Method and device for detecting a capacitor core package

Abstract

The application discloses a kind of detection methods of capacitor core package, including obtaining the pressure value when positive and negative pole of capacitor core package is flattened by pin flattening mechanism, the pressure value is converted into electrical signal;The thickness data is converted into electrical signal based on preset pressure thickness calibration curve, the thickness data is evaluated according to preset qualified range, and the evaluation result of the capacitor core package is obtained.The application also discloses a kind of detection device of capacitor core package.The thickness data is obtained by obtaining the pressure value when positive and negative pole is flattened, and the thickness difference of positive and negative pole pin can be accurately captured, so as to avoid the quality problems such as capacitor heating, service life shortening caused by excessive thickness from the source, and guarantee the reliability of core package and pin connection.

Description

Technical Field

[0001] This invention relates to the field of electrolytic capacitor core pack nailing and winding machines, and more particularly to a method and apparatus for detecting capacitor core packs. Background Technology

[0002] In the production process of electrolytic capacitor cores, the thickness accuracy of the positive and negative pins after flattening by the pinning machine plays a crucial role, directly determining the reliability of the connection between the core and the leads. If the pin thickness exceeds the standard range, it can cause a series of serious problems. From a quality perspective, excessive thickness can easily lead to poor soldering of the core, increasing contact resistance, causing the capacitor to overheat, and significantly shortening its lifespan. From a cost and risk perspective, if these defective products flow into the downstream packaging process, it will not only significantly increase rework costs but also increase the risk of customer complaints, damaging the company's market reputation.

[0003] In the existing technology, there is a lack of high-precision detection methods for the thickness of the positive and negative electrodes of the nail during the detection process of the capacitor core package, making it impossible to monitor the thickness of the nail in real time and accurately. Summary of the Invention

[0004] The main objective of this invention is to solve the technical problems described in the background section.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a method for detecting capacitor core packages, the method comprising: Obtain the pressure value when the positive and negative terminals of the nails on the capacitor core are flattened by the flattening mechanism, and convert the pressure value into an electrical signal; The electrical signal is converted into thickness data based on a preset pressure-thickness calibration curve. The thickness data is then evaluated according to a preset acceptable range to obtain the evaluation result of the capacitor core package.

[0006] Preferably, after the step of converting the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluating the thickness data according to a preset acceptable range, and obtaining the evaluation result of the capacitor core package, the method further includes: When the evaluation result is unqualified, a first appearance image is obtained, and the capacitor core package is located according to the first appearance image to obtain the coordinate position. A kick signal is generated according to the evaluation result and the coordinate position. The first appearance image includes the appearance image of the positive and negative terminals of the pins on the capacitor core package. The capacitor core is kicked out using the kick signal.

[0007] Preferably, after the step of converting the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluating the thickness data according to a preset acceptable range, and obtaining the evaluation result of the capacitor core package, the method further includes: When the evaluation result is qualified, the next step is to obtain the pressure value when the positive and negative terminals of the nails on the capacitor core are flattened by the flattening mechanism, and convert the pressure value into an electrical signal.

[0008] Preferably, the steps of obtaining a first appearance image when the evaluation result is unqualified, locating the capacitor core package according to the first appearance image to obtain its coordinate position, and generating a kick signal according to the evaluation result and the coordinate position can be replaced by: When the evaluation result is qualified, a first appearance image is obtained to perform a first defect identification and obtain a first identification result. The first appearance image includes the appearance images of the positive and negative terminals of the nail on the capacitor core package. When the first identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the first appearance image, and a kick signal is generated based on the first identification result and the coordinate position.

[0009] Preferably, after the step of acquiring a first appearance image and performing first defect identification to obtain a first identification result when the evaluation result is qualified, the method includes: When the first identification result is qualified, a second appearance image is acquired for second defect identification to obtain a second identification result. The second appearance image includes the appearance image of the capacitor core package. When the second identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the capacitor core package through the second appearance image, and a kick signal is generated according to the second identification result and the coordinate position.

[0010] Preferably, the step of converting the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluating the thickness data according to a preset acceptable range, and obtaining the evaluation result of the capacitor core package includes: When the thickness data exceeds the preset acceptable range, a warning of excessive pressure will be displayed on the screen. When the thickness data is lower than the preset acceptable range, a warning message indicating insufficient pressure will be displayed on the screen.

[0011] Secondly, the present invention provides a detection device for capacitor core packages, characterized in that the detection device for capacitor core packages comprises: A pressure sensor is installed at the lower end of the flattening mechanism of the nail roll machine. It is used to obtain the pressure value of the positive and negative poles of the nail on the capacitor core package when the flattening mechanism is flattened, and convert the pressure value into an electrical signal. The central controller, connected to the pressure sensor, is used to convert the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluate the thickness data according to a preset acceptable range, and obtain the evaluation result of the capacitor core package.

[0012] Preferably, the detection device for the capacitor core package further includes: A visual positioning mechanism, connected to the central controller, is used to acquire a first appearance image when the evaluation result is unqualified, locate the capacitor core package according to the first appearance image to obtain the coordinate position, and generate a kick signal according to the evaluation result and the coordinate position. The first appearance image includes the appearance image of the positive and negative terminals of the pins on the capacitor core package. The kicking mechanism is used to kick the core package made by the positive and negative pins through the kicking signal.

[0013] Preferably, the visual positioning mechanism is further configured to, when the evaluation result is qualified, acquire a first appearance image to perform a first defect identification and obtain a first identification result, wherein the first appearance image includes the appearance images of the positive and negative terminals of the pins on the capacitor core package; when the first identification result is unqualified, locate the capacitor core package using the first appearance image to obtain a coordinate position, and generate a kicking signal based on the first identification result and the coordinate position.

[0014] Preferably, the visual positioning mechanism further includes: A first camera is used to acquire a first appearance image when the evaluation result is qualified; An industrial control computer is used for first defect identification to obtain a first identification result. When the first identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the capacitor core through the first appearance image, and a kick signal is generated according to the first identification result and the coordinate position.

[0015] This invention obtains thickness data by acquiring the pressure value when the positive and negative electrodes of the pin are flattened. This allows for precise capture of the thickness difference between the positive and negative pins, preventing quality problems such as capacitor overheating and shortened lifespan caused by excessive thickness from the source. It ensures the reliability of the connection between the core package and the pins. At the same time, it can monitor the machine status by observing changes in pressure value and thickness data, quickly identify fault factors, and the evaluation process does not require manual intervention, reducing detection deviations caused by human factors and ensuring the stability of core package quality in mass production. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a flowchart illustrating a method for detecting capacitor core packages according to an embodiment of the present invention. Figure 2 This is a flowchart illustrating a method for detecting capacitor core packages according to an embodiment of the present invention. Figure 3 This is a flowchart illustrating a method for detecting capacitor core packages according to an embodiment of the present invention. Figure 4 This is a flowchart illustrating a method for detecting capacitor core packages according to an embodiment of the present invention. Figure 5 This is a schematic diagram of the structure of a capacitor core package detection device in one embodiment of the present invention; Figure 6 This is a schematic diagram of the interface of a display in one embodiment of the present invention; Figure 7 This is a schematic diagram of the interface of a display in one embodiment of the present invention; Figure 8 This is a schematic diagram of the installation position of the pressure sensor in one embodiment of the present invention. Detailed Implementation

[0018] To better understand the above technical solutions, exemplary embodiments of this disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art.

[0019] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0020] It should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the coordinate system shown in the accompanying drawings. They are used only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0021] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0023] Firstly, referring to Figure 1 This invention provides a method for detecting capacitor core packages, the method comprising: S100, obtain the pressure value when the positive and negative poles of the nail on the capacitor core are flattened by the flattening mechanism, and convert the pressure value into an electrical signal; Specifically, when the flattening mechanism of the stapler flattens the positive and negative poles of the staples, a sensing device (specifically a pressure sensor) detects the pressure change, obtains the pressure value after flattening, and converts the pressure value into an analog electrical signal (such as 0-10V or 4-20mA). The detection accuracy is 0.01mm, the repeatability is 0.03μm, the detection distance is 20-100mm (adapted to the installation space of the stapler flattening mechanism), the protection level is IP68, the temperature range is -15℃ to 55℃, and it can resist corrosion from electrolytic paper dust and trace electrolyte volatiles. It is suitable for the production environment of the stapler. The pressure sensor can be installed directly below the stapler flattening mechanism via an M10 thread to detect pressure changes.

[0024] S200: Based on a preset pressure-thickness calibration curve, the electrical signal is converted into thickness data, and the thickness data is evaluated according to a preset acceptable range to obtain the evaluation result of the capacitor core package.

[0025] Specifically, the system receives electrical signals and converts them into thickness data according to a preset pressure-thickness calibration curve. The thickness data detection accuracy is 0.01mm, and the repeatability is 0.03μm. The thickness data mainly includes the thickness of the positive and negative electrodes of the nail. The thickness of the positive and negative electrodes of the nail is then evaluated according to a preset acceptable range to obtain an evaluation result. The evaluation result includes qualified / good (both the thickness of the positive and negative electrodes of the nail meets the preset acceptable range) and unqualified / defective (the thickness of the positive electrode of the nail does not meet the preset acceptable range or the thickness of the negative electrode of the nail does not meet the preset acceptable range). When the evaluation result is unqualified, an NG signal is generated according to the evaluation result. When the NG signal is sent, a corresponding NG signal delay trigger is set (default is 0.1 seconds). In this step, the communication baud rate can also be set to 9600 or 19200bp. An example of the preset acceptable range is: the preset acceptable range of the positive electrode is set to 0.397-0.403mm, and the preset acceptable range of the negative electrode is set to 0.347-0.353mm.

[0026] In this embodiment, the present invention obtains thickness data by acquiring the pressure value when the positive and negative electrodes of the pin are flattened. This allows for precise capture of the thickness difference between the positive and negative pins, preventing quality problems such as capacitor overheating and shortened lifespan caused by excessive thickness from the source. This ensures the reliability of the connection between the core package and the pins. At the same time, the machine status can be monitored by observing changes in pressure value and thickness data, quickly identifying fault factors. The evaluation process requires no manual intervention, reducing detection deviations caused by human factors and ensuring the stability of core package quality in mass production.

[0027] In one implementation, refer to Figure 2 S200, after the step of converting the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluating the thickness data according to a preset acceptable range, and obtaining the evaluation result of the capacitor core package, includes: S300, when the evaluation result is unqualified, a first appearance image is obtained, the capacitor core package is positioned according to the first appearance image to obtain the coordinate position, and a kick signal is generated according to the evaluation result and the coordinate position. The first appearance image includes the appearance image of the positive and negative terminals of the pins on the capacitor core package. Specifically, when the evaluation result is unqualified (i.e., the thickness of the positive and / or negative electrode of the pin exceeds the preset qualified range), the vision system is triggered. The vision system adopts a one-to-three mode (i.e., one industrial computer connects to three industrial cameras), each responsible for the visual inspection task of different workstations. The first industrial camera is aimed at the exit of the pin flattening workstation. When the thickness detection result is unqualified, it immediately takes a picture of the appearance of the positive and negative electrodes of the pin on the capacitor core package to obtain the first appearance image. The industrial computer has a "pin positioning recognition template" preset based on the standard good pin image. When the thickness detection is unqualified and the shooting is triggered, the industrial computer compares the first appearance image with the template through image processing algorithms (such as template matching and edge detection), quickly identifies and locates the pin area in the image, and then converts the image coordinates into actual coordinates on the conveyor line through calibration parameters to obtain the coordinate position of the defective capacitor core package. Based on the evaluation result and coordinate position, a kick signal is generated. S400, kicking the capacitor core pack by the kicking signal.

[0028] Specifically, the industrial control computer sends a kick signal to the PLC control system of the nailing machine via an IO interface or RS485 communication. After receiving the kick signal, the PLC, in conjunction with the photoelectric sensor signals on the conveyor line, tracks the position of defective products through a shift register or queue instructions. When the defective product reaches the kicking mechanism, the air valve is triggered to remove the defective capacitor core package online, preventing it from flowing into subsequent processes. The triggering of the kick signal can be set with a delay time (default 0.1 seconds) to ensure accurate action of the kicking mechanism. Through this process, thickness detection and defective product removal are performed immediately after the nail is flattened, without waiting for the capacitor core package to be fully made. This effectively avoids material waste in subsequent processes, reduces rework and scrap costs, and ensures the production quality of the capacitor core package. In addition, the evaluation results included in the kick signal allow staff to query the data through the backend or a monitor, ensuring the accuracy of end-to-end quality traceability, the efficiency of problem diagnosis, the controllability of the production process, and the standardization of data management.

[0029] In one implementation, after step S200, which involves converting the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluating the thickness data according to a preset acceptable range, and obtaining the evaluation result of the capacitor core package, the method further includes: When the evaluation result is qualified, the next step is to obtain the pressure value when the positive and negative terminals of the nails on the capacitor core are flattened by the flattening mechanism, and convert the pressure value into an electrical signal.

[0030] Specifically, the detection process of the capacitor core pack is continuously automated: the continuous capacitor core packs conveyed on the working belt of the nailing machine in the order of the processing flow are collected in real time by pressure sensors pre-installed below the flattening mechanism, which collect the pressure values ​​of the positive and negative terminals of the nail pins on each capacitor core pack when they are flattened by the flattening mechanism. During the process of the capacitor core pack being conveyed from the working range of the flattening mechanism to the working range of the kicking mechanism (the short-circuit kicking structure built into the customer's nailing machine), the thickness detection, thickness data conversion and conformity assessment are completed in sequence. If the assessment is a defective product (unqualified), the coordinate positioning will be completed within a specified time and a standardized kicking signal will be generated. This kicking signal will be executed when the corresponding defective product arrives at the kicking mechanism. For example, when the first capacitor core package reaches the working range of the kicking mechanism, the thickness data of the positive and negative electrodes of the nail of the nth capacitor core package has been collected, and the evaluation of the (n-1)th capacitor core package has been completed. At the same time, the kicking signal of the unqualified core package is stored in the PLC / backend (the PLC is a component of the nail rolling machine and is used to control the kicking mechanism built into the nail rolling machine). When the corresponding unqualified core package is transmitted to the working range of the kicking mechanism, the PLC / backend drives the kicking mechanism to accurately execute the kicking action. The whole process does not require staff to monitor the test results in real time or manually trigger the test process. The production line can reduce the input of test personnel, effectively reduce labor costs, and avoid the test delay or misjudgment problem caused by human operation.

[0031] In one implementation, refer to Figure 3 In step S300, when the evaluation result is unqualified, the steps of acquiring a first appearance image, locating the capacitor core package according to the first appearance image to obtain its coordinate position, and generating a kick signal based on the evaluation result and the coordinate position can be replaced by: S310, when the evaluation result is qualified, a first appearance image is obtained to perform a first defect identification and obtain a first identification result. The first appearance image includes the appearance images of the positive and negative terminals of the nail on the capacitor core package. Specifically, the first defect identification is an appearance inspection of the semi-finished capacitor core package. The inspection items include petal area, petal defects, missing nail holes, nail head misalignment, nail misalignment, empty material, foil cracks, and the distance between the nail head and the foil being too close or too far. When any inspection item fails, the first identification result is unqualified. If the inspection result is unqualified, the inspection result also includes the reason for the unqualified (i.e., the name and data of the unqualified item). The first defect identification can be implemented using image recognition methods in the existing technology, such as appearance defect detection based on template matching, defect classification and localization based on deep learning, etc. (existing public technologies can be cited).

[0032] S320, when the first identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the capacitor core package through the first appearance image, and a kick signal is generated according to the first identification result and the coordinate position.

[0033] Specifically, the acquisition of the positioning coordinates and the execution of the kick signal are described above and will not be repeated here.

[0034] In this embodiment, by independently layering and detecting thickness and appearance, multi-dimensional quality control, early removal of defective products, and closed-loop data traceability are achieved without increasing the production line cycle time.

[0035] In one implementation, refer to Figure 4 S310, after the step of acquiring a first appearance image and performing first defect identification to obtain a first identification result when the evaluation result is qualified, includes: S311, when the first identification result is qualified, a second appearance image is acquired to perform a second defect identification, and a second identification result is obtained. The second appearance image includes the appearance image of the capacitor core package. Specifically, the second defect identification is an appearance inspection of the finished capacitor core package. The inspection items include core package width, core package height, uneven pins, and missing pins. When any inspection item fails, the second identification result is unqualified. This identification method can refer to the existing technology for appearance defect detection methods of capacitor core packages. If the inspection result is unqualified, the inspection result also includes the reason for the unqualified result (i.e., the name and data of the unqualified item). This identification method can be implemented using the existing image recognition method. In addition, as mentioned in the above embodiment, the vision system adopts a one-to-three mode. In this embodiment, the second appearance image is acquired through a second industrial camera. The second industrial camera is set at the output end of the finished capacitor core package, that is, the station after the core package is completely made and before it enters the receiving box or conveyor belt.

[0036] S312, when the second identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the capacitor core package through the second appearance image, and a kick signal is generated according to the second identification result and the coordinate position.

[0037] Specifically, the acquisition of the positioning coordinates and the execution of the kick signal are described above and will not be repeated here.

[0038] In one implementation, refer to Figure 6 The step S200, which involves converting the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluating the thickness data according to a preset acceptable range, and obtaining the evaluation result of the capacitor core package, includes: When the thickness data exceeds the preset acceptable range, a warning of excessive pressure will be displayed on the screen. When the thickness data is lower than the preset acceptable range, a warning of insufficient pressure will be displayed on the screen. Meanwhile, in this embodiment, when the thickness data is within the preset acceptable range but the fluctuation range of multiple consecutive measurements exceeds the preset fluctuation threshold, a mechanical abnormality is indicated through the display. When the thickness data is within the preset acceptable range but the measured value continues to deviate from the upper or lower limit of the acceptable range without significant fluctuation, a material abnormality warning will be displayed on the screen.

[0039] The causes of changes in the flattening thickness include bearing damage, loose screws, foreign objects in the flattening area (such as stuck guide pillows or dust accumulation), and material abnormalities. When these conditions exist, they will inevitably lead to changes in pressure.

[0040] Specifically, under normal mechanical conditions, excessively thick material will cause the sensor reading to be too high (due to excessive pressure), resulting in an overestimation of the actual physical thickness. Conversely, if the material is normal but the mechanical pressure increases (e.g., due to bearing jamming), the core pack will be compressed too tightly, causing the physical thickness to decrease. However, the thickness data calculated from the pressure displayed on the screen will be higher than expected. When a discrepancy is found between the pressure fluctuation and the thickness data change trend, or to verify the drift of the sensor during long-term operation, the true physical thickness can be obtained through manual verification (manual measurement). If the thickness displayed on the screen deviates from the manually measured thickness in the opposite direction (e.g., the screen shows a higher thickness, while the manual measurement shows a lower thickness), it can be determined that a mechanical component has malfunctioned (e.g., a faulty pressure transmission mechanism). By monitoring the thickness of the positive and negative poles of the stapler needles online and combining this with dynamic pressure changes, not only can the thickness be precisely controlled, but the working status of the stapler can also be diagnosed in real time. This effectively prevents the generation of batch defective products due to mechanical equipment failure, reduces rework and scrap costs, minimizes equipment cascading losses, and extends the service life of the machinery. Meanwhile, by combining automatic alarms with manual verification, the accuracy of thickness detection data can be ensured, avoiding "false judgment of qualified" or "false judgment of unqualified", thereby shortening the troubleshooting time, improving the production line utilization rate, stabilizing the production line rhythm, and ensuring the order delivery schedule.

[0041] Secondly, referring to Figure 5 , Figure 7 and Figure 8 The present invention provides a detection device for capacitor core packages, the detection device comprising: Pressure sensor 100 is located below the flattening mechanism of the nail roll machine. It is used to obtain the pressure value of the positive and negative poles of the nail on the capacitor core package when the flattening mechanism is flattened, and convert the pressure value into an electrical signal. The central controller 200 is connected to the pressure sensor and is used to convert the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluate the thickness data according to a preset acceptable range, and obtain the evaluation result of the capacitor core package.

[0042] The pressure sensor 100 is used to acquire the pressure when the positive and negative poles of the nail needle are pressed together and convert the pressure into an electrical signal. The central controller 200 is used to convert the electrical signal into thickness data and generate a thickness defect signal based on the unqualified thickness data. Specifically, the pressure sensor 100 can be installed directly below the nail machine pressing mechanism via an M10 thread. It can measure the pressure value when the positive and negative poles of the nail needle are pressed together. The pressure sensor has a detection accuracy of 0.01mm, a repeatability of ±0.03μm, a preset distance of 20-100mm (adapting to the installation space of the nail machine pressing mechanism), an IP68 protection rating, a temperature range of -15℃ to 55℃, and can resist corrosion from electrolytic paper dust and trace electrolyte volatiles, making it suitable for the production environment of the nail rolling machine. The central controller 200 is fixed in the electrical cabinet (near the PLC) where the industrial control computer of the vision positioning mechanism 300 is located. The control interface and the vision positioning mechanism 300 share a display, with a separate window. The installation location should ensure good ventilation (to avoid overheating of the controller). The wiring process includes connecting the central controller 200 to a 24V DC power supply, connecting the analog (AI1 / AI2) and digital (DI1 / DI2) signals of the pressure sensor 100, and connecting the central controller 200 to the 485 communication interface of the nailing machine PCL via an RS485 communication cable. When wiring, pay attention to the polarity of the A / B lines of the nailing machine (controller A connects to PLC A, controller B connects to PLC B) to avoid communication failure due to reverse connection.

[0043] The central controller 200 supports signal input from two pressure sensors (corresponding to the positive and negative terminals of the nail respectively), and features a 16-bit AD sampling module with a sampling frequency of 500kHz, capable of accurately acquiring the analog electrical signals output by the pressure sensor 100. This AD sampling data serves as the raw input for thickness conversion—the controller substitutes the acquired voltage value (0-10V) into a preset pressure-thickness calibration curve, and calculates the corresponding nail thickness value through interpolation or fitting algorithms. The controller has a built-in parameter setting function, allowing configuration of the acceptable thickness range for the positive and negative terminals (e.g., positive 0.397-0.403mm, negative 0.347-0.353mm), NG signal trigger delay (default 0.1 seconds), communication baud rate (9600 / 19200bps selectable), and other parameters. Parameter settings are automatically saved to power-off retention memory. The central controller 200 supports RS485 communication (Modbus-RTU protocol) and digital I / O interfaces, enabling the transmission of thickness data and NG signals to a PLC or vision positioning mechanism 300.

[0044] The pressure sensor 100 and the central controller 200 are connected by a shielded twisted-pair cable to transmit analog signals (0-10V, representing the real-time voltage value corresponding to the pressure) and digital signals (NPN switching signal, representing a preset simple threshold state). The cable length is ≤5 meters to reduce signal attenuation, and the shielding layer is grounded at one end (controller end) to prevent electromagnetic interference.

[0045] In addition, before using the device, it is necessary to check whether the nailing machine and the device are in normal condition, including but not limited to: whether the bearings are damaged, whether the swing arm is broken, whether the screws are loose, and whether there are foreign objects (such as stuck guide pins or dust accumulation) in the flattening area. If the above mechanical abnormalities exist, the system will first alarm and shut down, because the abnormal mechanical condition will cause the pressure value sensed by the pressure sensor to not accurately reflect the nail thickness (such as pressure fluctuations caused by bearing damage or falsely high pressure caused by foreign objects). At this time, the pressure-thickness calibration curve will fail, the thickness data will be unreliable, and the machine must be shut down for maintenance. It can only be used again after the fault is eliminated. When the mechanical condition is normal, the device can perform thickness detection normally: monitor the nail thickness deviation in real time. If the thickness exceeds the preset qualified range, a thickness defect signal will be generated, triggering the visual positioning and material rejection process to remove defective products online. If the thickness is continuously abnormal or there is a systematic deviation (such as a batch of materials being generally thicker), a deviation over-limit alarm can be set to remind the operator to pay attention to the quality of incoming materials or the drift of equipment parameters.

[0046] In one implementation, refer to Figure 5 The detection device for the capacitor core package further includes: A visual positioning mechanism 300, connected to the central controller, is used to acquire a first appearance image when the evaluation result is unqualified, locate the capacitor core package according to the first appearance image to obtain the coordinate position, and generate a kick signal according to the evaluation result and the coordinate position. The first appearance image includes the appearance image of the positive and negative terminals of the nails on the capacitor core package. The material kicking mechanism 400 is connected to the visual positioning mechanism 300 and is used to kick the core package made by the positive and negative pins through the material kicking signal.

[0047] The visual positioning mechanism 300 adopts a one-to-three mode, that is, one industrial control computer connects to three industrial cameras: the first industrial camera is installed at the flattening mechanism outlet to capture the first appearance image of the nail area; the second industrial camera is installed at the finished core package output end to capture the second appearance image of the finished core package; the third industrial camera is installed in the middle of the conveyor line or on the side of the turntable for supplementary detection (optional). The industrial control computer has a nail positioning recognition template pre-set based on standard good nail images. When a thickness defect signal is received, the first appearance image is analyzed through template matching and other algorithms to identify the nail area and convert it into actual conveyor line coordinates, generating a kick signal and sending it to the PLC for rejection; the kick mechanism 400 can be the kick mechanism built into the nail coiling machine. The IO line between the central controller 200 and the visual positioning mechanism 300 uses an RS485 nail coiling machine dedicated cable to transmit the nail coiling machine Modbus-RTU nail coiling machine protocol data. The line length is ≤5 meters to ensure signal stability.

[0048] In one implementation, the visual positioning mechanism 300 is further configured to acquire a first appearance image to perform a first defect identification when the evaluation result is qualified, and obtain a first identification result, wherein the first appearance image includes the appearance images of the positive and negative terminals of the pins on the capacitor core package; when the first identification result is unqualified, the capacitor core package is positioned by the first appearance image to obtain the coordinate position, and a kicking signal is generated according to the first identification result and the coordinate position.

[0049] In one embodiment, the visual positioning mechanism 300 further includes: The first camera 301 is used to acquire a first appearance image when the evaluation result is qualified; The industrial control computer 302 is used to perform a first defect identification and obtain a first identification result. When the first identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the capacitor core through the first appearance image, and a kick signal is generated according to the first identification result and the coordinate position.

[0050] In addition, the visual positioning mechanism also includes: The second camera 303 is used to acquire a second appearance image when the first recognition result is qualified; The industrial control computer 302 is also used to perform a second defect identification and obtain a second identification result. When the second identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the capacitor core through the second appearance image, and a kick signal is generated according to the second identification result and the coordinate position.

[0051] Specifically, the first and second cameras are Hikvision MV-CS050-90GC industrial cameras with 25mm adjustable focus lenses, which can clearly capture the details of the nails and core packages. The industrial control computer is Hikvision MV-VC3301X-128G60, which has a built-in RS485 communication interface and supports IO communication with PLC and Modbus-RTU protocol communication with sensors. The first appearance image is used to detect appearance defects of the positive and negative terminals of the nails, including petal area, petal defects, missing nail holes, nail head deviation, hole nail deviation, empty material, foil cracks, and the distance between the nail head and the foil being too close or too far. The second appearance image is used to detect appearance defects of the capacitor core package, including core package width, core package height, uneven feet, and missing nails, etc. For details, refer to the target recognition and detection of the appearance image of the capacitor core package in the existing technology.

[0052] In one embodiment, the capacitor core detection device further includes a display, which is connected to the central controller and the visual positioning mechanism, for: In this embodiment, a display is provided to show the thickness data detected by the positive and negative poles of the nail needle, as well as the set standard thickness and deviation for reference, and the detected unqualified / qualified data. The display also provides prompts based on the thickness and deviation, such as excessive pressure / insufficient pressure.

[0053] Reference Figure 6-7 When the machine is working properly, the pressure caused by the positive and negative electrode materials of the nail is too high. If the material is normal, the mechanical pressure will increase, which will cause the actual thickness of the (positive and negative electrode of the nail) to become thinner, but the actual thickness displayed on the screen will be too large. When the thickness displayed on the screen is opposite to the thickness measured manually, it is because there is a problem with the mechanical parts. The system can detect whether the working status of the machine is good and can also monitor the thickness of the material.

[0054] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A method for detecting capacitor core packages, characterized in that, The detection method for the capacitor core package includes: Obtain the pressure value when the positive and negative terminals of the nails on the capacitor core are flattened by the flattening mechanism, and convert the pressure value into an electrical signal; The electrical signal is converted into thickness data based on a preset pressure-thickness calibration curve. The thickness data is then evaluated according to a preset acceptable range to obtain the evaluation result of the capacitor core package.

2. The method for detecting capacitor cores as described in claim 1, characterized in that, The step of converting the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluating the thickness data according to a preset acceptable range, and obtaining the evaluation result of the capacitor core package includes: When the evaluation result is unqualified, a first appearance image is obtained, the capacitor core package is located according to the first appearance image to obtain the coordinate position, and a kick signal is generated according to the evaluation result and the coordinate position. The first appearance image includes the appearance image of the positive and negative terminals of the pins on the capacitor core package. The capacitor core is kicked out using the kick signal.

3. The method for detecting capacitor cores as described in claim 1, characterized in that, After the steps of converting the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluating the thickness data according to a preset acceptable range, and obtaining the evaluation result of the capacitor core package, the method further includes: When the evaluation result is qualified, the next step is to obtain the pressure value when the positive and negative terminals of the nails on the capacitor core are flattened by the flattening mechanism, and convert the pressure value into an electrical signal.

4. The method for detecting capacitor cores as described in claim 2, characterized in that, The steps of obtaining a first appearance image when the evaluation result is unqualified, locating the capacitor core package according to the first appearance image to obtain its coordinate position, and generating a kick signal according to the evaluation result and the coordinate position can be replaced by: When the evaluation result is qualified, a first appearance image is obtained to perform a first defect identification and obtain a first identification result. The first appearance image includes the appearance images of the positive and negative terminals of the nail on the capacitor core package. When the first identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the first appearance image, and a kick signal is generated based on the first identification result and the coordinate position.

5. The method for detecting capacitor cores as described in claim 4, characterized in that, After the step of obtaining a first appearance image and performing a first defect identification to obtain a first identification result when the evaluation result is qualified, the following steps are included: When the first identification result is qualified, a second appearance image is acquired for second defect identification to obtain a second identification result. The second appearance image includes the appearance image of the capacitor core package. When the second identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the capacitor core package through the second appearance image, and a kick signal is generated according to the second identification result and the coordinate position.

6. The method for detecting capacitor cores as described in claim 1, characterized in that, The step of converting the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluating the thickness data according to a preset acceptable range, and obtaining the evaluation result of the capacitor core package includes: When the thickness data exceeds the preset acceptable range, a warning of excessive pressure will be displayed on the screen. When the thickness data is lower than the preset acceptable range, a warning message indicating insufficient pressure will be displayed on the screen.

7. A detection device for capacitor core packages, characterized in that, The detection device for the capacitor core package includes: A pressure sensor is installed at the lower end of the flattening mechanism of the nail roll machine. It is used to obtain the pressure value of the positive and negative poles of the nail on the capacitor core package when the flattening mechanism is flattened, and convert the pressure value into an electrical signal. The central controller, connected to the pressure sensor, is used to convert the electrical signal into thickness data based on a preset pressure-thickness calibration curve, evaluate the thickness data according to a preset acceptable range, and obtain the evaluation result of the capacitor core package.

8. The capacitor core package detection device as described in claim 7, characterized in that, The detection device for the capacitor core package also includes: A visual positioning mechanism, connected to the central controller, is used to acquire a first appearance image when the evaluation result is unqualified, locate the capacitor core package according to the first appearance image to obtain the coordinate position, and generate a kick signal according to the evaluation result and the coordinate position. The first appearance image includes the appearance image of the positive and negative terminals of the pins on the capacitor core package. The kicking mechanism is used to kick the core package made by the positive and negative pins through the kicking signal.

9. The capacitor core package detection device as described in claim 8, characterized in that, The visual positioning mechanism is also used to acquire a first appearance image to perform a first defect identification when the evaluation result is qualified, and obtain a first identification result. The first appearance image includes the appearance images of the positive and negative terminals of the nails on the capacitor core package. When the first identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the first appearance image, and a kick signal is generated based on the first identification result and the coordinate position.

10. The capacitor core package detection device as described in claim 9, characterized in that, The visual positioning mechanism also includes: A first camera is used to acquire a first appearance image when the evaluation result is qualified; An industrial control computer is used for first defect identification to obtain a first identification result. When the first identification result is unqualified, the coordinate position of the capacitor core is obtained by locating the capacitor core through the first appearance image, and a kick signal is generated according to the first identification result and the coordinate position.

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