热压键合方法和用于执行此方法的压头
CN122421797APending Publication Date: 2026-07-17XINGKE JINPENG MANAGEMENT PTE LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-15
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing thermo-press bonding processes, uneven contact surfaces between the pressure head and the semiconductor die lead to poor heat transfer and bonding failures, especially uneven contact of solder bumps and undesirable electrical connections.
Method used
A pressure head coated with phase change material is used. The phase change material is heated to a temperature above its phase change temperature by a heater, which softens it and fills the gap between the pressure head and the semiconductor die, increasing the contact area and improving heat transfer and bonding effect.
Benefits of technology
It improves heat transfer efficiency, reduces bonding failures, ensures uniform contact and stable connection of solder bumps, and avoids undesirable electrical connections.
✦ Generated by Eureka AI based on patent content.
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Figure CN122421797A_ABST
Abstract
本发明提供了一种用于执行热压键合的方法，所述方法包括：提供压头，所述压头具有涂覆有包括至少一种相变材料的转变层的底表面；提供裸片，所述裸片具有附接有一个或多个凸块的底表面；将所述裸片移动到衬底上，使得所述凸块接触所述衬底；使用所述压头将所述裸片压靠在所述衬底上，使得转变层与所述裸片接触；以及经由从所述压头传递到所述裸片的热将所述凸块加热到熔融状态，同时所述相变材料的温度被加热到高于所述相变材料开始发生相变的第一转变温度以软化所述相变材料，使得当所述转变层被按压时，所述转变层与所述裸片之间的接触面积增加。
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