功率芯片封装支架和功率模块的制备方法
By fabricating a thermally conductive insulating film recessed into the edge of the chip holder on a metal substrate and combining it with a resistive film, the problem of poor insulation/voltage withstand performance of the thermally conductive insulating film is solved, enabling low-cost and high-efficiency packaging bracket and module fabrication, and enhancing creepage distance and heat dissipation performance.
Patent Information
- Application Number
- CN202610876977.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-17
- Publication Date
- 2026-07-17
AI Technical Summary
In existing power chip packaging brackets, thermally conductive insulating films have poor insulation/voltage withstand performance and are greatly affected by the manufacturing process, resulting in high costs.
A semi-cured thermally conductive insulating film is fabricated on a metal substrate, and a metal heat sink is pre-attached on it. After punching, it is finally cured to ensure that the thermally conductive insulating film is recessed within the edge of the chip socket, increasing the creepage distance. The film curing process is used to melt and fill cracks, and the coating area is defined by the resist film, simplifying the manufacturing process.
This technology enables low-cost improvement of the insulation/pressure withstand performance of the packaging bracket, simplifies the manufacturing process, enhances creepage distance, ensures that the film is not affected by punching force, and improves the heat dissipation efficiency of the packaging module.
Smart Images
Figure CN122421776A_ABST