Adjustable clamping device for chip processing

Abstract

The present application relates to chip clamping device technical field, especially to a kind of adjustable clamping device for chip processing;Its technical scheme includes: mounting seat;Workbench, fixedly connected to mounting seat;Four positioning blocks, slidingly connected to workbench;First adjusting assembly, set on workbench;Multiple air nozzles, fixedly connected to workbench, air nozzle is along the two straight lines of parallel to the movement direction of two groups of positioning blocks equal interval arrangement, overall cross-shaped distribution;Air pump, fixedly connected to mounting seat;Connecting pipe, connected between air pump and each air nozzle, so that negative pressure is generated at each air nozzle when air pump works.The present application realizes the quick centering and limiting of different size chips by adjustable positioning block, and realizes flexible adsorption fixing by cross arrangement of negative pressure air nozzle, which not only ensures the position accuracy and stability in the processing process, but also avoids damage caused by hard clamping, significantly improves the universality, safety and change production efficiency of chip clamping.

Description

Technical Field

[0001] This invention relates to the field of chip clamping device technology, and more particularly to an adjustable clamping device for chip processing. Background Technology

[0002] Chip fabrication is a crucial step in semiconductor manufacturing. The chips to be processed are typically square wafers with side lengths ranging from a few millimeters to tens of millimeters, and are extremely thin and brittle. In processing steps such as dicing, grinding, mounting, and testing, clamping devices must be used to reliably fix the chips at predetermined positions to ensure the positional accuracy and repeatability of the processing.

[0003] However, due to the tiny size and low material strength of chips, even slight errors in clamping force or alignment accuracy during the clamping process can easily lead to chip edge chipping, surface scratches, or even complete shattering, causing irreversible damage. To avoid such damage, the industry generally uses dedicated fixtures that are strictly matched to the dimensions of chips of different sizes. Obviously, this means that when switching between processing tasks for chips of different sizes, operators need to frequently disassemble and replace the corresponding fixtures. This process is not only cumbersome and time-consuming, but repeated disassembly and assembly can also introduce alignment errors, further affecting processing efficiency and yield. Summary of the Invention

[0004] The present invention provides an adjustable clamping device for chip processing that can adapt to chips of different sizes, is easy to adjust, and has reliable clamping, aiming to solve the defects of the prior art mentioned in the background art above.

[0005] The technical implementation scheme of the present invention is as follows: an adjustable clamping device for chip processing, comprising: a mounting base; a worktable fixedly connected to the mounting base for supporting the chip to be processed; four positioning blocks slidably connected to the worktable, the positioning blocks being divided into two groups, each group containing two blocks, the sliding directions of the two groups of positioning blocks being perpendicular to each other, and the four positioning blocks being used to position the four contour edges of the chip respectively; a first adjustment component disposed on the worktable for driving the four positioning blocks to move synchronously to make adaptive adjustments according to the chip size; multiple air nozzles fixedly connected to the worktable, the air nozzles being arranged at equal intervals along two straight lines parallel to the moving directions of the two groups of positioning blocks, forming a cross shape; an air pump fixedly connected to the mounting base; and a connecting pipe connecting the air pump and each air nozzle, so that when the air pump is working, negative pressure is generated at each air nozzle, thereby adsorbing and clamping the chip through the air nozzles.

[0006] Optionally, the first adjustment component includes: a first adjustment screw, rotatably connected inside the worktable and threadedly engaged with a positioning block; each positioning block is equipped with two first adjustment screws to ensure that the positioning block can be stably driven and reciprocate along its movement trajectory; a first motor, fixedly connected inside the worktable, with its output end coaxially fixedly connected to one of the first adjustment screws; a bevel gear, fixedly connected to the shaft of each first adjustment screw, also located inside the worktable; and a bevel gear ring, rotatably connected inside the worktable, with all bevel gears meshing synchronously with the bevel gear ring, thereby forming a synchronous rotation transmission structure.

[0007] Optionally, the device further includes: a valve plate, rotatably connected inside each air nozzle, the plate surface of which fits against the cross-section of the flow channel inside the air nozzle, so that the valve plate can control the on / off state of the air nozzle by rotation; and a control component, located inside the workbench, for controlling the rotation of the valve plate, the control component consisting of a first part and a second part, wherein the first part is set for each air nozzle and the second part is set for each positioning block.

[0008] Optionally, the rotation axis of the valve plate is perpendicular to the arrangement direction of the air nozzles; each first part of the control assembly includes: two control shafts, rotatably connected to both sides of the air nozzles, and coaxially fixedly connected to the rotation shafts on both sides of the valve plate; two L-shaped locking plates, respectively fixedly connected to the outer ends of the control shafts on both sides; two support plates, fixedly connected to the bottom of the workbench, with the two control shafts rotatably connected to the two support plates; two locking shafts, correspondingly slidably connected to the two support plates; each arm end of the L-shaped locking plate is provided with a locking hole, and in the two states of the valve plate rotating 90 degrees forward or backward, corresponding to the opening and closing of the control air nozzles, the L-shaped locking plate rotates synchronously until its two locking holes are aligned with the locking shafts; a return spring, sleeved on the locking shaft, with its two ends fixed to the support plate and the locking shaft respectively, for pushing the locking shaft into the locking hole on the L-shaped locking plate; and a contact rod, fixedly connected to the locking shaft and slidably engaged with the support plate.

[0009] Optionally, each second part of the control assembly includes: a first control part, which is fixedly connected to the positioning block and can move with the positioning block to contact the contact rod; the end of the contact rod is set as a hemispherical end so as to generate a smooth contact engagement through relative movement; the first control part on each positioning block can engage with the contact rods corresponding to all air nozzles on the movement trajectory of its respective positioning block; a second control part, which is fixedly connected to the first control part, can also engage with all L-shaped locking plates corresponding to the movement trajectory during the movement of the positioning block; the thickness dimension a of the first control part is greater than the thickness dimension b of the second control part to ensure that during the reciprocating movement of the positioning block, the first control part first contacts the contact rod to complete the unlocking action, and then the second control part contacts the L-shaped locking plate.

[0010] Optionally, the device further includes: a base; a middle layer seat slidably connected to the base along a first direction; a top seat slidably connected to the middle layer seat along a second direction, the first direction being perpendicular to the second direction; a mounting seat rotatably connected to the middle of the base; a second adjustment component disposed on the top seat and connected to the mounting seat, used to control the rotation of the mounting seat, the worktable on it, and the fixed chip; and two sets of third adjustment components, respectively disposed on the base and connected to the middle layer seat, and disposed on the middle layer seat and connected to the top seat, to correspondingly drive the middle layer seat and the top seat to move linearly.

[0011] Optionally, the second adjustment component includes: a second motor, fixedly connected inside the top seat; a spur gear, fixedly connected to the output shaft of the second motor; and a spur gear ring, fixedly connected to the outer ring of the mounting base, wherein the spur gear meshes with the spur gear ring.

[0012] Optionally, each group of third adjustment components includes: two second adjustment screws, one of which is rotatably connected to the base, and the other of which is rotatably connected to the middle layer seat; two third motors, one of which is fixedly connected to the base, and the other of which is fixedly connected to the middle layer seat, with the output end of each third motor coaxially fixedly connected to one of its corresponding second adjustment screws; and a synchronous belt group, disposed between the two second adjustment screws in each group.

[0013] The present invention has the following advantages: The present invention achieves rapid centering and positioning of chips of different sizes through adjustable positioning blocks, and achieves flexible adsorption and fixation by cross-shaped negative pressure nozzles, which not only ensures the positional accuracy and stability during the processing, but also avoids damage from rigid clamping, and significantly improves the versatility, safety and production changeover efficiency of chip clamping.

[0014] This invention uses a positioning block to synchronously drive and control the air nozzles outside the chip area, so that the negative pressure is concentrated on the chip area. This avoids damage to the chip by hard clamping and eliminates the need for manual adjustment of the air nozzles. At the same time, the positioning block is used to lock the valve plate, which ensures the chip alignment accuracy and the reliability of the air nozzle status, effectively improving changeover efficiency and processing yield.

[0015] This invention achieves chip rotation adjustment through a second adjustment component and translation adjustment in the XY direction through two sets of third adjustment components. The three components work together to enable the chip to be precisely adjusted in any position in the horizontal plane while in a fixed state, so as to avoid potential damage to the chip caused by repeated clamping, while significantly shortening the adjustment time and improving processing flexibility and efficiency. Attached Figure Description

[0016] Figure 1This is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 This is a schematic diagram of the internal structure of the present invention after partial cross-section.

[0018] Figure 3 This is a schematic diagram showing the distribution of the air nozzles and positioning blocks on the worktable in this invention.

[0019] Figure 4 This is a cross-sectional view of the connection structure between the positioning block and the first adjustment component in this invention.

[0020] Figure 5 This is a cross-sectional view of the connection structure of the valve plate inside the air nozzle in this invention.

[0021] Figure 6 This is a schematic diagram showing the position and structure of the first part of the control assembly and the air nozzle in this invention.

[0022] Figure 7 This is a schematic diagram of two possible mating structures between the L-shaped locking plate and the valve plate in this invention.

[0023] Figure 8 This is a schematic diagram of the cooperation structure between the first and second parts of the control component in this invention.

[0024] Figure 9 This is a schematic diagram of the cooperation structure between the first control unit and the contact rod, and the second control unit and the L-shaped locking plate in this invention.

[0025] Figure 10 This is a cross-sectional view of the connection structure between the second and third adjustment components in this invention.

[0026] The meanings of the reference numerals in the figure are as follows: 101: Mounting base, 102: Workbench, 103: Positioning block, 104: Air nozzle, 105: Connecting pipe, 106: Air pump, 111: First adjusting screw, 112: First motor, 113: Bevel gear, 114: Bevel gear ring, 201: Valve plate, 202: Control shaft, 203: L-shaped locking plate, 204: Support plate, 205: Locking shaft, 2051: Lock hole, 206: Return spring, 207: Contact rod, 208: First control unit, 209: Second control unit, 301: Base, 302: Middle layer seat, 303: Top seat, 304: Second motor, 305: Flat gear, 306: Flat gear ring, 307: Second adjusting screw, 308: Third motor, 309: Synchronous belt assembly. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings. It is hereby declared that the directional terms such as up, down, left, right, front, back, inside, and outside used in this text are based solely on the accompanying drawings and are not intended to specifically limit the invention.

[0028] Example: An adjustable clamping device for chip processing, such as... Figures 1-4 As shown, it includes: a mounting base 101; a worktable 102, fixedly mounted on the mounting base 101 for supporting the chip to be processed; four positioning blocks 103, slidably mounted on the worktable 102, the positioning blocks 103 being divided into two groups, each group containing two blocks, the sliding directions of the two groups of positioning blocks 103 being perpendicular to each other, the four positioning blocks 103 being used to position the four contour edges of the chip respectively; and a first adjustment component, disposed on the worktable 102, for driving the four positioning blocks 103 to move synchronously, so as to... The chip size is adjusted accordingly; multiple air nozzles 104 are fixedly installed on the worktable 102, and the air nozzles 104 are arranged at equal intervals along two straight lines parallel to the moving direction of the two sets of positioning blocks 103, forming a cross shape; an air pump 106 is fixedly installed on the mounting base 101; a connecting pipe 105 is connected between the air pump 106 and each air nozzle 104, so that when the air pump 106 is working, it generates negative pressure at each air nozzle 104, thereby adsorbing and clamping the chip through the air nozzle 104.

[0029] When using this device to fix the chip, firstly, based on the chip's side length, the first adjustment component drives four positioning blocks 103 to move synchronously, defining a placement area on the worktable 102 that matches the chip's outline. Then, the chip is placed within the area enclosed by the four positioning blocks 103, which initially limit the chip's position. Next, the air pump 106 is activated, creating negative pressure at each air nozzle 104 via the connecting pipe 105. The air nozzles 104 tightly adhere to the lower surface of the chip, stably fixing it to the worktable 102. This process uses negative pressure adsorption instead of traditional mechanical clamping, avoiding chip edge breakage or surface scratches caused by uneven clamping force or operational errors. Simultaneously, because the positioning blocks 103 are adjustable, this device can quickly adapt to square chips of different sizes without requiring the replacement of special clamps, making the adjustment process simple and convenient.

[0030] This device achieves rapid centering and positioning of chips of different sizes through adjustable positioning blocks 103, and achieves flexible adsorption and fixation by cross-shaped negative pressure nozzles 104. This ensures positional accuracy and stability during processing, while avoiding damage from rigid clamping, significantly improving the versatility, safety and production changeover efficiency of chip clamping.

[0031] like Figure 2 and Figure 4As shown, the first adjustment assembly includes: a first adjustment screw 111, rotatably mounted inside the worktable 102 and threadedly engaged with the positioning block 103; each positioning block 103 is correspondingly configured with two first adjustment screws 111 to ensure that the positioning block 103 can be stably driven and reciprocate along its movement trajectory; a first motor 112, fixedly mounted inside the worktable 102, with its output end coaxially fixedly connected to one of the first adjustment screws 111; a bevel gear 113, fixedly mounted on the shaft of each first adjustment screw 111, also located inside the worktable 102; and a bevel gear ring 114, rotatably mounted inside the worktable 102, with all bevel gears 113 synchronously meshing with the bevel gear ring 114, thereby forming a synchronous rotation transmission structure.

[0032] During operation, the first motor 112 is started, driving the first adjusting screw 111 connected to it to rotate, thereby adjusting the position of the corresponding positioning block 103. Simultaneously, through the meshing transmission of the bevel gear 113 and the bevel gear ring 114, all the first adjusting screws 111 rotate synchronously, thereby driving all the positioning blocks 103 to achieve unified and synchronous movement control. This transmission structure significantly shortens the adjustment time while facilitating operation, and by utilizing the high-precision feed characteristics of the first adjusting screw 111, it can effectively avoid positioning deviations and improve the alignment accuracy of chip clamping.

[0033] like Figure 2 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the device also includes: a valve plate 201, which is rotatably installed inside each air nozzle 104, with its plate surface fitting against the cross-section of the flow channel inside the air nozzle 104, so that the valve plate 201 can control the on / off state of the air nozzle 104 by rotation; and a control component, which is located inside the worktable 102 and is used to control the rotation of the valve plate 201. The control component consists of a first part and a second part, wherein the first part is set for each air nozzle 104 and the second part is set for each positioning block 103.

[0034] When using the air nozzle 104 to adsorb and fix the chip, the valve plate 201 is operated by the control component to close all air nozzles 104 outside the chip coverage area, so that the negative pressure is concentrated on the area where the chip is located, thereby improving the chip fixing effect.

[0035] like Figure 6 , Figure 7 , Figure 8 and Figure 9As shown, the rotation axis of the valve plate 201 is perpendicular to the arrangement direction of the air nozzles 104; each first component in the control assembly includes: two control shafts 202, rotatably mounted on both sides of the air nozzles 104, and coaxially fixedly connected to the rotation shafts on both sides of the valve plate 201 respectively; two L-shaped locking plates 203, respectively fixedly mounted on the outer ends of the control shafts 202 on both sides; two support plates 204, fixedly mounted on the bottom of the workbench 102, with the two control shafts 202 rotatably connected to the two support plates 204 respectively; two locking shafts 205, correspondingly slidably mounted on the two support plates 204; L-shaped locking plates Each arm end of 203 is provided with a locking hole 2051. When the valve plate 201 rotates 90 degrees in the forward or reverse direction, corresponding to the opening and closing of the control nozzle 104, the L-shaped locking plate 203 rotates synchronously until the two locking holes 2051 on it are aligned with the locking shaft 205. The return spring 206 is sleeved on the locking shaft 205, and its two ends are fixed to the support plate 204 and the locking shaft 205 respectively. It is used to push the locking shaft 205 into the locking hole 2051 on the L-shaped locking plate 203. The contact rod 207 is fixedly installed on the locking shaft 205 and slides with the support plate 204.

[0036] like Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, each second part of the control assembly includes: a first control part 208, which is fixedly installed on the positioning block 103 and can move with the positioning block 103 to contact the contact rod 207; the end of the contact rod 207 is a hemispherical end to generate a smooth contact engagement through relative movement; the first control part 208 on each positioning block 103 can engage with the contact rod 207 corresponding to all the air nozzles 104 on the movement trajectory of its respective positioning block 103; a second control part 209, which is fixedly installed on the first control part 208, can also engage with all the L-shaped locking plates 203 corresponding to the movement trajectory during the movement of the positioning block 103; the thickness dimension a of the first control part 208 is greater than the thickness dimension b of the second control part 209 to ensure that during the reciprocating movement of the positioning block 103, the first control part 208 first contacts the contact rod 207 to complete the unlocking action, and then the second control part 209 contacts the L-shaped locking plate 203.

[0037] When adjusting the position of the positioning block 103 according to the chip size, the positioning block 103 passes through the air nozzles 104 that are not within the chip fixing range in sequence. Specifically, the positioning block 103 first contacts the contact rod 207 through its first control part 208, thereby squeezing the contact rod 207 and driving the locking shaft 205 away from the L-shaped locking plate 203. At this time, the valve plate 201 is unlocked and the return spring 206 is compressed. Next, the positioning block 103 contacts the L-shaped locking plate 203 through its second control part 209 and squeezes the L-shaped locking plate 203 to rotate, thereby controlling the valve plate 201 to close the air nozzles 104. Finally, after the positioning block 103 carries away the first control part 208 and the second control part 209, the return spring 206 drives the contact rod 207 and the locking shaft 205 to reset. At this time, the locking shaft 205 is aligned with the locking hole 2051 at the other arm end of the rotated L-shaped locking plate 203, thereby locking the valve plate 201 in the closed air nozzle 104 state.

[0038] Conversely, when the positioning block 103 moves to enlarge the size of the positioning chip, the positioning block 103 moves outward and again contacts the contact rod 207 and the L-shaped locking plate 203 via the first control unit 208 and the second control unit 209 respectively, causing the valve plate 201 to switch to the open nozzle 104 state and relock. In summary, this device uses the adjustment action of the positioning block 103 to synchronously control the opening and closing of the nozzle 104, automatically adapting to changes in chip size without additional operation, significantly improving operational convenience, and avoiding mismatch between the opening and closing state of the nozzle 104 and the chip coverage area due to human error, resulting in better performance.

[0039] This device automatically closes the air nozzles 104 outside the chip range through the synchronous drive control component of the positioning block 103, so that the negative pressure is concentrated on the chip area, which not only avoids hard clamping damage to the chip, but also eliminates the step of manually adjusting the air nozzles 104. At the same time, the linkage locking structure of the positioning block 103 to the valve plate 201 ensures the chip alignment accuracy and the reliability of the air nozzle status, effectively improving changeover efficiency and processing yield.

[0040] like Figure 1 , Figure 2 and Figure 10 As shown, the device further includes: a base 301; a middle layer base 302, which is slidably mounted on the base 301 in the front-to-back direction; a top base 303, which is slidably mounted on the middle layer base 302 in the left-to-right direction; a mounting base 101, which is rotatably mounted on the middle part of the base 301; a second adjustment component, which is disposed on the top base 303 and connected to the mounting base 101, for controlling the rotation of the mounting base 101, the worktable 102 on it, and the fixed chip; and two sets of third adjustment components, which are respectively disposed on the base 301 and connected to the middle layer base 302, and disposed on the middle layer base 302 and connected to the top base 303, so as to drive the middle layer base 302 and the top base 303 to move linearly.

[0041] like Figure 2 and Figure 10 As shown, the second adjustment component includes: a second motor 304, which is fixedly installed inside the top seat 303; a spur gear 305, which is fixedly installed on the output shaft of the second motor 304; and a spur gear ring 306, which is fixedly installed on the outer ring of the mounting base 101, with the spur gear 305 meshing with the spur gear ring 306.

[0042] like Figure 2 and Figure 10 As shown, each group of third adjustment components includes: two second adjustment screws 307, one of which is rotatably mounted on the base 301 and the other of which is rotatably mounted on the middle layer 302; two third motors 308, one of which is fixedly mounted on the base 301 and the other of which is fixedly mounted on the middle layer 302, with the output end of each third motor 308 coaxially fixedly connected to one of its corresponding second adjustment screws 307; and a synchronous belt group 309, located between the two second adjustment screws 307 in each group.

[0043] During operation, the second motor 304 is activated, and through the meshing transmission of the spur gear 305 and the spur gear ring 306, it can stably drive the fixed chip to change its angle. Activating the third motor 308, by controlling the sliding of the middle layer seat 302 in the front-to-back direction and the sliding of the top seat 303 in the left-to-right direction, allows the chip to be adjusted to any position on the horizontal plane. The combination of these two functions allows for flexible adaptation to the position and angle requirements of subsequent processing operations, enabling multi-degree-of-freedom adjustments without disassembling the fixed chip, thus significantly improving the effectiveness of the device.

[0044] This device achieves chip rotation adjustment through the second adjustment component and translation adjustment in the XY direction through two sets of third adjustment components. The three work together to enable the chip to be precisely adjusted in any position in the horizontal plane while in a fixed state, so as to avoid potential damage to the chip caused by repeated clamping, while greatly shortening the adjustment time and improving processing flexibility and efficiency.

[0045] The above embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Therefore, all equivalent changes made to the content described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. An adjustable holding device for chip processing, characterized by, include: Mounting base; The worktable, fixedly connected to the mounting base, is used to support the chip to be processed. Four positioning blocks are slidably connected to the worktable. The positioning blocks are divided into two groups, each containing two blocks. The sliding directions of the two groups of positioning blocks are perpendicular to each other. The four positioning blocks are used to position the four contour edges of the chip. The first adjustment component is set on the worktable to drive the four positioning blocks to move synchronously, so as to make adaptive adjustments according to the chip size. Multiple air nozzles are fixedly connected to the worktable. The air nozzles are arranged at equal intervals along two straight lines parallel to the moving directions of the two groups of positioning blocks, forming a cross shape. An air pump is fixedly connected to the mounting base. A connecting pipe is connected between the air pump and each air nozzle, so that when the air pump is working, negative pressure is generated at each air nozzle, thereby adsorbing and clamping the chip through the air nozzle. The first adjustment assembly includes: a first adjustment screw, rotatably connected inside the worktable and threadedly engaged with a positioning block; each positioning block is equipped with two first adjustment screws to ensure that the positioning block can be stably driven and reciprocate along its movement trajectory; a first motor, fixedly connected inside the worktable, with its output end coaxially fixedly connected to one of the first adjustment screws; a bevel gear, fixedly connected to the shaft of each first adjustment screw, also located inside the worktable; and a bevel gear ring, rotatably connected inside the worktable, with all bevel gears meshing synchronously with the bevel gear ring, thereby forming a synchronous rotation transmission structure. The device further includes: a valve plate, rotatably connected inside each air nozzle, the plate surface of which fits against the cross-section of the flow channel inside the air nozzle, so that the valve plate can control the on / off state of the air nozzle by rotation; and a control component, located inside the workbench, used to control the rotation of the valve plate. The control component consists of a first part and a second part, wherein the first part corresponds to each air nozzle and the second part corresponds to each positioning block. The rotation axis of the valve plate is perpendicular to the arrangement direction of the air nozzles; each first part of the control assembly includes: two control shafts, rotatably connected to both sides of the air nozzles, and coaxially fixedly connected to the rotation shafts on both sides of the valve plate; two L-shaped locking plates, respectively fixedly connected to the outer ends of the control shafts on both sides; two support plates, fixedly connected to the bottom of the workbench, with the two control shafts rotatably connected to the two support plates; two locking shafts, correspondingly slidably connected to the two support plates; each arm end of the L-shaped locking plate has a locking hole, and in the two states of the valve plate rotating 90 degrees forward or backward, corresponding to the opening and closing of the control air nozzles, the L-shaped locking plate rotates synchronously until its two locking holes are aligned with the locking shafts; a return spring, sleeved on the locking shaft, with its two ends fixed to the support plate and the locking shaft respectively, is used to push the locking shaft into the locking hole on the L-shaped locking plate; a contact rod, fixedly connected to the locking shaft and slidably engaged with the support plate; Each second part of the control assembly includes: a first control part, which is fixedly connected to the positioning block and can move with the positioning block to contact the contact rod; the end of the contact rod is set as a hemispherical end to generate a smooth contact engagement through relative movement; the first control part on each positioning block can engage with the contact rods corresponding to all air nozzles on the movement trajectory of its respective positioning block; a second control part, which is fixedly connected to the first control part, can also engage with all L-shaped locking plates corresponding to the movement trajectory during the movement of the positioning block; the thickness dimension a of the first control part is greater than the thickness dimension b of the second control part to ensure that during the reciprocating movement of the positioning block, the first control part first contacts the contact rod to complete the unlocking action, and then the second control part contacts the L-shaped locking plate.

2. The adjustable chucking device for chip processing according to claim 1, wherein The device further includes: a base; a middle layer seat slidably connected to the base along a first direction; a top seat slidably connected to the middle layer seat along a second direction, the first direction being perpendicular to the second direction; a mounting seat rotatably connected to the middle of the base; a second adjustment component disposed on the top seat and connected to the mounting seat, used to control the rotation of the mounting seat, the worktable on it, and the fixed chip; and two sets of third adjustment components, respectively disposed on the base and connected to the middle layer seat, and disposed on the middle layer seat and connected to the top seat, to correspondingly drive the middle layer seat and the top seat to move linearly.

3. The adjustable chucking device for chip processing according to claim 2, wherein The second adjustment component includes: a second motor, fixedly connected inside the top base; a spur gear, fixedly connected to the output shaft of the second motor; and a spur gear ring, fixedly connected to the outer ring of the mounting base, with the spur gear meshing with the spur gear ring.

4. The adjustable chucking device for chip processing according to claim 3, wherein Each group of third adjustment components includes: two second adjustment screws, one of which is rotatably connected to the base, and the other of which is rotatably connected to the middle layer seat; two third motors, one of which is fixedly connected to the base, and the other of which is fixedly connected to the middle layer seat, with the output end of each third motor coaxially fixedly connected to one of its corresponding second adjustment screws; and a synchronous belt group, located between the two second adjustment screws in each group.

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