A method of laser processing of small angle film holes with a coating

By employing a layered, continuously variable parameter laser removal process using a five-axis linkage laser drilling machine and an online monitoring system, the processing challenge of small-angle irregular-shaped air film holes has been solved, achieving efficient and precise integrated processing of the coating and substrate, thus improving processing quality and efficiency.

CN122425367APending Publication Date: 2026-07-21WUXI CHENGFENG AVIATION ENG TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WUXI CHENGFENG AVIATION ENG TECH CO LTD
Filing Date
2026-05-12
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing technologies are difficult to adapt to composite coating structures and cannot achieve precise laser processing of small-angle irregular air film holes, resulting in problems such as low processing efficiency, poor quality, and insufficient parameter adaptability.

Method used

A layered, continuous variable-parameter laser removal process based on a five-axis linkage laser drilling machine is adopted. Combined with an online monitoring module and a central control system, the laser parameters are dynamically adjusted to achieve precise energy input to the coating and substrate. A bidirectional through-processing method is used to process irregular air film holes with a depth-to-diameter ratio greater than 10.

Benefits of technology

It achieves high-quality and high-efficiency small-angle film hole processing, avoids coating overheating and substrate erosion, ensures channel accuracy and shape consistency, and reduces manufacturing costs and cycle time.

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Abstract

The application relates to a laser processing method for a small-angle gas film hole with a coating, which is aimed at a composite structure of a base material-bonding layer-thermal barrier coating, adopts a layered continuous variable parameter laser removal process, dynamically adjusts laser power, frequency, pulse width and protective gas parameters according to the differences in the thermal physical properties of each layer, realizes closed-loop regulation and control of the parameters by monitoring the processing area in real time through an online monitoring module during the processing, flexibly selects a one-way processing mode from an inlet to an outlet or a bidirectional through processing mode from an outlet to an inlet according to the type of the gas film hole, and realizes intelligent matching and collaborative feedback of design parameters-manufacturing feasibility through a process database. The application solves the problems of poor process adaptability, low small-angle processing precision and difficult processing of special-shaped deep holes in the prior art, and realizes high-quality, high-efficiency and low-cost laser processing of the small-angle special-shaped gas film hole with the coating.
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