A package substrate and electronic device
By setting edge misalignment of adjacent conductive layers in the packaging substrate, especially by using a wavy or stepped misalignment structure, the problem of substrate warping and breakage caused by the difference in thermal expansion coefficients is solved, thereby improving the reliability and production yield of the substrate and extending the service life of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- AALTOSEMI INC
- Filing Date
- 2026-04-03
- Publication Date
- 2026-07-17
AI Technical Summary
During the manufacturing process of semiconductor packaging substrates, the difference in thermal expansion coefficients between the insulating resin layer and the copper conductive layer leads to the concentration of thermomechanical stress, which causes substrate warping and breakage. In particular, structural weak points appear at the overlapping edges of the multilayer copper conductive layers, affecting production yield and device reliability.
By setting the edges of adjacent conductive layers in the packaging substrate to be misaligned so that they do not overlap in the projection perpendicular to the substrate plane, and by adopting a wavy or stepped misalignment structure, the interface contact area is increased and stress is dispersed, thus optimizing the thermomechanical stress distribution.
It effectively reduces the risk of substrate edge breakage, improves the reliability and production yield of the packaging substrate, and extends the service life of electronic devices.
Smart Images
Figure CN122421790A_ABST