Cutting height adjustment method, system, device, medium, and computer program product

Abstract

The application belongs to the technical field of laser processing, and more particularly relates to a cutting height adjusting method, system, device, medium and computer program product. A capacitive sensor and a photoelectric displacement sensor are arranged on a cutting head, and both can detect the distance between the cutting head and the plate machining surface. The method first acquires the moving path of the cutting head, judges the region where the cutting head is located, and if it is an internal region of the plate, the actual distance detected by the capacitive sensor is used to adjust the height of the cutting head; if it is an edge region of the plate, the detection values of the two sensors are weighted and averaged to obtain the final actual distance, and the cutting height is adjusted accordingly. The application combines the detection advantages of the two types of sensors, can improve the accuracy of distance detection, and prevent the cutting head from colliding with the plate.

Description

Technical Field

[0001] This application belongs to the field of laser processing technology, and more specifically, relates to a cutting height adjustment method, system, equipment, medium and computer program product. Background Technology

[0002] In laser cutting technology, to ensure cutting quality and efficiency, a constant cutting height needs to be maintained between the cutting head and the workpiece surface. This usually relies on a capacitive sensor mounted on the cutting head for distance measurement and real-time feedback.

[0003] However, the measurement principle of a capacitive sensor is based on the virtual capacitance formed between the sensor probe and the conductive plate below. Inside the plate, the electric field is uniformly distributed, making the distance measurement by the capacitive sensor accurate and reliable. However, when the capacitive sensor moves with the cutting head to the edge of the plate, the inherent electric field edge effect can cause significant deviations in the measurement value, making the cutting head prone to collision with the plate and resulting in damage to the cutting head. Summary of the Invention

[0004] This application provides a cutting height adjustment method, system, device, medium, and computer program product, which can improve the accuracy of distance detection and prevent the cutting head from colliding with the plate.

[0005] The technical solution adopted in this application embodiment is: providing a cutting height adjustment method, wherein a capacitive sensor and a photoelectric displacement sensor are provided on the cutting head, and the capacitive sensor and the photoelectric displacement sensor are both used to measure the distance between the cutting head and the side of the plate close to the cutting head. The method includes the following steps:

[0006] Obtain the movement path of the cutting head; Based on the movement path of the cutting head, determine whether the cutting head is currently located in the inner region or the edge region of the plate; If the cutting head is currently located in the inner region of the plate, the first current actual distance H1 measured by the capacitive sensor is obtained, and the cutting head is adjusted to the target height according to the first current actual distance H1; If the cutting head is currently located in the edge region of the plate, the second current actual distance H2 measured by the capacitive sensor and the third current actual distance H3 measured by the photoelectric displacement sensor are obtained. The second current actual distance H2 and the third current actual distance H3 are weighted and averaged to obtain the fourth current actual distance H4. The cutting head is then adjusted to the target height according to the fourth current actual distance H4.

[0007] Optionally, if the cutting head is currently located in the edge region of the plate, the following steps are taken: First, if the cutting head is located in the edge region of the plate, then the second current actual distance H2 measured by the capacitive sensor and the third current actual distance H3 measured by the photoelectric displacement sensor are obtained. Second, the second current actual distance H2 and the third current actual distance H3 are weighted and averaged to obtain a fourth current actual distance H4. Third, the cutting head is adjusted to the target height based on the fourth current actual distance H4. Calculate the difference ΔH between the second current actual distance H2 and the third current actual distance H3; Determine whether the difference ΔH exceeds the error threshold; Based on whether the difference △H exceeds the error threshold, adjust the weight of the second current actual distance H2 or the third current actual distance H3; The fourth current actual distance H4 is calculated based on the adjusted weighted average. Adjust the cutting head to the target height based on the fourth current actual distance H4.

[0008] Optionally, adjusting the weight of the second current actual distance H2 or the third current actual distance H3 based on whether the difference ΔH exceeds the error threshold includes the following steps: If the difference ΔH does not exceed the error threshold, then the weight of the second current actual distance H2 is made greater than the weight of the third current actual distance H3; If the difference ΔH exceeds the error threshold, then the weight of the second current actual distance H2 is made less than or equal to the weight of the third current actual distance H3.

[0009] Optionally, the inner region is a region located at a distance greater than or equal to R from the edge of the material, where R is the radius of the side of the cutting head closest to the material.

[0010] Optionally, the inner region is a region located at a distance greater than or equal to 1.2R from the edge of the plate.

[0011] This application embodiment also provides a cutting height adjustment system, the system being used to implement the cutting height adjustment method described above, the system comprising: The path acquisition module is used to acquire the movement path of the cutting head; The path determination module is used to determine whether the cutting head is currently located in the inner region or the edge region of the plate based on the movement path of the cutting head; The first height adjustment module is used to acquire the first current actual distance H1 measured by the capacitive sensor when the cutting head is currently located in the inner region of the plate, and adjust the cutting head to the target height according to the first current actual distance H1; The second height adjustment module is used to obtain the second current actual distance H2 measured by the capacitive sensor and the third current actual distance H3 measured by the photoelectric displacement sensor when the cutting head is currently located in the edge area of ​​the plate, calculate the weighted average of the second current actual distance H2 and the third current actual distance H3 to obtain the fourth current actual distance H4, and adjust the cutting head to the target height according to the fourth current actual distance H4.

[0012] Optionally, the second height adjustment module includes: The calculation unit is used to calculate the difference △H between the second current actual distance H2 and the third current actual distance H3; The judgment unit is used to determine whether the difference ΔH exceeds the error threshold; A weight adjustment unit is used to adjust the weight of the second current actual distance H2 or the third current actual distance H3 according to the judgment result of the judgment unit. The calculation unit is used to calculate the fourth current actual distance H4 based on the adjusted weighted average. A height adjustment unit is used to adjust the cutting head to the target height according to the fourth current actual distance H4.

[0013] This application embodiment also provides a height control device, including a processor and a memory; the memory is used to store a computer program, the computer program including program instructions; the processor is used to call the computer program to implement the cutting height adjustment method described above.

[0014] This application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of the cutting height adjustment method described above.

[0015] This application also provides a computer program product, which stores computer instructions. When the computer instructions are executed by a processor, they implement the steps of the cutting height adjustment method described above.

[0016] The beneficial effects of the cutting height adjustment method, system, device, medium, and computer program products provided in this application are as follows: The cutting height adjustment method of this application adopts a differentiated ranging strategy by region. In the internal region of the sheet metal, a capacitive sensor is used directly to complete the ranging, eliminating the need for complex fusion calculations. This reduces the computational load on the control system while ensuring detection accuracy, effectively improving the height adjustment response speed and adapting to the rapid cutting needs of large sheet metal areas. Addressing the problem of excessive ranging errors caused by electric field leakage distortion at the edge of the sheet metal using pure capacitive sensors, this invention employs dual-sensor weighted fusion ranging in the edge region, significantly improving the accuracy of height adjustment in the edge region, effectively improving edge cutting quality, reducing processing scrap rate, and solving the long-standing industry problem of inaccurate ranging in the edge region.

[0017] The cutting height adjustment, device, medium, and computer program product of this application embodiment, since including the cutting height adjustment method in any of the above embodiments, have the beneficial effects brought by the cutting height adjustment method in any of the above embodiments, which will not be repeated here. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Fig. 1 A flowchart illustrating the cutting height adjustment method provided in this application embodiment; Fig. 2 This is a schematic diagram of the module structure of the cutting height adjustment system provided in the embodiments of this application.

[0020] The following are the labeling elements in the figure: 1. Path acquisition module; 2. Path determination module; 3. First height adjustment module; 4. Second height adjustment module. Detailed Implementation

[0021] To make the technical problem to be solved, the technical solution and the beneficial effects of this application clearer, the following is in conjunction with the appendix. Figs. 1-2 The present application will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

[0022] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0023] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0024] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0025] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0026] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0028] Please see Fig. 1The cutting height adjustment method provided in this application embodiment will now be described. This cutting height adjustment method is applied to a laser cutting equipment for dynamic adjustment of the Z-axis height (i.e., the thickness direction of the plate) of the cutting head during plate cutting. The cutting head is equipped with a capacitive sensor and a photoelectric displacement sensor: the capacitive sensor is fixed to the nozzle of the cutting head, and the photoelectric displacement sensor is fixed to the cutting head and located on one side of the photoelectric displacement sensor. Both sensors have their measuring ends facing the surface of the plate to be cut, and both can independently detect the distance between the cutting head and the surface of the plate closest to the cutting head. The detection signal is transmitted to the cutting equipment control unit, which then executes the following steps: S1. Obtain the cutting head movement path: Before cutting, the control unit reads the pre-imported cutting program, extracts the preset movement path of the cutting head, and stores the coordinates of all processing points and the outline coordinates of the sheet material.

[0029] S2. Based on the movement path of the cutting head, determine whether the cutting head is currently located in the inner region or the edge region of the plate.

[0030] During processing, the control unit obtains the current coordinates of the cutting head in real time and compares them with the pre-stored coordinates of the board outline: if the projection range of the cutting head falls completely inside the board outline, it is determined that the cutting head is currently located in the inner area of ​​the board; if the projection part of the cutting head exceeds the board outline or is within the board boundary range, it is determined that the cutting head is currently located in the edge area of ​​the board.

[0031] S3. If the cutting head is currently located in the inner region of the plate, the first current actual distance H1 measured by the capacitive sensor is obtained, and the cutting head is adjusted to the target height according to the first current actual distance H1.

[0032] If the cutting head is located inside the material, the control unit directly acquires the first actual distance H1 measured by the capacitive sensor, calculates the difference between H1 and the preset target height, generates a Z-axis adjustment command, and controls the cutting head to move to the target height. Since there is no external electric field leakage interference inside the material, the capacitive sensor's detection is stable. Directly using its detection results reduces the computational load and ensures fast height adjustment response.

[0033] S4. If the cutting head is currently located in the edge area of ​​the plate, the second current actual distance H2 measured by the capacitive sensor and the third current actual distance H3 measured by the photoelectric displacement sensor are obtained. The second current actual distance H2 and the third current actual distance H3 are weighted and averaged to obtain the fourth current actual distance H4. The cutting head is then adjusted to the target height according to the fourth current actual distance H4.

[0034] If the cutting head is located at the edge of the material, the control unit simultaneously acquires the second current actual distance H2 output by the capacitive sensor and the third current actual distance H3 output by the photoelectric displacement sensor, and calculates the fused fourth current actual distance H4 according to a preset weighted formula. The calculation formula is as follows: H4 = α × H2 + β × H3 Where α is the weighting coefficient of the capacitive sensor and β is the weighting coefficient of the photoelectric displacement sensor, satisfying α+β=1.

[0035] In this embodiment, the sheet material to be processed is typically a metal sheet. The photoelectric displacement sensor can specifically be a laser displacement sensor, a fiber optic displacement sensor, or a spectral confocal displacement sensor. This solution selects a capacitive sensor as the main sensor and a photoelectric displacement sensor as an auxiliary sensor. The core reason for choosing a capacitive sensor as the main sensor and a photoelectric displacement sensor as an auxiliary sensor lies in the multiple advantages of capacitive sensors in adapting to cutting scenarios: they have a fast response speed, reaching kHz-level response frequencies, making them suitable for high-speed cutting conditions. They also possess moderate cost, strong resistance to cutting fumes / arc light interference, and small size for easy integration. In contrast, photoelectric displacement sensors are not only more expensive than capacitive sensors, but the spatter, fumes, and molten mist generated during the cutting process can also interfere with their measurement stability and accuracy. Therefore, they are only configured as auxiliary sensors.

[0036] Compared with the prior art, the present invention has the following beneficial effects: Balancing adjustment efficiency and accuracy: By adopting differentiated ranging strategies in different regions, the internal region directly uses capacitive sensors for ranging, eliminating the need for complex fusion calculations. This reduces the computational load on the control system while ensuring detection accuracy, improves the height adjustment response speed, and adapts to the processing needs of rapid cutting over a wide range.

[0037] It solves the industry pain point of inaccurate distance measurement in edge areas: It adopts dual-sensor weighted fusion distance measurement for the edge area of ​​the board, which solves the problem of excessive distance measurement error caused by electric field leakage distortion of pure capacitive sensors at the edge position. It significantly improves the accuracy of height adjustment in the edge area, effectively improves the edge cutting quality, and reduces the processing scrap rate.

[0038] High adaptability and low modification cost: This invention is based on the existing cutting head architecture with dual sensors. It does not require major hardware modifications. Performance can be improved simply by optimizing the control logic, resulting in low modification cost.

[0039] In this embodiment of the application, S4, if the cutting head is currently located in the edge region of the plate, then the second current actual distance H2 measured by the capacitive sensor and the third current actual distance H3 measured by the photoelectric displacement sensor are obtained. The second current actual distance H2 and the third current actual distance H3 are weighted and averaged to obtain the fourth current actual distance H4. The cutting head is then adjusted to the target height according to the fourth current actual distance H4, including the following steps: S41. Calculate the difference △H between the second current actual distance H2 and the third current actual distance H3.

[0040] The second current actual distance H2 measured by the capacitive sensor and the third current actual distance H3 measured by the photoelectric displacement sensor are acquired simultaneously. The absolute value of the difference between the two measurements, ΔH = |H2 - H3|, is calculated.

[0041] S42. Determine whether the difference △H exceeds the error threshold.

[0042] The calculated ΔH is compared with the pre-calibrated error threshold to determine whether ΔH exceeds the error threshold; the error threshold can be manually set according to processing requirements.

[0043] S43. Adjust the weight of the second current actual distance H2 or the third current actual distance H3 according to whether the difference △H exceeds the error threshold.

[0044] In some embodiments, if ΔH does not exceed the error threshold, it indicates that the measurement results of both sensors are reliable and can be calculated with the same weight. If ΔH exceeds the error threshold, it indicates that the measurement of the capacitance sensor is inaccurate. In this embodiment, the weight of the capacitance sensor measurement value is further reduced, and the weight of the photoelectric displacement sensor measurement value is increased.

[0045] S44. The fourth current actual distance H4 is calculated based on the adjusted weighted average. S45. Adjust the cutting head to the target height according to the fourth current actual distance H4.

[0046] The difference between the calculated fourth current actual distance H4 and the preset cutting target height is used to drive the lifting and adjusting mechanism of the cutting head to adjust the cutting head to the target height, thus completing this height following adjustment.

[0047] This application embodiment automatically identifies abnormal measurement data by judging the difference between the second current actual distance H2 and the third current actual distance H3, and dynamically adjusts the weight ratio of different sensors, which has a much better anti-interference capability than the single sensor solution.

[0048] In this embodiment of the application, S43, adjusting the weight of the second current actual distance H2 or the third current actual distance H3 based on whether the difference △H exceeds the error threshold, includes the following steps: S431. If the difference ΔH does not exceed the error threshold, then the weight of the second current actual distance H2 is made greater than the weight of the third current actual distance H3.

[0049] This leverages the core advantages of capacitive sensors: fast response, resistance to smoke and dust interference, and low cost. Using capacitive sensors as the primary data source ensures high-speed response for height adjustment, adapting to high-speed cutting conditions while reducing the computational load on the control unit.

[0050] While ensuring measurement accuracy, we maximize the use of cost-effective capacitive sensing data and reduce the weight of photoelectric displacement sensor data that is susceptible to interference, thereby achieving the optimal balance between performance and economy.

[0051] S432. If the difference ΔH exceeds the error threshold, then the weight of the second current actual distance H2 is made less than or equal to the weight of the third current actual distance H3.

[0052] This solution completely resolves the ranging failure issue caused by electric field distortion at the edge of the sheet material by capacitive sensors. By reducing the weight of the capacitive sensor, the error source is isolated, preventing erroneous data from dominating the adjustment, thus fundamentally improving the edge cutting quality.

[0053] In this embodiment, the internal region is a region located at a distance greater than or equal to R from the edge of the plate, where R is the radius of the side of the cutting head closest to the plate.

[0054] The complete outline edge coordinates of the material to be processed can be obtained through visual scanning or system import. Then, the structural parameters of the cutting head used for processing are read to determine the radius of the cutting head on the side of the material closest to the material, which is denoted as the threshold R.

[0055] The area at a distance greater than or equal to R from the edge of the board is designated as the inner area; the area at a distance less than R is designated as the edge area.

[0056] Furthermore, the internal region is the area located at a distance greater than or equal to 1.2R from the edge of the board.

[0057] The internal area can be set to be greater than or equal to 1.2R from the edge of the board, which can identify edge risks earlier and avoid measurement deviations caused by the capacitive sensor when it is close to the edge.

[0058] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0059] Please see Fig. 2 This application also provides a cutting height adjustment system, which is used to implement the cutting height adjustment method described above. The system includes: Path acquisition module 1 is used to acquire the movement path of the cutting head; The path determination module 2 is used to determine whether the cutting head is currently located in the inner area or the edge area of ​​the plate according to the movement path of the cutting head; The first height adjustment module 3 is used to acquire the first current actual distance H1 measured by the capacitive sensor when the cutting head is currently located in the inner area of ​​the plate, and adjust the cutting head to the target height according to the first current actual distance H1; The second height adjustment module 4 is used to obtain the second current actual distance H2 measured by the capacitive sensor and the third current actual distance H3 measured by the photoelectric displacement sensor when the cutting head is currently located in the edge area of ​​the plate, calculate the weighted average of the second current actual distance H2 and the third current actual distance H3 to obtain the fourth current actual distance H4, and adjust the cutting head to the target height according to the fourth current actual distance H4. In this embodiment of the application, the second height adjustment module 4 includes: The calculation unit is used to calculate the difference △H between the second current actual distance H2 and the third current actual distance H3; The judgment unit is used to determine whether the difference ΔH exceeds the error threshold; A weight adjustment unit is used to adjust the weight of the second current actual distance H2 or the third current actual distance H3 according to the judgment result of the judgment unit. The calculation unit is used to calculate the fourth current actual distance H4 based on the adjusted weighted average. A height adjustment unit is used to adjust the cutting head to the target height according to the fourth current actual distance H4.

[0060] In this embodiment of the application, the weight adjustment unit further includes: The first weight adjustment sub-unit is used to make the weight of the second current actual distance H2 greater than the weight of the third current actual distance H3 when the difference ΔH does not exceed the error threshold. The second weight adjustment sub-unit is used to make the weight of the second current actual distance H2 less than or equal to the weight of the third current actual distance H3 when the difference ΔH exceeds the error threshold.

[0061] Understandably, the cutting height adjustment system of the present invention corresponds to the cutting height adjustment method described above, and will not be repeated here.

[0062] Each module in the aforementioned cutting height adjustment system can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of the computer device in software form, so that the processor can call and execute the corresponding operations of each module.

[0063] This application embodiment also provides a height control device, including a processor and a memory; the memory is used to store a computer program, the computer program including program instructions; the processor is used to call the computer program to implement the cutting height adjustment method described above.

[0064] The height control device can be a computing device such as a desktop computer, laptop, handheld computer, or cloud server. This height control device may include, but is not limited to, a processor and memory.

[0065] The processor can be a Central Processing Unit (CPU), but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor or any conventional processor.

[0066] In some embodiments, the memory may be an internal storage unit of the height control device, such as the hard drive or RAM of the height control device. In other embodiments, the memory may be an external storage device of the height control device, such as a plug-in hard drive, Smart Media Card (SMC), Secure Digital (SD) card, Flash Card, etc., provided on the height control device. Furthermore, the memory may include both internal and external storage units of the height control device. The memory is used to store operating systems, applications, boot loaders, data, and other programs, such as program code for computer programs. The memory can also be used to temporarily store data that has been output or will be output.

[0067] For example, a computer program may be divided into one or more modules / units, one or more of which are stored in memory and executed by a processor to complete this application. One or more modules / units may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in a highly controlled device.

[0068] This application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of the cutting height adjustment method described above.

[0069] The computer-readable storage medium of this application embodiment includes the cutting height adjustment method in any of the above embodiments, and therefore has the beneficial effects brought about by the cutting height adjustment method in any of the above embodiments, which will not be repeated here.

[0070] This application also provides a computer program product, which stores computer instructions. When the computer instructions are executed by a processor, they implement the steps of the cutting height adjustment method described above.

[0071] The computer program product of this application includes the cutting height adjustment method in any of the above embodiments, and therefore has the beneficial effects brought about by the cutting height adjustment method in any of the above embodiments, which will not be repeated here.

[0072] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for adjusting cutting height, characterized in that, The cutting head is equipped with a capacitive sensor and a photoelectric displacement sensor. Both the capacitive sensor and the photoelectric displacement sensor are used to measure the distance between the cutting head and the side of the plate closest to the cutting head. The method includes the following steps: Obtain the movement path of the cutting head; Based on the movement path of the cutting head, determine whether the cutting head is currently located in the inner region or the edge region of the plate; If the cutting head is currently located in the inner region of the plate, the first current actual distance H1 measured by the capacitive sensor is obtained, and the cutting head is adjusted to the target height according to the first current actual distance H1; If the cutting head is currently located in the edge region of the plate, the second current actual distance H2 measured by the capacitive sensor and the third current actual distance H3 measured by the photoelectric displacement sensor are obtained. The second current actual distance H2 and the third current actual distance H3 are weighted and averaged to obtain the fourth current actual distance H4. The cutting head is then adjusted to the target height according to the fourth current actual distance H4.

2. The cutting height adjustment method according to claim 1, characterized in that, If the cutting head is currently located in the edge region of the plate, the second current actual distance H2 measured by the capacitive sensor and the third current actual distance H3 measured by the photoelectric displacement sensor are obtained. The second current actual distance H2 and the third current actual distance H3 are weighted and averaged to obtain a fourth current actual distance H4. The cutting head is then adjusted to the target height according to the fourth current actual distance H4, including the following steps: Calculate the difference ΔH between the second current actual distance H2 and the third current actual distance H3; Determine whether the difference ΔH exceeds the error threshold; Based on whether the difference △H exceeds the error threshold, adjust the weight of the second current actual distance H2 or the third current actual distance H3; The fourth current actual distance H4 is calculated based on the adjusted weighted average. Adjust the cutting head to the target height based on the fourth current actual distance H4.

3. The cutting height adjustment method according to claim 2, characterized in that, The step of adjusting the weight of the second current actual distance H2 or the third current actual distance H3 based on whether the difference ΔH exceeds the error threshold includes the following steps: If the difference ΔH does not exceed the error threshold, then the weight of the second current actual distance H2 is made greater than the weight of the third current actual distance H3; If the difference ΔH exceeds the error threshold, then the weight of the second current actual distance H2 is made less than or equal to the weight of the third current actual distance H3.

4. The cutting height adjustment method according to claim 1, characterized in that, The internal region is the area at a distance greater than or equal to R from the edge of the material, where R is the radius of the side of the cutting head closest to the material.

5. The cutting height adjustment method according to claim 4, characterized in that, The internal region is the area located at a distance greater than or equal to 1.2R from the edge of the board.

6. A cutting height adjustment system, characterized in that, The system is used to implement the cutting height adjustment method according to any one of claims 1-5, the system comprising: The path acquisition module is used to acquire the movement path of the cutting head; The path determination module is used to determine whether the cutting head is currently located in the inner region or the edge region of the plate based on the movement path of the cutting head; The first height adjustment module is used to acquire the first current actual distance H1 measured by the capacitive sensor when the cutting head is currently located in the inner region of the plate, and adjust the cutting head to the target height according to the first current actual distance H1; The second height adjustment module is used to obtain the second current actual distance H2 measured by the capacitive sensor and the third current actual distance H3 measured by the photoelectric displacement sensor when the cutting head is currently located in the edge area of ​​the plate, calculate the weighted average of the second current actual distance H2 and the third current actual distance H3 to obtain the fourth current actual distance H4, and adjust the cutting head to the target height according to the fourth current actual distance H4.

7. The cutting height adjustment system according to claim 6, characterized in that, The second height adjustment module includes: The calculation unit is used to calculate the difference △H between the second current actual distance H2 and the third current actual distance H3; The judgment unit is used to determine whether the difference ΔH exceeds the error threshold; A weight adjustment unit is used to adjust the weight of the second current actual distance H2 or the third current actual distance H3 according to the judgment result of the judgment unit. The calculation unit is used to calculate the fourth current actual distance H4 based on the adjusted weighted average. A height adjustment unit is used to adjust the cutting head to the target height according to the fourth current actual distance H4.

8. A height control device, characterized in that, It includes a processor and a memory; the memory is used to store a computer program, the computer program including program instructions; the processor is used to invoke the computer program to implement the cutting height adjustment method as described in any one of claims 1 to 5.

9. A computer-readable storage medium, characterized in that, The storage medium stores a computer program, which, when executed by a processor, implements the steps of the cutting height adjustment method according to any one of claims 1 to 5.

10. A computer program product, characterized in that, The computer program product stores computer instructions, which, when executed by a processor, implement the steps of the cutting height adjustment method according to any one of claims 1 to 5.

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