An epoxy adhesive with high performance and resistance to extremely low temperature and a preparation method thereof
CN122427633APending Publication Date: 2026-07-21AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
- Filing Date
- 2026-04-24
- Publication Date
- 2026-07-21
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Figure CN122427633A_ABST
Abstract
The present application relates to a kind of extremely low temperature resistant high performance epoxy adhesive and its preparation method, belong to functional epoxy adhesive field, the present application will bisphenol A epoxy resin, copolyether resin, aromatic amine curing agent, crown ether and accelerator are uniformly mixed, obtain crown ether modified extremely low temperature resistant high performance epoxy adhesive.The present application utilizes supramolecular technology, through the non-covalent interaction between crown ether molecule and epoxy resin, effectively inhibit the freezing of molecular chain segment at low temperature, reduce glass transition temperature, improve the strength and toughness of epoxy adhesive at low temperature, the tensile shear strength at-196 DEG C is more than 30MPa, the tensile strength at-60 DEG C is more than 60MPa, and the elongation at break is more than 1.5%.
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