A method for processing a sapphire light guide block

Abstract

The present disclosure relates to the technical field of sapphire crystal processing, and particularly relates to a processing method of a sapphire light guide block. The processing method of the sapphire light guide block provided by the present disclosure cuts a sapphire crystal plate into a sapphire light guide block by using a multi-wire cutting method, and then performs chamfering, batch inspection, double-side fine grinding and double-side polishing processing on the cut sapphire light guide block in sequence. Through process adjustment of the multi-wire cutting, chamfering and double-side fine grinding processes, the coarse grinding process is cancelled, the processing time is reduced, and the processing cost is reduced.

Description

Technical Field

[0001] This invention belongs to the field of sapphire crystal processing technology, and specifically relates to a processing method for sapphire light guide blocks. Background Technology

[0002] In sapphire processing technology, rough grinding generally refers to grinding sapphire crystals using a grinding machine in conjunction with a planetary wheel and boron carbide polishing slurry. The rough grinding process is a common and crucial step in the processing of sapphire light guide blocks. It occurs after the slicing process and before the fine grinding process, and its functions include: 1. Removing micro-cracks, chipping, and subsurface damage formed on the sapphire surface during the cutting process to prevent residual damage from affecting subsequent processing accuracy and yield; 2. Correcting warping (TTV) and flatness deviations caused by cutting, providing a uniform substrate for subsequent processes; 3. Reducing the surface roughness (Ra) of the sapphire, balancing material removal efficiency with surface damage depth, avoiding excessively high roughness that increases fine grinding time or excessively low roughness that masks deep defects. However, with the rapid pace of technological advancements and the rapid iteration of electronic and medical aesthetic products, competition in the current sapphire light guide block application market is increasingly fierce. In this context, continuing to use the rough grinding process results in long processing times and high costs. Therefore, there is an urgent need for a sapphire light guide block processing method that eliminates rough grinding, thereby reducing processing time and costs. Summary of the Invention

[0003] The purpose of this invention is to provide a processing method for sapphire light guide blocks that can reduce processing time and lower processing costs while ensuring processing yield.

[0004] To achieve the above objectives, the present invention provides a method for processing sapphire light guide blocks that eliminates rough grinding, comprising the following steps: Step 1: Cut the sapphire crystal plate into sapphire light guide blocks; Step 2: Chamfer the edges of the sapphire light guide block; Step 3: Conduct the first inspection on the chamfered sapphire light guide block; sapphire light guide blocks that meet the first preset value in the first inspection are batched according to the thickness standard; Step 4: Perform double-sided precision grinding on the batches of sapphire light guide blocks; Step 5: Polish the finely ground sapphire light guide block on both sides.

[0005] Preferably, the sapphire light guide block has a cuboid structure.

[0006] Preferably, the chamfering process at the edges of the sapphire light guide block includes chamfering the 12 edges of the sapphire light guide block.

[0007] Preferably, the first preset value is that the chamfer angle of the sapphire light guide block is between 42° and 48°.

[0008] Preferably, the thickness standard refers to a batch defined as a thickness deviation of 0.01 mm based on the design value of the sapphire light guide block after cutting.

[0009] Preferably, the process further includes CNC machining of the sapphire light guide block after double-sided fine grinding and before double-sided polishing.

[0010] Preferably, the CNC machining of the sapphire light guide block refers to creating a groove on the side of the sapphire light guide block.

[0011] Preferably, the processing time for the double-sided fine grinding process is set according to the thickness of the sapphire light guide block, with the processing time increasing by 10 minutes for every 0.01 mm increase in thickness.

[0012] The technical solution provided in this disclosure has the following advantages compared with the prior art: The present disclosure provides a processing method for sapphire light guide blocks, which involves sequentially performing chamfering, inspection, double-sided fine grinding, CNC machining, and double-sided polishing on the cut sapphire light guide blocks, eliminating the need for rough grinding and effectively reducing processing time and costs; at the same time, the adjustment of the above process ensures that the processing yield is not affected. Attached Figure Description

[0013] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0014] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a flowchart of the sapphire light guide block manufacturing process; Detailed Implementation

[0016] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0017] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure. Example

[0018] like Figure 1 As shown, a method for processing a sapphire light guide block includes the following steps: Step 1: Cut the sapphire crystal plate into sapphire light guide blocks; In this step, a multi-wire cutting machine in conjunction with diamond wire is used to cut the sapphire crystal plate into several sapphire light guide blocks. The sapphire light guide blocks have a rectangular structure. The cutting of the sapphire crystal plate into light guide blocks requires two cuts using the multi-wire cutting machine and diamond wire. During cutting, the multi-wire cutting machine's table descent speed is 12-14 mm / h, the wire speed is 600-900 m / min, the oscillation angle is ±5°, and the oscillation speed is 500° / min. The amount of diamond wire used is calculated using the following formula: Wire usage for the first cut: M1 = 2 * N1 * (L / A1) * (W * H / S); The amount of wire used for the second cut is: M2 = 2 * N2 * (W / A2) * (L * H / S); in, N1 is the line coefficient used during the first cut, and it is a constant. N2 is the line coefficient used in the second cutting, and it is a constant. A1 is the groove spacing of the grooved wheel used in the first cut; A2 is the groove spacing of the grooved wheel used in the second cutting; L is the length of the sapphire crystal plate; W is the width of the sapphire crystal plate; H is the height of the sapphire crystal plate; S is the cutting coefficient, which is a constant.

[0019] The above calculation formula can accurately calculate the amount of diamond wire used in the multi-wire cutting process. When multi-wire cutting, the more precise the amount of wire used, the better the surface quality of the sapphire light guide block. Too much or too little wire will lead to an increased defect rate of the cut products.

[0020] In addition, after cutting, the sapphire light guide block is placed in a multi-tank ultrasonic cleaner for cleaning.

[0021] Step 2: Chamfer the edges of the sapphire light guide block; In this step, a fully automatic chamfering machine is used to chamfer the 12 edges of the sapphire light guide block. The parameters of the fully automatic chamfering machine are set as follows: pressure 0.4-0.8 MPa, spindle speed 2500 rpm, and grinding disc speed 2500 rpm. After processing, the sapphire light guide block is placed in a multi-tank ultrasonic cleaner for cleaning.

[0022] Step 3: Conduct the first inspection on the chamfered sapphire light guide block; the sapphire light guide blocks that meet the first preset value in the first inspection are divided into batches according to the thickness standard; In this step, the chamfer angle of the sapphire light guide block is inspected using testing equipment, and sapphire light guide blocks with a chamfer angle of 42°-48° are selected. The thickness standard refers to a batch defined as a thickness deviation of 0.01mm based on the design value of the sapphire light guide block after cutting.

[0023] Step 4: Perform double-sided precision grinding on each batch of the sapphire light guide blocks after batching; In this step, a double-sided grinding machine is used to grind the sapphire light guide block on both sides. The parameters of the double-sided grinding machine are set as follows: upper plate speed 10 rpm, lower plate speed 30 rpm, pressure 450-550 KG, and grinding time 70 min. During processing, depending on the batch of sapphire light guide blocks, the processing time is increased by 10 min for every 0.01 mm increase in thickness, based on the basic parameters. After processing, the sapphire light guide block is placed in a multi-tank ultrasonic cleaner for cleaning.

[0024] Step 5: Cut grooves on the side of the sapphire light guide block; In this step, CNC machining equipment, along with diamond abrasives, is used to create grooves on the side of the sapphire light guide block. After machining, the sapphire light guide block is placed in a multi-tank ultrasonic cleaner for cleaning.

[0025] Step 6: Polish the sapphire light guide block on both sides.

[0026] In this step, the sapphire light guide block is polished on both sides using a double-sided polishing machine. The parameters of the double-sided polishing machine are set as follows: upper plate speed 12-14 rpm, lower plate speed 35-45 rpm, and pressure 530-550 kg. After processing, the sapphire light guide block is placed in a multi-tank ultrasonic cleaning machine for cleaning.

[0027] In summary, the processing method for sapphire light guide blocks provided in this disclosure sequentially performs chamfering, inspection, double-sided fine grinding, CNC machining, and double-sided polishing on the cut sapphire light guide blocks, eliminating the need for rough grinding and effectively reducing processing time and costs. Furthermore, this method involves chamfering the cut sapphire light guide blocks and selecting the chamfer angle. Simultaneously, before double-sided fine grinding, the sapphire light guide blocks to be processed are batched according to their thickness, and different processing times are set for different batches during the double-sided fine grinding process. This control and processing method effectively corrects warping (TTV) and flatness deviations caused by cutting, while removing micro-cracks, chipping, and subsurface damage formed on the sapphire surface during the cutting process to avoid residual damage and reduce the surface roughness of the sapphire light guide block.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0029] The above are merely specific embodiments of this disclosure, enabling those skilled in the art to understand or implement this disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to these embodiments, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for processing a sapphire light guide block, characterized in that, Includes the following steps: Step 1: Cut the sapphire crystal plate into sapphire light guide blocks; Step 2: Chamfer the edges of the sapphire light guide block; Step 3: Conduct the first inspection on the chamfered sapphire light guide block; sapphire light guide blocks that meet the first preset value in the first inspection are batched according to the thickness standard; Step 4: Perform double-sided precision grinding on the batches of sapphire light guide blocks; Step 5: Polish the finely ground sapphire light guide block on both sides.

2. The processing method of a sapphire light guide block according to claim 1, characterized in that, The sapphire light guide block has a cuboid structure.

3. The processing method of a sapphire light guide block according to claim 2, characterized in that, The chamfering process at the edges of the sapphire light guide block includes chamfering the 12 edges of the sapphire light guide block.

4. The processing method of a sapphire light guide block according to claim 1, characterized in that, The first preset value is that the chamfer angle of the sapphire light guide block is between 42° and 48°.

5. The processing method of a sapphire light guide block according to claim 1, characterized in that, The thickness standard refers to a batch defined as a thickness deviation of 0.01mm based on the design value of the sapphire light guide block after cutting.

6. The processing method of a sapphire light guide block according to claim 1, characterized in that, It also includes CNC machining of the sapphire light guide block after double-sided fine grinding and before double-sided polishing.

7. The processing method of a sapphire light guide block according to claim 6, characterized in that, The CNC machining of the sapphire light guide block refers to creating a groove on the side of the sapphire light guide block.

8. The processing method of a sapphire light guide block according to claim 5, characterized in that, The processing time for the double-sided fine grinding process is set according to the thickness of the sapphire light guide block. For every 0.01mm increase in thickness, the processing time increases by 10 minutes.

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