Load lock apparatus
By adjusting the relative position of the cooling plate and the worktable in the loading locking device, the problem of low cooling efficiency during vertical transport was solved, and a highly efficient wafer cooling effect was achieved.
Patent Information
- Application Number
- CN202511847329.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2025-01-16
- Filing Date
- 2025-12-09
- Publication Date
- 2026-07-17
AI Technical Summary
During the vertical transport of wafers, the wall of the existing loading and locking chamber moves vertically, making it difficult to configure the cooling unit, affecting cooling efficiency, and making it difficult to adjust the relative position of the cooling plate and the wafer.
The device employs a loading and locking mechanism, which includes a fixed part and a moving part. The moving part has a cooling gas inlet. The cooling plate is moved relative to the worktable via a second support shaft and a second drive part, thereby adjusting their relative positions and improving the supply efficiency of cooling gas.
It improves wafer cooling efficiency, enhances the thermal conductivity of cooling gas, and simplifies the adjustment of the relative position of the cooling plate and the worktable, ensuring efficient cooling effect.
Smart Images

Figure CN122421691A_ABST
Abstract
Citation Information
Patent Citations
Wafer treatment apparatus and method therefor, and ion implanter
JP2006156762A