Load lock apparatus

By adjusting the relative position of the cooling plate and the worktable in the loading locking device, the problem of low cooling efficiency during vertical transport was solved, and a highly efficient wafer cooling effect was achieved.

CN122421691APending Publication Date: 2026-07-17NISSIN ION EQUIPMENT CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202511847329.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2025-01-16
Filing Date
2025-12-09
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

During the vertical transport of wafers, the wall of the existing loading and locking chamber moves vertically, making it difficult to configure the cooling unit, affecting cooling efficiency, and making it difficult to adjust the relative position of the cooling plate and the wafer.

Method used

The device employs a loading and locking mechanism, which includes a fixed part and a moving part. The moving part has a cooling gas inlet. The cooling plate is moved relative to the worktable via a second support shaft and a second drive part, thereby adjusting their relative positions and improving the supply efficiency of cooling gas.

Benefits of technology

It improves wafer cooling efficiency, enhances the thermal conductivity of cooling gas, and simplifies the adjustment of the relative position of the cooling plate and the worktable, ensuring efficient cooling effect.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122421691A_ABST
    Figure CN122421691A_ABST
Patent Text Reader

Abstract

本发明提供一种装载锁定装置。在壁面的一部分向垂直方向移动的装载锁定装置中,实现高冷却效率。装载锁定装置(1a、1b、1c、1d、1e)具有固定部(F)及通过与固定部连接而形成装载锁定室(L)的移动部(M),至少固定部和移动部中的任意一方具有向装载锁定室内供给冷却气体的冷却气体导入口(7)。移动部具有:工作台(6),支承晶圆(W);冷却板(5),冷却晶圆;基座构件(2),支承工作台和冷却板中的任意一个;第二支承轴(12),与工作台和冷却板中的未被基座构件支承的构件连结;第二驱动部(13),使第二支承轴移动;第一支承轴(10),与基座构件连结;及第一驱动部(11),使第一支承轴、第二支承轴及第二驱动部一起移动。
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Wafer treatment apparatus and method therefor, and ion implanter

    JP2006156762A