A method of laser processing of small angle film holes with a coating
By employing a layered, continuously variable parameter laser removal process using a five-axis linkage laser drilling machine and an online monitoring system, the processing challenge of small-angle irregular-shaped air film holes has been solved, achieving efficient and precise integrated processing of the coating and substrate, thus improving processing quality and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WUXI CHENGFENG AVIATION ENG TECH CO LTD
- Filing Date
- 2026-05-12
- Publication Date
- 2026-07-21
AI Technical Summary
Existing technologies are difficult to adapt to composite coating structures and cannot achieve precise laser processing of small-angle irregular air film holes, resulting in problems such as low processing efficiency, poor quality, and insufficient parameter adaptability.
A layered, continuous variable-parameter laser removal process based on a five-axis linkage laser drilling machine is adopted. Combined with an online monitoring module and a central control system, the laser parameters are dynamically adjusted to achieve precise energy input to the coating and substrate. A bidirectional through-processing method is used to process irregular air film holes with a depth-to-diameter ratio greater than 10.
It achieves high-quality and high-efficiency small-angle film hole processing, avoids coating overheating and substrate erosion, ensures channel accuracy and shape consistency, and reduces manufacturing costs and cycle time.
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Figure CN122425367A_ABST