Cooling chamber and evaporation apparatus

Abstract

The application discloses a cooling chamber and an evaporation equipment. The cooling chamber is provided with an inner cavity for accommodating a carrier plate which carries at least one wafer. The cavity is provided with a transmission system for transmitting the carrier plate to a predetermined cooling position in the inner cavity. The bottom of the cavity is provided with a jacking device including a water-cooled plate, a jacking shaft and a driving assembly. The upper surface of the water-cooled plate is provided with a wafer contact surface for directly contacting the wafer. The jacking shaft penetrates through the bottom of the cavity to communicate the vacuum side with the atmospheric side. The driving assembly is arranged outside the cavity. The driving assembly drives the jacking shaft to lift and lower, and the jacking shaft drives the water-cooled plate to vertically lift and lower in the cavity. The wafer contact surface is in surface contact with the wafer on the carrier plate, and the wafer is rapidly cooled through heat conduction. The wafer is rapidly cooled in batches through the surface contact between the wafer contact surface and the wafer, so as to adapt to the Inline type evaporation production line and improve the overall production efficiency.

Description

Technical Field

[0001] This invention relates to the field of vacuum evaporation coating technology, and more particularly to a cooling chamber and evaporation equipment. Background Technology

[0002] Vacuum evaporation coating technology is a crucial step in semiconductor manufacturing, widely used in thin film deposition processes for integrated circuits, display panels, and optical devices. Before high-temperature coating processes such as electron beam evaporation or point-source evaporation, the wafer needs to be rapidly and uniformly heated to remove adsorbed moisture and other volatile impurities from its surface. This prevents defects such as bubbles and pinholes from forming during subsequent coating processes, which would affect film quality. After heating and degassing, the wafer temperature typically rises to a high level and must be rapidly cooled to room temperature before the next evaporation step can proceed. This prevents the wafer's base temperature from affecting the quality of the deposited film.

[0003] Existing wafer cooling technologies primarily employ non-contact radiative cooling. Specifically, this involves installing circulating cooling water pipes within a vacuum chamber, radiating heat to the wafer through the water-cooled pipe walls, or installing a cooling water jacket on the chamber walls to utilize radiative heat transfer. The advantages of this non-contact cooling method are its relatively simple structure, lack of complex moving mechanical parts, and reliable operation in a vacuum environment. However, radiative heat transfer efficiency is low, the heat transfer rate is slow, and it typically takes a considerable amount of time for the wafer to cool from high temperature to room temperature.

[0004] In modern semiconductor manufacturing's continuous production lines, especially inline automated lines, the speed of transition between processes directly impacts overall production efficiency. Existing non-contact radiation cooling methods, due to their slow cooling rate, struggle to meet the production line's cycle time requirements. After wafers complete their heating and degassing process, they need to remain in the cooling station for an extended period to cool down, thus limiting the overall production line's capacity. This bottleneck is particularly pronounced in batch production scenarios, where multiple wafers need to be processed consecutively, severely impacting the production line's overall output and equipment utilization.

[0005] Therefore, a technical solution is needed to achieve rapid cooling of wafers in a vacuum environment in order to improve cooling efficiency, shorten cooling time, meet the cycle time requirements of inline continuous production lines, and thus improve overall production efficiency. Summary of the Invention

[0006] The purpose of this invention is to provide a cooling chamber and vapor deposition equipment that enables rapid cooling of wafers in batches within an inline vapor deposition production line, thereby improving overall production efficiency.

[0007] To solve the above-mentioned technical problems, embodiments of the present invention provide a technical solution as follows: a cooling chamber, comprising: a cavity body and a cavity cover sealed to the top of the cavity body, the cavity body and the cavity cover forming an inner cavity, the inner cavity being used to accommodate a carrier plate carrying a wafer, the carrier plate carrying at least one wafer; a transmission system installed in the cavity body for transmitting the carrier plate to a predetermined cooling position in the inner cavity; a lifting device installed at the bottom of the cavity body, comprising a water-cooled plate, a lifting shaft and a drive assembly; the water-cooled... The plate is equipped with cooling water channels, and the upper surface of the water-cooled plate is provided with a wafer contact surface for direct contact with the wafer. The lifting shaft passes through the bottom of the cavity to connect the vacuum side and the atmospheric side. The water-cooled plate is located in the inner cavity and is connected to a drive assembly located outside the cavity via the lifting shaft. The drive assembly drives the lifting shaft to move up and down, and the lifting shaft drives the water-cooled plate to move vertically up and down within the cavity. When the water-cooled plate is raised, the wafer contact surface contacts the wafer surface on the carrier plate, and the wafer is rapidly cooled through heat conduction.

[0008] Furthermore, the drive assembly includes a servo motor and a guide mechanism for guiding the lifting shaft to move vertically up and down; the guide mechanism includes a guide rail fixedly connected to the bottom of the cavity and a slider that slides with the guide rail, and the lifting shaft is fixedly connected to the slider; the servo motor is fixedly connected to the guide rail via a mounting base plate, the output shaft of the servo motor is connected to a lead screw via a coupling, and the slider is threadedly connected to the lead screw, the two forming a helical pair.

[0009] Furthermore, a position sensor is provided on the movement path of the slider to limit the movement range of the slider, thereby limiting the lifting stroke of the lifting shaft.

[0010] Furthermore, the position sensor is a photoelectric sensor, which is mounted and fixed on the guide rail or mounting base plate, and includes an upper limit sensor and a lower limit sensor. The upper limit sensor is used to detect the rising position of the water-cooled plate, and the lower limit sensor is used to detect the falling and resetting position of the water-cooled plate.

[0011] Furthermore, the transmission system includes a power component and a transmission component. The power component includes a servo motor and a reducer. The transmission component includes a transmission shaft symmetrically arranged on both sides of the cavity. One end of the transmission shaft is connected to the power component, and the other end extends into the inner cavity and is provided with a roller for carrying the carrier plate. The roller is driven to rotate by the power component to drive the carrier plate to move.

[0012] Furthermore, the carrier plate is made of aluminum alloy, the surface of the carrier plate is hard anodized, and the bottom of the carrier plate and the contact surface with the roller are sandblasted.

[0013] Furthermore, a telescopic bellows is fitted onto the lifting shaft. One end of the bellows is fixed to the bottom of the cavity, and the other end is fixed to the atmospheric side of the lifting shaft, which is used to maintain the vacuum seal of the inner cavity while allowing the lifting shaft to move up and down.

[0014] Furthermore, the wafer contact surface of the water-cooled plate is mirror-polished to reduce contact thermal resistance and prevent scratching the wafer.

[0015] Furthermore, the carrier plate is provided with two wafer positioning holes, which correspond one-to-one with the two wafer contact surfaces on the water-cooling plate, so as to achieve simultaneous cooling of the two wafers.

[0016] To solve the above-mentioned technical problems, the present invention also provides a vapor deposition apparatus, including a heating chamber and a vapor deposition chamber, and a cooling chamber as described in any of the above claims disposed between the heating chamber and the vapor deposition chamber, wherein the cooling chamber is used to cool the wafer to room temperature before the wafer enters the vapor deposition chamber.

[0017] The cooling chamber and vapor deposition equipment provided by this invention, compared with the prior art, conduct heat through the surface contact between the water-cooled plate wafer contact surface and the wafer, which has a much higher heat transfer efficiency than non-contact radiation cooling. The cooling time is shortened to 5 to 15 seconds, and the cooling speed is increased several times. The rapid cooling capability enables the equipment to adapt to the cycle requirements of inline continuous production lines, eliminates the efficiency bottleneck of the cooling process, and greatly improves production efficiency. When the wafer does not move on the carrier plate, the water-cooled plate is driven to rise and fall vertically in the inner cavity by the lifting shaft. The wafer contact surface can directly contact the wafer plane to implement rapid cooling, which is beneficial to the continuous batch cooling operation of wafers and meets the cycle requirements of continuous production lines. In particular, by using servo motors and lead screw drives in the drive components, along with position sensors, precise control and reliable positioning of the water-cooled plate's lifting and lowering are achieved, ensuring parallel contact between the wafer and the water-cooled plate and guaranteeing consistent cooling performance. The lifting shaft design with a telescopic bellows effectively isolates the vacuum side from the atmospheric side, ensuring that the vacuum environment inside the cavity is not disrupted while enabling the reciprocating lifting and lowering motion of the water-cooled plate in the vacuum, thus solving the sealing problem of mechanical movement in a vacuum environment. Attached Figure Description

[0018] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings represent similar elements. Unless otherwise stated, the figures in the drawings do not constitute a limitation on scale.

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the cooling chamber in an embodiment of the present invention; Figure 2 This is a top view of the cooling chamber in an embodiment of the present invention; Figure 3 For the appendix Figure 2 Schematic diagram of the AA section; Figure 4 For the appendix Figure 3 Schematic diagram of the BB cross section; Figure 5 This is a schematic diagram of the lifting device structure in an embodiment of the present invention; Figure 6 This is a schematic diagram of the combined structure of the lifting device and the carrier plate in an embodiment of the present invention.

[0020] Explanation of reference numerals in the attached drawings: 1. Cavity; 11. Inner cavity; 2. Cavity cover; 3. Transmission system; 31. Drive shaft; 32. Roller; 4. Lifting device; 41. Water-cooled plate; 411. Cooling water channel; 412. Wafer contact surface; 42. Lifting shaft; 421. Bellows; 43. Drive assembly; 431. Servo motor; 432. Coupling; 433. Lead screw; 434. Guide rail; 435. Slider; 436. Mounting substrate; 437. Connecting seat; 5. Carrier plate; 51. Wafer positioning hole; 6. Frame; 7. Wafer; 8. Position sensor; 81. Upper limit sensor; 82. Lower limit sensor. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the various embodiments of this invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this invention to facilitate a better understanding of this application. However, the technical solutions claimed in the claims of this application can be implemented even without these technical details and with various variations and modifications based on the following embodiments.

[0022] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0023] like Figures 1-6 As shown, one embodiment of the present invention relates to a cooling chamber, including main components such as a chamber body 1, a chamber cover 2, a transmission system 3, a carrier plate 5, a lifting device 4, and a frame 6. The entire device is mounted on the frame 6, and the chamber body 1 is fixedly connected to the top of the frame 6 by bolts. The frame 6 is made of Q235B material and has a painted surface, providing a stable support platform for the device.

[0024] A cavity cover 2 is sealed at the top opening of cavity 1. Cavity cover 2 has a vent. The inner cavity 11 formed by cavity 1 and cavity cover 2 is used to accommodate carrier plates 5 that support wafers 7. Each carrier plate 5 can support at least one wafer 7. The inner wall of cavity 1 is passivated after electrolytic polishing, and the outer wall is passivated after sandblasting. Electrolytic polishing makes the inner wall surface smooth and reduces particulate contamination sources, while passivation forms a dense oxide film, improving corrosion resistance. A vent (not shown in the attached diagram) on the cavity wall is connected to a vacuum pump system (not shown in the attached diagram) to evacuate the inner cavity 11 to a vacuum state.

[0025] The transmission system 3 is installed in the cavity 1 and is used to transport the carrier plate 5 to a predetermined cooling position in the inner cavity 11. In one example, the transmission system 3 includes a power component and a transmission component. The power component includes a servo motor and a reducer. The transmission component includes a transmission shaft 31 symmetrically arranged on both sides of the cavity 1. One end of the transmission shaft 31 is connected to the power component, and the other end extends into the inner cavity 11 and is provided with a roller 32 for carrying the carrier plate 5. The roller 32 rotates around its own central axis under the drive of the power component to drive the carrier plate 5 to move.

[0026] The lifting device 4 is installed at the bottom of the cavity 1 and includes a water-cooled plate 41, a lifting shaft 42, and a drive assembly 43. The water-cooled plate 41 has a cooling water channel 411 inside, and its upper surface has a wafer contact surface 412 for direct contact with the wafer 7. Heat conduction occurs through the surface contact between the water-cooled plate 41 and the wafer 7, effectively improving the cooling rate of the wafer 7. Preferably, the water-cooled plate 41 is made of 6061-T6 aluminum alloy, which has good thermal conductivity and can quickly transfer heat from the wafer 7 to the internal cooling water channel 411. Preferably, the wafer contact surface 412 of the water-cooled plate 41 is mirror-polished to further reduce contact thermal resistance and prevent scratching the wafer 7. The mirror-polished wafer contact surface 412 has high surface flatness and low roughness, allowing it to fully adhere to the wafer 7, increasing the contact area, improving heat conduction efficiency, and preventing scratches on the wafer 7 surface. The lifting shaft 42 passes through the bottom of the cavity 1 to connect the vacuum side and the atmospheric side; the water-cooled plate 41 is located in the inner cavity 11 and is connected to the drive assembly 43 located outside the cavity 1 through the lifting shaft 42; the drive assembly 43 drives the lifting shaft 42 to rise and fall, and the lifting shaft 42 drives the water-cooled plate 41 to rise and fall vertically in the cavity 1; when the water-cooled plate 41 rises, the wafer contact surface 412 contacts the wafer 7 on the carrier plate 5, and the wafer 7 is rapidly cooled through heat conduction; after the wafer is cooled, the lifting shaft 42 is controlled to drive the water-cooled plate 41 to fall and reset, and the transmission system 3 drives the carrier plate 5 to transfer the wafer 7. Preferably, in order to maintain the vacuum seal of the inner cavity 11 during the lifting and lowering process of the lifting shaft 42, a telescopic bellows 421 is fitted onto the lifting shaft 42. One end of the bellows 421 is fixed to the bottom of the cavity 1, and the other end is fixed to the atmospheric side of the lifting shaft 42, so as to maintain the vacuum seal of the inner cavity 11 while allowing the lifting shaft 42 to move up and down. When the lifting shaft 42 reciprocates, the telescopic bellows 421 expands and contracts accordingly, while maintaining the vacuum seal, effectively isolating the vacuum side from the atmospheric side, and ensuring that the vacuum environment of the inner cavity 11 is not disturbed.

[0027] like Figure 6As shown, in one example, the carrier plate 5 is preferably made of 6063-T6 aluminum alloy. The surface of the carrier plate 5 is hard anodized to improve surface hardness and wear resistance, while the oxide layer has good insulation and corrosion resistance. The bottom of the carrier plate 5 and the contact surface with the roller 32 are sandblasted to increase surface roughness and increase friction between the carrier plate 5 and the roller 32, preventing the carrier plate 5 from slipping during transport. The carrier plate 5 is provided with multiple through holes adapted to the size of the wafer to be heated. The through holes are wafer positioning holes 51, which are used to hold and position the wafer 7. In this embodiment, the carrier plate 5 is provided with two wafer positioning holes 51, which are used to place 12-inch wafers 7. Correspondingly, the water-cooling plate 41 is also provided with two wafer contact surfaces 412, which correspond one-to-one with the wafer positioning holes 51, so that the two wafers 7 carried on the carrier plate 5 can be cooled simultaneously to improve the batch processing capacity of the cooling chamber.

[0028] like Figures 3-6 As shown, in one embodiment, a cooling chamber is provided, including a cavity 1. A lifting device 4 is installed at the bottom of the cavity 1. The lifting device 4 includes a water-cooled plate 41, a lifting shaft 42, and a drive assembly 43. The drive assembly 43 includes a servo motor 431 and a guide mechanism for guiding the lifting shaft 42 to move vertically. The guide mechanism includes a guide rail 434 fixedly connected to the bottom of the cavity 1 and a slider 435 slidably engaged with the guide rail 434. The lifting shaft 42 is fixedly connected to the slider 435 via a connecting seat 437. The servo motor 431 is fixedly connected to the guide rail 434 via a mounting base 436. The output shaft of the servo motor 431 is connected to a lead screw 433 via a coupling 432. The slider 435 is threadedly connected to the lead screw 433, forming a helical pair. The servo motor 431 drives the lead screw 433 to rotate, causing the slider 435 to move linearly along the guide rail 434, thereby driving the lifting shaft 42 to move vertically. Preferably, a position sensor 8 is provided on the movement path of the slider 435 to limit the movement range of the slider 435, thereby limiting the lifting stroke of the lifting shaft 42. Figure 5 As shown, in order to improve the control of the lifting accuracy of the water-cooled plate 41, the position sensor 8 is a photoelectric sensor, which is installed and fixed on the guide rail 434 or the mounting base plate 436. It includes an upper limit sensor 81 and a lower limit sensor 82. The upper limit sensor 81 is used to detect the rising position of the water-cooled plate 41, that is, the wafer contact surface 412 of the water-cooled plate 41 is in contact with the lower end surface of the wafer 7, and surface contact heat conduction can be performed. The lower limit sensor 82 is used to detect the falling and resetting position of the water-cooled plate 41.

[0029] In one embodiment of the present invention, the process of rapidly cooling the wafer 7 through the cooling chamber is as follows: a carrier plate 5 carrying at least one wafer 7 is transferred to a predetermined cooling position in the cooling chamber via a transmission system 3; the inlet and outlet of the cooling chamber are closed; the inner cavity 11 is evacuated; the lifting device 4 is activated; and the water-cooled plate 41 is driven to rise vertically, so that the wafer contact surface 412 of the water-cooled plate 41 directly contacts the wafer 7; at the same time, cooling water is circulated in the cooling water channel 411 within the water-cooled plate 41; the water-cooled plate 41 is kept in direct contact with the wafer 7 for a preset time, and the heat of the wafer 7 is rapidly transferred to the water-cooled plate 41 through heat conduction, completing the cooling; the water-cooled plate 41 is driven to descend vertically to reset and detach from the wafer 7; and the carrier plate 5 is transferred to the next process via the transmission system 3. The lifting stroke is controlled by the servo motor 431 and position sensor 8 of the lifting device 4. The stroke is precisely adjusted according to the actual situation, and the lifting stroke range of the water-cooled plate 41 is 15mm to 20mm. The preset time is determined based on the initial temperature of the wafer 7 and the preset cooling temperature. The preset time is 5 seconds to 15 seconds, meaning that the cooling of the wafer 7 can be completed in 5-15 seconds, so that the cooling cycle matches the overall cycle of the production line.

[0030] Embodiments of the present invention also provide a vapor deposition apparatus, comprising a heating chamber (not shown in the accompanying drawings), a cooling chamber, and a vapor deposition chamber (not shown in the accompanying drawings) arranged sequentially. The cooling chamber may be any of the aforementioned cooling chambers.

[0031] After being heated and degassed in the heating chamber 11, the carrier plate 5 is transferred to the cooling chamber for rapid cooling to room temperature. It is then conveyed to the evaporation chamber via the transmission system 3, where a vacuum evaporation process is performed. This evaporation equipment is a component of a continuous production line for electron beam evaporation or point source evaporation. The cooling chamber is used for continuous batch cooling of the wafers 7 before the evaporation process. Under the action of the lifting device 4, the water-cooled plate 41 can make contact with the wafers 7 on the carrier plate 5 for heat conduction, achieving rapid cooling of the wafers 7 and meeting the cycle time requirements of an inline continuous production line, thereby improving overall production efficiency.

[0032] The cooling chamber and vapor deposition equipment provided by this invention conduct heat through surface contact between the water-cooled plate wafer contact surface and the wafer, resulting in a heat transfer efficiency far exceeding that of non-contact radiation cooling. The cooling time is shortened to 5 to 15 seconds, and the cooling speed is increased several times. This rapid cooling capability enables the equipment to adapt to the cycle time requirements of inline continuous production lines, eliminating the efficiency bottleneck of the cooling process and greatly improving production efficiency. With the wafer remaining stationary on the carrier plate, the water-cooled plate is vertically raised and lowered within the cavity via a lifting shaft, allowing the wafer contact surface to directly contact the wafer plane for rapid cooling. This facilitates continuous batch cooling operations of wafers and meets the cycle time requirements of continuous production lines. In particular, by using servo motors and lead screw drives in the drive components, along with position sensors, precise control and reliable positioning of the water-cooled plate's lifting and lowering are achieved, ensuring parallel contact between the wafer and the water-cooled plate and guaranteeing consistent cooling performance. The lifting shaft design with a telescopic bellows effectively isolates the vacuum side from the atmospheric side, ensuring that the vacuum environment inside the cavity is not disrupted while enabling the reciprocating lifting and lowering motion of the water-cooled plate in the vacuum, thus solving the sealing problem of mechanical movement in a vacuum environment.

[0033] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the claims.

Claims

1. A cooling chamber, characterized in that, include: A cavity (1) and a cavity cover (2) sealed to the top of the cavity (1), the cavity (1) and the cavity cover (2) together form an inner cavity (11), the inner cavity (11) is used to accommodate a carrier plate (5) that carries a wafer (7), the carrier plate (5) carries at least one wafer (7); A transmission system (3) is installed in the cavity (1) for transmitting the carrier plate (5) to a predetermined cooling position in the inner cavity (11); A lifting device (4) is installed at the bottom of the cavity (1) and includes a water-cooled plate (41), a lifting shaft (42), and a drive assembly (43). The water-cooled plate (41) has a cooling water channel (411) inside and a wafer contact surface (412) for direct contact with the wafer (7) on the upper surface of the water-cooled plate (41). The lifting shaft (42) passes through the bottom of the cavity (1) to connect the vacuum side and the atmospheric side. The water-cooled plate (41) is located in the inner cavity (11) and is connected to the drive assembly (43) located outside the cavity (1) through the lifting shaft (42). The drive assembly (43) drives the lifting shaft (42) to rise and fall, and the lifting shaft (42) drives the water cooling plate (41) to rise and fall vertically in the cavity (1); when the water cooling plate (41) rises, the wafer contact surface (412) contacts the wafer (7) on the carrier plate (5) and cools the wafer (7) rapidly through heat conduction.

2. The cooling chamber according to claim 1, characterized in that, The drive assembly (43) includes a servo motor (431) and a guide mechanism for guiding the lifting shaft (42) to move vertically up and down. The guide mechanism includes a guide rail (434) fixedly connected to the bottom of the cavity (1) and a slider (435) slidably engaged with the guide rail (434). The lifting shaft (42) is fixedly connected to the slider (435). The servo motor (431) is fixedly connected to the guide rail (434) via a mounting base plate (436). The output shaft of the servo motor (431) is connected to the lead screw (433) via a coupling (432). The slider (435) is threadedly connected to the lead screw (433), and the two form a helical pair.

3. The cooling chamber according to claim 2, characterized in that, A position sensor (8) is provided on the movement path of the slider (435) to limit the movement range of the slider (435), thereby limiting the lifting stroke of the lifting shaft (42).

4. The cooling chamber according to claim 3, characterized in that, The position sensor (8) is a photoelectric sensor, which is installed and fixed on the guide rail (434) or the mounting base plate (436). It includes an upper limit sensor (81) and a lower limit sensor (82). The upper limit sensor (81) is used to detect the rising position of the water-cooled plate (41), and the lower limit sensor (82) is used to detect the falling and resetting position of the water-cooled plate (41).

5. The cooling chamber according to claim 1, characterized in that, The transmission system (3) includes a power component and a transmission component. The power component includes a servo motor and a reducer. The transmission component includes a transmission shaft (31) symmetrically arranged on both sides of the cavity (1). One end of the transmission shaft (31) is connected to the power component, and the other end extends to the inner cavity (11) and is provided with a roller (32) for carrying the carrier plate (5). The roller (32) is driven to rotate by the power component to drive the carrier plate (5) to move.

6. The cooling chamber according to claim 5, characterized in that, The carrier plate (5) is made of aluminum alloy. The surface of the carrier plate (5) is hard anodized. The bottom of the carrier plate (5) and the contact surface with the roller (32) are sandblasted.

7. The cooling chamber according to claim 1, characterized in that, A telescopic bellows (421) is fitted on the lifting shaft (42). One end of the bellows (421) is fixed to the bottom of the cavity (1), and the other end is fixed to the atmospheric side of the lifting shaft (42). This is used to maintain the vacuum seal of the inner cavity (11) while allowing the lifting shaft (42) to move up and down.

8. The cooling chamber according to claim 1, characterized in that, The wafer contact surface (412) of the water-cooled plate (41) is mirror-polished to reduce contact thermal resistance and prevent scratching of the wafer (7).

9. The cooling chamber according to claim 1, characterized in that, The carrier plate (5) is provided with two wafer positioning holes (51), which correspond one-to-one with the two wafer contact surfaces (412) on the water cooling plate (41) to achieve simultaneous cooling of the two wafers (7).

10. A vapor deposition apparatus, characterized in that, It includes a heating chamber and a vapor deposition chamber, and a cooling chamber as described in any one of claims 1-9 disposed between the heating chamber and the vapor deposition chamber, the cooling chamber being used to cool the wafer (7) to room temperature before the wafer (7) enters the vapor deposition chamber.

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