Aluminum substrate copper layer bond strength enhancement method and system

By performing hierarchical physical morphology reconstruction and intermetallic compound transition layer deposition on the surface of the aluminum substrate, combined with thermal coupling, the problem of insufficient bonding strength between the aluminum substrate and the copper layer was solved, thereby improving the interfacial bonding strength and releasing stress, and ensuring the stability and consistency of the copper clad layer on the aluminum substrate.

CN122428232APending Publication Date: 2026-07-21JIANGSU RONGJIN ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIANGSU RONGJIN ELECTRONICS CO LTD
Filing Date
2026-06-23
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

In existing technologies, the bonding strength between the aluminum substrate and the copper layer is insufficient, which cannot effectively cope with the stress caused by the difference in thermal expansion coefficients, resulting in the propagation of microcracks at the interface. Furthermore, the fixed traditional process parameters cannot be dynamically adjusted, leading to fluctuations in bonding performance.

Method used

A hierarchical microstructure layer is formed by physically reconstructing the surface of an aluminum substrate, and an intermetallic compound transition layer is deposited on it. Combined with thermal coupling, atomic diffusion behavior is controlled to form a metallurgical bonding interface. The bonding strength and stress release are optimized by adaptively adjusting process parameters.

Benefits of technology

It significantly improves the interfacial bonding strength between the aluminum substrate and the copper clad layer, effectively alleviates the stress caused by the difference in thermal expansion coefficients, ensures stable adhesion under extreme working conditions, and improves the high-temperature service reliability and bonding strength consistency of the product.

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Abstract

The present application relates to the technical field of aluminum substrate copper cladding, and particularly relates to a method and system for enhancing the bonding strength of an aluminum substrate copper cladding layer. The method comprises forming a microstructure layer through physical topography reconstruction, depositing a transition layer of intermetallic compound to obtain an interface transition structure, depositing copper material to form a copper cladding layer and control atomic diffusion to form a metallurgical bonding interface, applying thermal coupling to obtain a stress release structure, and generating a control instruction based on the deviation between the interface bonding strength parameter and the stress relief effect parameter for adaptive adjustment. The present application significantly improves the bonding strength of the copper cladding layer and relieves the interface thermal stress.
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