Laminated substrate

By employing a combination of thermoplastic resin and dispersed resin materials in the laminated substrate, the problems of adhesion and warping between the conductor pattern and the resin layer are solved, achieving a tight bond between the resin layer and the conductor layer and improving dielectric properties.

CN122422142APending Publication Date: 2026-07-17MURATA MFG CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
MURATA MFG CO LTD
Filing Date
2024-11-26
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In existing laminates, the large coefficient of thermal expansion of the first resin layer leads to a decrease in the adhesion between the conductor pattern and the resin layer, and causes laminate warping.

Method used

A resin layer structure containing thermoplastic resin material and thermoplastic resin material dispersed therein is adopted to ensure that the difference in the coefficient of thermal expansion between the first resin layer and the second resin layer is within a specific range, and a certain proportion of the second resin material is present at the interface to form a tight bond between the conductor layer and the resin layer.

Benefits of technology

It improves the adhesion between the resin layer and the conductor layer, suppresses the warping of the laminated substrate, and enhances the dielectric properties and heat resistance in the high-frequency region.

✦ Generated by Eureka AI based on patent content.

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Abstract

层叠基板（1）具备：第1树脂层（10a），具有在厚度方向上相对的第1主面（10aa）以及第2主面（10ab）；第2树脂层（10b），具有在厚度方向上相对的第3主面（10ba）以及第4主面（10bb），并设置为第4主面（10bb）与第1主面（10aa）对置；以及第1导体层（20a），位于第1树脂层（10a）与第2树脂层（10b）之间，并设置为与第1主面（10aa）以及第4主面（10bb）相接，第1树脂层（10a）以及第2树脂层（10b）分别包含包括热塑性树脂的第1树脂材料（11a）和包括热塑性树脂并分散在第1树脂材料（11a）中的第2树脂材料（11b），若将第1树脂材料（11a）的熔点设为Tm1，并将第2树脂材料（11b）的熔点设为Tm2，则Tm1>Tm2，在与厚度方向垂直的面方向上，若将第1树脂材料（11a）的热膨胀系数设为CTE1，将第2树脂材料（11b）的热膨胀系数设为CTE2，并将第1导体层（20a）的热膨胀系数设为CTE3，则|CTE3‑CTE2|>|CTE3‑CTE1|，在观察沿着厚度方向的第1剖面时，在第1树脂层（10a）和第1导体层（20a）的界面处，第2树脂材料（11b）的存在比例为40%以上且70%以下。
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