A miniaturized stacked interconnect structure suitable for integration between multifunctional sip modules

Abstract

The application discloses a miniaturized stacking interconnection structure suitable for integration between multifunctional SIP modules and relates to the technical field of semiconductor devices, comprising a corner pressure relief assembly arranged on one side of an integrated plate body, wherein the corner pressure relief assembly comprises a reinforcing plate and a cooling fin, a heat conduction plate is arranged in the reinforcing plate, the heat conduction plate is in contact with the cooling fin to form a vertical heat dissipation channel, the reinforcing plate bears the mechanical pressure of the SIP module and is used for realizing the effect of facilitating heat dissipation of four corners by bearing force, the corner pressure relief assembly further comprises a plurality of second wedge-shaped blocks, a first wedge-shaped block mounted at the bottom of the reinforcing plate drives two second wedge-shaped blocks to move left and right, since independent heat dissipation channels are arranged at the four corners, parallel heat dissipation is realized, the compression pads are respectively in radial support with the bottom of a first SMP joint and a second SMP joint, and elastic polyurethane is adopted for the contact part of the first SMP joint and the second SMP joint, the effect is that the hard clamping force is uniformly distributed on the surface of the connector shell, and local indentation is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, specifically to a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules. Background Technology

[0002] Semiconductor devices need to be assembled in a small physical space. The traditional way is to integrate multiple functional SIP modules into a complete and powerful structure. The traditional way is to lay multiple functional modules flat on the circuit board. This structure allows the modules to be stacked vertically, making full use of vertical space. The stacked structure allows multiple chip functions to be set in a slightly larger volume than a single chip. Each module has a SIP chip and passive components. Multiple SMP connectors are surface-mount soldered around the board. SMP connectors are divided into male connectors and female connectors for vertical signal transmission.

[0003] Currently, traditional connection structures occupy a large space and are difficult to integrate at high density. As multifunctional SiP modules are miniaturized, traditional interconnect components are bulky, resulting in a large overall thickness and projected area after the single-board functional modules are surface-mounted onto the circuit board. This limits the number of multi-channel modules that can be integrated within a limited board space. To improve integration efficiency, some structures attempt to vertically stack modules and use SMP connectors to achieve interlayer signal interconnection. SMP connectors not only transmit signals but also bear the weight of the upper-layer modules. However, most stacked structures do not have independent force transmission paths, and gravity acts directly on the signal connectors. Since the four corners of the board are both load-bearing structures and channels for dissipating chip heat to the external environment, existing structures can only choose one effect to arrange within a limited space. Therefore, during the stacking of multiple layers, the stress on the four corners of the structure gradually increases, causing the connector contact interface to loosen easily. This not only reduces the lifespan of the connectors but also causes signal transmission instability. In addition, the heat generated by the modules is transferred layer by layer along the stacking direction, and the interconnection between modules relies on the friction of the connectors themselves. This causes the side connectors of the structure to easily separate axially or radially, resulting in a momentary signal interruption. Summary of the Invention

[0004] The purpose of this invention is to provide a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules, in order to solve the problem that the existing structures mentioned in the background art can only select one effect for arrangement in a limited space. Therefore, during the stacking of multiple layers, the stress on the four corners of the structure gradually increases, which leads to the problem that the connector contact interface is prone to relaxation.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules, comprising; Integrated board; The first SMP connector and the second SMP connector are respectively located on the outer side of the integrated board. The corner pressure relief assembly is located on one side of the integrated board. The corner pressure relief assembly includes a reinforcement plate, a heat sink, and a heat conduction plate. The heat conduction plate is installed on the inside side of the reinforcement plate. The heat conduction plate and the heat sink form a vertical heat dissipation channel. The reinforcement plate bears the mechanical pressure of the SIP module and is used to achieve the effect of heat dissipation at the four corners by bearing the force. The corner pressure relief assembly also includes multiple second wedge blocks. The first wedge block installed at the bottom of the reinforcing plate drives the two second wedge blocks to move left and right to clamp the sides of the reinforcing plate. A side-pressure resisting component is disposed on one side of the corner pressure relief component. The side-pressure resisting component includes multiple third plates and pressure-resistant pads. Two adjacent third plates are connected by mortise and tenon joints to enhance the bending resistance of the first SMP joint and the second SMP joint. A circumferential bonding assembly is disposed on one side of the side pressure-resistant assembly. The circumferential bonding assembly includes multiple airbags that can expand to increase the wrapping surface with the connector, preventing axial and radial separation.

[0006] Preferably, the corner pressure relief assembly further includes a plurality of first protective sleeves, which are respectively disposed at the corners of the integrated plate, a second protective sleeve is disposed on one side of each of the plurality of reinforcing plates, and two first plates are disposed at the bottom of each of the plurality of reinforcing plates.

[0007] Preferably, the integrated plate body is provided with a plurality of auxiliary strips inside, and an auxiliary block is sleeved on one end of each of the plurality of auxiliary strips. The bottom of the plurality of second wedge blocks is connected to the bottom of the plurality of auxiliary blocks respectively, and two guide holes are opened on one side of each of the plurality of second wedge blocks.

[0008] Preferably, springs are wound around the outside of the plurality of auxiliary strips, one end of each of the plurality of springs is connected to one side of the plurality of auxiliary blocks, and two second plates are provided on the top of each of the plurality of reinforcing plates.

[0009] Preferably, two rollers are provided between the inner walls of two adjacent second plates, two extension plates are provided on one side of the plurality of second protective sleeves, and a limit strip is provided between the inner walls of two adjacent extension plates.

[0010] Preferably, the side pressure-resistant component further includes multiple displacement blocks, which are respectively disposed at the bottom of multiple third plates. Each of the multiple displacement blocks has a tenon block at its bottom, and both sides of the two pressure-resistant pads have arc-shaped blocks.

[0011] Preferably, a fourth plate is provided on the top of each of the multiple arc-shaped blocks, an anti-compression block is provided inside the multiple fourth plate, a tenon hole is provided on the top of each of the multiple anti-compression blocks, and the multiple tenons are respectively connected to the multiple tenons hole by mortise and tenon joints.

[0012] Preferably, the circumferential bonding assembly further includes two L-shaped plates, each of which is connected to one side of one of the two displacement blocks. A control box is provided on the other side of each of the two L-shaped plates, and a rigid pad is provided on one side of each of the two pressure pads.

[0013] Preferably, each of the two rigid pads is provided with a cover on its top, and each of the two cover is provided with a through plate on one side.

[0014] Preferably, each of the two through plates is provided with a piston rod, the two control boxes are respectively located directly above the two piston rods, and the multiple airbags are respectively connected to the two wrapping sleeves.

[0015] Compared with the prior art, the beneficial effects of the present invention are: In this invention, the gravity of the upper module is transferred to the lower module through an independent path, ensuring that the first and second SMP connectors are not subjected to axial pressure. Simultaneously, heat generated by the chip is conducted from the center of the board to the four corners and vertically through the interlayer contact surfaces, forming heat dissipation channels. The reinforcing plate is a rectangular flat plate located on one side of the second protective sleeve, with its central area in direct contact with the end face of the support column of the upper module. The reinforcing plate is made of high thermal conductivity tool steel, which both withstands pressure and transfers heat. As the second protective sleeve moves downward, its bottom gradually abuts against the top of the first protective sleeve for positioning. The inclined surface of the first wedge presses against the inclined surface of the second wedge, generating a horizontal component force that pushes the second wedge horizontally towards the inside of the module. As the second wedge moves, it gradually approaches the first board. Multiple second wedges can clamp one side of multiple first boards respectively, making the integrated board and the reinforcement board more securely installed. Heat continues to be transferred downward from the chip of the upper module, the integrated board, the heat conduction plate, the first board, the heat sink, the thermal grease and the reinforcement board, and finally reaches the bottom main plug board. Since there are independent heat dissipation channels at the four corners, heat does not need to pass through the center of the module, realizing parallel heat dissipation. The pressure pads provide radial support to the bottom of the first SMP connector and the second SMP connector respectively. The contact parts with the first SMP connector and the second SMP connector are made of elastic polyurethane, which is used to evenly distribute the rigid clamping force on the surface of the connector shell and avoid local indentation.

[0016] In this invention, the first and second SMP connectors on the side are limited and fixed by the mortise and tenon joints and tenon blocks of the two third plates and the mortise holes. This not only increases the stability of the corner pressure relief components when installed on the integrated plate, but also strengthens the connectors on the side in a timely manner, keeping the connector contact interface stable at all times. The upper end of the piston rod extends out of the top of the control box, and the lower end of the piston rod is located in the cylinder hole and is equipped with a sealing piston ring. When the L-shaped plate continues to move, the inclined surface forces the piston rod to move downward, compressing the air in the cylinder. The compressed air is delivered to the sleeve through the air outlet at the bottom of the control box and through the through plate, and then to the interior of multiple airbags. The airbags gradually expand as they are inflated, which is used to evenly transmit the expansion force of the airbags to the connector shell, generating radial pressure and locking the connector shell. The sleeve is a semi-rigid cylindrical sheath made of elastic fabric reinforced silicone rubber with a certain tensile strength. The airbags are annular air chambers embedded in the sleeve, and multiple airbags are evenly distributed along the circumference of the sleeve. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to the present invention; Figure 2 This invention relates to a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules. Figure 1 Enlarged view of point A in the middle; Figure 3 This is a partial side view of a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to the present invention. Figure 4 This is a schematic diagram of the corner pressure relief component in a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to the present invention. Figure 5 This invention relates to a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules. Figure 4 Enlarged view of point B in the middle; Figure 6 This is a schematic diagram of the side-pressure-resistant component in a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to the present invention. Figure 7 This is a schematic diagram of the circumferential bonding component in a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to the present invention. Figure 8 This is a partial side view of the encapsulation structure in a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to the present invention. Figure 9This is a partial bottom view of the third plate in a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to the present invention. Figure 10 This is a partial side view of the heat sink in a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to the present invention. Figure 11 This is a partial side view of the limiting strip in a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to the present invention. Figure 12 This is a partial side view of the first wedge block in a miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to the present invention.

[0018] In the diagram: 100, Integrated plate; 111, First SMP connector; 112, Second SMP connector; 2, Corner pressure relief assembly; 201, First protective sleeve; 202, Second protective sleeve; 203, Reinforcing plate; 204, Heat-conducting plate; 205, First plate; 206, First wedge block; 207, Auxiliary strip; 208, Auxiliary block; 209, Spring; 210, Second wedge block; 211, Guide hole; 212, Second plate; 213, Roller; 21 4. Extension plate; 215. Limiting strip; 216. Heat sink; 3. Side anti-compression assembly; 301. Third plate; 302. Displacement block; 303. Tenon block; 304. Anti-compression pad; 305. Arc block; 306. Fourth plate; 307. Anti-compression block; 308. Tenon hole; 4. Circumferential bonding assembly; 401. L-shaped plate; 402. Control box; 403. Piston rod; 404. Through plate; 405. Rigid pad; 406. Wrapping sleeve; 407. Airbag. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] To address the problem that existing miniaturized stacked interconnect structures suitable for integrating multifunctional SIP modules can only be arranged within a limited space during operation, resulting in gradually increasing stress at the four corners of the structure during multi-layer stacking, leading to easy loosening of the connector contact interface, this invention provides a miniaturized stacked interconnect structure suitable for integrating multifunctional SIP modules. (Refer to...) Figure 1 and Figure 3 As shown: including: Integrated board 100; The first SMP connector 111 and the second SMP connector 112 are respectively disposed on the outer side of the integrated plate 100; The corner pressure relief component 2 is disposed on one side of the integrated board 100. The corner pressure relief component 2 includes a reinforcing plate 203, a heat sink 216 and a heat conduction plate 204. The heat conduction plate 204 is installed on the inner side of the reinforcing plate 203. The heat conduction plate 204 and the heat sink 216 contact to form a vertical heat dissipation channel. The reinforcing plate 203 bears the mechanical pressure of the SIP module and is used to achieve the effect of promoting heat dissipation at the four corners by bearing the force. The corner pressure relief assembly 2 also includes a plurality of second wedge blocks 210. The first wedge block 206 installed at the bottom of the reinforcing plate 203 drives the two second wedge blocks 210 to move left and right to clamp the sides of the reinforcing plate 203. Side pressure-resistant component 3 is disposed on one side of corner pressure relief component 2. Side pressure-resistant component 3 includes multiple third plates 301 and pressure-resistant pads 304. Two adjacent third plates 301 are connected by mortise and tenon joints to enhance the bending resistance of the first SMP joint 111 and the second SMP joint 112. The circumferential bonding component 4 is disposed on one side of the side pressure-resistant component 3. The circumferential bonding component 4 includes multiple airbags 407, which can expand to increase the wrapping surface with the connector and prevent axial and radial separation.

[0021] First, the top of the integrated board 100 is fitted with SiP chips, capacitors, and resistors (active or passive components) to form a complete electrical functional module. The top and bottom surfaces of the integrated board 100 are machined to ensure flatness and parallelism, and the four corners are integrally formed to withstand the stacking weight. The integrated board 100 has pre-drilled mounting holes for connectors to fix the first SMP connector 111 or the second SMP connector 112. The mounting holes are through-holes. The integrated board 100 can be surface-mounted onto a circuit board to form a connection structure for small single-board functional modules. These single boards can be further connected to each other on the same plug-in board to achieve integration between multi-channel modules, utilizing SMP... The unique blind mating function and extremely small physical size of the P connector enable a compact surface mount connection between the SiP module and the underlying circuit board. During stacking, the second SMP connector 112 of the lower module is connected to the first SMP connector 111 of the upper module through an SMP-KK adapter. The SMP-KK adapter serves as an intermediate component for stacking. After insertion, signal transmission can be achieved. When all modules are stacked in place, a through-type long pull rod is used to pass through the center hole of the support column of each layer of module from top to bottom. A nut is used at the bottom to apply pre-tightening force, and the entire stack is locked into a whole. When the system is powered on, the locking status of each SMP connector is confirmed by the embedded contact resistance monitoring circuit signal.

[0022] To address the issue that most stacked structures lack independent force transmission paths, resulting in gravity acting directly on the signal connectors and poor heat dissipation at the corners of the modules, corner pressure relief components 2 are installed to not only transmit force within a limited space but also dissipate heat from the stacked modules at the corners.

[0023] Preferably, the specific working process of the corner pressure relief component 2 is as follows: Figure 4 and Figure 5As shown, the corner pressure relief assembly 2 also includes multiple first protective sleeves 201, which are respectively disposed at the corners of the integrated plate 100. A second protective sleeve 202 is disposed on one side of each of the multiple reinforcing plates 203. Two first plates 205 are disposed at the bottom of each of the multiple reinforcing plates 203. Multiple auxiliary strips 207 are disposed inside the integrated plate 100. An auxiliary block 208 is fitted onto one end of each of the multiple auxiliary strips 207. The bottoms of multiple second wedge blocks 210 are respectively connected to the bottoms of the multiple auxiliary blocks 208. Two guide holes 211 are opened on one side of each of the multiple second wedge blocks 210. The multiple first protective sleeves 201 are respectively fixedly disposed at the corners of the integrated plate 100, and the multiple second protective sleeves 202 are respectively disposed on the corners of the multiple first protective sleeves. The top of 201 is movable, one side of multiple reinforcing plates 203 is fixed to one side of multiple second protective sleeves 202, multiple heat-conducting plates 204 are fixedly installed inside multiple reinforcing plates 203, the top of multiple first plates 205 are fixedly connected to the bottom of multiple reinforcing plates 203, multiple first wedge blocks 206 are fixedly installed on one side of multiple reinforcing plates 203, multiple auxiliary strips 207 are fixedly installed inside integrated plate 100, multiple auxiliary blocks 208 are movably sleeved with one end of multiple auxiliary strips 207, one end of multiple springs 209 is fixed to one side of multiple auxiliary blocks 208, the bottom of multiple second wedge blocks 210 is fixedly connected to the top of multiple auxiliary blocks 208, and multiple guide holes 211 are... The circumferential bonding components 4 are set in multiple groups on one side of the multiple second wedge blocks 210, and are respectively set at the four corners of the integrated board 100. Each corner works independently. During vertical stacking, the gravity of the upper module is transferred to the lower module through an independent path, so that the first SMP connector 111 and the second SMP connector 112 are not subjected to axial pressure. At the same time, the heat generated by the chip is conducted from the center of the board to the four corners and vertically conducted through the interlayer contact surface to form a heat dissipation channel. The first protective sleeve 201 is located on the outermost corner of the integrated board 100 and is used to accommodate the second protective sleeve 202. The first protective sleeve 201 is made of high-strength stainless steel, providing rigid protection and wear-resistant guidance. The second protective sleeve 202 itself adopts the same design as the first protective sleeve. The reinforcing plate 201 is made of the same material, but its inner wall is embedded with a self-lubricating PTFE bushing to ensure smooth sliding. The reinforcing plate 203 is a rectangular flat plate located on one side of the second protective sleeve 202. Its central area is in direct contact with the end face of the support column of the upper module. The reinforcing plate 203 is made of high thermal conductivity tool steel, which can both withstand pressure and transfer heat. As the second protective sleeve 202 moves downward, its bottom gradually abuts against the top of the first protective sleeve 201 for limiting. At this time, the bottom of the reinforcing plate 203 falls into the top of the integrated plate 100 and is located in the corner area of ​​the integrated plate 100. The heat-conducting plate 204 falls into the top of multiple heat sinks 216, and the two are tightly attached. As the reinforcing plate 203 descends, the first wedge block 206 installed on one side of it descends simultaneously.With its inclined surface facing downwards, the second wedge 210 has an inclined surface at its top that matches that of the first wedge 206. As the first wedge 206 descends, it gradually applies an outward force to the second wedges 210 on both sides. The inclined surface of the first wedge 206 presses against the inclined surface of the second wedge 210, generating a horizontal component force that pushes the second wedge 210 horizontally towards the inside of the module. As the second wedge 210 moves, it gradually approaches the first plate 205. The multiple second wedges 210 can then clamp one side of each of the multiple first plates 205, making the integrated plate 100 and the reinforcing plate 203 more securely installed.

[0024] Preferred, according to Figure 2 and Figure 10 As shown, multiple auxiliary strips 207 are all wrapped with springs 209, one end of each spring 209 is connected to one side of multiple auxiliary blocks 208, two second plates 212 are provided on the top of each of the multiple reinforcing plates 203, two rollers 213 are provided between the inner walls of two adjacent second plates 212, and two extension plates 214 are provided on one side of each of the multiple second protective sleeves 202. Figure 11 As shown, limit strips 215 are provided between the inner walls of two adjacent extension plates 214. The bottoms of multiple second plates 212 are fixedly connected to the tops of multiple reinforcing plates 203. Multiple rollers 213 rotate between multiple second plates 212. One side of multiple extension plates 214 is fixedly connected to one side of multiple second protective sleeves 202. Multiple limit strips 215 are fixedly inserted between two adjacent extension plates 214. Multiple heat sinks 216 are fixedly installed inside the integrated plate 100. Two adjacent second wedge blocks 210 are connected by a rod. The second wedge block 210 that moves in contact with the first wedge block 206, under the connection of the rod, also drives the other second wedge block. The synchronous movement of the second wedge blocks 210 enables the synchronous movement of multiple second wedge blocks 210. When the second wedge block 210 is pushed, the auxiliary block 208 slides inward along the auxiliary strip 207, and the spring 209 is compressed and deformed under force. Finally, the end face of the auxiliary block 208 directly abuts against the SMP connector housing, applying radial clamping force. After stacking, the inclined surfaces of the first wedge block 206 and the second wedge block 210 are completely in contact. Since the inclined surface angle is less than the friction angle, self-locking is achieved. Even if the external pressure is lost, the wedge blocks will not retract on their own. When disassembly is required, simply lift the upper module upward, the first wedge block 206 rises, the spring 209 pushes the auxiliary block 208 and the second wedge block 210 to reset, and the clamping force is automatically released.

[0025] The heat sink 216 extends vertically through the entire thickness of the board. The heat sink 216 is a needle-fin copper sheet to increase the heat dissipation area. Multiple heat sinks 216 are arranged in an array. Their tops are in contact with the heat-conducting plate 204, while their bottoms are exposed and connected to the heat sinks 216 of the lower module. Thermal grease is applied between the bottom of the heat sink 216 of the upper module and the top of the reinforcement plate 203 of the lower module. Heat is transferred downward from the chip of the upper module, the integrated board 100, the heat-conducting plate 204, the first board 205, the heat sink 216, the thermal grease, and the reinforcement plate 203, and finally reaches the bottom main plug-in board. Since there are independent heat dissipation channels at the four corners, the heat does not need to pass through the center of the module, realizing parallel heat dissipation and avoiding the heat tower effect.

[0026] The second plate 212 is fixed to the top of the reinforcing plate 203 and is perpendicular to the reinforcing plate 203. The inner sidewall of the second plate 212 has an arc-shaped groove, in which a roller 213 is installed. The roller 213 is made of cylindrical ceramic with a chrome-plated surface and can rotate freely. When the module moves vertically, the roller 213 rolls into contact with the vertical guide rail groove on the adjacent module or frame, changing sliding friction into rolling friction and reducing the insertion force. At the same time, the roller 213 allows the module to move slightly along the guide rail direction when it expands thermally, releasing thermal stress. The extension plate 214 is fixed to one side of the second protective sleeve 202 and moves synchronously with the second protective sleeve 202. A limit strip 215 is provided between the extension plates 214 of two adjacent modules. The limit strip 215 is a long strip of metal, with both ends inserted into the grooves of the two extension plates 214 respectively. The function of the limit strip 215 is to ensure that the heat sinks 216 of the upper and lower modules are always aligned and to prevent poor heat dissipation contact due to assembly deviation.

[0027] It should be noted that spring 209 is a miniature compression spring made of piano wire, which allows for slight movements due to thermal expansion.

[0028] The main process effect of the corner pressure relief component 2 is as follows: the upper module descends, the reinforcing plate 203 contacts the support column of the lower module and bears the gravity, the reinforcing plate 203 pushes the first wedge block 206 down, squeezes the second wedge block 210 to move horizontally, the auxiliary block 208 compresses the spring 209 and presses the SMP connector shell to achieve stress-free clamping, the chip heat is continuously conducted downward through the heat conduction path in the board: heat conduction plate 204, first plate 205, heat sink 216, heat conduction interface material and lower module, and when disassembling, the module is lifted upward, the spring 209 is reset, the second wedge block 210 is retracted, and the SMP connector is freed.

[0029] To address the issue of gradually increasing stress at the four corners of the structure, which can lead to loosening of the contact interface of the side connectors, a side pressure-resistant component 3 is designed to work in conjunction with the corner pressure-relieving component 2, thereby further enhancing the support force on the side connectors.

[0030] Preferably, the specific working process of the side compression-resistant component 3 is as follows: Figure 6 and Figure 9 As shown, the side-supporting compression assembly 3 also includes multiple displacement blocks 302, which are respectively disposed at the bottom of multiple third plates 301. Each displacement block 302 has a tenon 303 at its bottom. Arc-shaped blocks 305 are disposed on both sides of the two compression pads 304. A fourth plate 306 is disposed at the top of each of the arc-shaped blocks 305. Compression blocks 307 are disposed inside each of the fourth plates 306. Tenon holes 308 are opened at the top of each compression block 307. The tenons 303 are mortised and tenoned into the tenon holes 308. The two compression pads 304 are respectively fixedly sleeved at one end of the first SMP connector 111 and the second SMP connector 112. Multiple third plates 301 are respectively fixedly sleeved on one end of multiple limiting strips 215. The tops of multiple displacement blocks 302 are respectively fixedly connected to the bottoms of multiple third plates 301. The tops of multiple tenon blocks 303 are respectively fixedly connected to the bottoms of multiple displacement blocks 302. One side of multiple arc-shaped blocks 305 is respectively fixed to one side of two pressure-resistant pads 304. The tops of multiple fourth plates 306 are respectively fixed to the tops of multiple arc-shaped blocks 305. Multiple pressure-resistant blocks 307 are respectively fixedly disposed inside multiple fourth plates 306. By setting the side pressure-resistant components 3, the lateral support force on the SMP connector is enhanced, preventing the contact interface from loosening due to increased corner stress. Figure 3 and attached Figure 9 As shown, the side pressure-resistant components 3 are disposed on the side of the integrated board 100. At this time, the side of the integrated board 100 is also provided with the first SMP connector 111 and the second SMP connector 112. Therefore, the two sets of side pressure-resistant components 3 respectively strengthen the lateral support force of the first SMP connector 111 and the second SMP connector 112, and are linked with the extension plate 214, the limiting strip 215 and the first protective sleeve 201 in the corner pressure relief components 2. The main function of the side pressure-resistant components 3 is to convert the lateral stress transmitted from the four corners into the radial support force of the SMP connector shell under vertical stacking and vibration environment, so as to prevent the connector contact interface from fretting and loosening due to board bending or thermal expansion, thereby ensuring the long-term stability of signal transmission.

[0031] In a multi-layer stacked structure, the four corners of each module bear the weight of the upper module and the preload of the through-bar. These forces cause the integrated board 100 to undergo slight bending deformation. In particular, the edge of the integrated board 100 near the SMP connector will produce a lateral displacement perpendicular to the connector axis. This lateral displacement acts directly on the SMP connector shell, which will cause uneven contact pressure between the inner conductor of the connector and the adapter, thereby increasing the contact resistance.

[0032] The third plate 301 is made of carbon fiber composite material and is elongated in shape. The displacement block 302 is perpendicular to the third plate 301 and is made of wear-resistant brass with a hard chrome plated surface. Its lower end is fixedly connected to the tenon block 303. The tenon block 303 is a T-shaped tenon with a self-locking angle and is made of tool steel. The top of the tenon block 303 is fixedly connected to the bottom of the displacement block 302. The tenon block 303 is inserted into the tenon hole 308 opened on the anti-compression block 307. The tenon hole 308 is a T-shaped through slot that matches the tenon block 303. The inner wall of the tenon hole 308 is also hardened. The second protective sleeve 202 is connected to the integrated plate 100. During insertion, the limiting strip 215 will also drive the third plate 301 to move downwards. Two adjacent third plates 301 are connected by a mortise and tenon structure, with a self-locking angle providing limiting. As the two third plates 301 are installed with mortise and tenon joints, the tenon 303 will gradually approach the pressure-resistant block 307. When the tenon 303 falls into the mortise hole 308, the two will also be limited by the mortise and tenon joint, further ensuring the firmness of the installation of the two adjacent first protective sleeves 201. The pressure-resistant pad 304 provides radial support to the bottom of the first SMP connector 111 and the second SMP connector 112, respectively, and to the first SMP... The contact portion of MP connector 111 and second SMP connector 112 uses elastic polyurethane to evenly distribute the rigid clamping force on the connector shell surface, avoiding localized indentations. The arc-shaped block 305 is a semi-cylindrical metal part; its inner arc surface fits against the pressure-resistant pad 304, and its outer arc surface is smooth. In fact, the fourth plate 306 is a common substrate connecting all the arc-shaped blocks 305. The fourth plate 306 is a rectangular flat plate made of aluminum alloy, which is lightweight and insulating. The pressure-resistant block 307 has a tenon hole 308 on its top for mating with the tenon block 303. The pressure-resistant block 307 is made of wear-resistant bronze, which has high hardness and a low coefficient of friction, mainly through two... The mortise and tenon of the third plate 301 and the tenon block 303 are connected to the mortise and tenon of the tenon hole 308 to limit and fix the first SMP connector 111 and the second SMP connector 112 on the side. This not only increases the stability of the corner pressure relief component 2 when it is installed on the integrated plate 100, but also strengthens the connector on the side in time, and always keeps the connector contact interface stable. The side pressure relief component 3 cooperates with the corner pressure relief component 2 to solve the three major problems of gravity conduction, heat dissipation and lateral support. The force conversion is achieved entirely by mechanical structure. Wear-resistant, self-lubricating and elastic materials are selected to ensure that the accuracy is maintained after long-term cyclic use.

[0033] To address the issue that interconnection between modules relies heavily on the friction of the connectors themselves, which can lead to easy axial or radial separation of the side connectors, a circumferential bonding component 4 is designed to work in conjunction with the side anti-compression component 3. This increases the clamping force on the side connectors, preventing axial or radial separation.

[0034] Preferably, the specific working process of the circumferential bonding component 4 is as follows: Figure 7 and Figure 8 As shown, the circumferential bonding assembly 4 also includes two L-shaped plates 401, which are respectively connected to one side of the two displacement blocks 302. A control box 402 is provided on the other side of each of the two L-shaped plates 401. A rigid pad 405 is provided on one side of each of the two pressure pads 304. The bottoms of the two wrapping sleeves 406 are respectively connected to the tops of the two rigid pads 405. Figure 12As shown, each of the two wrapping sleeves 406 has a through plate 404 on one side, and a piston rod 403 is installed inside each of the two through plates 404. Two control boxes 402 are located directly above the two piston rods 403. Multiple airbags 407 are connected to the two wrapping sleeves 406. One side of each of the two L-shaped plates 401 is fixedly connected to one side of each of the two displacement blocks 302. The two control boxes 402 are fixedly installed on one side of each of the two L-shaped plates 401. One side of each of the two rigid pads 405 is fixedly connected to one side of each of the two pressure-resistant pads 304. The bottom of each of the two wrapping sleeves 406 is fixedly connected to the top of each of the two rigid pads 405. Multiple airbags 407 are fixedly interlocked with the inner surfaces of the two wrapping sleeves 406. The stopper rod 403 moves through the interiors of the two control boxes 402. The circumferential fitting component 4 is located on the side of the integrated plate 100, specifically around the two SMP connectors. It is driven to move in conjunction with the displacement block 302, pressure pad 304, and arc block 305 in the side pressure-resistant component 3. Based on the radial clamping provided by the side pressure-resistant component 3, the airbag 407 is further pneumatically driven to completely wrap the SMP connector shell without gaps, eliminating axial and radial movement caused by vibration, thereby preventing the risk of separation of the connector contact interface. The vertical movement of the displacement block 302 in the side pressure-resistant component 3 drives the vertical movement of the connected L-shaped plate 401, which in turn drives the vertical movement of the connected control box 402. The control box 402 is a small, sealed cavity, fixedly installed on the side of the L-shaped plate 401. It converts the vertical displacement generated by the stacking into a compression process by the air pump. The compressed gas is then delivered to each airbag 407 via the movable piston rod 403. The control box 402 has a vertically oriented miniature cylinder bore and is made of aluminum alloy. It contains a miniature air pump structure, with the piston rod 403 slidingly fitted within this cylinder bore. The upper end of the piston rod 403 extends out from the top of the control box 402, while the lower end is located within the cylinder bore and fitted with a sealing piston ring. As the L-shaped plate 401 continues to move, the inclined surface forces the piston rod 403 downwards, compressing the air in the cylinder. The compressed air passes through the bottom of the control box 402. The air outlet of the unit is conveyed through the through plate 404 to the sleeve 406, and then to the interior of multiple airbags 407. The airbags 407 gradually expand as they are inflated, and the expansion force of the airbags 407 is evenly transmitted to the connector housing to generate radial pressure and lock the connector housing. The sleeve 406 is a semi-rigid cylindrical sleeve made of elastic fabric reinforced silicone rubber with a certain tensile strength. The airbags 407 are annular air chambers embedded inside the sleeve 406. Multiple airbags 407 are evenly distributed along the circumference of the sleeve 406. The airbags 407 are made of high-elasticity fluorosilicone rubber, which is oil-resistant and aging-resistant. The air inlet of the airbag 407 is connected to the air pipe from the control box 402 through the through plate 404.

[0035] It should be noted that the control box 402 is also equipped with a one-way valve, which is for both air intake and exhaust. The air intake valve allows outside air to enter the cylinder and prevents gas backflow, while the exhaust valve allows compressed gas to enter the air supply line and prevents gas backflow. A return spring is also installed inside the control box 402, located in the cylinder bore below the piston rod 403, to push the piston rod 403 back to its original position. A flow groove is formed in the through plate 404 and communicates with the rigid pad 405, the sheath 406, and the air bladder 407. When the L-shaped plate 401 moves downward, it compresses the piston rod 403, causing it to descend. The air in the cylinder is compressed, the pressure increases, the air intake one-way valve closes, and the exhaust one-way valve opens. The one-way valve opens, and compressed gas enters the through plate 404 through the outlet. Then, the air is delivered to the interior of multiple airbags 407. After inflation, the volume of multiple airbags 407 gradually increases. When the lateral stress decreases, the displacement block 302 retracts, the L-shaped plate 401 rises under the action of the return spring, and the piston rod 403 rises under the push of the return spring. Negative pressure is generated in the cylinder, the outlet one-way valve closes, and the inlet one-way valve opens, allowing external air to enter the cylinder in preparation for the next compression. As the L-shaped plate 401 rises, the piston rod 403 will also gradually separate from the through plate 404. The rise of the L-shaped plate 401 opens the pressure relief hole, and the airbags 407 contract.

[0036] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules, characterized in that, include: Integrated panel (100); The first SMP connector (111) and the second SMP connector (112) are respectively disposed on the outer side of the integrated plate (100); The corner pressure relief assembly (2) is disposed on one side of the integrated board (100). The corner pressure relief assembly (2) includes a reinforcing plate (203), a heat sink (216) and a heat conduction plate (204). The heat conduction plate (204) is installed on the inside side of the reinforcing plate (203). The heat conduction plate (204) contacts the heat sink (216) to form a vertical heat dissipation channel. The reinforcing plate (203) bears the mechanical pressure of the SIP module and is used to achieve the effect of promoting heat dissipation at the four corners by bearing the force. The corner pressure relief assembly (2) also includes a plurality of second wedge blocks (210), a first wedge block (206) installed at the bottom of the reinforcing plate (203), and drives the two second wedge blocks (210) to move left and right to clamp the side of the reinforcing plate (203); Side pressure-resistant component (3) is provided on one side of corner pressure-relieving component (2). The side pressure-resistant component (3) includes a plurality of third plates (301) and pressure-resistant pads (304). Two adjacent third plates (301) are connected by mortise and tenon joints to enhance the bending resistance of the first SMP joint (111) and the second SMP joint (112). A circumferential bonding component (4) is disposed on one side of the side pressure-resistant component (3). The circumferential bonding component (4) includes multiple airbags (407). The multiple airbags (407) can expand to increase the wrapping surface with the connector and avoid axial and radial separation.

2. The miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to claim 1, characterized in that: The corner pressure relief assembly (2) also includes a plurality of first protective sleeves (201), which are respectively disposed at the corners of the integrated plate (100). A second protective sleeve (202) is disposed on one side of each of the plurality of reinforcing plates (203), and two first plates (205) are disposed at the bottom of each of the plurality of reinforcing plates (203).

3. The miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to claim 2, characterized in that: The integrated plate (100) is provided with a plurality of auxiliary strips (207) inside. Each of the plurality of auxiliary strips (207) is fitted with an auxiliary block (208) at one end. The bottom of the plurality of second wedge blocks (210) is connected to the bottom of the plurality of auxiliary blocks (208) respectively. Each of the plurality of second wedge blocks (210) has two guide holes (211) on one side.

4. The miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to claim 3, characterized in that: The exterior of each of the auxiliary strips (207) is wrapped with a spring (209), one end of each of the springs (209) is connected to one side of each of the auxiliary blocks (208), and the top of each of the reinforcing plates (203) is provided with two second plates (212).

5. The miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to claim 4, characterized in that: Two rollers (213) are provided between the inner walls of two adjacent second plates (212), and two extension plates (214) are provided on one side of multiple second protective sleeves (202). Limiting strips (215) are provided between the inner walls of two adjacent extension plates (214).

6. The miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to claim 1, characterized in that: The side pressure-resistant component (3) also includes multiple displacement blocks (302), which are respectively disposed at the bottom of multiple third plates (301). The bottom of each of the multiple displacement blocks (302) is provided with tenon blocks (303), and the two pressure-resistant pads (304) are provided with arc-shaped blocks (305) on both sides.

7. The miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to claim 6, characterized in that: Each of the multiple arc-shaped blocks (305) has a fourth plate (306) on its top, and each of the multiple fourth plates (306) has an anti-compression block (307) inside its interior. Each of the multiple anti-compression blocks (307) has a tenon hole (308) on its top, and each of the multiple tenons (303) is connected to the multiple tenons (308) by mortise and tenon joints.

8. The miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to claim 1, characterized in that: The circumferential bonding assembly (4) also includes two L-shaped plates (401), which are respectively connected to one side of two displacement blocks (302). A control box (402) is provided on the other side of each of the two L-shaped plates (401), and a rigid pad (405) is provided on one side of each of the two pressure pads (304).

9. The miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to claim 8, characterized in that: The top of each of the two rigid pads (405) is provided with a cover (406), and a through plate (404) is provided on one side of each of the two cover (406).

10. The miniaturized stacked interconnect structure suitable for integration between multifunctional SIP modules according to claim 9, characterized in that: Both of the through plates (404) are equipped with piston rods (403), and the two control boxes (402) are located directly above the two piston rods (403). The multiple airbags (407) are connected to the two wrapping sleeves (406) respectively.

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