Semiconductor manufacturing apparatus component
By using a combination structure of dielectric plugs and conductive substrates in a semiconductor manufacturing apparatus, and covering it with a low volume resistivity film, the discharge problem near the junction of the ceramic substrate and the substrate is solved, thereby improving the reliability and safety of the apparatus.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NGK INSULATORS LTD
- Filing Date
- 2023-12-20
- Publication Date
- 2026-07-17
AI Technical Summary
In existing semiconductor manufacturing equipment components, discharge is prone to occur near the junction of the ceramic substrate and the base plate, and existing technologies are unable to effectively suppress this discharge phenomenon.
The structure employs a combination of dielectric plugs and a conductive base plate. The dielectric plugs are implanted through plug configuration holes in the ceramic substrate and covered with a film of low volume resistivity material on their lower surface. The conductive base plate is bonded to the ceramic substrate through a resin adhesive layer to form a conductive connection, which enhances the current conduction path and reduces the risk of discharge.
It effectively suppresses discharge near the junction of the ceramic substrate and the base plate, improving the reliability and safety of semiconductor manufacturing equipment.
Smart Images
Figure CN122423367A_ABST