth driving component; 253. Guide component; 26. Second lifting assembly. Detailed Implementation
[0041] The exemplary embodiments of this application are described in detail below with reference to the accompanying drawings. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of protection of this application. The scope of protection of this application is determined by the claims.
[0042] Techniques, methods, and apparatus known to those skilled in the art are considered part of the specification where appropriate and will not be discussed further here. Identical or similar reference numerals in the accompanying drawings represent identical or similar elements and will not be explained again in subsequent drawings.
[0043] In this document, directional terms such as "upper," "lower," "front," "rear," "left," and "right" are used only to describe the relative positional relationships between the components shown in the accompanying drawings, and not to define their absolute positions. Terms such as "first" and "second" are used only to distinguish different components and do not indicate importance, order, or interdependence. Furthermore, expressions such as "equal," "same," "aligned," "aligned," "flush," "axial direction," "horizontal direction," "above," "below," "consistent," "synchronous," "simultaneously," "in sequence," "axis," and "center" are not strict mathematical or geometric definitions, but rather allow for a reasonable range of error acceptable to those skilled in the art during manufacturing or use.
[0044] The circuit board processing equipment provided in this application includes: a base, a crossbeam, a spindle assembly, and a worktable. The worktable is disposed on the base and can move along a second direction; the crossbeam is mounted above the worktable, and at least one spindle assembly that can move along a first direction is slidably connected to it; the bottom of the spindle assembly holds a cutting tool and is driven by a drive mechanism to move along a third direction to process the circuit board on the worktable. The first direction, the second direction, and the third direction are perpendicular to each other, forming a spatial rectangular coordinate system. The circuit board processing equipment of this application can be a drilling machine, a forming machine, a milling machine, or a drilling and milling integrated machine, etc., and the number of spindle assemblies can be one, two, three, four, five, six, eight, ten, twelve, etc., without limitation.
[0045] The circuit board processing equipment includes a base, which serves as the load-bearing foundation for the entire equipment, supporting components such as the crossbeams and worktable. The base is preferably made of marble to ensure stable installation on the ground and to reduce the impact of vibrations generated by the high-speed, high-frequency movement of the spindle assembly on processing accuracy and stability.
[0046] The circuit board processing equipment also includes a worktable for supporting circuit boards. A drive mechanism drives the worktable to move the circuit boards along a second direction on a slide rail on a base. The worktable has at least one processing area, each carrying one circuit board. In some embodiments, the circuit board processing equipment includes a worktable with six processing areas for supporting circuit boards, which can move six circuit boards as a whole along the second direction. In other embodiments, the circuit board processing equipment includes six independent worktables, each with a processing area carrying one circuit board, and the six worktables can move their respective circuit boards independently along the second direction.
[0047] The circuit board processing equipment also includes a crossbeam spanning above the worktable, with both ends supported on a base by marble blocks. The crossbeam itself is preferably made of marble. A slide rail and a drive mechanism extending along a first direction are provided on the crossbeam for driving the spindle assembly to move along the first direction.
[0048] The circuit board processing equipment also includes a spindle assembly, which is slidably connected to a slide rail on a crossbeam. A drive mechanism drives the spindle assembly to move along a first direction. The spindle assembly moves along the first direction, and the worktable drives the circuit board to move along a second direction; the relative movement of the two establishes a two-dimensional planar coordinate system. The spindle assembly drives a cutting tool to reciprocate along a third direction, performing high-precision processing on the circuit board. In some embodiments, the number of spindle assemblies is the same as the number of circuit boards, with one spindle assembly corresponding to the processing of one circuit board. In other embodiments, at least two spindle assemblies can simultaneously replicate the processing of the same circuit board.
[0049] The circuit board processing equipment includes a pneumatic clamp assembly, which is mounted on a worktable and embedded in a groove on the upper surface of the worktable. The pneumatic clamp assembly is substantially flush with the worktable surface and can directly support the circuit board. The pneumatic clamp assembly includes a clamping part, a driving part, and a positioning groove. The clamping part includes two parallel clamping members that define a positioning groove with a predetermined width and depth. The width and depth of the positioning groove are adapted to a first positioning pin. The width of the positioning groove allows the first positioning pin to be inserted. When a second positioning pin disengages the first positioning pin from a positioning hole, the first positioning pin moves into the positioning groove, but does not contact the bottom of the positioning groove, leaving a depth allowance between them. The driving part drives the two clamping members to move relative to each other in a horizontal direction, and can control the clamping part to switch between a clamping state and a released state. In the clamped state, the two clamping members move closer to each other in the horizontal direction to clamp the first positioning pin, restricting the movement of the first positioning pin in the vertical direction; in the released state, the two clamping members move further apart in the horizontal direction, releasing the restriction on the first positioning pin, allowing the first positioning pin to move freely in the vertical direction.
[0050] A reference hole is pre-set in the positioning groove of the pneumatic clamping assembly. The reference hole guides the spindle assembly to machine the positioning hole on the circuit board. The position information of the reference hole pre-set on the worktable is obtained; the spindle assembly is controlled to machine the positioning hole concentric with the reference hole on the circuit board. The positioning hole and the reference hole are concentric. There are two reference holes, located near the edge of the circuit board in the non-processing area, and the distance between them is determined based on the length and width dimensions of the circuit board. Different spacing of reference holes can be set for circuit boards with different length and width dimensions to ensure that the reference holes are located on opposite sides of the circuit board. The reference hole guides the spindle assembly to machine the positioning hole on the circuit board. A first positioning pin is inserted into the positioning hole, passing through the positioning hole and entering the reference hole. The clamping part around the reference hole switches to a clamping state, clamping the first positioning pin, thereby fixing the circuit board to the worktable through the first positioning pin, creating conditions for machining the circuit board.
[0051] The circuit board processing equipment has a positioning unit on its worktable. This unit positions and presses the circuit boards onto the worktable surface. The positioning unit includes clamping components and positioning components, which together position the circuit boards. A positioning component is fixedly mounted on the worktable surface at one end of the pneumatic clamping assembly. This positioning component serves as a positioning reference for the circuit boards, ensuring consistent positioning of multiple circuit boards on the worktable. Clamping components are mounted on the other three sides of the worktable. These clamping components may consist of multiple sets, distributed in three directions of the worktable. They cooperate with a positioning component in one direction to limit the circuit boards on the worktable from four directions. The worktable also has guide grooves corresponding to the clamping components. A third driving component drives the clamping components to move within the guide grooves, pushing the circuit boards towards the positioning components, thereby positioning the circuit boards near the positioning components in the X and Y directions. The clamping and positioning components are also equipped with a lifting mechanism, which drives the clamping and positioning components to move up and down, positioning the circuit boards in the Z direction. The fourth driving component drives the clamping component and the positioning component to move up and down within the guide groove, and the end caps at the top of the clamping component and the positioning component press the circuit board from above the edge of the circuit board.
[0052] Positioning the circuit board on the worktable involves two steps: First, controlling the clamping member to move within the guide groove to push the circuit board horizontally, causing one side of the circuit board to abut against a positioning member on the worktable. The clamping member and the positioning member together limit the four sides of the circuit board, positioning circuit boards of different lengths and widths at the same reference position on the worktable. Second, controlling the clamping member and the positioning member to move vertically up and down to press the circuit board firmly onto the worktable. The clamping member and the positioning member include end caps. When the clamping member and the positioning member move vertically up and down, the end caps press the circuit board from above the edge of the circuit board, thereby limiting the circuit board in the Z direction. The circuit board may contain multiple functional structural layers. Stacking multiple structural layers on the worktable may cause irregularities in the X and Y directions. Positioning the circuit board in the X, Y, and Z directions by the clamping member and the positioning member ensures that the circuit board is neatly, stably, and reliably fixed on the worktable, creating conditions for machining the circuit board; at the same time, it also improves the stability and accuracy of machining multiple circuit boards.
[0053] The circuit board processing equipment includes a spindle assembly with a transport component mounted on it. The transport component moves synchronously with the cutting tool of the spindle assembly in a first direction, and independently with the cutting tool in a third direction. The transport component includes a first drive member, a second drive member, a gripper, and a pressing member. The first drive member drives the gripper to move vertically, passing through the guide channel of the pressing member. The second drive member drives the pressing member to move vertically. In the vertical direction, the height of the gripper from the worktable is less than the height of the pressing member from the worktable. The gripper is used to pick up a first locating pin and insert it into a locating hole, or to retrieve the first locating pin from the locating hole. The pressing member is used to press the circuit board, controlling the transport component to insert the first locating pin into the locating hole. The pressing member also presses the circuit board to prevent deformation caused by localized force imbalance. The transport component also includes a gripper drive member, which drives the gripper to grasp or release the first locating pin.
[0054] In some embodiments of this application, the tool head area of the worktable stores a first positioning pin. The first positioning pin is configured to be picked up by the transport assembly and inserted into a reference hole after a positioning hole is machined on the circuit board. When the first positioning pin extends into the reference hole, the pneumatic clamp assembly can switch from a released state to a clamping state to hold the first positioning pin, thereby locking the circuit board on the worktable. The transport assembly is controlled to insert the first positioning pin into the positioning hole. After the positioning hole is machined on the circuit board, the spindle assembly is controlled to move relative to the positioning hole, and the transport assembly follows the movement. When the gripper that picks up the first positioning pin moves to a position above the positioning hole, the second drive member drives the pressing member to descend to abut and press the circuit board, and the first drive member drives the gripper to descend. The gripper holding the first positioning pin passes through the guide channel of the pressing member and inserts the first positioning pin into the positioning hole.
[0055] During the insertion of the first locating pin into the locating hole, the control and conveying assembly inserts the first locating pin into the locating hole in two stages. In the first stage, the first drive unit controls the gripper to descend, and the gripper inserts the first locating pin into the locating hole. Since the locating hole and the reference hole are concentric and have essentially the same diameter, guided by the locating hole, at least a portion of the first locating pin aligns with the locating groove of the pneumatic clamp assembly located below the locating hole. In the second stage, the first drive unit controls the gripper to continue descending, and guided by the locating hole and the reference hole, the first locating pin moves towards the locating groove of the pneumatic clamp assembly, causing at least a portion of the first locating pin to extend into the clamping part. In some other embodiments, in the second stage, the second drive unit drives the pressing member to descend, and guided by the locating hole and the reference hole, the pressing member presses at least a portion of the first locating pin into the clamping part. Inserting the first locating pin in two stages can improve the perpendicularity of the first locating pin in the locating hole and the reference hole, ensuring the stability and reliability of the first locating pin locking the circuit board on the worktable.
[0056] The control of the lifting component's lifting movement also includes controlling the transport component to pick up the second positioning pin and insert it into the positioning hole to push the first positioning pin out of the positioning hole. The first positioning pin passes through the positioning hole and the reference hole and extends into the positioning groove between the clamping parts. During the process of separating the first positioning pin from the positioning hole of the circuit board, the transport component picks up the second positioning pin, moves it above the positioning hole, and inserts it into the positioning hole. The second positioning pin presses downward into the first positioning hole in the positioning hole, pushing the first positioning pin to move away from the positioning hole. This method of separating the first positioning pin can be applied to heavy-duty environments where the first positioning pin is stuck in the positioning hole, thereby preventing the first positioning pin from damaging the circuit board. The first and second positioning pins are of the same type, with the same length, diameter, and material, and both are stored in the cutter head of the worktable. In the above and below embodiments of this application, both the first and second positioning pins can be implemented as cylindrical pins.
[0057] After the circuit board disengages from the first locating pin, the removal of the circuit board also includes: controlling the grippers of the conveying device to grasp the edge of the circuit board near the locating hole, and driving the circuit board to perform lifting and translation movements to lift and remove the circuit board. A matching conveying device for transporting circuit boards is also provided near the circuit board processing equipment. The conveying device can extend into the worktable to remove the circuit board. After the first lifting assembly and the second lifting assembly lift the circuit board, the circuit board is supported by the second lifting assembly. The control conveying device moves above the circuit board, and the grippers of the conveying device extend into the side of the circuit board, grasping the edge near the locating hole. Through lifting and translation movements, the circuit board is removed from the worktable. The circuit board has four sides; selectively gripping the side near the locating hole helps to detach the circuit board from the first locating pin.
[0058] After the circuit board is removed, during the process of controlling the transport assembly to retrieve the first positioning pin, at least a portion of the first positioning pin is exposed because the clamping part is in a clamping state. The transport assembly's grippers hold the first positioning pin, the pneumatic clamp assembly's gripping part switches to a released state, releasing the first positioning pin, and the grippers pick up the first positioning pin from the reference hole, performing a lifting, lowering, and translating movement to retrieve the first positioning pin back into the cutter head of the worktable. When processing the next circuit board, the transport assembly can pick up the first positioning pin from the cutter head for reuse.
[0059] A first lifting assembly is installed on the worktable, located in grooves on both sides of the reference hole. The first lifting assembly is used to lift the circuit board, freeing it from the constraint of the first positioning pin. The first lifting assembly is positioned in the grooves on both sides of the pneumatic clamp assembly, and moves up and down within these grooves to lift the circuit board. The first lifting assembly rises to abut against the bottom surface of the circuit board around the positioning hole and continues to push the circuit board upwards, causing the positioning hole of the circuit board to disengage from the first positioning pin. After the first lifting assembly descends into the groove, it no longer lifts or abuts against the circuit board.
[0060] In the first lifting assembly, the first lifting assembly includes a top plate and a fifth driving component. The fifth driving component is used to drive the top plate to switch between an upward and downward state. In the upward state, the top plate lifts the circuit board, causing the positioning hole of the circuit board to disengage from the first positioning pin. In the downward state, the top plate sinks into the groove and no longer abuts against the circuit board. Specifically, during the upward movement of the top plate, the clamping part clamps the first positioning pin, which is connected in series through the positioning hole and the reference hole to the circuit board and the worktable, and the first positioning pin is in a locked clamped state. When the first lifting assembly switches from the downward state to the upward state, the top plate continues to move upward, abutting against the bottom of the circuit board around the positioning hole, and continues to push the circuit board upward. The upward pressure exerted by the top plate on the circuit board is greater than the frictional force between the first positioning pin and the circuit board in the positioning hole, causing the circuit board to slide relative to the first positioning pin until the positioning hole of the circuit board disengages from the first positioning pin. It should be noted that "disengagement" here refers to the separation of the first positioning pin and the positioning hole, including complete or partial disengagement; due to the influence of the gravity of the circuit board, at least a part of the first positioning pin may still be located in the positioning hole, and there is a possibility of partial disengagement.
[0061] In the first lifting assembly, both the top plate and the groove extend along the extension direction of the air clamp assembly, and the top plate is parallel to the central axis of the air clamp assembly. The first lifting assembly also includes multiple guide members arranged in a direction parallel to the central axis to support and guide the top plate. The top plate is square, with its length parallel to the central axis of the air clamp assembly, and the groove is adapted to the outer contour of the top plate. To support the lifting and lowering movement of the top plate, multiple guide members are provided below the top plate, distributed along the central axis. The fifth driving member drives the top plate to lift and lower vertically along the multiple guide members, ensuring the horizontality of the guide members and preventing deformation and damage to the circuit board due to localized force imbalance.
[0062] A second lifting assembly is also installed on the worktable. Multiple second lifting assemblies are evenly distributed on the worktable surface and configured to move up and down synchronously with the first lifting assembly to lift the circuit board as a whole. Multiple holes are formed on the worktable surface. The second lifting assemblies rise from these holes, lifting the circuit board off the worktable surface. The worktable has a predetermined area, and the circuit board is laid flat on it; typically, the circuit board's length and width are around 80 cm. Near the positioning holes on the circuit board, the first lifting assembly lifts the circuit board, separating it from the first positioning pin. In other areas of the circuit board, the second lifting assembly lifts the circuit board, separating it from the worktable. The second lifting assembly includes a drive mechanism that drives the second lifting assembly's up and down movement. A fifth drive component drives the first lifting assembly's up and down movement. Under the control of the control system, both move synchronously, thereby lifting the circuit board as a whole. This ensures the flatness of the large-sized circuit board during the lifting movement, preventing localized deformation and damage that could affect subsequent processing.
[0063] In the embodiments of this application, a circuit board processing control method is provided. This processing control method includes: positioning the circuit board on a worktable; controlling a spindle assembly to process positioning holes on the circuit board; controlling a transport assembly to pick up a first positioning pin and insert the first positioning pin through the positioning hole into a pneumatic clamp assembly on the worktable; controlling the pneumatic clamp assembly to clamp the first positioning pin to lock the circuit board on the worktable; controlling the spindle assembly to process the circuit board; after processing, controlling a first lifting assembly to move up and down to lift the circuit board and disengage it from the first positioning pin; removing the circuit board; controlling the pneumatic clamp assembly to release the first positioning pin and controlling the transport assembly to retract the first positioning pin.
[0064] In the embodiments of this application, a circuit board processing device is provided, comprising: a worktable for carrying a circuit board; a positioning part disposed on the worktable for positioning and pressing the circuit board onto the worktable surface; a pneumatic clamp assembly disposed on the worktable, wherein a reference hole is provided in the positioning groove of the pneumatic clamp assembly for guiding the spindle assembly to process the positioning hole on the circuit board; the pneumatic clamp assembly has a switchable release state and a clamping state; a first positioning pin configured to be picked up by a transport assembly and inserted into the reference hole through the positioning hole after the positioning hole is processed on the circuit board; when the first positioning pin extends into the reference hole, the pneumatic clamp assembly can switch from the release state to the clamping state to clamp the first positioning pin, thereby locking the circuit board on the worktable; and a first lifting assembly disposed on the worktable and located in the grooves on both sides of the reference hole; the first lifting assembly is used to lift the circuit board, so that the circuit board is freed from the constraint of the first positioning pin.
[0065] This circuit board processing equipment and control method involves machining positioning holes on the circuit board, inserting a first positioning pin into the positioning holes, and then using a pneumatic clamping assembly to clamp the first positioning pin from the bottom, thereby stably fixing the circuit board on the worktable. After processing the circuit board, a first lifting assembly and a second lifting assembly lift the circuit board, separating it from the positioning pin. On one hand, the circuit board is clamped by clamping and positioning components, and then fixed with the first positioning pin; on the other hand, the first lifting assembly separates the first positioning pin. This method of fixing and separating circuit boards is simple in structure, low in cost, high in precision, stable and reliable, and can simplify the circuit board positioning process and improve the efficiency of circuit board processing.
[0066] Example 1
[0067] This embodiment provides a circuit board processing control method and a circuit board processing device for implementing the method, such as... Figures 1 to 8 As shown, through the dual fixing mechanism of "board edge pressing + first positioning pin locking", and by setting the first lifting component and the second lifting component to separate the circuit board, high-precision positioning and reliable separation of the circuit board are achieved.
[0068] like Figure 1 As shown, the circuit board processing equipment includes a base 40, a crossbeam 30, a spindle assembly 10, a worktable 20, a conveying assembly 11, a pneumatic clamp assembly 24, a first lifting assembly 25, and a second lifting assembly 26. The base 40 supports the crossbeam 30 and the worktable 20. The crossbeam 30 spans above the worktable 20, with both ends supported on the base 40, and has slide rails extending along a first direction. The spindle assembly 10 is slidably connected to the crossbeam 30 and can move along the first direction; its bottom clamps a cutting tool and reciprocates along a third direction. The worktable 20 is mounted on the base 40 and can move along a second direction. The first, second, and third directions are perpendicular to each other.
[0069] like Figure 2 and Figure 3 As shown, a positioning part 21 is provided on the worktable 20. The positioning part 21 includes a positioning member 212, multiple clamping members 211, a guide groove 2110, and an end cap 2111. The positioning member 212 is fixed to one end of the worktable 20 adjacent to the pneumatic clamp assembly 24. The clamping members 211 are distributed on the other three sides and can move horizontally along the guide groove 2110 under the drive of the third driving member 2112, pushing the circuit board 28 against the positioning member 212. The end cap 2111 is provided at the top of the positioning member 212 and the clamping members 211, and is driven to rise and fall by the fourth driving member 2113 to press or release the circuit board 28 from above the edge of the board.
[0070] like Figure 2 and Figure 6As shown, the pneumatic clamp assembly 24 is embedded in a groove on the upper surface of the worktable 20, and includes a clamping part 241, a driving part 242, and a positioning groove 243. The clamping part 241 includes two parallel clamping members 2410, which define a positioning groove 243 with a predetermined width and depth. The positioning groove 243 is provided with two reference holes 22, which are located adjacent to the edge of the circuit board 28 and the spacing between them is determined according to the length and width dimensions of the circuit board. The driving part 242 can drive the clamping members 2410 to move relative to each other in the horizontal direction, so that the clamping part 241 switches between a clamping state and a released state.
[0071] like Figure 2 , Figure 4 and Figure 5 As shown, the first lifting assembly 25 is disposed in the grooves on both sides of the reference hole 22, and includes a top plate 251, a fifth drive member 252, and multiple guide members 253. The top plate 251 is parallel to the central axis of the air clamp assembly 24, and the guide members 253 are arranged along the central axis. The fifth drive member 252 drives the top plate 251 to switch between a rising state and a falling state along the guide members 253. The second lifting assembly 26 is evenly distributed on the table surface of the worktable 20 and is configured to rise and fall synchronously with the first lifting assembly 25.
[0072] like Figure 7 and Figure 8 As shown, the conveying assembly 11 is mounted on the spindle assembly 10 and includes a gripper 112, a pressing member 114, a first drive member 113, a second drive member 115, and a gripper drive member 117. A guide channel 116 is provided on the pressing member 114, through which the gripper 112 can move up and down. The gripper 112 and the pressing member 114 are driven by their respective independent drive mechanisms and move independently in the vertical direction.
[0073] The worktable 20 is also equipped with a tool head as a storage area for storing the first positioning pin 291 and the second positioning pin, both of which are cylindrical pins of the same specification.
[0074] This embodiment provides a circuit board processing control method, implemented using circuit board processing equipment. The equipment includes a base 40, a crossbeam 30, a spindle assembly 10, a worktable 20, a conveying assembly 11, a pneumatic clamp assembly 24, a first lifting assembly 25, a second lifting assembly 26, and a positioning part 21. The circuit board processing control method includes the following detailed steps:
[0075] Step S10: Position the circuit board 28 on the worktable 20.
[0076] S11: Place the circuit board 28 on the workbench 20, with the circuit board 28 covering the area where the air clamp assembly 24 is located.
[0077] S12: The third drive member 2112 of the control positioning unit 21 drives multiple clamping members 211 to move horizontally along the guide groove 2110. The clamping members 211 are distributed on three sides of the worktable 20, pushing the circuit board 28 from three directions, so that one side of the circuit board 28 abuts against the positioning member 212 fixedly set at one end of the pneumatic clamp assembly 24. At this time, the positioning member 212 and the clamping members 211 together limit the four sides of the circuit board 28, completing the horizontal (X, Y direction) positioning.
[0078] S13: Control the fourth driving member 2113 to drive the end cap 2111 at the top of the positioning member 212 and the clamping member 211 to descend vertically. The end cap 2111 presses against the circuit board 28 from above the edge of the circuit board 28, completing the vertical (Z direction) clamping. At this point, the circuit board 28 is reliably positioned and pressed against the table surface of the worktable 20.
[0079] Step S20: Control the spindle assembly 10 to machine positioning holes 23 on the circuit board 28.
[0080] S21: Obtain the position information of the reference hole 22 preset in the positioning groove 243 of the air clamp assembly 24. There are two reference holes 22, which are set adjacent to the edge of the circuit board 28, and the distance between them is determined according to the length and width of the circuit board 28.
[0081] S22: Control the spindle assembly 10 to move in the first direction along the slide rail on the crossbeam 30, and the worktable 20 to move in the second direction along the slide rail on the base 40. The two move in coordination so that the tool of the spindle assembly 10 is aligned with the position of the reference hole 22.
[0082] S23: Control the spindle assembly 10 to drive the tool to move downwards along a third direction, and machine a positioning hole 23 concentric with the reference hole 22 on the circuit board 28. The positioning hole is a through hole, and the diameter of the positioning hole 23 is adapted to the diameter of the first positioning pin 291. The two positioning holes 23 correspond to the two reference holes 22 respectively.
[0083] In step S30, the control conveying component 11 picks up the first positioning pin 291 and moves it above the positioning hole 23.
[0084] S31: Control the spindle assembly 10 to move the conveying assembly 11 mounted thereon to above the tool head area on the worktable 20. The tool head has multiple storage positions for storing the first positioning pin 291 and the second positioning pin.
[0085] S32: The first drive member 113 of the control conveying assembly 11 drives the gripper 112 to descend, and the gripper drive member 117 drives the gripper 112 to grip a first positioning pin 291. The first drive member 113 drives the gripper 112 to rise and reset, completing the pickup.
[0086] S33: Control the spindle assembly 10 to move in a first direction and the worktable 20 to move in a second direction, so that the transport assembly 11 is moved directly above the positioning hole 23 that has been machined on the circuit board 28.
[0087] Step S40: Insert the first positioning pin 291 through the positioning hole 23 into the air clamp assembly 24 on the worktable 20, and insert the first positioning pin 291 into the positioning hole 23 in two stages.
[0088] S41: In the first stage, the first driving member 113 drives the gripper 112 to descend, and the first positioning pin 291 held by the gripper 112 enters the positioning hole 23. Since the positioning hole 23 is concentric with the reference hole 22 and has a basically the same diameter, the lower end of the first positioning pin 291 is aligned with the positioning groove 243 of the air clamp assembly 24 located below the positioning hole 23 under the guidance of the positioning hole 23.
[0089] S42: In the second stage, the second driving member 115 drives the pressing member 114 to descend vertically. The lower surface of the pressing member 114 abuts against and presses the upper surface of the circuit board 28 to prevent the circuit board 28 from deforming or warping due to local force during the subsequent insertion process.
[0090] S43: The first driving member 113 drives the gripper 112 to continue descending, and the gripper 112 drives the first positioning pin 291 to pass through the guide channel 116 on the pressing member 114. At least a portion of the first positioning pin 291 extends downward into the positioning groove 243 of the pneumatic clamp assembly 24. At this time, a predetermined gap remains between the bottom end of the first positioning pin 291 and the bottom of the positioning groove 243, and it does not contact the bottom of the groove.
[0091] In step S50, the pneumatic clamp assembly 24 is controlled to clamp the first positioning pin 291 to lock the circuit board 28 onto the worktable 20.
[0092] S51: The drive unit 242 of the control air clamp assembly 24 is operated, driving the two clamping members 2410 of the clamping unit 241 to move closer to each other in the horizontal direction.
[0093] S52: The two clamping members 2410 switch from the released state to the clamping state, clamping the first positioning pin 291 located in the positioning groove 243 in the horizontal direction, and restricting the movement of the first positioning pin 291 in the vertical direction.
[0094] S53: Since the first positioning pin 291 passes through the positioning hole 23 of the circuit board 28 and is clamped by the clamping part 241, the circuit board 28 is firmly locked on the worktable 20, and the locking is completed.
[0095] S54: Control the first drive unit 113 to drive the gripper 112 to release the first positioning pin 291 and rise to reset; control the second drive unit 115 to drive the pressing member 114 to rise to reset. The conveying assembly 11 resets to the standby position.
[0096] Step S60: Control the spindle assembly 10 to process the circuit board 28.
[0097] S61: According to the preset processing program, the spindle assembly 10 is controlled to move along the first direction, the worktable 20 drives the circuit board 28 to move along the second direction, and the spindle assembly 10 drives the tool to reciprocate along the third direction to perform mechanical processing such as drilling, forming, and milling on the circuit board 28.
[0098] S62: During the processing, the circuit board 28 is always firmly locked by the first positioning pin 291 and the air clamp assembly 24 to maintain processing accuracy and stability.
[0099] In step S70, the first lifting component 25 is controlled to lift the circuit board 28, so that the circuit board 28 is disengaged from the first positioning pin 291.
[0100] S71: After processing is completed, the control of the fourth driving component 2113 drives the end cover 2111 of the positioning part 21 to rise in the vertical direction, switching the positioning part 21 from the descending pressing state to the rising positioning state, and releasing the pressing on the edge of the circuit board 28.
[0101] S72: Control the fifth drive component 252 of the first lifting assembly 25 to operate, driving the top plate 251 to rise vertically from the groove along multiple guides 253. The guides 253 are arranged in a direction parallel to the central axis of the air clamp assembly 24 to ensure that the top plate 251 rises smoothly and maintains its levelness.
[0102] S73: The top plate 251 rises to abut the bottom surface of the circuit board 28 around the first positioning pin 291 and continues to push the circuit board 28 upward. The upward force applied by the top plate 251 overcomes the friction between the positioning hole 23 and the first positioning pin 291, and the circuit board 28 slides upward relative to the first positioning pin 291.
[0103] S74: Simultaneously, multiple second lifting components 26, evenly distributed on the workbench 20, are controlled to move up and down synchronously with the first lifting component 25. The second lifting components 26 rise synchronously from the holes opened on the workbench, abutting against other areas of the bottom surface of the circuit board 28, and together with the top plate 251, lift the circuit board 28 horizontally as a whole.
[0104] S75: The circuit board 28 rises smoothly until the positioning hole 23 is completely disengaged from the first positioning pin 291. At this point, the circuit board 28 is lifted by the second lifting assembly 26 and is no longer constrained by the first positioning pin 291. The first positioning pin 291 is still clamped by the clamping part 241 of the pneumatic clamp assembly 24 and remains in its original position.
[0105] Step S80: Remove circuit board 28.
[0106] S81: Controls a transport device (such as a robotic arm) located near the circuit board processing equipment to move above the worktable 20.
[0107] S82: The gripping part of the conveying device extends into the side area of the circuit board 28 and grips the edge of the circuit board 28 adjacent to the positioning hole 23. Selecting this edge helps to confirm the final separation of the circuit board 28 from the first positioning pin 291.
[0108] S83: The conveying device first moves the circuit board 28 vertically upward, so that the circuit board 28 is completely away from the space above the first positioning pin 291 and the second lifting component 26; then it moves horizontally to move the circuit board 28 out of the worktable 20, thus completing the removal.
[0109] S84: Control the second lifting component 26 and the first lifting component 25 to descend and reset, the top plate 251 sinks into the groove, and the second lifting component 26 retracts into the hole opened on the platform.
[0110] In step S90, control the air clamp assembly 24 to release the first positioning pin 291, and control the conveying assembly 11 to retract the first positioning pin 291.
[0111] S91: Control the spindle assembly 10 to move the conveying assembly 11 above the pneumatic clamp assembly 24, so that the gripper 112 is aligned with the first positioning pin 291 that is still clamped.
[0112] S92: Control the first drive member 113 to drive the gripper 112 to descend, and the gripper drive member 117 to drive the gripper 112 to clamp the portion of the first positioning pin 291 that is exposed above the clamping part 241.
[0113] S93: The drive unit 242 of the control air clamp assembly 24 drives the two clamping members 2410 of the clamping unit 241 to move away from each other in the horizontal direction, switching from the clamping state to the releasing state, and releasing the first positioning pin 291. At this time, the first positioning pin 291 is only held by the jaws 112.
[0114] S94: Control the first driving member 113 to drive the gripper 112 to rise, and remove the first positioning pin 291 from the reference hole 22 and the positioning groove 243.
[0115] S95: Control the spindle assembly 10 to move the transport assembly 11 to above the tool head on the worktable 20.
[0116] S96: The first drive unit 113 drives the gripper 112 to descend, and the gripper drive unit 117 drives the gripper 112 to release the first positioning pin 291, returning it to the corresponding storage position on the tool turret, thus completing the recycling. The first positioning pin 291 can be reused when processing the next circuit board.
[0117] Through the above steps, multiple processes such as positioning, locking, processing, and separation of circuit boards on the worktable can be achieved. The technical advantages of this circuit board processing equipment and control method are: high positioning accuracy and good consistency among multiple boards. The positioning structure of "one-side reference, three-side clamping" ensures that circuit boards of different sizes can be positioned at the same reference position, and the end cap presses against the board edge to achieve multi-directional constraint. Reliable locking and strong processing stability are achieved by using pins passing through positioning holes and being horizontally clamped by pneumatic clamping components to rigidly lock the circuit board to the worktable, effectively suppressing processing vibration. Staged pin insertion protects thin circuit boards; the "first clamp, then insert pin" action sequence prevents warping deformation caused by localized stress. Overall synchronous lifting ensures damage-free separation of large boards, and multi-point synchronous lifting ensures flatness during the separation of large-format circuit boards. Automatic pin retrieval and full-process automation—the entire process of pin picking, locking, releasing, and retrieval is completed automatically. The structure is compact and the cost is low; the pneumatic clamping components are embedded in the worktable, the pins are reusable, and the mechanism is simple and reliable.
[0118] Example 2
[0119] This embodiment provides a circuit board processing control method and a circuit board processing equipment for implementing the method. The structure of the circuit board processing equipment in this embodiment is basically the same as that in Embodiment 1, except that the method of separating the first positioning pin is different.
[0120] This embodiment describes a rework method when the first positioning pin 291 is stuck in the positioning hole 23. This method can be performed before or after step S70 of embodiment one, which involves lifting the circuit board 28. During the lifting of the top plate 251, if the positioning hole 23 of the circuit board 28 fails to disengage smoothly from the first positioning pin 291 during the lifting action, it is determined to be stuck, and the rework process is initiated. Alternatively, the rework process can also be initiated when the lifting is completed but the first positioning pin 291 is still embedded in the positioning hole 23. Specifically, the following steps are included:
[0121] S110, control the fourth drive unit 2113 to keep the end cover 2111 of the positioning part 21 in the rising positioning state, so as to avoid interfering with the subsequent movement of the circuit board 28.
[0122] S120, the control conveying assembly 11 picks up the second positioning pin from the cutter head on the worktable 20. The second positioning pin and the first positioning pin 291 are cylindrical pins of the same specification and are stored in different positions on the same cutter head.
[0123] S130, the spindle assembly 10 drives the conveying assembly 11 to move directly above the stuck positioning hole 23.
[0124] S140, the second drive member 115 drives the pressing member 114 to descend and press the circuit board 28 from above to prevent the circuit board 28 from bending or warping when subjected to force.
[0125] S150, the first driving member 113 drives the gripper 112 to hold the second positioning pin, pass through the guide channel 116 on the pressing member 114, and insert the second positioning pin vertically downward into the positioning hole 23.
[0126] S160, the second positioning pin presses down on the top of the first positioning pin 291 in the positioning hole 23, pushing the first positioning pin 291 downward along the positioning hole 23 and the reference hole 22 until the first positioning pin 291 is completely disengaged from the positioning hole 23.
[0127] S170, the second driving component 115 drives the pressing component 114 to rise and reset, and the first driving component 113 drives the gripper 112 to rise and reset. At this time, the circuit board 28 is completely separated from the first positioning pin 291.
[0128] S180, following the normal procedure, control the first lifting component 25 and the second lifting component 26 to rise synchronously, lift the circuit board 28 as a whole and move it away; or if the circuit board 28 was already in a lifted state, it can be directly moved away by the transport device.
[0129] S190, control the conveying assembly 11 to retrieve the first positioning pin 291 and the second positioning pin. The gripper 112 first grips the first positioning pin 291 exposed in the gripping part 241, controls the gripping part 241 to switch to the release state and removes it; then moves to the positioning hole 23 to grip the second positioning pin; finally, put the two pins back onto the cutter head in sequence.
[0130] This rework method utilizes a second locating pin of the same specification as the first locating pin for opposing compression, avoiding potential edge damage or locating hole deformation caused by directly pulling the circuit board. It is particularly suitable for processing high-density, thin circuit boards. The technical advantages of this circuit board processing equipment and control method are: effectively solving pin jamming, ensuring processing continuity, and quickly restoring normal production by applying force from above with the second locating pin to push out the first locating pin. It avoids circuit board damage and improves product yield by using a coaxial opposing compression method, with the force direction consistent with the axial direction of the locating hole. Furthermore, the pressing component first presses the circuit board, concentrating the separation force between the pin and the hole wall, without pulling the board. The pins are universal, simplifying material management; the two pins are of the same specification and can be used interchangeably. Automated execution reduces manual reliance, and the rework process is fully automated. The process is integrable, with good system compatibility; it can be directly integrated into the main process as an optional sub-process, automatically triggered upon detecting jamming via sensors or motion monitoring, requiring no additional hardware modifications.
[0131] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical applications, or technological improvements to the embodiments in the market, or to enable others skilled in the art to understand the embodiments disclosed herein. The scope of this application is defined by the appended claims.
Claims
1. A circuit board processing control method, characterized in that, include: Position the circuit board on the worktable; The spindle assembly is controlled to have positioning holes machined on the circuit board; The control conveying component picks up the first positioning pin and inserts the first positioning pin through the positioning hole into the pneumatic clamping component on the worktable; the control of the pneumatic clamping component clamps the first positioning pin to lock the circuit board on the worktable, wherein controlling the pneumatic clamping component to clamp the first positioning pin includes: driving the clamping part of the pneumatic clamping component to move in the horizontal direction, so that the clamping part switches to the clamping state; Control the spindle assembly to process the circuit board; Controlling the lifting component to move up and down to lift the circuit board, causing the positioning hole to disengage from the first positioning pin; wherein, disengaging the positioning hole from the first positioning pin includes: the first lifting component rising to abut against the bottom surface of the circuit board around the positioning hole, and continuing to push the circuit board up; or, further includes: controlling the conveying component to pick up the second positioning pin and insert the second positioning pin into the positioning hole, thereby pushing the first positioning pin out of the positioning hole; The workbench is also provided with a second lifting component, which is evenly distributed on the surface of the workbench. The second lifting component moves up and down synchronously with the first lifting component, causing the circuit board to detach from the workbench as a whole. Remove the circuit board; Controlling the pneumatic clamp assembly to release the first positioning pin, and controlling the conveying assembly to retract the first positioning pin; wherein, controlling the pneumatic clamp assembly to release the first positioning pin includes: driving the clamping part of the pneumatic clamp assembly to move in a horizontal direction, so that the clamping part switches to a release state.
2. The circuit board processing control method according to claim 1, characterized in that, Removing the circuit board includes: controlling the grippers of the conveying device to grasp the edge of the circuit board near the positioning hole, and driving the circuit board to perform lifting and translation movements to lift and remove the circuit board.
3. The circuit board processing control method according to claim 1, characterized in that, Controlling the conveying assembly to insert the first positioning pin into the positioning hole includes controlling the conveying assembly to insert the first positioning pin into the positioning hole in two stages. In the first stage, the first positioning pin is guided through the positioning hole and aligned with the positioning groove of the air clamp assembly; in the second stage, at least a portion of the first positioning pin is inserted into the positioning groove.
4. The circuit board processing control method according to claim 1, characterized in that, The control and handling assembly for retrieving the first positioning pin includes: controlling the grippers of the handling assembly to hold the portion of the first positioning pin exposed in the pneumatic clamp assembly; controlling the pneumatic clamp assembly to switch from a clamping state to a releasing state to release the first positioning pin; and controlling the grippers to remove the first positioning pin from the positioning slot and transfer it to the cutter head on the worktable.
5. The circuit board processing control method according to any one of claims 1 to 4, characterized in that, Positioning the circuit board on the worktable includes: controlling the clamping member of the positioning part to push the circuit board in the horizontal direction, so that the side of the circuit board abuts against the positioning member on the worktable; controlling the positioning part to move in the vertical direction to press the circuit board firmly on the worktable.
6. The circuit board processing control method according to claim 5, characterized in that, The positioning part switches between an upward positioning state and a downward pressing state; controlling the first lifting component to perform lifting and lowering movements to lift the circuit board also includes: switching the positioning part to the upward positioning state.
7. The circuit board processing control method according to any one of claims 1 to 4, characterized in that, The process of controlling the spindle assembly to process positioning holes on the circuit board includes: acquiring the position information of a reference hole preset on the worktable; and controlling the spindle assembly to process the positioning hole concentric with the reference hole on the circuit board.
8. A circuit board processing equipment, characterized in that, include: The workbench is used to support the circuit boards; A positioning part is provided on the workbench for positioning and pressing the circuit board onto the workbench surface; An air clamp assembly is disposed on the worktable. The air clamp assembly includes a clamping part and a driving part. A reference hole is provided in the positioning groove of the air clamp assembly. The reference hole is used to guide the spindle assembly to process positioning holes on the circuit board. The driving unit is used to drive the clamping unit to move in the horizontal direction, so that it switches between a clamping state and a releasing state. The first positioning pin is configured to be picked up by the transport assembly and inserted into the reference hole after the positioning hole is machined on the circuit board; when the first positioning pin is inserted into the reference hole, the clamping part can switch from the released state to the clamping state and clamp the first positioning pin in the horizontal direction, thereby locking the circuit board on the worktable. A first lifting assembly is disposed on the worktable and located in the grooves on both sides of the reference hole; the first lifting assembly includes a top plate and a fifth driving member, the fifth driving member being used to drive the top plate to switch between a rising state and a falling state. In the rising state, the top plate lifts the circuit board, causing the positioning hole to disengage from the first positioning pin; both the top plate and the grooves extend along the extending direction of the air clamp assembly, and the top plate is parallel to the central axis of the air clamp assembly; The second lifting assembly, a plurality of the second lifting assemblies are evenly distributed on the table surface of the workbench and are configured to move up and down synchronously with the first lifting assembly to lift the circuit board as a whole.
9. The circuit board processing equipment according to claim 8, characterized in that, The positioning groove has a predetermined depth, and when the first positioning pin is inserted into the positioning groove and clamped, there is a gap between the bottom end of the first positioning pin and the bottom of the positioning groove.
10. The circuit board processing equipment according to claim 8, characterized in that, The first lifting assembly also includes a plurality of guide members arranged in a direction parallel to the central axis for supporting and guiding the top plate.
11. The circuit board processing equipment according to any one of claims 8 to 10, characterized in that, The transport assembly is disposed on the spindle assembly, and the transport assembly includes a gripper and a pressing member; the gripper is used to pick up, insert or retrieve the first positioning pin; the pressing member is used to press the circuit board from above when the first positioning pin is inserted into the positioning hole.
12. The circuit board processing equipment according to any one of claims 8 to 10, characterized in that, The number of reference holes is two, and the two reference holes are set near the edge of the circuit board, and the distance between them is determined based on the length and width dimensions of the circuit board.
Citation Information
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