Magnesium alloy electronic part die casting release agent

Abstract

The present application relates to a magnesium alloy electronic part die-casting release agent, containing the following weight percentage of components: base oil 1~10%; special additives 2~10%; lubricant 1~10%; surfactant 2~5%; silicone 10~50%; preservative 0~1%; water balance; excellent demoulding performance. The formula selects a water-based polymeric resin dispersant with excellent heat preservation performance, under the condition of heating at 400 degrees, the release agent is diluted by 60 times and sprayed on the SPC steel plate, the adsorption amount is greater than or equal to 1.0 mg / cm 2 , the effective ingredient content of TGA thermogravimetric experiment is greater than or equal to 50%. It has good lubricating performance, low residual amount, and outstanding ductility. It is safe and environmentally friendly. No toxic and harmful substances such as heavy metals and aromatic hydrocarbons are used, the acute oral toxicity LD50 of the product is greater than or equal to 5000 mg / kg, the acute inhalation toxicity LC50 is greater than or equal to 5000 mg / m 3 , and there is no respiratory mucosa irritation.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of release agents for metal die casting, specifically to a high-efficiency, low-residue water-based release agent for the die casting process of ultra-thin magnesium alloy electronic components. Background Technology

[0002] Currently, ultra-light, ultra-small, and ultra-thin IT electronic products such as mobile phones and laptops on the market use magnesium alloy casings. Magnesium alloy casings have outstanding advantages such as low density, high strength, good heat dissipation and shielding, and recyclability. However, due to the relatively lagging research and development of release agents—an indispensable additive in molding technology—domestic magnesium alloy casing foundries still generally use ordinary release agents, which seriously restricts the further development of ultra-thin magnesium alloy casing technology. Currently, some domestic manufacturers are researching and producing release agents for die casting magnesium alloy electronic components, but due to technological backwardness and other reasons, they generally suffer from poor release properties (adsorption capacity less than 0.5mg / 100cm³). 2 Poor lubricity (coefficient of friction greater than 0.25), poor fluidity of the solution (100cm). 2 The steel plate has an elongated area of ​​less than 28.2 cm². 2 Problems such as these lead to difficulties in demolding magnesium alloy electronic components, slow molding, blackening of the surface, and unevenness.

[0003] Therefore, it is necessary to develop a special release agent for die casting of ultra-thin magnesium alloy electronic components with excellent lubrication, release, and heat resistance properties. Summary of the Invention

[0004] The purpose of this invention is to provide a magnesium alloy electronic component die-casting release agent with excellent lubrication, release, and heat resistance properties.

[0005] To achieve the above objectives, embodiments of the present invention have designed a magnesium alloy electronic component die-casting release agent containing the following components by weight percentage: Base oil 1~10%; Special additives 2-10%; Lubricant 1~10%; Surfactant 2~5%; Organosilicon 10~50%; Preservatives 0-1%; Water balance.

[0006] Furthermore, in the magnesium alloy electronic component die-casting release agent of the present invention, the base oil is a naphthenic mineral oil or a paraffinic mineral oil or a mixture of naphthenic mineral oil and paraffinic mineral oil.

[0007] Furthermore, in the magnesium alloy electronic component die-casting release agent of the present invention, the special additive is selected from one or a mixture of several of alkyl dimethyl ammonium chloride, sodium phosphate, hydroxymethyl polystyrene resin, sodium hydroxide, and sodium alkylbenzene sulfonate.

[0008] Furthermore, in the magnesium alloy electronic component die-casting release agent of the present invention, the lubricant is selected from one or more of glyceryl monostearate, tetrameric castor oil ester, and propylene glycol diacetate.

[0009] Furthermore, in the magnesium alloy electronic component die-casting release agent of the present invention, the surfactant is selected from one or a mixture of several of the following: polyoxyethylene polyoxypropylene block polyether, secondary alkanol polyether, fatty alcohol alkoxy compound, fatty alcohol polyoxyethylene ether sodium sulfate, sodium dodecylbenzene sulfonate, dioctyl sodium sulfosuccinate, and alkyl phosphate.

[0010] Furthermore, in the magnesium alloy electronic component die-casting release agent of the present invention, the organosilicon is selected from one or a mixture of several of polydimethylsiloxane emulsion, octamethylcyclotetrasiloxane emulsion, dimethyltetraphenyldisiloxane emulsion, organosilicon-modified styrene-acrylic emulsion, and cationic styrene-acrylic emulsion.

[0011] Furthermore, in the magnesium alloy electronic component die-casting release agent of the present invention, the corrosion inhibitor is selected from one or a mixture of several heterocyclic mixtures such as benzothiazolinone and 1,2-benzoisothiazolin-3-one.

[0012] Furthermore, in the magnesium alloy electronic component die-casting release agent of the present invention, the weight percentage of the octamethylcyclotetrasiloxane emulsion is 30%.

[0013] Furthermore, in the magnesium alloy electronic component die-casting release agent of the present invention, the weight percentage of the organosilicon-modified styrene-acrylic emulsion is 20%.

[0014] Furthermore, in the magnesium alloy electronic component die-casting release agent of the present invention, the weight percentage of the tetrameric castor oil ester is 3%; and the weight percentage of the glyceryl monostearate is 2%.

[0015] Compared with the prior art, the present invention provides a magnesium alloy electronic component die-casting release agent containing the following components by weight percentage: base oil 1-10%; special additives 2-10%; lubricant 1-10%; surfactant 2-5%; organosilicon 10-50%; corrosion inhibitor 0-1%; and water as the balance. The beneficial effects of the present invention are: (1) Excellent release performance. The formula uses a water-based polymeric resin dispersant with excellent thermal insulation properties. Under high temperature heating conditions of 400 degrees Celsius, the release agent is diluted 60 times and sprayed onto the SPC steel plate. The adsorption amount is greater than or equal to 1.0 mg / cm³.2 The effective component content in the TGA thermogravimetric assay is greater than or equal to 50%.

[0016] (2) Good lubrication performance and low residue. The formula uses a combination of self-emulsifying ester and organic alcohol ether. Under high temperature conditions of 150 degrees, the coefficient of friction is less than 0.158 and the residue on the workpiece surface is less than 3%.

[0017] (3) Excellent ductility. The formulation uses modified silicone emulsions with long carbon chains (C8-C10) and benzene ring structures, with a ductility of 100cm. 2 The steel plate has an elongated area of ​​40.3 cm² or greater. 2 .

[0018] (4) Safety and environmental protection. No heavy metals, aromatic hydrocarbons, or other toxic or harmful substances are used. The product's acute oral toxicity LD50 is greater than or equal to 5000 mg / kg, and its acute inhalation toxicity LC50 is greater than or equal to 5000 mg / m³. 3 No respiratory mucosal irritation. Detailed Implementation

[0021] The first embodiment of the present invention relates to a die-casting release agent for magnesium alloy electronic components, wherein the following components by weight percentage are mixed and stirred at room temperature for 30 minutes, and the product is obtained after stirring until homogeneous: Octamethylcyclotetrasiloxane emulsion: 30% Organosilicon-modified styrene-acrylic emulsion: 20% Tetrameric ricinoleate: 3% Glyceryl monostearate: 2% Sodium dodecylbenzenesulfonate: 4% Sodium fatty alcohol polyoxyethylene ether sulfate: 2% Sodium phosphate: 3% Hydroxymethyl polystyrene resin: 3% Benzothiazolinone: 0.5% Pure water: 32.5%.

[0022] The above product was diluted 60 times and sprayed onto an SPC steel plate. The adsorption capacity was tested at 400 degrees Celsius: 1.2 mg / cm³. 2 The coefficient of friction is 0.145, 100cm 2 The steel plate has an elongated area of ​​42.1 cm². 2 The surface residue of the workpiece is 2.1%, which meets the requirements of the die-casting process for ultra-thin magnesium alloy electronic components.

[0023] The second embodiment of the present invention relates to a release agent for die casting of magnesium alloy electronic components. The organosilicon-modified styrene-acrylic emulsion in Example 1 is replaced with an equal amount of polydimethylsiloxane emulsion, while the remaining components and preparation method remain unchanged. The resulting product, after testing, showed performance comparable to that of Example 1; under 400°C conditions, the adsorption capacity was 1.2 mg / cm³. 2 The coefficient of friction is 0.145, 100cm 2 The steel plate has an elongated area of ​​42.1 cm². 2 The surface residue of the workpiece is 2.1%, which meets the requirements of the die-casting process for ultra-thin magnesium alloy electronic components.

[0024] The third embodiment of the present invention relates to a release agent for die casting of magnesium alloy electronic components. The special additives in Example 1 are replaced with a mixture of 1% alkyl dimethyl ammonium chloride, 1% sodium phosphate, and 1% hydroxymethyl polystyrene resin, while the remaining components and preparation method remain unchanged. The resulting product, after testing, showed performance comparable to that of Example 1; under 400°C conditions, the adsorption capacity was 1.2 mg / cm³. 2 The coefficient of friction is 0.143, 100cm 2 The steel plate has an extended area of ​​42.2 cm². 2 The surface residue of the workpiece is 2.1%, which meets the requirements of the die-casting process for ultra-thin magnesium alloy electronic components.

[0025] The third embodiment of the present invention relates to a release agent for die casting of magnesium alloy electronic components, wherein the lubricant used in Example 1 is a mixture of 1% glyceryl monostearate and 1% tetrameric castor oil ester. The remaining components and preparation method remain unchanged. The resulting product, after testing, showed performance comparable to that of Example 1; under 400°C conditions, the adsorption capacity was 1.2 mg / cm³. 2 The coefficient of friction is 0.144, 100cm 2 The steel plate has an extended area of ​​42.3 cm². 2 The surface residue of the workpiece is 2.2%, which meets the requirements of the die-casting process for ultra-thin magnesium alloy electronic components.

[0026] The third embodiment of this invention relates to a release agent for die casting of magnesium alloy electronic components. The surfactant used in Example 1 is a mixture of 1% polyoxyethylene polyoxypropylene block polyether, 1% secondary alkyl alcohol polyether, 1% fatty alcohol alkoxy compound, and 1% sodium fatty alcohol polyoxyethylene ether sulfate, with the remaining components and preparation method unchanged. The resulting product, after testing, showed performance comparable to that of Example 1; under 400°C conditions, the adsorption capacity was 1.1 mg / cm³. 2 The coefficient of friction is 0.141, 100cm 2 The steel plate has an elongated area of ​​42.1 cm². 2 The surface residue of the workpiece is 2.0%, which meets the requirements of the die-casting process for ultra-thin magnesium alloy electronic components.

[0027] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of the present invention.

Claims

1. A release agent for die casting of magnesium alloy electronic components, characterized in that, It contains the following components by weight percentage: Base oil 1~10%; Special additives 2-10%; Lubricant 1~10%; Surfactant 2~5%; Organosilicon 10~50%; Preservatives 0-1%; Water balance.

2. The magnesium alloy electronic component die-casting release agent according to claim 1, characterized in that, The base oil is a naphthenic mineral oil, a paraffinic mineral oil, or a mixture of naphthenic and paraffinic mineral oils.

3. The magnesium alloy electronic component die-casting release agent according to claim 1, characterized in that, The special additive is selected from one or a mixture of several of alkyl dimethyl ammonium chloride, sodium phosphate, hydroxymethyl polystyrene resin, sodium hydroxide, and sodium alkylbenzene sulfonate.

4. The magnesium alloy electronic component die-casting release agent according to claim 1, characterized in that, The lubricant is selected from one or more of glyceryl monostearate, tetrameric castor oil ester, and propylene glycol diacetate.

5. The magnesium alloy electronic component die-casting release agent according to claim 1, characterized in that, The surfactant is selected from one or a mixture of several of the following: polyoxyethylene polyoxypropylene block polyether, secondary alkanol polyether, fatty alcohol alkoxy compounds, sodium fatty alcohol polyoxyethylene ether sulfate, sodium dodecylbenzene sulfonate, dioctyl sodium sulfosuccinate, and alkyl phosphates.

6. The magnesium alloy electronic component die-casting release agent according to claim 1, characterized in that, The organosilicon is selected from one or a mixture of several of the following: polydimethylsiloxane emulsion, octamethylcyclotetrasiloxane emulsion, dimethyltetraphenyldisiloxane emulsion, organosilicon-modified styrene-acrylic emulsion, and cationic styrene-acrylic emulsion.

7. The magnesium alloy electronic component die-casting release agent according to claim 1, characterized in that, The preservative is selected from one or more of the following heterocyclic mixtures: benzothiazolinone, 1,2-benzisothiazolin-3-one.

8. The magnesium alloy electronic component die-casting release agent according to claim 6, characterized in that, The weight percentage of the octamethylcyclotetrasiloxane emulsion is 30%.

9. The magnesium alloy electronic component die-casting release agent according to claim 6, characterized in that, The organosilicon-modified styrene-acrylic emulsion has a weight percentage of 20%.

10. The magnesium alloy electronic component die-casting release agent according to claim 4, characterized in that, The weight percentage of the tetrameric ricinoleate is 3%; the weight percentage of the glyceryl monostearate is 2%.