A semiconductor manufacturing apparatus and manufacturing method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANDONG JUZHI SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2026-04-23
- Publication Date
- 2026-07-21
Smart Images
Figure CN122425802A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor processing equipment, and more particularly to a semiconductor manufacturing apparatus and manufacturing method. Background Technology
[0002] Wafer dicing is an indispensable and critical process in chip manufacturing. Precisely belonging to the core back-end stage after wafer fabrication, it connects to the front-end wafer mass production and subsequent packaging and testing processes; none can be omitted. Its core task is to precisely divide the fully fabricated wafer into individual chips according to the chip design specifications. Using high-speed rotating specialized diamond blades, it accurately cuts these individual single-crystal chip particles, completely separating adjacent circuit units, eliminating crosstalk, and preparing them adequately for subsequent packaging, bonding, and performance testing processes. It is a crucial step in chip formation.
[0003] Currently, a Chinese invention patent, application number CN202310566401.2, discloses a cutting device for semiconductor processing, including a base, a mounting cylinder fixedly connected to the base, a carrier plate rotatably connected to the upper end of the mounting cylinder, and a drive mechanism for driving the carrier plate to rotate; a wafer support stage for adsorbing and fixing wafers is installed on the carrier plate; a cross-cutting mechanism is installed on the left side of the carrier plate, and a longitudinal cutting mechanism is installed on the front side of the carrier plate. The cross-cutting mechanism and the longitudinal cutting mechanism have the same structure and are set perpendicularly. By using the rotating carrier plate and the wafer support stage mounted on the carrier plate to cooperate with the cross-cutting mechanism and the longitudinal cutting mechanism, the cross-cutting and longitudinal cutting of wafers can be carried out in steps to achieve high-efficiency production. However, in the process of automated production, FFOC often needs to replace the cutter rollers of the cross-cutting mechanism and the longitudinal cutting mechanism regularly. At present, the industry mostly uses manual replacement, which is not only cumbersome and time-consuming, but also inefficient, making it difficult to meet the continuous and efficient production requirements of automated production lines. Summary of the Invention
[0004] This invention proposes a semiconductor manufacturing apparatus and manufacturing method.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor manufacturing apparatus includes a mounting cylinder for mounting a support plate and a mounting cover fixedly connected to the mounting cylinder. Mounting plates are mounted on the inner walls of both sides of the mounting cover. Each mounting plate has an identical inverted L-shaped guide groove. Two ends of a cutting roller are slidably mounted within the L-shaped guide groove via connecting posts. The cutting roller and the connecting posts are rotatably connected. One mounting plate has a sliding groove, within which a sliding plate is slidably mounted. The sliding plate is screwed to a lead screw rotatably mounted within the mounting cover. An inclined groove is formed on the sliding plate. A connecting post at one end of the cutting roller is slidably connected to the inclined groove. A second motor is slidably mounted along the L-shaped guide groove on the inner wall of the mounting groove. A connecting rod is linearly slidably mounted on the output shaft of the second motor. The end of the connecting rod passes through the connecting post and is screwed into a threaded hole at one end of the cutting roller. The other end of the cutting roller engages with the opening of the L-shaped guide groove on the other side.
[0006] A further preferred embodiment of the present invention is that the top of the inclined groove mates with the straight end of the L-shaped guide groove, and the bottom of the inclined groove mates with the vertical end of the L-shaped guide groove.
[0007] A further preferred embodiment of the present invention: the end of the lead screw passes through the mounting cover and is fixedly connected to the output shaft of the first motor fixed on the outer wall of the mounting cover.
[0008] A further preferred embodiment of the present invention is that the connecting column of one end of the cutter roller has a rhomboid plate-like structure at the interface with the inclined groove, and the left and right sides of the rhomboid plate-like structure of the connecting column are in contact with the inclined groove.
[0009] A further preferred embodiment of the present invention: the bottom of the L-shaped guide groove is further provided with a receiving component, which includes a support frame, a receiving platform, a support rod, a control wheel, a support spring, and a trapezoidal platform. The support frame is fixedly installed inside the mounting cover, and the receiving platform is slidably installed on the top of the support frame. A support spring is provided between the receiving platform and the support frame. A limiting rod that is inserted into the limiting hole of the cutter roller is vertically provided on the receiving platform. A support rod is fixedly installed under the receiving platform, and a control wheel is rotatably installed at the bottom of the support rod. The control wheel is movably installed on the trapezoidal platform that is fixedly connected to the mounting cover.
[0010] A further preferred embodiment of the present invention: both the bottom of the L-shaped guide groove and the inclined groove are open, wherein the opening width of one side of the L-shaped guide groove and the inclined groove is the same as the width of the connecting column, and the opening width of the other side of the L-shaped guide groove is the same as the width of the end of the cutter roller and is smaller than the width of the connecting column.
[0011] A semiconductor manufacturing method includes the following steps: Step 1: Preparations before starting the machine: Check the reliability of the mounting cylinder, mounting cover and mounting bearing plate, confirm that the wiring of the first motor and the second motor is normal, and clean the moving parts such as the lead screw, slide plate, L-shaped guide groove and inclined groove to ensure that there is no jamming or debris residue; Step 2: Installation and initial positioning of the cutter roller. Place the connecting columns at both ends of the cutter roller into the receiving platform. Insert the limiting rod on the receiving platform into the limiting hole on the cutter roller. Close the installation cover. The trapezoidal platform on the installation cover works with the control wheel. The control wheel moves along the inclined surface of the trapezoidal platform and pushes the support rod to raise and lower the receiving platform. This allows the connecting columns of the cutter roller and the end of the cutter roller to be installed in the inverted L-shaped guide grooves on both sides of the installation cover. This ensures that the diamond-shaped plate structure at one end of the cutter roller fits snugly against the inclined groove of the sliding plate. Step 3: Locking and adjusting the cutter roller. The electromagnet on the connecting rod is attracted by the electromagnet in the screw hole, and the connecting rod and the screw hole cooperate. The second motor is started to drive the connecting rod to rotate, so that the threaded end of the connecting rod is screwed into the screw hole at the end of the cutter roller. The screwing between the connecting rod and the screw hole changes the distance between them, driving the cutter roller to move linearly, so that the connecting post at the other end of the cutter roller is installed on the L-shaped guide groove. The cutter roller is locked, the second motor is turned off, and the first motor is started. The first motor drives the lead screw to rotate, driving the slide plate to slide along the slide groove. The slide plate pushes the connecting post of the cutter roller along the L-shaped guide groove through the inclined groove. The horizontal feed of the cutter roller is achieved by the cooperation between the top of the inclined groove and the straight end of the L-shaped guide groove, and the vertical lifting and lowering of the cutter roller is achieved by the cooperation between the bottom of the inclined groove and the vertical end of the L-shaped guide groove, until the cutter roller reaches the preset working position, which is the straight end of the L-shaped guide groove. Step 4: Cutter roller drive. When the cutter roller reaches the preset working position, the cutter roller separates from the limit rod on the receiving platform. The second motor is started. Under the drive of the second motor, the connecting rod drives the cutter roller to rotate. The first motor is started. The horizontal feed of the cutter roller is achieved by the cooperation between the top of the inclined groove and the straight end of the L-shaped guide groove, so as to process the semiconductor workpiece. Step 5: Cutter Roller Disassembly. When the work is completed or the cutter roller is replaced, stop the second motor to stop the cutter roller from rotating. Control the first motor to reverse and drive the slide plate to reset, so that the cutter roller descends along the L-shaped guide groove and exits the working position, placing the cutter roller on the receiving platform. The limiting rod on the receiving platform is inserted into the corresponding limiting hole on the cutter roller connecting column. Control the second motor to reverse, so that the connecting rod is separated from the screw hole of the cutter roller. With the cooperation between the connecting rod and the screw hole, move the cutter roller, open the installation cover door, and control the wheel to move along the inclined surface of the trapezoidal platform. Under the action of the support spring, the receiving platform moves down, and the receiving platform removes both ends of the cutter roller from the L-shaped guide groove, completing the cutter roller disassembly.
[0012] The present invention has the following advantages: 1. This invention, through the cooperation of an inverted L-shaped guide groove, a sliding plate inclined groove, a lead screw transmission mechanism, a second motor locking structure, and a receiving component, achieves an automated process for the cutter roller from placement, alignment, lifting, feeding, locking to transmission connection, eliminating the need for manual disassembly, alignment, and fastening. The cutter roller relies on the constraints of the L-shaped guide groove and the inclined groove to achieve precise trajectory control of vertical lifting followed by horizontal feeding, resulting in high positioning accuracy and stable repeatability. This fundamentally solves the problems of cumbersome, time-consuming, and inefficient manual cutter roller replacement in existing equipment, significantly improving the continuous and automated production capabilities of semiconductor cutting production lines.
[0013] 2. The second motor of the present invention is rigidly connected to the end of the cutter roller via a connecting rod, and the power transmission is direct and without gaps, which effectively avoids transmission loosening, vibration and slippage, and ensures the processing accuracy when the cutter roller rotates at high speed.
[0014] 3. The receiving component and installation cover of this invention are linked and controlled. Automatic support and lifting of the cutter roller are achieved through a trapezoidal platform, control wheels, support rods, and support springs. The cutting roller is fed in and removed simply by opening and closing the installation cover. Operation is simple, safe, and reliable. The entire cutting roller adjustment, locking, feeding, rotation, and disassembly mechanism is highly integrated, with smooth movement of parts and no complex manual operation. This reduces the labor intensity of operators and minimizes equipment damage caused by human error, making overall device maintenance simpler, extending service life, and enhancing applicability. Attached Figure Description
[0015] Figure 1 This is a three-dimensional structural diagram of the assembly of the present invention; Figure 2 This is a schematic diagram of the front cross-sectional structure of the mounting cover of the present invention; Figure 3 This is a schematic diagram of the main cross-sectional structure of the mounting cover of the present invention (without the blade roller installed). Figure 4 This is a schematic front cross-sectional view of the mounting cover of the present invention (without the cutter roller and slide plate installed). Figure 5 This is a three-dimensional structural diagram of the cutter roller of the present invention; Figure 6 This is a side view of the receiving component of the present invention. Figure 7 This is a schematic diagram of the main structure of the receiving component of the present invention; In the diagram: 1-mounting cylinder, 2-bearing plate, 3-mounting cover, 4-mounting plate, 5-slide groove, 6-lead screw, 7-L-shaped guide groove, 8-sloping groove, 9-first motor, 10-support frame, 11-receiving platform, 12-trapezoidal platform, 13-slide plate, 14-cutter roller, 15-connecting column, 16-support spring, 17-support rod, 18-control wheel, 19-limiting rod, 20-moving seat, 21-connecting spring, 22-telescopic seat, 23-insertion rod. Detailed Implementation
[0016] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0017] according to Figure 1-7 As shown, a semiconductor manufacturing apparatus includes a mounting cylinder 1 for mounting a support plate 2 and a mounting cover 3 fixedly connected to the mounting cylinder 1. Mounting plates 4 are correspondingly mounted on the inner walls of both sides of the mounting cover 3. Each mounting plate 4 has an identical inverted L-shaped guide groove 7. Both ends of a cutting roller 14 are slidably mounted in the L-shaped guide groove 7 via connecting posts 15. The cutting roller 14 and the connecting posts 15 are rotatably connected. One mounting plate 4 has a sliding groove 5, and a sliding plate 13 is slidably mounted in the sliding groove 5. The sliding plate 13 is screwed to a lead screw 6 rotatably mounted inside the mounting cover 3. An inclined groove 8 is formed on the sliding plate 13. The connecting post 15 at one end of the cutting roller 14 is slidably connected to the inclined groove 8. A second motor is slidably mounted along the L-shaped guide groove 7 on the inner wall of the mounting groove. The second motor can move relative to the mounting plate 4. The slot 7 can limit the second motor. When the connecting rod is connected to the cutter roller 14, the fixed end of the second motor and the connecting column 15 are equivalent to a whole. The connecting rod is linearly slidably installed on the output shaft of the second motor. The end of the connecting rod passes through the connecting column 15 and is screwed into the screw hole at one end of the cutter roller 14. The connecting rod can only be fixedly connected to the cutter roller. The connecting rod and the connecting column 15 do not contact each other. Therefore, the connecting rod can control the rotation of the cutter roller. Electromagnets are provided in the screw hole at one end of the connecting rod and the screw hole at one end of the cutter roller 14. When the cutter roller 14 needs to be installed, the end of the connecting rod and the electromagnet in the screw hole at one end of the cutter roller 14 attract each other. When the cutter roller 14 needs to be disassembled, the end of the connecting rod and the electromagnet in the screw hole at one end of the cutter roller 14 repel each other. The other end of the cutter roller is engaged with the opening of the L-shaped guide groove on the other side.
[0018] The top of the inclined groove 8 engages with the straight end of the L-shaped guide groove 7, and the bottom of the inclined groove 8 engages with the vertical end of the L-shaped guide groove 7. The horizontal feeding of the cutter roller 14 is achieved by the engagement of the top of the inclined groove 8 with the straight end of the L-shaped guide groove 7, and the vertical lifting of the cutter roller 14 is achieved by the engagement of the bottom of the inclined groove 8 with the vertical end of the L-shaped guide groove 7.
[0019] The end of the lead screw 6 passes through the mounting cover 3 and is fixedly connected to the output shaft of the first motor 9, which is fixed on the outer wall of the mounting cover 3. The first motor 9 is a forward and reverse motor, which can control the forward and reverse rotation of the lead screw 6.
[0020] The connecting post 15 of one end of the cutter roller 14 and the inclined groove 8 have a diamond-shaped plate structure at the joint. The left and right sides of the diamond-shaped plate structure of the connecting post 15 are in contact with the inclined groove 8. The horizontal feeding of the cutter roller 14 is achieved by the cooperation between the top of the inclined groove 8 and the straight end of the L-shaped guide groove 7. The vertical lifting of the cutter roller 14 is achieved by the cooperation between the bottom of the inclined groove 8 and the vertical end of the L-shaped guide groove 7.
[0021] The bottom of the L-shaped guide groove 7 is also provided with a receiving component, which includes a support frame 10, a receiving platform 11, a support rod 17, a control wheel 18, a support spring 16, and a trapezoidal platform 12. The support frame 10 is fixedly installed inside the mounting cover 3. The receiving platform 11 is slidably installed on the top of the support frame 10. A support spring 16 is provided between the receiving platform 11 and the support frame 10. A limiting rod 19 is vertically installed on the receiving platform 11 and is inserted into the limiting hole of the cutter roller 14. The width of the limiting hole is close to the width of the limiting rod 19, but the length of the limiting hole is greater than the length of the limiting rod 19 to ensure that the limiting rod 19 can move within the limiting hole. The support rod 17 is fixedly installed under the receiving platform 11. The control wheel 18 is rotatably installed at the bottom of the support rod 17. The control wheel 18 is movably installed on the trapezoidal platform 12, which is fixedly connected to the door of the mounting cover 3.
[0022] Both the L-shaped guide groove 7 and the inclined groove 8 have openings at the bottom. The opening width of one side of the L-shaped guide groove 7 and the inclined groove 8 is the same as the width of the connecting column 15. The opening width of the other side of the L-shaped guide groove 7 is the same as the width of the end of the cutter roller 14 and is smaller than the width of the connecting column 15.
[0023] A semiconductor manufacturing method includes the following steps: Step 1: Before starting the machine, check the fixing reliability of the mounting cylinder 1, mounting cover 3 and mounting bearing plate 2, confirm that the wiring of the first motor 9 and the second motor is normal, and clean the moving parts such as the lead screw 6, slide plate 13, L-shaped guide groove 7 and inclined groove 8 to ensure that there is no jamming or debris residue. Step 2: Installation and initial positioning of the cutter roller 14. Place the connecting columns 15 at both ends of the cutter roller 14 onto the receiving platform 11. Insert the limiting rod 19 on the receiving platform 11 into the limiting hole on the cutter roller 14. Close the installation cover 3. The trapezoidal platform 12 on the installation cover 3 cooperates with the control wheel 18. The control wheel 18 moves along the inclined surface of the trapezoidal platform 12 and pushes the support rod 17 to realize the lifting and lowering of the receiving platform 11. This allows the connecting columns 15 of the cutter roller 14 and the end of the cutter roller 14 to be installed in the inverted L-shaped guide grooves 7 on both sides of the installation plate 4 of the installation cover 3. This makes the diamond-shaped plate structure at one end of the cutter roller 14 fit and cooperate with the inclined groove 8 of the slide plate 13. Step 3: Locking and adjusting the position of the cutter roller 14. The electromagnet on the connecting rod is attracted by the electromagnet in the screw hole, and the connecting rod and the screw hole cooperate. The second motor is started to drive the connecting rod to rotate, so that the threaded end of the connecting rod is screwed into the screw hole at the end of the cutter roller 14. The screw connection between the connecting rod and the screw hole changes the distance between them, driving the cutter roller 14 to move linearly, so that the connecting post 15 at the other end of the cutter roller 14 is installed on the L-shaped guide groove 7. The cutter roller 14 is locked, the second motor is turned off, and the first motor 9 is started. The first motor 9 drives the lead screw 6 to rotate, driving the slide plate 13 to slide along the slide groove 5. The slide plate 13 pushes the connecting post 15 of the cutter roller 14 to move along the L-shaped guide groove 7 through the inclined groove 8. The cutter roller 14 is fed horizontally by the cooperation between the top of the inclined groove 8 and the straight end of the L-shaped guide groove 7, and the cutter roller 14 is raised and lowered vertically by the cooperation between the bottom of the inclined groove 8 and the vertical end of the L-shaped guide groove 7, until the cutter roller 14 reaches the preset working position, which is the straight end of the L-shaped guide groove 7. Step 4: Drive the cutter roller 14. When the cutter roller 14 reaches the preset working position, the cutter roller 14 separates from the limit rod 19 on the receiving platform 11. Start the second motor. Under the drive of the second motor, the connecting rod drives the cutter roller 14 to rotate. Start the first motor 9. Utilize the cooperation between the top of the inclined groove 8 and the straight end of the L-shaped guide groove 7 to realize the horizontal feeding of the cutter roller 14 and realize the processing of semiconductor workpieces. Step 5: Disassembly of the cutter roller 14. When the work is completed or the cutter roller 14 is replaced, stop the second motor to stop the cutter roller 14 from rotating. Control the first motor 9 to reverse and drive the slide plate 13 to reset, so that the cutter roller 14 descends along the L-shaped guide groove 7 and exits the working position, so that the cutter roller 14 is placed on the receiving platform 11. The limiting rod 19 on the receiving platform 11 is inserted into the corresponding limiting hole on the connecting column 15 of the cutter roller 14. Control the second motor to reverse, so that the connecting rod is separated from the screw hole of the cutter roller 14. With the cooperation between the connecting rod and the screw hole, move the cutter roller 14, open the mounting cover 3, and control the wheel 18 to move along the inclined surface of the trapezoidal platform 12. Under the action of the support spring 16, the receiving platform 11 moves down, and the receiving platform 11 removes both ends of the cutter roller 14 from the L-shaped guide groove 7, thus completing the disassembly of the cutter roller 14.
[0024] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.
Claims
1. A semiconductor manufacturing apparatus, characterized in that: The device includes a mounting cylinder for mounting a support plate and a mounting cover fixedly connected to the mounting cylinder. Mounting plates are installed on the inner walls of both sides of the mounting cover. Each mounting plate has the same inverted L-shaped guide groove. The two ends of the cutter roller are slidably installed in the L-shaped guide groove through connecting columns. The cutter roller and the connecting columns are rotatably connected. One of the mounting plates has a sliding groove, in which a sliding plate is slidably installed. The sliding plate is screwed to a lead screw rotatably installed in the mounting cover. An inclined groove is opened on the sliding plate. The connecting column at one end of the cutter roller is slidably connected to the inclined groove. A second motor is slidably installed along the L-shaped guide groove on the inner wall of the mounting groove. A connecting rod is linearly slidably installed on the output shaft of the second motor. The end of the connecting rod passes through the connecting column through a thread and is screwed to a screw hole at one end of the cutter roller. The other end of the cutter roller is engaged with the opening of the L-shaped guide groove on the other side.
2. The semiconductor manufacturing apparatus according to claim 1, characterized in that: The top of the inclined groove mates with the straight end of the L-shaped guide groove, and the bottom of the inclined groove mates with the vertical end of the L-shaped guide groove.
3. A semiconductor manufacturing apparatus according to claim 1, characterized in that: The end of the lead screw passes through the mounting cover and is fixedly connected to the output shaft of the first motor, which is fixed on the outer wall of the mounting cover.
4. A semiconductor manufacturing apparatus according to claim 1, characterized in that: The connecting column of one end of the cutter roller has a diamond-shaped plate structure at the interface with the inclined groove, and the left and right sides of the diamond-shaped plate structure of the connecting column are in contact with the inclined groove.
5. A semiconductor manufacturing apparatus according to claim 1, characterized in that: The bottom of the L-shaped guide groove is also equipped with a receiving assembly, which includes a support frame, a receiving platform, a support rod, a control wheel, a support spring, and a trapezoidal platform. The support frame is fixedly installed inside the mounting cover, and the receiving platform is slidably installed on the top of the support frame. A support spring is installed between the receiving platform and the support frame. A limit rod that is inserted into the limit hole of the cutter roller is vertically installed on the receiving platform. A support rod is fixedly installed under the receiving platform, and a control wheel is rotatably installed at the bottom of the support rod. The control wheel is movable and installed on the trapezoidal platform that is fixedly connected to the mounting cover.
6. A semiconductor manufacturing apparatus according to claim 1, characterized in that: Both the L-shaped guide groove and the inclined groove have openings at the bottom. The opening width of one side of the L-shaped guide groove and the inclined groove is the same as the width of the connecting column, while the opening width of the other side of the L-shaped guide groove is the same as the width of the end of the cutter roller and is smaller than the width of the connecting column.
7. A semiconductor manufacturing method, based on the semiconductor manufacturing apparatus according to any one of claims 1-6, characterized in that, Includes the following steps: Step 1: Preparations before starting the machine: Check the reliability of the mounting cylinder, mounting cover and mounting bearing plate, confirm that the wiring of the first motor and the second motor is normal, and clean the moving parts such as the lead screw, slide plate, L-shaped guide groove and inclined groove to ensure that there is no jamming or debris residue; Step 2: Installation and initial positioning of the cutter roller. Place the connecting columns at both ends of the cutter roller into the receiving platform. Insert the limiting rod on the receiving platform into the limiting hole on the cutter roller. Close the installation cover. The trapezoidal platform on the installation cover works with the control wheel. The control wheel moves along the inclined surface of the trapezoidal platform and pushes the support rod to raise and lower the receiving platform. This allows the connecting columns of the cutter roller and the end of the cutter roller to be installed in the inverted L-shaped guide grooves on both sides of the installation cover. This ensures that the diamond-shaped plate structure at one end of the cutter roller fits snugly against the inclined groove of the sliding plate. Step 3: Locking and adjusting the cutter roller. The electromagnet on the connecting rod is attracted by the electromagnet in the screw hole, and the connecting rod and the screw hole cooperate. The second motor is started to drive the connecting rod to rotate, so that the threaded end of the connecting rod is screwed into the screw hole at the end of the cutter roller. The screwing between the connecting rod and the screw hole changes the distance between them, driving the cutter roller to move linearly, so that the connecting post at the other end of the cutter roller is installed on the L-shaped guide groove. The cutter roller is locked, the second motor is turned off, and the first motor is started. The first motor drives the lead screw to rotate, driving the slide plate to slide along the slide groove. The slide plate pushes the connecting post of the cutter roller along the L-shaped guide groove through the inclined groove. The horizontal feed of the cutter roller is achieved by the cooperation between the top of the inclined groove and the straight end of the L-shaped guide groove, and the vertical lifting and lowering of the cutter roller is achieved by the cooperation between the bottom of the inclined groove and the vertical end of the L-shaped guide groove, until the cutter roller reaches the preset working position, which is the straight end of the L-shaped guide groove. Step 4: Cutter roller drive. When the cutter roller reaches the preset working position, the cutter roller separates from the limit rod on the receiving platform. The second motor is started. Under the drive of the second motor, the connecting rod drives the cutter roller to rotate. The first motor is started. The horizontal feed of the cutter roller is achieved by the cooperation between the top of the inclined groove and the straight end of the L-shaped guide groove, so as to process the semiconductor workpiece. Step 5: Cutter Roller Disassembly. When the work is completed or the cutter roller is replaced, stop the second motor to stop the cutter roller from rotating. Control the first motor to reverse and drive the slide plate to reset, so that the cutter roller descends along the L-shaped guide groove and exits the working position, placing the cutter roller on the receiving platform. The limiting rod on the receiving platform is inserted into the corresponding limiting hole on the cutter roller connecting column. Control the second motor to reverse, so that the connecting rod is separated from the screw hole of the cutter roller. With the cooperation between the connecting rod and the screw hole, move the cutter roller, open the installation cover door, and control the wheel to move along the inclined surface of the trapezoidal platform. Under the action of the support spring, the receiving platform moves down, and the receiving platform removes both ends of the cutter roller from the L-shaped guide groove, completing the cutter roller disassembly.