Joining system and joining method
By introducing multiple bonding and conveying devices into the bonding system and optimizing the bonding process between the bare die and the target substrate using control circuitry, the problem of long setup time for bonding devices was solved, thereby improving production efficiency.
CN122423360APending Publication Date: 2026-07-17TOKYO ELECTRON LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2024-12-05
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing technologies, the adjustment time of the joining device is relatively long, resulting in low production efficiency.
Method used
By combining multiple bonding devices with conveying devices and control circuits, the bonding process between the die and the target substrate is optimized through the control circuit, achieving efficient die type change and bonding, and shortening the adjustment time.
Benefits of technology
By optimizing the control circuit and device layout, the adjustment time of the coupling device was significantly shortened, and production efficiency was improved.
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Figure CN122423360A_ABST
Abstract
本发明的接合系统具备：多个接合装置，各接合装置将裸片从载体进行分离并接合于目标基板；输送装置，其针对多个所述接合装置输送所述载体和所述目标基板；以及控制电路，其对多个所述接合装置和所述输送装置进行控制。所述控制电路进行在希望的期间中，一边更换所述目标基板一边反复进行多个所述接合装置仅将针对每个所述接合装置所设定的一种所述裸片接合于所述目标基板的控制、以及在所述希望的期间中，所述输送装置将各所述目标基板依次输送到针对所述目标基板接合不同种类的所述裸片的多个所述接合装置的控制。
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Citation Information
Patent Citations
Chip carrier and chip processing method
JP2023132650A