Sound device
By setting a support frame and a matching part for the diaphragm on the housing wall of the audio device, the problem of inconsistent adhesive thickness between the acoustic matching plate and the diaphragm part is solved, the acoustic impedance matching accuracy is improved, and efficient and consistent sound propagation is achieved.
CN122422927APending Publication Date: 2026-07-17MURATA MFG CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- MURATA MFG CO LTD
- Filing Date
- 2024-12-13
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing audio devices, the inconsistent thickness of the adhesive between the acoustic matching plate and the diaphragm leads to a decrease in acoustic impedance matching accuracy, which affects sound propagation efficiency and consistency.
Method used
A matching part is provided on the wall of the housing, including a support frame, a diaphragm and a mounting part. The support frame is in direct contact with the housing to ensure the precise positioning of the diaphragm and the housing, achieve acoustic impedance matching and avoid the influence of adhesive thickness.
Benefits of technology
It improves the efficiency of sound propagation, reduces the consistency problem of sound propagation, and achieves efficient sound propagation.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122422927A_ABST
Abstract
提供音响装置。音响装置（1）具备在壳体（90）的壁面（91A）处设置的匹配部（100），且该匹配部（100）为了使来自音源（50）的声音穿过壳体（90）传播而使声阻抗匹配，匹配部（100）具有：具有与壳体（90）的壁面（91A）接触的端面（21）的支承框（20）；由支承框（20）支承的振动膜（10）；以及将支承框（20）安装于壳体（90）的壁面（91A）处的安装部（30）。
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Citation Information
Patent Citations
Ultrasonic transducer
WO2021192417A1