Substrate coating method, substrate processing method, and substrate coating apparatus

Abstract

The application provides a substrate gluing method, a substrate processing method and a substrate gluing device. The substrate gluing method comprises the following steps: placing a substrate in a gluing station; controlling the substrate gluing device to apply a layer of uniform-thickness protective glue to the center position of the sidewall of the substrate; and curing the protective glue at the center position of the sidewall of the substrate by curing. The glue is accurately and reliably applied to the middle position of the sidewall of the substrate, which can improve the strength of the substrate and facilitate handling, prevent the problem of edge collapse and fragmentation in substrate processing, and prevent the adverse effects of glue on the surface processing of the substrate, thereby improving the processing yield and processing quality of the substrate.

Description

Technical Field

[0001] This invention relates to the field of substrate coating, and in particular to a substrate coating method, a substrate processing method, and a substrate coating equipment. Background Technology

[0002] Glass substrates and ceramic substrates represent core technological advancements in advanced packaging. However, the edges of brittle materials like glass and ceramics are often uneven after cutting and processing. Applying adhesive can prevent these edges from posing safety risks or cracking. Current adhesive application equipment and processes are insufficient for effectively applying adhesive to the edges of substrates used in advanced packaging, negatively impacting substrate yield and quality. Summary of the Invention

[0003] Therefore, it is necessary to provide a substrate coating method, substrate processing method, and substrate coating equipment that can improve the processing yield and processing quality of the substrate, in order to address the above problems.

[0004] The technical solution is as follows:

[0005] In a first aspect, a substrate coating method is provided, applied to a substrate coating apparatus, the substrate coating method comprising:

[0006] Place the substrate at the adhesive coating station;

[0007] The substrate coating device is controlled to coat a layer of protective adhesive of uniform thickness along the center position of the sidewall of the substrate;

[0008] The protective adhesive is cured at the center of the sidewall of the substrate by a curing process.

[0009] The technical solution will be further explained below:

[0010] In one embodiment, the substrate coating apparatus includes a glue conveying component with a glue outlet, and a first transmission component and a second transmission component located on both sides of the glue outlet are sleeved on the glue conveying component; placing the substrate at the coating station specifically includes:

[0011] The sidewall of the substrate is positioned on the sidewalls of the first and second transmission components, with the center of the sidewall of the substrate located above the dispensing port of the dispensing component.

[0012] In one embodiment, the substrate coating apparatus includes a drive mechanism that is pulsatorically connected to the first transmission member and / or the second transmission member. The control of the substrate coating apparatus to coat a uniformly thick protective adhesive layer along the center position of the substrate sidewall specifically includes:

[0013] The driving mechanism drives the first transmission component and / or the second transmission component to rotate, thereby causing the sidewall of the substrate to move and displace, so as to apply the adhesive at the dispensing port to the sidewall of the substrate, and control the substrate coating device to coat a layer of protective adhesive of uniform thickness along the center position of the sidewall of the substrate.

[0014] In one embodiment, the sidewall of the substrate is displaced by rotating the first transmission member and / or the second transmission member, specifically including:

[0015] The first transmission member and / or the second transmission member apply a frictional force to the sidewall of the substrate, and the sidewall of the substrate undergoes displacement movement under the action of the frictional force.

[0016] In one embodiment, prior to the step of controlling the sidewall of the substrate to be positioned on the sidewalls of the first and second transmission members, with the center of the substrate sidewall located above the dispensing port of the dispensing member, the method further includes:

[0017] The first transmission member and the second transmission member are controlled to move in a direction that brings them closer to each other or away from each other, so that the width between the first transmission member and the second transmission member is adapted to the thickness of the substrate.

[0018] In one embodiment, the protective adhesive is a photocurable resin, and the curing method is photocuring.

[0019] In one embodiment, the substrate is a glass substrate or a ceramic substrate.

[0020] In one embodiment, prior to the step of applying a uniformly thick protective adhesive layer along the center position of the substrate sidewall using the substrate coating apparatus, the method further includes:

[0021] Based on the required thickness and width of the adhesive to be applied to the sidewall of the substrate, at least one of the following is adjusted: the distance between the sidewall of the substrate and the dispensing port of the substrate adhesive application device, the dispensing speed of the protective adhesive, and the displacement speed of the substrate.

[0022] Secondly, a substrate processing method is provided, including:

[0023] The substrate is pretreated using the substrate coating method described above, so that a layer of protective adhesive of uniform thickness is coated on the center position of the sidewall of the substrate; the substrate is then transported to the processing platform of the substrate processing device for processing.

[0024] The protective adhesive is removed using a debonding method.

[0025] In one embodiment, removing the protective adhesive using the adhesive removal method specifically includes: dissolving the protective adhesive using an adhesive remover.

[0026] Thirdly, a substrate coating apparatus is provided, wherein the substrate coating apparatus performs a coating process on the substrate according to the substrate coating method.

[0027] Compared with the existing adhesive coating methods, the substrate adhesive coating method, substrate processing method and substrate mechanism equipment in this application have at least the following advantages: by accurately and reliably coating the adhesive on the middle position of the sidewall of the substrate, the strength of the substrate can be improved, the handling can be facilitated, the problem of chipping and breaking during substrate processing can be prevented, and the adverse effects of the adhesive on the surface processing of the substrate can be prevented, thereby improving the processing yield and processing quality of the substrate. Attached Figure Description

[0028] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of a substrate coating apparatus according to one embodiment.

[0031] Figure 2 for Figure 1 A schematic diagram of the substrate after it has been coated with protective adhesive.

[0032] Figure 3 for Figure 2 A schematic diagram of the substrate and protective adhesive from another perspective.

[0033] Figure 4 for Figure 1 A schematic diagram of the substrate coating device.

[0034] Figure 5 for Figure 4 A cross-sectional view of a substrate coating apparatus.

[0035] Figure 6 This is a schematic diagram of a substrate coating apparatus according to another embodiment.

[0036] Figure 7 for Figure 4A schematic diagram of the substrate coating device.

[0037] Figure 8 This is a flowchart of a substrate coating method according to one embodiment.

[0038] Figure 9 A flowchart of a substrate coating method according to another embodiment.

[0039] Figure 10 This is a flowchart of a substrate processing method according to one embodiment.

[0040] Explanation of reference numerals in the attached figures:

[0041] 1. Substrate coating equipment; 10. Substrate coating device; 100. Adhesive conveying component; 110. Adhesive outlet; 120. Adhesive conveying hole; 200. First transmission component; 300. Second transmission component; 400. Drive mechanism; 410. Hollow motor; 420. Drive component; 430. Transmission roller; 20. Mounting body; 30. Bearing device; 40. Drive device; 50. Substrate; 60. Protective adhesive. Detailed Implementation

[0042] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0043] Glass substrates and ceramic substrates represent core technological advancements in advanced packaging. However, after cutting and processing brittle materials such as glass and ceramics, the edges are uneven. Applying protective adhesive can prevent edge chipping, cracking, or other safety risks.

[0044] To address the problem that existing coating devices and processes cannot adequately coat the edges of substrates used in advanced packaging, thus negatively impacting substrate yield and quality, the inventors conducted research and analysis. They discovered that when the substrate is used to fabricate glass-based IC package substrates, the IC package substrate, as the carrier connecting and transmitting signals between the bare chip and the printed circuit board, requires high-precision processing. If conventional methods are used to coat the glass edges, the protective adhesive will overflow onto the surface of the glass substrate (i.e., the front and back sides). If this cannot be completely removed, it will adversely affect the subsequent fabrication process and yield of the glass-based IC substrate.

[0045] Based on the above problems, the inventors have proposed the following embodiments of the substrate coating apparatus 10, substrate coating equipment 1, substrate coating method and substrate processing method to solve the above technical problems.

[0046] like Figures 1 to 5 As shown, in one embodiment, a substrate coating apparatus 10 is provided for coating a substrate 50 with adhesive. The substrate coating apparatus 10 includes a dispensing member 100, a first transmission member 200, a second transmission member 300, and a driving mechanism 400. The dispensing member 100 has a dispensing port 110 extending to its sidewall. The first transmission member 200 and the second transmission member 300 are rotatably sleeved on the sidewall of the dispensing member 100 and are located on opposite sides of the dispensing port 110. The driving mechanism 400 is driveably connected to the first transmission member 200 and / or the second transmission member 300. The driving mechanism 400 is configured to drive the first transmission member 200 and / or the second transmission member 300 to rotate. When the edge of the substrate 50 is placed between the first transmission member 200 and the second transmission member 300, and is in contact with both the first transmission member 200 and the second transmission member 300, the driving mechanism 400 drives the first transmission member 200 and / or the second transmission member 300 to rotate. The rotation of the first transmission member 200 and / or the second transmission member 300 causes the edge of the substrate 50 to move, so as to coat the protective adhesive 60 at the adhesive outlet 110 onto the sidewall of the substrate 50.

[0047] In the above embodiment, the substrate coating apparatus 10 is used by moving at least one of the substrate coating apparatus 10 and the substrate 50, such that the edge of the substrate 50 is positioned between the first transmission member 200 and the second transmission member 300, and is in contact with both the first transmission member 200 and the second transmission member 300. Protective adhesive 60 is delivered to the adhesive conveying member 100, and the protective adhesive 60 flows out from the adhesive outlet 110. The drive mechanism 400 is activated, and the drive mechanism 400 drives the edge of the substrate 50 to move through the first transmission member 200 and / or the second transmission member 300. At this time, the edge of the substrate 50 passes through the adhesive outlet 110 during the displacement movement, thereby uniformly coating the protective adhesive 60 at the adhesive outlet 110 onto the middle position of the sidewall of the substrate 50. Compared with the prior art, the substrate coating apparatus 10 in this application uses the adhesive outlet 110 to apply adhesive, which ensures that the protective adhesive 60 can be accurately and reliably applied to the middle position of the side wall of the substrate 50. This can not only improve the strength of the substrate 50 and facilitate handling, but also prevent the problem of chipping and breaking during the processing of the substrate 50, as well as prevent the protective adhesive 60 from having an adverse effect on the surface processing of the substrate 50, thereby improving the processing yield and processing quality of the substrate 50.

[0048] The dispensing component 100 can be configured as a dispensing tube, a rotating shaft with a dispensing channel, or other dispensing structure. It should be noted that the size of the dispensing port 110 can be flexibly adjusted according to actual usage requirements.

[0049] The first transmission member 200 and the second transmission member 300 can both be configured as a transmission sleeve, a transmission hollow column, or other transmission structures. In other embodiments, only one of the first transmission member 200 and the second transmission member 300 needs to be provided, as long as the drive mechanism 400 can drive the substrate 50 to move through the first transmission member 200 or the second transmission member 300, so as to apply the protective adhesive 60 at the dispensing port 110 to the center position of the side wall of the substrate 50.

[0050] It should be noted that the middle position of the sidewall of substrate 50 refers to the area located between the two edges of the sidewall of substrate 50 along the axial direction of substrate 50 (i.e., the normal direction of the front and back surfaces of substrate 50).

[0051] It should be noted that substrate 50 includes any substrate 50 that needs to be coated with protective adhesive 60; for example, substrate 50 is a glass substrate, or substrate 50 is a ceramic substrate. This application does not limit the type of substrate 50. This application describes the application of substrate coating apparatus 10 to coating brittle substrates as an example (that is, substrate 10 includes any substrate that needs to be coated with protective adhesive, and brittle substrates are just a typical application).

[0052] It should be noted that the adhesive coating thickness is set according to the requirements during use. This solution provides a method for achieving a specific adhesive coating thickness: specifically, according to the adhesive coating thickness requirements, at least one of the following is adjusted: the distance between the sidewall of the substrate 50 and the adhesive outlet 110, the dispensing speed of the protective adhesive 60, the viscosity of the protective adhesive 60, and the rotational speed (i.e., the moving speed of the substrate 50) of the first transmission member 200 and / or the second transmission member 300.

[0053] It should be noted that both the first transmission component 200 and the second transmission component 300 are rotatably sleeved on the side wall of the glue conveying component 100. Alternatively, both the first transmission component 200 and the second transmission component 300 can be directly rotatably sleeved on the side wall of the glue conveying component 100, or both the first transmission component 200 and the second transmission component 300 can be sleeved on the side wall of the glue conveying component 100 through a rotating component (such as a rotating bearing), or both the first transmission component 200 and the second transmission component 300 can be structures that can rotate around their own axis and are sleeved on the side wall of the glue conveying component 100.

[0054] It should be noted that the order of at least one step in the moving substrate coating apparatus 10 and the substrate 50, and the step of conveying the protective adhesive 60 to the adhesive conveying member 100, can be flexibly adjusted according to the needs of use. Specifically, in this embodiment, the protective adhesive 60 is conveyed to the adhesive conveying member 100 first, and then at least one of the moving substrate coating apparatus 10 and the substrate 50 is moved. In other embodiments, at least one of the moving substrate coating apparatus 10 and the substrate 50 may be moved first, and then the protective adhesive 60 may be conveyed to the adhesive conveying member 100; or, the moving substrate coating apparatus 10 and the substrate 50 and the conveying of the protective adhesive 60 may be performed simultaneously.

[0055] like Figure 4 and Figure 5 As shown, further, the width between the two end faces of the first transmission member 200 and the second transmission member 300 that are close to each other gradually decreases. Thus, the first transmission member 200 and the second transmission member 300 respectively contact the two opposite sides of the sidewall of the substrate 50, reducing the contact area between the first transmission member 200 and the substrate 50, and between the second transmission member 300 and the substrate 50. At the same time, both the first transmission member 200 and the second transmission member 300 can also prevent the protective adhesive 60 on the sidewall of the substrate 50 from being applied to the surface of the substrate 50, improving the reliability of the substrate coating apparatus 10. In addition, the two end faces of the first transmission member 200 and the second transmission member 300 that are close to each other support the substrate 50, thereby causing displacement movement of the edge of the substrate 50 by rotating the first transmission member 200 and / or the second transmission member 300, achieving adhesive coating on all or part of the edges of the substrate 50.

[0056] Wherein, the radial direction of the first transmission member 200 refers to the straight line direction along the diameter or radius of the first transmission member 200, that is, perpendicular to the axial direction of the first transmission member 200 (e.g., Figure 4 The direction indicated by B in the diagram. The axial direction of the first transmission component 200 refers to the direction of the axis of the first transmission component 200.

[0057] Optionally, the two end faces of the first transmission member 200 and the second transmission member 300 that are close to each other are both configured as annular inclined surfaces that slope towards each other. This facilitates the manufacture of the first transmission member 200 and the second transmission member 300.

[0058] Optionally, the first transmission member 200 and the second transmission member 300, together with the sidewall of the adhesive delivery member 100 located between them, form an annular groove. This reduces the volume at the bottom of the annular groove, decreasing the amount of protective adhesive 60 used and improving the practicality of the substrate coating apparatus 10.

[0059] In some implementations, the width between the two adjacent end faces of the first transmission member 200 and the second transmission member 300 along the radial direction of the first transmission member 200 and near the adhesive conveying member 100 can remain constant; or in other embodiments, the width between the two adjacent end faces of the first transmission member 200 and the second transmission member 300 along the radial direction of the first transmission member 200 and near the adhesive conveying member 100 changes non-linearly; or in other embodiments, the width between the two adjacent end faces of the first transmission member 200 and the second transmission member 300 along the radial direction of the first transmission member 200 and near the adhesive conveying member 100 can be any combination of linear change, non-linear change, and constant.

[0060] like Figure 4 and Figure 5 As shown, in some embodiments, the first transmission member 200 and the second transmission member 300 are symmetrically arranged on both sides of the adhesive outlet 110. Thus, when the edge of the substrate 50 is positioned between the first transmission member 200 and the second transmission member 300, the adhesive outlet 110 is aligned with the center position of the sidewall of the substrate 50, ensuring that the protective adhesive 60 at the adhesive outlet 110 can be accurately and stably coated onto the center position of the sidewall of the substrate 50, thereby improving the reliability of the substrate coating apparatus 10.

[0061] like Figure 4 and Figure 5 As shown, in some embodiments, both the first transmission member 200 and the second transmission member 300 are engaged with components that can move axially along the adhesive delivery member 100. Thus, by adjusting the width between the first transmission member 200 and the second transmission member 300, the substrate adhesive application apparatus 10 can be flexibly applied to the edges of substrates 50 of different thicknesses, improving the practicality of the substrate adhesive application apparatus 10.

[0062] It should be noted that the axial direction of the dispensing component 100 refers to the direction of the axis of the dispensing component 100 (e.g., ...). Figure 4 (The direction indicated by B in the middle).

[0063] Optionally, when the edge of the substrate 50 is positioned between the first transmission member 200 and the second transmission member 300, and is in contact with both the first transmission member 200 and the second transmission member 300, the substrate 50 and the glue outlet 110 are spaced apart, and the distance between the substrate 50 and the glue outlet 110 is the glue coating thickness of the sidewall of the substrate 50. Thus, when the two end faces of the first transmission member 200 and the second transmission member 300 that are close to each other are both set as annular inclined surfaces that slope towards each other, the contact position between the substrate 50 and the annular inclined surfaces can be adjusted by adjusting the width between the two end faces of the first transmission member 200 and the second transmission member 300 that are close to each other, thereby adjusting the distance between the substrate 50 and the glue outlet 110, thereby achieving the effect of adjusting the glue coating thickness of the sidewall of the substrate 50 and improving the practicality of the substrate coating apparatus 10.

[0064] In other embodiments, one of the first transmission member 200 and the second transmission member 300 may be configured to move and cooperate with the glue conveying member 100 along the axial direction of the glue conveying member 100, while the other remains relatively fixed to the glue conveying member 100.

[0065] like Figure 5 As shown, in some embodiments, one end of the adhesive feeding member 100 is provided with an adhesive feeding hole 120 extending axially along the adhesive feeding member 100. An adhesive outlet 110 is provided on the side wall of the adhesive feeding member 100 and communicates with the adhesive feeding hole 120. In this way, both the adhesive feeding hole 120 and the adhesive outlet 110 can be formed by drilling, improving the processing convenience of the substrate coating apparatus 10.

[0066] Specifically, in this embodiment, the glue outlet 110 is located at the top of the glue supply component 100. The shape of the glue supply component 100 can be flexibly adjusted according to actual usage needs. One end of the glue supply hole 120 is set as a blind end, and the other end extends to the fixed end of the glue supply component 100. In this way, while the glue supply component 100 is fixedly installed, the glue supply hole 120 can also be connected simultaneously, improving the convenience of assembling the substrate coating device 10.

[0067] The connection between the drive mechanism 400 and the first transmission member 200 and / or the second transmission member 300 means that the drive mechanism 400 can be connected to both the first transmission member 200 and the second transmission member 300, or it can be connected to one of the first transmission member 200 and the second transmission member 300. When the drive mechanism 400 is connected to one of the first transmission member 200 and the second transmission member 300, the other of the first transmission member 200 and the second transmission member 300 can rotate under the action of the frictional force applied by the substrate 50.

[0068] In one embodiment, the drive mechanism 400 includes at least one hollow motor 410.

[0069] Optionally, the drive mechanism 400 includes a hollow motor 410. The hollow motor 410 is sleeved on one end of the first transmission member 200 or the second transmission member 300 that is far from each other, and is correspondingly connected to the first transmission member 200 or the second transmission member 300 in a transmission connection. Thus, during adhesive application, the hollow motor 410 drives the first transmission member 200 or the second transmission member 300 to rotate, and the first transmission member 200 or the second transmission member 300 applies a frictional force to the edge of the substrate 50. Under the action of this frictional force, the edge of the substrate 50 passes through the adhesive outlet 110 (i.e., the annular groove), so that the protective adhesive 60 at the adhesive outlet 110 is applied to the center position of the sidewall of the substrate 50.

[0070] like Figure 4 and Figure 5As shown, optionally, the drive mechanism 400 includes two hollow motors 410. The two hollow motors 410 are respectively sleeved on the ends of the first transmission member 200 and the second transmission member 300 that are far apart from each other, and are correspondingly connected to the first transmission member 200 and the second transmission member 300 in a transmission connection. Thus, during adhesive application, the two hollow motors 410 respectively drive the first transmission member 200 and the second transmission member 300 to rotate. The first transmission member 200 and the second transmission member 300 respectively apply frictional force to both sides of the edge of the substrate 50. Under the action of the frictional force, the edge of the substrate 50 passes through the adhesive outlet 110 (i.e., the annular groove), so that the protective adhesive 60 at the adhesive outlet 110 is applied to the center position of the sidewall of the substrate 50.

[0071] Specifically, in this embodiment, one of the two hollow motors 410 is integrated with the first transmission member 200 and moves axially with the glue conveying member 100. The other of the two hollow motors 410 is integrated with the second transmission member 300 and moves axially with the glue conveying member 100.

[0072] like Figure 6 and Figure 7 As shown, in one embodiment, the driving mechanism 400 includes a driving member 420 and a transmission roller 430 pulverizedly connected to the driving member 420. The transmission roller 430 contacts and frictionally engages with the sidewalls of the first transmission member 200 and / or the second transmission member 300, thereby driving the first transmission member 200 and / or the second transmission member 300 to rotate. Thus, during adhesive application, the driving member 420 drives the transmission roller 430 to rotate, and the transmission roller 430 contacts both the first transmission member 200 and / or the second transmission member 300, applying a frictional force to the first transmission member 200 and / or the second transmission member 300. Under the action of the frictional force, the first transmission member 200 and / or the second transmission member 300 rotate, and the first transmission member 200 and / or the second transmission member 300 apply a frictional force to the edge of the substrate 50. Under the action of the frictional force, the edge of the substrate 50 passes through the adhesive outlet 110, so that the protective adhesive 60 at the adhesive outlet 110 is applied to the center position of the sidewall of the substrate 50.

[0073] The drive component 420 can be configured as a motor, cylinder or other drive structure.

[0074] Specifically, in this embodiment, the sidewalls of both the first transmission member 200 and the second transmission member 300 are cylindrical. The axis of the first transmission member 200 coincides with the axis of the second transmission member 300. The axis of the transmission roller 430 is parallel to the axis of the first transmission member 200. The transmission roller 430 maintains line contact with both the first transmission member 200 and the second transmission member 300.

[0075] In other embodiments, the drive mechanism 400 may also be configured as an electromagnetic drive structure, that is, the drive mechanism 400 applies electromagnetic force to the first transmission member 200 and / or the second transmission member 300, so that the first transmission member 200 and / or the second transmission member 300 can rotate relative to the glue conveying member 100.

[0076] In one embodiment, a substrate coating apparatus 1 is also provided, including a glue supply device and a substrate coating apparatus 10 as described in any of the above embodiments. The glue supply device is connected to the substrate coating apparatus 10 and is used to deliver protective glue 60 to the protective glue 60 channel.

[0077] In the above embodiment, the substrate coating equipment 1 is used by moving at least one of the substrate coating device 10 and the substrate 50, such that the edge of the substrate 50 is positioned between the first transmission member 200 and the second transmission member 300, and is in contact with both the first transmission member 200 and the second transmission member 300. The adhesive supply device delivers protective adhesive 60 to the adhesive conveying member 100, and the protective adhesive 60 flows out from the adhesive outlet 110. The drive mechanism 400 is activated, and the drive mechanism 400 drives the edge of the substrate 50 to move through the first transmission member 200 and / or the second transmission member 300. At this time, the edge of the substrate 50 passes through the adhesive outlet 110 during the displacement movement, thereby uniformly coating the protective adhesive 60 at the adhesive outlet 110 onto the middle position of the sidewall of the substrate 50. Compared with the prior art, the substrate coating equipment 1 in this application uses the adhesive outlet 110 to apply adhesive, which ensures that the protective adhesive 60 can be accurately and reliably coated on the middle position of the side wall of the substrate 50. This can not only improve the strength of the substrate 50 and facilitate handling, but also prevent the problem of chipping and breaking during the processing of the substrate 50, as well as prevent the protective adhesive 60 from having an adverse effect on the surface processing of the substrate 50, thereby improving the processing yield and processing quality of the substrate 50.

[0078] The adhesive supply device can be any type of device capable of stably supplying adhesive to the adhesive conveying component 100. The number of substrate coating devices 10 can be flexibly adjusted according to usage requirements. The adhesive supply device is connected to the adhesive delivery hole 120 of the substrate coating device 10.

[0079] like Figure 1 and Figure 6As shown, optionally, the substrate coating apparatus 1 further includes a mounting body 20, a support device 30 movably mounted on the mounting body 20, and a drive device 40 mounted on the mounting body 20. The substrate coating apparatus 10 is mounted on the drive device 40. Thus, during coating, firstly, the substrate 50 is placed on the support device 30, and the support device 30 is fixed integrally with the substrate 50. Then, the drive device 40 drives the substrate coating apparatus 10 to move, so that the edge of the substrate 50 is positioned between the first transmission member 200 and the second transmission member 300, and in contact with both the first transmission member 200 and the second transmission member 300. Finally, the adhesive supply device delivers protective adhesive 60 to the adhesive conveying member 100, and the protective adhesive 60 flows out from the adhesive outlet 110. The drive mechanism 400 is then activated, and the drive mechanism 400 moves the substrate 50 through the first transmission member 200 and / or the second transmission member 300, so as to coat the protective adhesive 60 at the adhesive outlet 110 onto the center position of the sidewall of the substrate 50.

[0080] The carrier device 30 can be configured as any of the existing structures used to support the substrate 50 when applying adhesive to the substrate 50. The drive device 40 can be configured as any of the existing structures used to drive the substrate adhesive application device 10 to move when applying adhesive to the substrate 50.

[0081] The instruction manual indicates that, in actual use, the configuration and working mode of the substrate coating equipment 1 can be flexibly adjusted according to the configuration of the carrier device 30 and / or the drive device 40, as well as the size and shape of the substrate 50 that needs to be coated. By driving the edge of the substrate 50 through the glue outlet 110, the protective glue 60 at the glue outlet 110 is applied to the center position of the side wall of the substrate 50.

[0082] Specifically, in this embodiment, the driving device 40 can be connected to the substrate coating device 10 by snap-fit, screw-fit, or other means, and is used to drive the substrate coating device 10 to move vertically. The axes of the first transmission member 200 and the second transmission member 300 in the substrate coating device 10 are both parallel to the horizontal plane. The supporting device 30 can rotate around its own axis while also moving and engaging with the mounting body 20 along a first direction. The first direction is perpendicular to both the vertical direction and the axis of the first transmission member 200. Thus, when the substrate 50 is circular, under the action of the frictional force applied by the substrate coating device 10, the supporting device 30 and the substrate 50 rotate together to apply the protective adhesive 60 at the dispensing port 110 to the center position of the sidewall of the substrate 50. When the substrate 50 is square, under the action of the frictional force applied by the substrate coating device 10, the supporting device 30 and the substrate 50 translate together along the first direction to apply the protective adhesive 60 at the dispensing port 110 to the center position of the sidewall of the substrate 50. When it is necessary to apply adhesive to different sides of the square substrate 50, the drive support device 30 drives the substrate 50 to rotate so that the side of the substrate 50 to be coated corresponds to the substrate coating device 10. Then, the above steps are repeated to achieve coating of the entire sidewall of the substrate 50.

[0083] like Figure 8 and Figure 9 As shown, in one embodiment, a substrate coating method is also provided, applied to a substrate coating apparatus 10. The substrate coating method includes at least the following steps:

[0084] S100. Place the substrate 50 at the adhesive coating station.

[0085] It should be noted that the adhesive application station refers to the position of the substrate 50 when the substrate adhesive application device 10 applies adhesive to the center position of the side wall of the substrate 50.

[0086] In this specific embodiment, the substrate 50 is a glass substrate or a ceramic substrate.

[0087] Optionally, the substrate coating apparatus 10 includes a glue conveying component 100 with a glue outlet 110, and a first transmission component 200 and a second transmission component 300 located on both sides of the glue outlet 110 are sleeved on the glue conveying component 100.

[0088] Placing the substrate 50 at the adhesive coating station specifically includes:

[0089] S110, the sidewall of the control substrate 50 is placed on the sidewall of the first transmission member 200 and the second transmission member 300, and the center position of the sidewall of the substrate 50 is located above the glue outlet 110 of the glue supply member 100. In this way, the sidewalls of the first transmission member 200 and the second transmission member 300 support the substrate 50, thereby driving the sidewall of the substrate 50 to move by rotating the first transmission member 200 and / or the second transmission member 300, so as to uniformly coat the center position of all or part of the sidewalls of the substrate 50 with protective glue 60.

[0090] S200: The substrate coating apparatus 10 applies a uniformly thick layer of protective adhesive 60 along the center of the sidewall of the substrate 50. This ensures that the protective adhesive 60 is accurately and reliably applied to the center of the sidewall of the substrate 50, improving the strength of the substrate 50, facilitating handling, preventing chipping and breakage during substrate processing, and preventing adverse effects of the adhesive on the surface finish of the substrate 50, thereby improving the processing yield and quality of the substrate 50.

[0091] It should be noted that the substrate coating method in this application can be applied to the substrate coating apparatus 10 in any of the above embodiments, including but not limited to.

[0092] Optionally, the substrate coating apparatus 10 includes a drive mechanism 400 that is drively connected to the first drive member 200 and / or the second drive member 300.

[0093] The substrate coating apparatus 10 applies a layer of protective adhesive 60 of uniform thickness along the center position of the sidewall of the substrate 50, specifically including:

[0094] S210, the drive mechanism 400 drives the first transmission member 200 and / or the second transmission member 300 to rotate. The rotation of the first transmission member 200 and / or the second transmission member 300 causes displacement of the sidewall of the substrate 50, thereby applying adhesive from the dispensing port 110 to the sidewall of the substrate 50. The substrate coating device 10 is controlled to apply a uniformly thick layer of protective adhesive 60 along the center position of the sidewall of the substrate 50. Thus, the substrate coating device 10 simultaneously has coating and driving functions, eliminating the need for a separate drive structure to drive the substrate 50 to move, thereby reducing coating costs.

[0095] Optionally, the sidewall of the substrate 50 is displaced by rotating the first transmission member 200 and / or the second transmission member 300, specifically including:

[0096] The first transmission member 200 and / or the second transmission member 300 apply a frictional force to the sidewall of the substrate 50, causing the sidewall of the substrate 50 to move under the action of the frictional force. In this way, the first transmission member 200 and / or the second transmission member 300 and the sidewall of the substrate 50 are connected and disconnected through contact and separation, thereby improving the convenience of the substrate coating method.

[0097] S300: The protective adhesive 60 is cured at the center of the sidewall of the substrate 50 by a curing process. In this way, the protective adhesive 60 is fixed to the substrate 50 as a whole, so that the protective adhesive 60 can stably and reliably protect the substrate 50.

[0098] Optionally, the protective adhesive 60 is a light-curing resin, and the curing method is light curing.

[0099] It should be noted that the protective adhesive 60 is a light-curing resin for glass fixing, which has excellent adhesion strength and can be cured by light curing.

[0100] It should be noted that this solution preferably uses photocuring because it is efficient, convenient, and does not damage the substrate 50 itself. In other embodiments, the curing method may also be baking, etc.

[0101] like Figure 9 As shown, in some embodiments, prior to the step of placing the sidewall of the control substrate 50 on the sidewall of the first transmission member 200 and the sidewall of the second transmission member 300, and the center position of the sidewall of the substrate 50 being located above the dispensing port 110 of the dispensing member 100, the method further includes:

[0102] S400: Control the first transmission member 200 and the second transmission member 300 to move towards or away from each other, so that the width between the first transmission member 200 and the second transmission member 300 is adapted to the thickness of the substrate 50. Thus, by adjusting the width between the first transmission member 200 and the second transmission member 300, the substrate coating apparatus 10 can be flexibly applied to coating the sidewalls of substrates 50 with different thicknesses, improving the applicability of the substrate coating method.

[0103] like Figure 9 As shown, in some embodiments, before the step of applying a uniformly thick protective adhesive 60 along the center position of the sidewall of the substrate 50 using the substrate coating apparatus 10, the method further includes:

[0104] S500: Based on the required thickness and width of adhesive to be applied to the sidewall of the substrate 50, adjust at least one of the following: the distance between the sidewall of the substrate 50 and the adhesive outlet 110 of the substrate coating apparatus 10; the dispensing speed of the protective adhesive 60; and the displacement speed of the substrate 50. In this way, the substrate coating apparatus 10 can flexibly and precisely control the thickness and width of the protective adhesive 60, improving the practicality of the substrate coating method.

[0105] Optionally, when it is necessary to increase the thickness and width of the adhesive coating on the sidewall of the substrate 50, the distance between the sidewall of the substrate 50 and the adhesive outlet 110 of the substrate coating device 10 can be increased accordingly; when it is necessary to decrease the thickness and width of the adhesive coating on the sidewall of the substrate 50, the distance between the sidewall of the substrate 50 and the adhesive outlet 110 of the substrate coating device 10 can be decreased accordingly.

[0106] Optionally, when it is necessary to increase the thickness and width of the adhesive coating on the sidewall of the substrate 50, the dispensing speed of the protective adhesive 60 can be increased accordingly; when it is necessary to decrease the thickness and width of the adhesive coating on the sidewall of the substrate 50, the dispensing speed of the protective adhesive 60 can be decreased accordingly.

[0107] Optionally, when it is necessary to increase the thickness and width of the adhesive coating on the sidewall of the substrate 50, the displacement speed of the substrate 50 can be adjusted to be reduced accordingly; when it is necessary to decrease the thickness and width of the adhesive coating on the sidewall of the substrate 50, the displacement speed of the substrate 50 can be adjusted to be increased accordingly.

[0108] like Figure 10 As shown, in one embodiment, a substrate processing method is also provided, comprising at least the following steps:

[0109] S10. The substrate 50 is pretreated using the substrate coating method in any of the above embodiments, so that a layer of protective adhesive 60 of uniform thickness is coated on the center position of the sidewall of the substrate 50. In this way, the protective adhesive 60 is accurately and reliably coated on the center position of the sidewall of the substrate 50, ensuring that the protective adhesive 60 is not coated on the surface of the substrate 50 and thus does not have an adverse effect on the surface processing of the substrate 50, thereby improving the yield of substrate 50 processing.

[0110] S20. The substrate is transported to the processing platform of the substrate processing apparatus for processing. In this way, the protective adhesive 60 can improve the strength of the substrate 50, prevent the substrate 50 from chipping or breaking during processing, and improve the yield of substrate 50 processing.

[0111] It should be noted that the substrate processing apparatus can be configured as any of the existing apparatuses for substrate processing.

[0112] S30. Remove the protective adhesive 60 using a debonding method. In this way, the protective adhesive 60 is separated from the substrate 50, so that the substrate 50 can be used for subsequent packaging.

[0113] Optionally, the protective adhesive 60 is removed using a debonding method, specifically including:

[0114] The protective adhesive 60 is dissolved using a descaling agent. This method is efficient and convenient, and does not damage the substrate 50 itself, thus improving the yield of substrate 50 processing.

[0115] In other embodiments, the protective adhesive 60 on the sidewall of the substrate 50 can also be removed by other methods in the prior art, which will not be described in detail here.

[0116] In one embodiment, a substrate coating apparatus 1 is also provided, which coats the substrate 50 with adhesive according to the substrate coating method in any of the above embodiments.

[0117] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0118] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0119] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0120] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0121] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0122] It should also be understood that, in interpreting the connection or positional relationships of components, although not explicitly described, connection and positional relationships are interpreted to include a range of error, which should be within the acceptable deviation range of a specific value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0123] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0124] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A substrate coating method, applied to a substrate coating apparatus, characterized in that, The substrate coating method includes: Place the substrate at the adhesive coating station; The substrate coating device is controlled to coat a layer of protective adhesive of uniform thickness along the center position of the sidewall of the substrate; The protective adhesive is cured at the center of the sidewall of the substrate by a curing process.

2. The substrate coating method according to claim 1, characterized in that, The substrate coating apparatus includes a glue conveying component with a glue outlet, and a first transmission component and a second transmission component are sleeved on both sides of the glue outlet; placing the substrate at the coating station specifically includes: The sidewall of the substrate is positioned on the sidewalls of the first and second transmission components, with the center of the sidewall of the substrate located above the dispensing port of the dispensing component.

3. The substrate coating method according to claim 2, characterized in that, The substrate coating apparatus includes a drive mechanism that is drively connected to the first transmission member and / or the second transmission member. The control of the substrate coating apparatus to coat a uniformly thick protective adhesive layer along the center position of the substrate sidewall specifically includes: The driving mechanism drives the first transmission component and / or the second transmission component to rotate, thereby causing the sidewall of the substrate to move and displace, so as to apply the adhesive at the dispensing port to the sidewall of the substrate, and control the substrate coating device to coat a layer of protective adhesive of uniform thickness along the center position of the sidewall of the substrate.

4. The substrate coating method according to claim 3, characterized in that, The displacement of the sidewall of the substrate is caused by rotating the first transmission member and / or the second transmission member, specifically including: The first transmission member and / or the second transmission member apply a frictional force to the sidewall of the substrate, and the sidewall of the substrate undergoes displacement movement under the action of the frictional force.

5. The substrate coating method according to claim 2, characterized in that, Before the step of controlling the sidewall of the substrate to be placed on the sidewalls of the first and second transmission members, with the center of the substrate sidewall located above the dispensing port of the dispensing member, the method further includes: The first transmission member and the second transmission member are controlled to move in a direction that brings them closer to each other or away from each other, so that the width between the first transmission member and the second transmission member is adapted to the thickness of the substrate.

6. The substrate coating method according to claim 1, characterized in that, The protective adhesive is a photocurable resin, and the curing method is photocuring.

7. The substrate coating method according to claim 1, characterized in that, The substrate is a glass substrate or a ceramic substrate.

8. The substrate coating method according to any one of claims 1-7, characterized in that, Before the step of applying a uniformly thick protective adhesive layer along the center position of the sidewall of the substrate using a controlled substrate coating device, the method further includes: Based on the required thickness and width of the adhesive to be applied to the sidewall of the substrate, at least one of the following is adjusted: the distance between the sidewall of the substrate and the dispensing port of the substrate adhesive application device, the dispensing speed of the protective adhesive, and the displacement speed of the substrate.

9. A substrate processing method, characterized in that, include: The substrate is pretreated using the substrate coating method as described in any one of claims 1 to 8, so that a protective adhesive of uniform thickness is coated at the center of the sidewall of the substrate. The substrate is transported to the processing platform of the substrate processing apparatus for processing. The protective adhesive is removed using a debonding method.

10. The substrate processing method as described in claim 9, characterized in that, The method of removing the protective adhesive specifically includes: using an adhesive remover to dissolve the protective adhesive.

11. A substrate coating apparatus, characterized in that, The substrate coating equipment performs a coating process on the substrate according to any one of claims 1 to 8.

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