Smt assembly apparatus and method of operation thereof

Abstract

The present application belongs to the technical field of carrying thin or filamentous material, and particularly relates to an assembling device for SMT patches and a working method thereof. The device comprises a base, a rack arranged above the base, a film tearing driving assembly arranged on the rack, and a film tearing execution mechanism. The film tearing execution mechanism is slidably connected with the rack guide rail through a sliding block and is linearly moved along a film tearing direction by the film tearing driving assembly. A negative pressure adsorption assembly and a pressing assembly are arranged on the mechanism. The negative pressure adsorption assembly is used for adsorbing a PCB protective film. The pressing assembly comprises an air jet roller and a rotary driving member. The air jet roller is arranged opposite to the negative pressure adsorption assembly, and the rotary driving member can adjust the air jet direction. During work, the air jet roller vertically sprays air downward to tightly attach the protective film to the board surface, and then moves synchronously with the mechanism to complete the peeling together with the adsorption assembly.

Description

Technical Field

[0001] This invention belongs to the technical field of handling thin or filamentous materials, specifically relating to equipment for packaging objects or materials, and more particularly to an assembly equipment for SMT placement and its working method. Background Technology

[0002] In the manufacturing process of printed circuit boards (PCBs) and surface mount technology (SMT), a protective film is usually applied to the surface of the PCB to protect the copper foil traces from oxidation, contamination, or mechanical scratches. This protective film needs to be peeled off by automated equipment before subsequent processing steps begin.

[0003] Existing automated film peeling equipment typically operates on the principle of negative pressure adsorption. The equipment uses a robotic arm to drive suction cups with negative pressure adsorption capabilities to adhere to the edges or specific areas of the protective film, then forcibly peels the film from the PCB board surface through linear motion. However, in actual industrial production, PCB designs often include numerous vias, blind / buried vias, component pads, and other structures. When the protective film adheres tightly to such a complex morphology, the presence of microstructures can easily create localized closed air chambers or varying degrees of physical interlocking between the film and the board surface. This results in highly uneven peeling resistance between different parts of the protective film and the PCB board surface during the peeling process. Existing solutions that simply rely on negative pressure adsorption for clamping and direct peeling lack effective mechanisms to control these localized resistances, easily leading to stress imbalance on the protective film at the moment of peeling. This uneven stress concentration often causes irreversible tensile deformation or even tearing of the protective film, resulting in peeling failure. This not only affects production cycle time but may also cause quality issues due to film residue.

[0004] Therefore, how to overcome the problem of uneven stress during film removal caused by the complex morphology of PCB boards is a technical problem that urgently needs to be solved by those skilled in the art.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0006] This disclosure provides at least one SMT assembly device and its operating method.

[0007] In a first aspect, embodiments of this disclosure provide an assembly apparatus for SMT (Surface Mount Technology) placement, comprising: a base on which a loading tray for placing PCB boards is disposed; The frame is positioned above the feeding tray; A film-tearing drive assembly is mounted on the frame; A film-tearing actuator is disposed above the feeding tray and slides in cooperation with the frame along the film-tearing direction; The film-peeling mechanism includes at least one negative pressure adsorption component for adsorbing the protective film on the PCB board; The film-tearing drive assembly is connected to the film-tearing actuator to drive the film-tearing actuator to move linearly along the film-tearing direction; The clamping assembly includes an air-jet roller and a rotary drive. The air-jet roller is arranged opposite to the negative pressure adsorption assembly to press the protective film firmly during the film-tearing process; and, The rotary drive is connected to the jet roller and is used to adjust the jet direction of the jet roller; The control module is electrically connected to the film-tearing drive assembly, the film-tearing actuator, and the rotary drive component, respectively, and is used to control the start and stop of the film-tearing drive assembly, the adsorption action of the negative pressure adsorption assembly, and the angle switching sequence of the rotary drive component.

[0008] In one alternative embodiment, the jet roller includes an outer roller and an inner roller arranged coaxially; The outer roller has at least two ventilation holes facing different directions, including a vertical ventilation hole and an oblique ventilation hole; The inner roller has jet holes on its peripheral wall that correspond to the vertical and oblique air holes. The rotary drive is connected to the inner roller and is used to drive the inner roller to rotate relative to the outer roller, so that the jet hole switches between the vertical vent and the oblique vent.

[0009] In one optional embodiment, the airflow ejected from the vertical vent is perpendicular to the panel of the PCB board, and the airflow ejected from the oblique vent forms an angle of 30°-60° with the PCB board.

[0010] In one optional embodiment, one end of the inner roller is provided with a rotary joint, and an external air source is connected to the air supply channel of the inner roller through the rotary joint; The inner roller rotates relative to the outer roller via a bearing.

[0011] In one optional embodiment, the negative pressure adsorption assembly includes a cylinder and a negative pressure suction cup; The cylinder is connected to the negative pressure suction cup for adjusting the distance between the negative pressure suction cup and the PCB board.

[0012] In one optional embodiment, the film-tearing actuator further includes a support, and the negative pressure adsorption assembly is disposed on the cantilever of the support; and, A slider is also provided on the side of the bracket away from the negative pressure adsorption component, and a guide rail is provided on the frame to slide with the slider.

[0013] In one optional embodiment, a servo motor and a rotating shaft are provided on the other side of the frame relative to the guide rail, and the output shaft of the servo motor and the rotating shaft are connected by a conveyor belt. The support is provided with a connecting block, which passes through the frame and connects to the conveyor belt. The servo motor drives the conveyor belt to move in a cycle, so as to pull the support to move in a straight line along the tearing direction through the connecting block.

[0014] In one optional embodiment, the pressing assembly further includes a pair of mounting seats, which are respectively disposed on the cylinder of the negative pressure adsorption assembly and are disposed in front of the negative pressure adsorption assembly along the tearing direction. The jet roller is positioned between a pair of mounting bases to move synchronously with the negative pressure adsorption assembly along the film-tearing direction.

[0015] In one optional implementation, the loading tray is provided with positioning pins to position the PCB board placed thereon.

[0016] Secondly, embodiments of this disclosure also provide a method for operating an assembly apparatus for SMT placement, comprising: Place the PCB board with the film to be peeled into the loading tray of the base and position it using the positioning pins; The photoelectric sensor detects the edge position of the protective film and sends the position signal to the control module. The control module controls the film-tearing drive assembly to move the film-tearing actuator above the PCB board, so that the negative pressure adsorption assembly is aligned with the edge of the protective film. The control module controls the cylinder of the negative pressure adsorption component to drive the negative pressure suction cup downward to approach the protective film; According to the angle switching sequence, the angle switching of the air jet roller is controlled: the control module first controls the rotary drive to drive the inner roller of the air jet roller to rotate, so that the air jet hole is aligned with the oblique ventilation hole and sprays air obliquely onto the protective film surface to blow away dust; then the rotary drive continues to drive the inner roller to rotate, so that the air jet hole is switched to be aligned with the vertical ventilation hole to spray air vertically downward, so that the protective film adheres tightly to the PCB board surface. After the negative pressure suction cup adheres to the protective film, the control module controls the film-tearing drive component to continue driving the film-tearing actuator to move linearly along the film-tearing direction, causing the negative pressure suction cup to pull the protective film. The air jet roller moves synchronously with the negative pressure suction cup to maintain the pressure on the protective film until the protective film is completely detached from the PCB board.

[0017] The beneficial effects of this invention are that the SMT assembly equipment and its working method, by adding a rotatable air jet roller arranged opposite to the negative pressure adsorption component, firstly, the air jet roller uses oblique airflow to blow away the floating dust at the edge of the protective film during operation, so that the negative pressure adsorption component can adsorb the protective film; then the air jet roller switches to vertical downward airflow, so that the protective film is continuously pressed against the PCB board surface by micro-positive pressure in the area that is about to enter the peeling front edge, smoothing the originally discrete and abrupt local resistance into a more uniform bonding force field along the peeling front edge; the air jet roller moves forward and backward synchronously with the negative pressure adsorption component, providing controlled bonding pressure on the film surface throughout the peeling process, so that the peeling front edge of the film layer remains stable, avoiding excessive stretching or even tearing of the protective film due to abrupt changes in local resistance, and solving the hidden danger of unstable film peeling caused by the lack of a local resistance control mechanism in the existing simple negative pressure adsorption scheme.

[0018] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and drawings.

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 A perspective view of an assembly apparatus for SMT placement provided in an embodiment of this disclosure; Figure 2 A partially enlarged perspective view of an SMT assembly apparatus provided in an embodiment of this disclosure; Figure 3 A partially enlarged perspective view of an SMT assembly apparatus provided in an embodiment of this disclosure; Figure 4 A cross-sectional view of the inner roller of an SMT assembly device in its initial position, provided in an embodiment of this disclosure; Figure 5 A cross-sectional view of the inner and outer rollers of an SMT assembly apparatus during film removal, provided in an embodiment of this disclosure; Figure 6This is a schematic block diagram of a control module for an SMT assembly equipment provided in an embodiment of the present disclosure.

[0022] In the picture: 100. Base; 200. Feeding tray; 210. Positioning pin; 300. Rack; 310. Guide rail; 400. Film tearing drive assembly; 410. Servo motor; 420. Rotary shaft; 430. Conveyor belt; 500. Film-tearing actuator; 510. Negative pressure adsorption assembly; 511. Cylinder; 512. Negative pressure suction cup; 600, Clamping assembly; 610, Air jet roller; 611, Outer roller; 6112, Vertical vent; 6113, Angled vent; 612, Inner roller; 6121, Air jet hole; 620, Rotary drive component; 630, Mounting base; 700, bracket; 710, cantilever; 720, slider; 730, connecting block. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0025] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0026] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0027] Research has revealed shortcomings in existing technologies: Current automated film-peeling equipment typically operates on the principle of negative pressure adsorption. This involves a robotic arm driving suction cups with negative pressure adsorption capabilities to adhere to the edges or specific areas of the protective film, then forcibly peeling the film off the PCB board surface via linear motion. However, in actual industrial production, PCB designs often include numerous vias, blind / buried vias, and component pads. When the protective film adheres tightly to such a complex surface, the presence of microstructures can easily create localized closed air chambers or varying degrees of physical interlocking between the film and the board surface. This results in highly uneven peeling resistance between different parts of the protective film and the PCB board surface during the peeling process. Existing solutions that rely solely on negative pressure adsorption for clamping and direct peeling lack effective mechanisms to control these localized resistances, easily leading to stress imbalance on the protective film at the moment of peeling. This uneven stress concentration often causes irreversible tensile deformation or even tearing of the protective film, resulting in peeling failure. This not only affects production cycle time but may also cause quality issues due to residual film residue.

[0028] Based on the above research, this disclosure provides an assembly device for SMT chip mounting and its working method. By setting an air jet roller that is arranged opposite to the negative pressure adsorption component and can be rotated and adjusted, the microscopic interlocking between the film and the board surface is broken by oblique airflow before film peeling. During the film peeling process, the airflow continuously presses the film layer onto the board surface. At the same time, the air jet roller moves forward and backward synchronously with the film peeling actuator, transforming the originally abrupt and discrete local peeling resistance into a uniformly distributed bonding force along the film peeling path, thereby achieving non-destructive and stable peeling of the protective film.

[0029] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0030] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0031] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0032] See Figure 1 This disclosure provides an SMT assembly device, including a base 100, which serves as the mounting foundation for the entire device. A loading tray 200 is mounted on the base 100, which holds PCB boards to be peeled off. A frame 300 spans directly above the loading tray 200, providing longitudinal support and space for the peeling action. A peeling drive assembly 400 is fixedly mounted on the frame 300, and a peeling actuator 500 is mounted above the loading tray 200 and slides in cooperation with the frame 300. The sliding direction of the peeling actuator 500 is consistent with the peeling direction.

[0033] See Figure 1 and Figure 2 In some embodiments, the film-peeling actuator 500 is equipped with at least one negative pressure adsorption component 510. This component specifically includes a cylinder 511 and a negative pressure suction cup 512 connected to its piston rod. The cylinder 511 drives the negative pressure suction cup 512 to rise and fall, allowing it to precisely adsorb the edge of the protective film on the PCB board. A pressing component 600 is also provided on the film-peeling actuator 500. The pressing component 600 includes an air jet roller 610 and a rotary drive 620. The air jet roller 610 is spatially arranged opposite to the negative pressure adsorption component 510, and its function is to press the protective film, which is at the critical peeling state, in real time during the movement of the film-peeling actuator 500. The rotary drive 620 is fixedly connected to one end of the air jet roller 610 and can drive the air jet roller 610 to rotate, thereby flexibly adjusting the orientation of the air vents of the air jet roller 610 to adapt to the control requirements of pressing force and air jet direction at different stages of film peeling. During the film peeling process, the rotary drive 620 adjusts the air jet direction of the air jet roller 610, so that it applies a continuous pressing force to the protective film on the peeling path, effectively breaking the physical interlocking between the film layer and the PCB board surface caused by structures such as through holes, and eliminating the uneven distribution of peeling resistance; at the same time, the air jet roller 610 and the negative pressure adsorption component 510 are arranged opposite to each other and move forward and backward synchronously with them, preventing the film layer from being stretched or torn due to local force imbalance during the peeling process.

[0034] See Figure 2 and Figure 4In some embodiments, the air jet roller 610 of the pressing assembly 600 adopts a coaxial split inner and outer roller 611 structure, specifically including an outer roller 611 and an inner roller 612, which are coaxially arranged and driven by a rotary drive member 620 to rotate relative to the outer roller 611 about a common axis. At least two sets of ventilation holes with different orientations are opened on the peripheral wall of the outer roller 611, including at least one vertical ventilation hole 6112 and one oblique ventilation hole 6113. The vertical ventilation hole 6112 and the oblique ventilation hole 6113 are both constructed as elongated holes extending along the axial direction of the outer roller 611, so that the air jet forms a continuous air jet strip along the roller axial direction. Specifically, the outlet of the vertical vent 6112 is oriented substantially perpendicular to the PCB board surface and is used to spray air vertically downwards onto the protective film to create a pressing and adhesion effect; the outlet of the oblique vent 6113 is inclined relative to the board surface and opens upstream in the peeling direction, used to form an oblique blowing airflow in the peeling leading edge area to blow away micro-dust on the upstream side of the protective film. An air supply channel is formed inside the inner roller 612, and an air jet hole 6121 is opened on its peripheral wall; an external air source is connected to the air inlet end of the inner roller 612, and the airflow reaches the air jet hole 6121 through the air supply channel.

[0035] See also Figure 4 and Figure 5 In some embodiments, the rotary drive 620 can be a servo motor 410 or a servo motor, whose output shaft is coaxially connected to one end of the inner roller 612 via a coupling, for driving the inner roller 612 to rotate relative to the fixed outer roller 611. Specifically, the initial position of the air jet hole 6121 on the inner roller 612 can be defined as zero position, at which time the air jet direction of the air jet hole 6121 on the inner roller 612 is perpendicular to the air jet direction of the vertical ventilation hole 6112 on the outer roller 611 (e.g., Figure 4 As shown, the controller has pre-stored switching angle parameters (set to 22.5° in this embodiment). When the film edge cleaning action needs to be performed, the controller sends a rotation command to the servo motor 410, driving the inner roller 612 to rotate 22.5° clockwise relative to the outer roller 611, so that the air jet hole 6121 is deflected to align with the oblique ventilation hole 6113, outputting oblique airflow; when the cleaning is completed and the pressing and peeling stage is to be entered, the controller continues to send a rotation command to the servo motor 410, driving the inner roller 612 to continue rotating 22.5° clockwise, so that the air jet hole 6121 is deflected to align with the vertical ventilation hole 6112, outputting vertical airflow to press the protective film. After the film peeling is completed, the controller sends a rotation command to the servo motor 410, driving the inner roller 612 to rotate counterclockwise relative to the outer roller 611, so that the air jet hole 6121 of the inner roller 612 returns to the zero position.

[0036] See also Figure 2 and Figure 4In some embodiments, the vertical vent 6112 on the outer roller 611 is configured such that its outlet airflow direction is perpendicular to the surface of the PCB board. This design ensures that during the main film-peeling stage, the airflow applies a purely normal pressure to the protective film, uniformly and smoothly pressing the film layer onto the board surface. The corresponding oblique vent 6113 is configured such that its outlet airflow direction forms an angle of 30° to 60° with the PCB board surface, preferably 45°. This angle range balances blowing force and airflow coverage area. The oblique airflow at this specific angle effectively removes dust particles from the edges of the protective film, facilitating the suction cup 512's adsorption of the protective film. Furthermore, to achieve stable air supply to the inner roller 612 during continuous rotation, a rotary joint is installed at one end of the inner roller 612. An external air source is connected to this rotary joint via a pipeline, and the airflow is introduced into the air supply channel inside the inner roller 612 through the rotary joint without twisting with the inner roller 612, avoiding entanglement and fatigue fracture of the air supply pipeline. Meanwhile, to ensure smooth rotation of the inner roller 612 relative to the outer roller 611, both ends of the inner roller 612 are rotatably supported within the outer roller 611 by bearings. The bearings not only bear radial loads but also ensure that the air jet holes 6121 on the inner roller 612 can be precisely aligned with the air vents on the outer roller 611 during rotation, achieving stable switching of airflow output.

[0037] See Figure 2 In some embodiments, the negative pressure adsorption assembly 510 includes a cylinder 511 and a negative pressure suction cup 512. The cylinder 511 is preferably a biaxial cylinder 511 or a sliding cylinder 511 to provide stable linear guidance and sufficient downward or upward force. The negative pressure suction cup 512 is made of high-temperature resistant and anti-aging silicone material and is connected to the vacuum generation system via a quick-connect coupling. The cylinder 511 is fixedly mounted on the bracket 700 via a mounting flange or connecting plate, and its piston rod extends downward and is drivenly connected to the negative pressure suction cup 512. Optionally, this drive connection includes not only a direct rigid connection but also an elastic floating connection achieved through a floating joint or a buffer spring to prevent the suction cup contact plate from experiencing a sudden, hard impact.

[0038] See Figure 1 and Figure 3In some embodiments, the bracket 700 serves as the main frame of the film-tearing actuator 500, with its front end extending forward to form a cantilever 710. The negative pressure adsorption assembly 510 is fixedly mounted on the cantilever 710. The extension of the cantilever 710 ensures that the negative pressure suction cup 512 can cross the interference range of the frame 300 and accurately reach the protective film area on the PCB board. A slider 720 is provided on the side of the bracket 700 away from the negative pressure adsorption assembly 510. Correspondingly, a guide rail 310 extending along the film-tearing direction is fixed on the inner wall of the frame 300. The slider 720 and the guide rail 310 form a sliding engagement, providing linear guidance for the back-and-forth movement of the bracket 700 and preventing the negative pressure adsorption assembly 510 from shaking or shifting due to lateral forces during the film-tearing process. Furthermore, the film-tearing drive assembly 400 is arranged on the other side of the frame 300 relative to the guide rail 310, and it adopts a synchronous belt drive structure consisting of a motor, a rotating shaft 420, and a conveyor belt 430. Specifically, the film-tearing drive assembly 400 includes a servo motor 410, a rotating shaft 420, and a conveyor belt 430 fitted onto both. A connecting block 730 is fixedly connected to the side of the support 700, and a clearance groove (not labeled in the figure) extending along the film-tearing direction is provided on the frame 300. The connecting block 730 passes through the clearance groove and is fixedly connected to the conveyor belt 430 located outside the frame 300. When film-tearing is required, the servo motor 410 drives the output shaft to rotate, which in turn drives the rotating shaft 420 to rotate through the synchronous pulley, causing the conveyor belt 430 fitted onto both to perform cyclic linear motion. Since the connecting block 730 rigidly connects the support 700 and the conveyor belt 430, the linear motion of the conveyor belt 430 is converted into linear reciprocating motion of the support 700 along the guide rail 310 through the connecting block 730.

[0039] See Figure 2 and Figure 3 In some embodiments, the pressing assembly 600 further includes a pair of mounting seats 630, which are respectively fixedly mounted on the side walls of the cylinders 511 of the negative pressure adsorption assembly 510, such that the air jet roller 610 is physically positioned in front of the negative pressure adsorption assembly 510 along the film-tearing direction. The air jet roller 610 is mounted between these two mounting seats 630. When the film-tearing drive assembly 400 pulls the bracket 700 in a linear motion along the film-tearing direction, the pressing assembly 600, as a whole, moves together with the negative pressure adsorption assembly 510 and the cylinders 511.

[0040] See Figure 2In some embodiments, the upper surface of the loading tray 200 is provided with a plurality of positioning pins 210. Specifically, the positioning pins 210 are usually four or more, distributed at diagonal positions on the PCB board. When an operator or automated equipment places the PCB board on the loading tray 200, the process holes of the PCB board engage with the positioning pins 210, thereby achieving rapid positioning of the PCB board in the plane and preventing it from slipping due to force during the film removal process.

[0041] See Figure 2 and Figure 6Some embodiments also provide a method of operating an assembly equipment for SMT placement, including the following steps: placing the PCB board to be peeled off in the loading tray 200 of the base 100, using the positioning pins 210 on the loading tray 200 to perform planar positioning of the PCB board, ensuring that its positional accuracy meets the reference requirements for subsequent peeling operations; a photoelectric sensor is provided on the frame 300, which is used to identify the positional information of the protective film edge and feeds the information back to the control module. The peeling drive assembly 400 is started, and the conveyor belt 430 is driven to move by the servo motor 410. The connecting block 730 pulls the bracket 700 to slide along the guide rail 310. The control module fine-tunes the position of the peeling actuator 500 according to the feedback signal of the photoelectric sensor, so that the peeling actuator 500 moves as a whole to a predetermined position above the PCB board, ensuring that the negative pressure suction cup 512 of the negative pressure adsorption assembly 510 is aligned with the edge area of ​​the protective film; the control module controls the cylinder 511 of the negative pressure adsorption assembly 510 to drive the negative pressure suction cup 512 downward, approaching the surface of the protective film. Simultaneously, the control module, according to the angle switching sequence, controls the rotary drive 620 to drive the inner roller 612 to switch angles: the control module controls the rotary drive 620 of the pressing assembly 600 to start, driving the inner roller 612 of the air jet roller 610 to rotate. The controller controls the inner roller 612 to rotate from the initial zero position by a preset angle, first aligning the air jet hole 6121 on the inner roller 612 with the oblique ventilation hole 6113 of the outer roller 611. High-pressure gas enters the air supply channel of the inner roller 612 through the rotary joint and is ejected from the oblique vent 6113, forming an oblique airflow that sweeps away dust particles at the edge of the protective film and the gap between the protective film and the PCB board surface. After pre-blowing, the control module controls the rotary drive 620 to continue driving the inner roller 612 to rotate another preset angle according to the angle switching sequence, so that the air jet 6121 switches to the vertical vent 6112 aligned with the outer roller 611. At this time, the airflow is sprayed vertically downward, pressing the protective film tightly onto the PCB board surface and eliminating the loose areas caused by the unevenness of the board surface. After receiving the air jet arrival signal, the control module controls the negative pressure suction cup 512 to start the vacuum and firmly adsorb the edge of the protective film. When the vacuum pressure switch feedbacks the adsorption success signal, the control module controls the film peeling drive assembly 400 to start again, and the traction bracket 700 moves linearly along the film peeling direction. During this process, the air jet roller 610 moves synchronously with the negative pressure adsorption assembly 510 through the mounting base 630, continuously applying vertical pressure to the peeling leading edge. Under the pull of the negative pressure suction cup 512 and the cooperation of the air jet roller 610, the protective film is peeled off from the PCB board surface under uniform force. After the film is peeled off, the negative pressure adsorption component 510 releases the protective film, and the cylinder 511 drives the negative pressure suction cup 512 to move upward and reset; the rotary drive component 620 drives the inner roller 612 to rotate back to the initial zero position, waiting for the next operation cycle.

[0042] In summary, this SMT assembly equipment and its working method, by adding an air jet roller 610 arranged opposite to the negative pressure adsorption component 510, allows the air jet roller 610 to first use oblique airflow to sweep away the dust at the edge of the protective film, facilitating the adsorption of the protective film by the negative pressure adsorption component 510. Subsequently, the air jet roller 610 switches to vertical downward airflow, causing the protective film to be continuously pressed against the PCB board surface by a slight positive pressure in the area about to enter the peeling front edge. This smooths out the originally discrete and abrupt local resistance into a more uniform bonding force field along the peeling front edge. The air jet roller 610 moves forward and backward synchronously with the negative pressure adsorption component 510, providing controlled bonding pressure on the film surface throughout the peeling process. This keeps the peeling front edge of the film layer stable, preventing the protective film from being overstretched or even torn due to abrupt changes in local resistance. This solves the hidden danger of unstable film peeling caused by the lack of a local resistance control mechanism in existing simple negative pressure adsorption solutions.

[0043] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0044] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless explicitly indicated above. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as a second element, component, region, layer, or segment.

[0045] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. An assembly device for SMT (Surface Mount Technology) surface mount technology, characterized in that, include: A base (100) is provided with a loading tray (200) for placing PCB boards. A frame (300) is positioned above the feed tray (200); A film-tearing drive assembly (400) is mounted on the frame (300); A film-tearing actuator (500) is disposed above the feeding tray (200) and slides in cooperation with the frame (300) along the film-tearing direction; The film-peeling actuator (500) includes at least one negative pressure adsorption component (510) for adsorbing the protective film on the PCB board; wherein, the film-peeling drive component (400) is connected to the film-peeling actuator (500) to drive the film-peeling actuator (500) to move linearly along the film-peeling direction; The clamping assembly (600) includes an air jet roller (610) and a rotary drive (620). The jet roller (610) is arranged opposite to the negative pressure adsorption assembly (510) for pressing the protective film during the film-tearing process; and, The rotary drive (620) is connected to the jet roller (610) and is used to adjust the jet direction of the jet roller (610); The control module is electrically connected to the film-tearing drive assembly (400), the film-tearing actuator (500), and the rotary drive component (620), respectively, and is used to control the start and stop of the film-tearing drive assembly (400), the adsorption action of the negative pressure adsorption assembly (510), and the angle switching sequence of the rotary drive component (620). The jet roller (610) includes an outer roller (611) and an inner roller (612) arranged coaxially. The outer roller (611) has at least two ventilation holes with different orientations, including a vertical ventilation hole (6112) and an oblique ventilation hole (6113). The inner roller (612) has jet holes (6121) on its peripheral wall that correspond to the vertical air hole (6112) and the oblique air hole (6113). The rotary drive (620) is connected to the inner roller (612) and is used to drive the inner roller (612) to rotate relative to the outer roller (611) so that the jet hole (6121) switches between the vertical vent (6112) and the oblique vent (6113).

2. The SMT assembly equipment as described in claim 1, characterized in that, The airflow ejected from the vertical vent (6112) is perpendicular to the panel of the PCB board, and the airflow ejected from the oblique vent (6113) has an angle of 30°-60° with the PCB board.

3. The SMT assembly equipment as described in claim 1, characterized in that, One end of the inner roller (612) is provided with a rotary joint, and an external air source is connected to the air supply channel of the inner roller (612) through the rotary joint; The inner roller (612) rotates relative to the outer roller (611) via a bearing.

4. The SMT assembly equipment as described in claim 1, characterized in that, The negative pressure adsorption assembly (510) includes a cylinder (511) and a negative pressure suction cup (512). The cylinder (511) is connected to the negative pressure suction cup (512) for adjusting the distance of the negative pressure suction cup (512) relative to the PCB board.

5. The SMT assembly equipment as described in claim 1, characterized in that, The film-tearing actuator (500) further includes a bracket (700), and the negative pressure adsorption assembly (510) is disposed on the cantilever (710) of the bracket (700); and, A slider (720) is provided on the side of the bracket (700) away from the negative pressure adsorption component (510), and a guide rail (310) is provided on the frame (300) to slide in cooperation with the slider (720).

6. The SMT assembly equipment as described in claim 5, characterized in that, The frame (300) is provided with a film-tearing drive assembly (400) on the other side of the guide rail (310). The film-tearing drive assembly (400) includes a servo motor (410) and a rotating shaft (420). The output shaft of the servo motor (410) and the rotating shaft (420) are connected by a conveyor belt (430). The support (700) is provided with a connecting block (730), which passes through the frame (300) and is connected to the conveyor belt (430). The servo motor (410) drives the conveyor belt (430) to circulate, so as to pull the support (700) to move linearly along the tearing direction through the connecting block (730).

7. The SMT assembly equipment as described in claim 1, characterized in that, The pressing assembly (600) further includes a pair of mounting seats (630), which are respectively disposed on the cylinder (511) of the negative pressure adsorption assembly (510) and disposed in front of the negative pressure adsorption assembly (510) along the tearing direction; The jet roller (610) is disposed between a pair of mounting bases (630) to move synchronously with the negative pressure adsorption assembly (510) in the film-tearing direction.

8. The SMT assembly equipment as described in claim 1, characterized in that, The loading tray (200) is provided with positioning pins (210) to position the PCB board placed on it.

9. A method for operating an assembly equipment for SMT (Surface Mount Technology) surface mount technology, characterized in that, Using the SMT assembly equipment as described in any one of claims 1-8, comprising: The PCB board to be peeled is placed in the loading tray (200) of the base (100) and positioned by the positioning pin (210); The photoelectric sensor detects the edge position of the protective film and sends the position signal to the control module. The control module controls the film tearing drive assembly (400) to drive the film tearing actuator (500) to move above the PCB board, so that the negative pressure adsorption assembly (510) is aligned with the edge of the protective film. The control module controls the cylinder (511) of the negative pressure adsorption component (510) to drive the negative pressure suction cup (512) to move downward and approach the protective film; According to the angle switching sequence, the angle switching of the jet roller (610) is controlled: the control module first controls the rotary drive (620) to drive the inner roller (612) of the jet roller (610) to rotate, so that the jet hole (6121) is aligned with the oblique ventilation hole (6113) and jets obliquely onto the protective film surface to blow away dust; then the rotary drive (620) continues to drive the inner roller (612) to rotate, so that the jet hole (6121) is switched to be aligned with the vertical ventilation hole (6112) to jet vertically downward, so that the protective film adheres tightly to the PCB board surface; After the negative pressure suction cup (512) adsorbs the protective film, the control module controls the film tearing drive assembly (400) to continue driving the film tearing actuator (500) to move linearly along the film tearing direction, causing the negative pressure suction cup (512) to pull the protective film. The air jet roller (610) moves synchronously with the negative pressure suction cup (512) to maintain the pressure on the protective film until the protective film is completely removed from the PCB board.

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