Semiconductor manufacturing apparatus component
By employing a plug structure with a tapered inner circumferential surface and a dense outer circumferential surface in components used in semiconductor manufacturing equipment, the problems of plug fixing strength and positioning accuracy are solved, achieving efficient discharge suppression and convenient plug replacement.
CN122423366APending Publication Date: 2026-07-17NGK INSULATORS LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NGK INSULATORS LTD
- Filing Date
- 2023-12-20
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing semiconductor manufacturing equipment, without the use of adhesives, it is difficult to guarantee the fixing strength and positioning accuracy of plugs, resulting in poor discharge suppression.
Method used
A ceramic plug with a conical inner circumferential surface and a dense outer circumferential surface is used. The plug is implanted into the substrate by direct fitting, which ensures the positioning accuracy of the plug at the specified height position and improves the fixing strength through friction.
Benefits of technology
It achieves high positioning accuracy and fixation strength of the plug without the use of adhesive, effectively suppresses discharge between the wafer and the substrate, and facilitates plug replacement.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122423366A_ABST
Abstract
本发明的课题在于，提供即便不使用粘接剂也能够将插塞以高定位精度植入于插塞配置孔的半导体制造装置用部件。半导体制造装置用部件具备：陶瓷基板，其具有供晶片载放的上表面及下表面；插塞配置孔，其沿上下方向贯穿所述陶瓷基板，且具有上部开口的面积比下部开口的面积大的锥状的内周面；陶瓷插塞，其具有致密的外周面及贯穿该插塞的气体流路，该插塞的致密的外周面以直接嵌合的方式植入于所述插塞配置孔的内周面；导电性的基板，其借助接合层而被接合于所述陶瓷基板的下表面；气体供给路，其从所述基板及所述接合层通过，用于向所述陶瓷插塞的气体流路供给气体。
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