A system on chip testing apparatus
By designing the pressure base and pressing mechanism of the system chip testing device, the problems of poor contact and excessive force at the test points were solved, achieving stable contact and efficient testing, reducing the risk of air leakage, and improving the test success rate and device lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-30
- Publication Date
- 2026-07-21
AI Technical Summary
In existing system-on-a-chip (SoC) testing equipment, during the testing process, the test points of the chip under test are prone to poor contact with the test probes or excessive interaction between the test points and the probes, leading to test failure or damage.
A system chip testing device was designed, including a base, a test board, a support plate, a support frame, a pressure seat, and a pressing mechanism. By adjusting the downward stroke of the pressure seat and the synchronously linked pressing rod system, the device ensures good contact between the chip under test and the test probe, avoids excessive force, and adopts a sealed structure to reduce the possibility of air leakage.
This achieves stable contact between the chip under test and the test probe, improving the success rate and accuracy of testing, extending the service life of the device, and reducing the risk of leakage.
Smart Images
Figure CN122430675A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of system-on-a-chip (SoC) testing technology, and in particular to a SoC testing apparatus. Background Technology
[0002] The UCIe standard (Universal Chip Interconnect Express) is an open standard for connecting multiple chips within the same package. It makes different functional partitions of a complex chip into different chips, and then uses advanced packaging technology to combine these chips with different process nodes and materials to form a system chip. This breaks through the limits of photomask size and function, and significantly reduces design and production costs.
[0003] System-on-a-chip (SoC) testing equipment is used to verify whether chips produced by different manufacturers and at different process nodes can achieve high-speed, low-latency, and highly reliable inter-die communication within the same package through the UCIe standard interface. It is a key device to ensure the "plug-and-play" functionality of the chip ecosystem and can meet the testing needs of single-chip and multi-chip applications.
[0004] The existing technical solutions mentioned above have the following drawbacks: when using existing system chip testing devices to test system chips, the test points of the chip under test are prone to poor contact with the test probes or excessive interaction between the test points of the chip under test and the test probes, resulting in test failure or damage to the test points of the chip under test. Summary of the Invention
[0005] To ensure good contact between the test points and test probes of the chip under test and to avoid excessive interaction between the test points and test probes, this application provides a system chip testing device.
[0006] This application provides a system-on-a-chip (SoC) testing device, which adopts the following technical solution: A system-on-a-chip (SoC) testing apparatus, comprising: The base has a test groove formed on the top and a vent on one side that communicates with the test groove; The test board is installed inside the test slot, and test probes are formed on its top surface; The support plate is installed in the test slot and located above the test board. The top has a receiving slot for accommodating the chip under test, and the bottom has a clearance hole that communicates with the receiving slot. The clearance hole allows the test probe to pass through. A support frame is positioned above the base; The pressure holder is mounted vertically on the support frame and is used to press down the chip under test. The pressing mechanism, mounted on the support frame, is capable of actuation to drive the pressure seat downward; The stroke adjustment mechanism is in contact with the pressing mechanism and is used to adjust the height of the pressing mechanism in the vertical direction, thereby adjusting the downward stroke of the pressure seat.
[0007] By employing the above technical solution, the pressure holder is used to press down on the chip under test (DUT), ensuring that the DUT's test points contact the test probes on the test board. The pressing mechanism actuates to drive the pressure holder downwards. A stroke adjustment mechanism, in contact with the pressing mechanism, fine-tunes the vertical height of the pressing mechanism, thereby fine-tuning the downward stroke of the pressure holder and ultimately the descent height of the DUT. This ensures good contact between the DUT's test points and the test probes while preventing excessive interaction forces, thus guaranteeing test success rate and results, and preventing damage to the DUT's test points.
[0008] This application further specifies that the pressing mechanism includes: The top cover is installed on the top of the support frame by adjusting bolts, so that the height of the top cover in the vertical direction is adjustable; The first pressure bar is inclined and rotatably connected to one side of the top cover in the middle. The first follower wheel is rotatably mounted on the bottom end of the first pressure rod, and its outer wall abuts against the top surface of the pressure seat; The second pressure rod is inclined and rotatably connected to the other side of the top cover in the middle. The second follower wheel is rotatably mounted on the bottom end of the second pressure rod, and its outer wall abuts against the top surface of the pressure seat; The connecting rod is rotatably connected at one end to the top of the first pressing rod and at the other end to the top of the second pressing rod. The lever is inclined and its bottom end is fixedly connected to the side of the second pressing rod away from the first pressing rod. It is used to drive the second pressing rod to rotate, and then drive the first pressing rod to rotate through the connecting rod, so that the pressure seat moves downward.
[0009] By adopting the above technical solution, the first and second pressing rods are connected into a synchronously linked whole using a connecting rod, ensuring that the swing angles of the first and second pressing rods are completely consistent, thus improving the stability of the pressure seat's downward movement. When the top of the lever moves, it drives the bottom of the second pressing rod to move to the left, and through the connecting rod, it drives the bottom of the first pressing rod to move to the left, thereby driving the pressure seat downward, and thus moving the chip under test downward. Because the first and second pressing rods move synchronously, the first and second follower wheels can apply downward pressure to the pressure seat synchronously, ensuring that the pressure on all parts of the chip under test is consistent, preventing the chip under test from tilting, and ensuring the accuracy of the test results. Moreover, during the leftward movement of the bottom of the first and second pressing rods, the first and second follower wheels rotate, reducing the resistance encountered by the first and second pressing rods, ensuring the smoothness of the downward pressing process, and at the same time, reducing the wear between the first / second pressing rods and the pressure seat, extending their service life. The lever, the first pressing lever, and the second pressing lever all adopt the lever principle. The operator only needs to apply a small force to the top of the lever to apply a large pressure to the pressure seat, which reduces the difficulty of operation and makes it easy to accurately control the swing amplitude of the lever, thereby accurately controlling the downward pressure.
[0010] This application further specifies that the pressing mechanism also includes: There are four guide columns, all vertically installed, with their bottom ends fixedly connected to the four corners of the top surface of the pressure seat, and their side walls slidably connected to the four corners of the support frame. There are four return springs, which are fitted onto the four guide posts one by one.
[0011] By adopting the above technical solution, when the first and second pressing rods drive the pressure seat downwards, the four guide pins move downwards along with the pressure seat, and the four springs are gradually compressed. When the operator's hand is removed from the lever, the force of the four springs restoring their deformation drives the four guide pins upwards, thereby causing the pressure seat to reset.
[0012] The application further provides that: a first inclined surface is formed on each of the opposite sides of the bottom of the top cover; The travel adjustment mechanism includes: The fixing block is fixed to the top of the support frame and located below the top cover; There are two lifting blocks, which are respectively set on opposite sides of the fixed block and can slide toward or away from the fixed block. The top of each lifting block has a second inclined surface that matches the first inclined surface. When either lifting block slides toward the fixed block, the top cover moves upward. Threaded holes are formed on each of the two lifting blocks. The sleeve is fixed inside the fixing block, and threads are formed on the inner walls at opposite ends; There are two adjusting screws; one end of one adjusting screw is screwed to one end of the sleeve, and its side wall is screwed to one of the lifting blocks through a threaded hole; one end of the other adjusting screw is screwed to the other end of the sleeve, and its side wall is screwed to another lifting block through a threaded hole; the rotating adjusting screw can drive the corresponding lifting block to slide toward or away from the fixed block.
[0013] By adopting the above technical solution, the rotating adjusting screw can drive the corresponding lifting block to slide towards or away from the fixed block, thereby finely adjusting the height of the top cover in the vertical direction, and thus finely adjusting the downward stroke of the pressure seat. This ensures good contact between the test point of the chip under test and the test probe, while avoiding excessive interaction force between the test point of the chip under test and the test probe.
[0014] This application further specifies that the pressure seat includes: Upper pressure plate; The lower pressure plate has an internal mounting cavity, and its top end is fixedly connected to the bottom end of the upper pressure plate, moving up and down with the upper pressure plate. Pressure sensor, installed inside the mounting cavity; The pressure head is slidably mounted on the bottom of the lower pressure plate and moves up and down with the lower pressure plate. Its top end contacts the bottom end of the pressure sensor, and its bottom end can contact the chip under test. There are two pressure plates, which are fixed on opposite sides of the top surface of the upper pressure plate, and the top surface is in contact with the lower pressure mechanism.
[0015] This application further includes: An electrical connector, mounted on the support frame, connects to the pressure sensor.
[0016] This application further specifies that the base includes: lower base plate; The upper substrate is fixed to the top of the lower substrate, with a test groove formed in the middle and a vent connected to the test groove on one side.
[0017] By adopting the above technical solution, compared with the method of installing the vent on the support frame, the relative position of the vent and the test slot remains unchanged throughout the entire test process, which reduces the difficulty of sealing and the possibility of air leakage at the connection.
[0018] The present application further comprises: a first sealing groove formed on the top surface of the lower substrate; and a second sealing groove formed on the bottom surface and the top surface of the upper substrate, respectively. The base also includes: The first sealing ring is installed in the first sealing groove; There are two second sealing rings, which are installed in the second sealing grooves one by one, corresponding to the two second sealing grooves.
[0019] By adopting the above technical solution, the first sealing ring provides a preliminary seal between the top surface of the lower substrate and the bottom surface of the upper substrate. One of the second sealing rings provides a secondary seal between the top surface of the lower substrate and the bottom surface of the upper substrate, significantly reducing the possibility of air leakage. The other second sealing ring seals the top surface of the upper substrate and the bottom surface of the pressure base, further reducing the possibility of air leakage.
[0020] This application is further configured such that one side of the support frame is rotatably connected to one side of the base.
[0021] By adopting the above technical solution, the support frame and the base can be opened and closed, which makes it easier to pick up and put down the chip.
[0022] This application further includes: A locking mechanism is installed on the other side of the support frame and the base to connect or disconnect the support frame and the other side of the base.
[0023] In summary, the beneficial technical effects of this application are as follows: 1. The pressure holder is used to press down the chip under test (DUT), ensuring that the DUT's test points contact the test probes on the test board. The pressing mechanism actuates to drive the pressure holder downwards. A stroke adjustment mechanism, in contact with the pressing mechanism, fine-tunes the vertical height of the pressing mechanism, thereby fine-tuning the downward stroke of the pressure holder and ultimately the descent height of the DUT. This ensures good contact between the DUT's test points and the test probes while preventing excessive interaction forces, thus guaranteeing a high test success rate and accurate test results, and preventing damage to the DUT's test points.
[0024] 2. A connecting rod is used to link the first and second pressing rods into a synchronized unit, ensuring that the swing angles of the first and second pressing rods are completely consistent, thus improving the stability of the pressure seat's downward movement. When the top of the lever moves, it drives the bottom of the second pressing rod to move to the left, and through the connecting rod, it drives the bottom of the first pressing rod to move to the left, thereby driving the pressure seat downward, and thus moving the chip under test downward. Because the first and second pressing rods move synchronously, the first and second follower wheels can apply downward pressure to the pressure seat synchronously, ensuring that the pressure on all parts of the chip under test is consistent, preventing the chip under test from tilting, and ensuring the accuracy of the test results. Moreover, during the leftward movement of the bottom of the first and second pressing rods, the first and second follower wheels rotate, reducing the resistance encountered by the first and second pressing rods, ensuring the smoothness of the downward pressing process, and at the same time reducing the wear between the first / second pressing rods and the pressure seat, extending their service life. The lever, first pressing lever, and second pressing lever all utilize the lever principle. The operator only needs to apply a small force to the top of the lever to apply significant pressure to the pressure seat, reducing operational difficulty and facilitating precise control of the lever's swing amplitude, thereby precisely controlling the downward pressure. When the first and second pressing levers drive the pressure seat downwards, the four guide pins move downwards along with the pressure seat, and the four springs are gradually compressed. When the operator's hand is removed from the lever, the restoring force of the four springs drives the four guide pins upwards, thereby resetting the pressure seat.
[0025] 3. The rotating adjusting screw can drive the corresponding lifting block to slide toward or away from the fixed block, thereby fine-tuning the height of the top cover in the vertical direction, and thus fine-tuning the downward stroke of the pressure seat. This ensures good contact between the test point of the chip under test and the test probe, while avoiding excessive interaction force between the test point of the chip under test and the test probe.
[0026] 4. By placing the vent on one side of the upper substrate, compared to mounting the vent on the support frame, the relative position of the vent and the test slot remains unchanged throughout the entire test, reducing the difficulty of sealing and the possibility of leakage at the connection point. The first sealing ring provides an initial seal between the top surface of the lower substrate and the bottom surface of the upper substrate. One of the second sealing rings provides a secondary seal between the top surface of the lower substrate and the bottom surface of the upper substrate, significantly reducing the possibility of leakage. The other second sealing ring seals between the top surface of the upper substrate and the bottom surface of the pressure base, further reducing the possibility of leakage. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of the structure of an embodiment of a system chip testing device; Figure 2 yes Figure 1Top view of the system chip testing device shown; Figure 3 yes Figure 2 The system chip test setup shown is a cross-sectional view along AA. Figure 4 yes Figure 2 The system chip test setup shown is a cross-sectional view along BB. Figure 5 yes Figure 1 A schematic diagram of the test board in the system chip testing device shown; Figure 6 yes Figure 1 The diagram shows the structure of the support plate in the system chip testing device. Figure 7 yes Figure 1 A schematic diagram of the combined structure of the support frame, pressure base, pressing mechanism and stroke adjustment mechanism in the system chip testing device shown; Figure 8 yes Figure 1 The diagram shows the combined structure of the pressure base and the pressing mechanism in the system chip testing device shown. Figure 9 yes Figure 1 The diagram shows the combined structure of the stroke adjustment mechanism and the top cover in the system chip testing device shown. Figure 10 yes Figure 1 The diagram shows the structure of the pressure base in the system chip testing device. Figure 11 yes Figure 10 The exploded view of the pressure seat is shown below; Figure 12 yes Figure 1 The diagram shows the structure of the base in the system chip testing device. Figure 13 yes Figure 12 The exploded view of the base shown.
[0028] Reference numerals: 110, base; 111, lower substrate; 1111, first sealing groove; 112, upper substrate; 1121, test groove; 1122, vent; 1123, second sealing groove; 113, first sealing ring; 114, second sealing ring; 120, test plate; 121, test probe; 130, support plate; 131, receiving groove; 132, clearance hole; 140, support frame; 150, pressure seat; 151, upper pressure plate; 152, lower pressure plate; 1521, mounting cavity; 153, pressure sensor; 154, pressure head; 1541 155. Anti-detachment plate; 160. Pressure plate; 161. Pressing mechanism; 161. Top cover; 1611. Adjusting bolt; 1612. First inclined surface; 162. First pressing rod; 163. First follower wheel; 164. Second pressing rod; 165. Second follower wheel; 166. Connecting rod; 167. Lever; 168. Guide post; 169. Return spring; 170. Stroke adjustment mechanism; 171. Fixing block; 172. Lifting block; 1721. Second inclined surface; 173. Sleeve; 174. Adjusting screw; 180. Electrical connector; 190. Locking mechanism. Detailed Implementation
[0029] The following is in conjunction with the appendix Figure 1-13 This application will be described in further detail.
[0030] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 This application discloses a system-on-a-chip (SoC) testing device, including a base 110, a test board 120, a support plate 130, a support frame 140, a pressure seat 150, a pressing mechanism 160, and a stroke adjustment mechanism 170. A test slot 1121 is formed on the top of the base 110, and a vent 1122 connected to the test slot 1121 is provided on one side. It should be noted that during testing, the test voltage can reach above 1.5KV, which will ionize the air and interfere with the test results. Therefore, before testing, the air in the test slot 1121 is first vented through the vent 1122, and then an inert gas such as nitrogen is introduced into the test slot 1121 through the vent 1122 to provide an inert atmosphere for the test. The test board 120 is installed inside the test slot 1121. It should be noted that the test board 120 can be electrically connected to external electrical equipment for outputting test signals to the outside. Figure 5 As shown, test probes 121 are formed on the top surface of the test plate 120. A support plate 130 is installed within the test slot 1121 and is positioned above the test plate 120. Figure 6As shown, a receiving groove 131 for accommodating the chip under test is formed on the top of the support plate 130, and a clearance hole 132 communicating with the receiving groove 131 is formed on the bottom. The clearance hole 132 allows the test probe 121 to pass through. During testing, the test probe 121 contacts the test point of the chip under test. The support frame 140 is disposed above the base 110 and supports the pressure seat 150, the pressing mechanism 160, and the stroke adjustment mechanism 170. The pressure seat 150 is movably mounted on the support frame 140 and is used to press down the chip under test so that the test point of the chip under test contacts the test probe 121 of the test board 120. The pressing mechanism 160 is mounted on the support frame 140 and can be activated to drive the pressure seat 150 downward. The stroke adjustment mechanism 170 contacts the pressing mechanism 160 and is used to fine-tune the height of the pressing mechanism 160 in the vertical direction, thereby fine-tuning the downward stroke of the pressure seat 150, and thus fine-tuning the descent height of the chip under test. This ensures good contact between the test point of the chip under test and the test probe 121, while avoiding excessive interaction force between the test point of the chip under test and the test probe 121, thus ensuring the test success rate and test results, and preventing damage to the test point of the chip under test.
[0031] Reference Figure 3 , Figure 7 and Figure 8In one embodiment, the pressing mechanism 160 includes a top cover 161, a first pressing rod 162, a first follower wheel 163, a second pressing rod 164, a second follower wheel 165, a connecting rod 166, and a lever 167. The top cover 161 is mounted on the top of the support frame 140 by an adjusting bolt 1611, so that the height of the top cover 161 in the vertical direction is adjustable. It should be noted that when it is necessary to fine-tune the height of the top cover 161 in the vertical direction, the adjusting bolt 1611 can be loosened. After the height adjustment is completed, the adjusting bolt 1611 can be tightened. The first pressing rod 162 is inclined and its middle part is rotatably connected to one side of the top cover 161. The first follower wheel 163 is rotatably mounted on the bottom end of the first pressing rod 162, and its outer wall abuts against the top surface of the pressure seat 150. The second pressing rod 164 is inclined and its middle part is rotatably connected to the other side of the top cover 161. The second follower wheel 165 is rotatably mounted on the bottom end of the second pressing rod 164, and its outer wall abuts against the top surface of the pressure seat 150. One end of the connecting rod 166 is rotatably connected to the top end of the first pressing rod 162, and the other end is rotatably connected to the top end of the second pressing rod 164. The connecting rod 166 connects the first pressing rod 162 and the second pressing rod 164 into a synchronously linked whole, ensuring that the swing angles of the first pressing rod 162 and the second pressing rod 164 are completely consistent, thus improving the stability of the downward movement of the pressure seat 150. The lever 167 is inclined, and its bottom end is fixedly connected to the side of the second pressing rod 164 away from the first pressing rod 162. It is used to drive the second pressing rod 164 to rotate, which in turn drives the first pressing rod 162 to rotate through the connecting rod 166, so that the pressure seat 150 moves downward. When the top end of the lever 167 moves along the... Figure 8 When the center arrow moves, it drives the bottom end of the second pressing rod 164 to move to the left, and through the connecting rod 166, it drives the bottom end of the first pressing rod 162 to move to the left, thereby driving the pressure seat 150 to move downward, thus moving the chip under test downward. Because the first pressing rod 162 and the second pressing rod 164 move synchronously, the first follower wheel 163 and the second follower wheel 165 can simultaneously apply downward pressure to the pressure seat 150, ensuring that the pressure on all parts of the chip under test is consistent, preventing the chip from tilting and ensuring the accuracy of the test results. Furthermore, during the leftward movement of the bottom ends of the first pressing rod 162 and the second pressing rod 164, the first follower wheel 163 and the second follower wheel 165 rotate, reducing the resistance to the movement of the first pressing rod 162 and the second pressing rod 164, ensuring the smoothness of the downward pressing process, and at the same time reducing the wear between the first pressing rod 162 / second pressing rod 164 and the pressure seat 150, extending their service life. The lever 167, the first pressing lever 162, and the second pressing lever 164 all adopt the lever principle. The operator only needs to apply a small force to the top of the lever 167 to apply a large pressure to the pressure seat 150, which reduces the difficulty of operation and makes it easy to accurately control the swing amplitude of the lever 167, thereby accurately controlling the downward pressure.
[0032] Reference Figure 7 and Figure 8 In one embodiment, the pressing mechanism 160 further includes four guide posts 168 and four return springs 169. The four guide posts 168 are all vertically arranged, with their bottom ends fixedly connected to the four corners of the top surface of the pressure seat 150, and their sidewalls slidably connected to the four corners of the support frame 140. The four return springs 169 are fitted onto the guide posts 168 in a one-to-one correspondence. When the first pressing rod 162 and the second pressing rod 164 drive the pressure seat 150 downwards, the four guide posts 168 move downwards along with the pressure seat 150, and the four springs are gradually compressed. When the operator's hand is removed from the lever 167, the force of the four springs restoring their deformation drives the four guide posts 168 upwards, thereby resetting the pressure seat 150.
[0033] Preferably, a plurality of first guide holes are formed on the top cover 161. A plurality of second guide holes are formed on the pressure seat 150. A plurality of first guide pins are formed on the top of the support frame 140, and a plurality of second guide pins are formed on the bottom. The plurality of first guide pins are inserted into the first guide holes in a one-to-one correspondence with the plurality of first guide holes. The plurality of second guide pins are inserted into the second guide holes in a one-to-one correspondence with the plurality of second guide holes. The plurality of first guide pins and the plurality of first guide holes cooperate to ensure that the top cover 161 can only move in the vertical direction. The plurality of second guide pins and the plurality of second guide holes cooperate to ensure that the pressure seat 150 can only move in the vertical direction.
[0034] Reference Figure 4 , Figure 7 and Figure 9In one embodiment, first inclined surfaces 1612 are formed on opposite sides of the bottom of the top cover 161. The stroke adjustment mechanism 170 includes a fixed block 171, two lifting blocks 172, a sleeve 173, and two adjusting screws 174. The fixed block 171 is fixed to the top of the support frame 140 and located below the top cover 161. The two lifting blocks 172 are respectively disposed on opposite sides of the fixed block 171 and can slide toward or away from the fixed block 171, and each has a second inclined surface 1721 formed on its top that cooperates with the first inclined surface 1612. When either lifting block 172 slides toward the fixed block 171, the top cover 161 moves upward. Threaded holes are formed on each of the two lifting blocks 172. The sleeve 173 is fixed inside the fixed block 171, and threads are formed on the inner walls at opposite ends. One end of one adjusting screw 174 is screwed to one end of the sleeve 173, and its sidewall is screwed to one of the lifting blocks 172 through a threaded hole. One end of the other adjusting screw 174 is screwed to the other end of the sleeve 173, and its sidewall is screwed to another lifting block 172 through a threaded hole. The rotating adjusting screw 174 can cause the corresponding lifting block 172 to slide towards or away from the fixed block 171, thereby fine-tuning the vertical height of the top cover 161 and thus fine-tuning the downward stroke of the pressure seat 150. This ensures good contact between the test point of the chip under test and the test probe 121, while avoiding excessive interaction force between the test point and the test probe 121, thus ensuring the test success rate and test results, and preventing damage to the test point of the chip under test. It should be noted that before fine-tuning the height of the top cover 161, the adjusting bolt 1611 needs to be loosened first.
[0035] Reference Figure 8 , Figure 10 and Figure 11 In one embodiment, the pressure base 150 includes an upper pressure plate 151, a lower pressure plate 152, a pressure sensor 153, a pressure head 154, and two pressure plates 155. The four corners of the upper pressure plate 151 are fixedly connected to the bottom ends of four guide posts 168. The lower pressure plate 152 has an internal mounting cavity 1521, with its top end fixedly connected to the bottom end of the upper pressure plate 151, and moves up and down with the upper pressure plate 151. The pressure sensor 153 is installed in the mounting cavity 1521 to detect the downward pressure. The pressure head 154 is slidably mounted on the bottom of the lower pressure plate 152 and moves up and down with the lower pressure plate 152. Its top end contacts the bottom end of the pressure sensor 153, and its bottom end can contact the chip under test. Two pressure plates 155 are fixed to opposite sides of the top surface of the upper pressure plate 151, and the top surface is in contact with the lower pressure mechanism 160, replacing the upper pressure plate 151 in contact with the first follower wheel 163 / second follower wheel 165 of the lower pressure mechanism 160, thus extending the service life of the upper pressure plate 151.
[0036] Preferably, the upper pressure plate 151 and the lower pressure plate 152 are made of plastic, while each pressure plate 155 is made of metal.
[0037] Preferably, an anti-detachment plate 1541 is formed at the top of the pressure head 154 to prevent the pressure head 154 from spontaneously detaching from the lower pressure plate 152 and to increase the contact area between the pressure head 154 and the pressure sensor 153.
[0038] Reference Figure 1 and Figure 3 In one embodiment, the system chip testing apparatus further includes an electrical connector 180. The electrical connector 180 is mounted on the support frame 140 and electrically connected to the pressure sensor 153 to facilitate electrical connection between the pressure sensor 153 and external devices.
[0039] Reference Figure 3 , Figure 12 and Figure 13 In one embodiment, the base 110 includes a lower substrate 111, an upper substrate 112, a first sealing ring 113, and two second sealing rings 114. The upper substrate 112 is fixed to the top of the lower substrate 111, and a test groove 1121 is formed in the middle. A vent 1122 communicating with the test groove 1121 is provided on one side. Compared to mounting the vent 1122 on the support frame 140, the relative position of the vent 1122 and the test groove 1121 remains unchanged throughout the test, reducing the sealing difficulty and the possibility of air leakage at the connection. A first sealing groove 1111 is formed on the top surface of the lower substrate 111. A second sealing groove 1123 is formed on the bottom and top surfaces of the upper substrate 112, respectively. The first sealing ring 113 is installed in the first sealing groove 1111, providing a preliminary seal between the top surface of the lower substrate 111 and the bottom surface of the upper substrate 112. Two second sealing rings 114 are installed in the two second sealing grooves 1123 in a one-to-one correspondence. One of the second sealing rings 114 provides a secondary seal between the top surface of the lower substrate 111 and the bottom surface of the upper substrate 112, significantly reducing the possibility of air leakage. The other second sealing ring 114 provides a seal between the top surface of the upper substrate 112 and the bottom surface of the pressure seat 150, further reducing the possibility of air leakage.
[0040] Reference Figure 3In one embodiment, one side of the support frame 140 is rotatably connected to one side of the base 110, facilitating the opening and closing of the support frame 140 and the base 110, thereby facilitating the placement and removal of chips. It should be noted that during the opening and closing process, the test board 120 and the support plate 130 do not rotate with the support frame 140, while the pressure seat 150, the pressing mechanism 160, and the stroke adjustment mechanism 170 rotate with the support frame 140. The system chip testing device also includes a locking mechanism 190. The locking mechanism 190 is installed on the other side of the support frame 140 and the base 110, used to connect or disconnect the support frame 140 from the other side of the base 110. During testing, the locking mechanism 190 tightly locks the support frame 140 and the base 110, eliminating gaps at the opening and closing connection points, ensuring that the support frame 140 does not wobble during the pressing process, and guaranteeing pressing accuracy and testing stability. After the test is completed, the support frame 140 can be quickly opened by unlocking, achieving a seamless switch between the test state and the pick-up and put-down state without the need for additional disassembly of parts, thus improving the smoothness of the test process.
[0041] Preferably, the locking mechanism 190 is a snap-fit structure or other structure, etc.
[0042] The implementation principle of this embodiment is as follows: During testing, the test probe 121 contacts the test point of the chip under test. The pressure holder 150 is movably mounted on the support frame 140 and is used to press down on the chip under test, ensuring that the test point of the chip under test contacts the test probe 121 of the test board 120. The pressing mechanism 160 can actuate to drive the pressure holder 150 downward. The stroke adjustment mechanism 170 is used to fine-tune the vertical height of the pressing mechanism 160, thereby fine-tuning the downward stroke of the pressure holder 150, and thus fine-tuning the descent height of the chip under test. This ensures good contact between the test point of the chip under test and the test probe 121 while avoiding excessive interaction force between the test point and the test probe 121, thus ensuring the test success rate and test results, and preventing damage to the test point of the chip under test.
[0043] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.
Claims
1. A system-on-a-chip (SoC) testing device, characterized in that, include: The base (110) has a test groove (1121) formed on the top and a vent (1122) connected to the test groove (1121) on one side; A test plate (120) is installed in the test slot (1121), and a test probe (121) is formed on its top surface; A support plate (130) is installed in the test slot (1121) and located above the test plate (120). A receiving slot (131) for accommodating the chip under test is formed at the top, and a clearance hole (132) communicating with the receiving slot (131) is formed at the bottom. The clearance hole (132) is used for the test probe (121) to pass through. A support frame (140) is disposed above the base (110); The pressure base (150) is movably mounted on the support frame (140) and is used to press down the chip under test; The pressing mechanism (160) is mounted on the support frame (140) and is capable of operating to drive the pressing seat (150) to move downward; The stroke adjustment mechanism (170) is in contact with the pressing mechanism (160) and is used to adjust the height of the pressing mechanism (160) in the vertical direction, thereby adjusting the downward stroke of the pressure seat (150).
2. The system-on-a-chip testing apparatus according to claim 1, characterized in that, The pressing mechanism (160) includes: The top cover (161) is installed on the top of the support frame (140) by adjusting bolts (1611) so that the height of the top cover (161) in the vertical direction is adjustable; The first pressing rod (162) is inclined and its middle part is rotatably connected to one side of the top cover (161); The first follower wheel (163) is rotatably mounted on the bottom end of the first pressure rod (162), and its outer wall abuts against the top surface of the pressure seat (150); The second pressure rod (164) is inclined and its middle part is rotatably connected to the other side of the top cover (161); The second follower wheel (165) is rotatably mounted on the bottom end of the second pressure rod (164), and its outer wall abuts against the top surface of the pressure seat (150). The connecting rod (166) is rotatably connected at one end to the top end of the first pressing rod (162) and at the other end to the top end of the second pressing rod (164); The lever (167) is inclined and its bottom end is fixedly connected to the side of the second pressing rod (164) away from the first pressing rod (162). It is used to drive the second pressing rod (164) to rotate, and then drive the first pressing rod (162) to rotate through the connecting rod (166), so that the pressure seat (150) moves downward.
3. The system-on-a-chip testing apparatus according to claim 2, characterized in that, The pressing mechanism (160) further includes: There are four guide columns (168), all of which are vertically arranged. Their bottom ends are fixedly connected to the four corners of the top surface of the pressure seat (150), and their side walls are slidably connected to the four corners of the support frame (140). There are four return springs (169), which are sleeved on the guide posts (168) one by one, corresponding to the four guide posts (168).
4. The system-on-a-chip testing apparatus according to claim 2, characterized in that, The bottom of the top cover (161) has a first inclined surface (1612) formed on each of the opposite sides; The stroke adjustment mechanism (170) includes: A fixing block (171) is fixed to the top of the support frame (140) and located below the top cover (161); There are two lifting blocks (172), which are respectively disposed on opposite sides of the fixed block (171) and can slide toward or away from the fixed block (171). The top of each lifting block (172) is formed with a second inclined surface (1721) that cooperates with the first inclined surface (1612). When either of the lifting blocks (172) slides toward the fixed block (171), the top cover (161) moves upward. Threaded holes are formed on each of the two lifting blocks (172). The sleeve (173) is fixed inside the fixing block (171), and threads are formed on the inner walls at opposite ends; There are two adjusting screws (174); one end of one adjusting screw (174) is screwed to one end of the sleeve (173), and its sidewall is screwed to one of the lifting blocks (172) through the threaded hole; one end of the other adjusting screw (174) is screwed to the other end of the sleeve (173), and its sidewall is screwed to the other lifting block (172) through the threaded hole; the rotating adjusting screw (174) can drive the corresponding lifting block (172) to slide toward or away from the fixed block (171).
5. The system-on-a-chip testing apparatus according to any one of claims 1 to 4, characterized in that, The pressure seat (150) includes: Upper pressure plate (151); The lower pressure plate (152) has an internal mounting cavity (1521) and its top end is fixedly connected to the bottom end of the upper pressure plate (151), and moves up and down with the upper pressure plate (151). A pressure sensor (153) is installed in the mounting cavity (1521); The pressure head (154) is slidably mounted on the bottom of the lower pressure plate (152) and moves up and down with the lower pressure plate (152). Its top end contacts the bottom end of the pressure sensor (153), and its bottom end can contact the chip under test. There are two pressure plates (155), which are fixed on opposite sides of the top surface of the upper pressure plate (151) and the top surface is in contact with the lower pressure mechanism (160).
6. The system-on-a-chip testing apparatus according to claim 5, characterized in that, Also includes: An electrical connector (180) is mounted on the support frame (140) and connected to the pressure sensor (153).
7. The system-on-a-chip testing apparatus according to any one of claims 1 to 4, characterized in that, The base (110) includes: Lower base plate(111); The upper substrate (112) is fixed to the top of the lower substrate (111), and the test groove (1121) is formed in the middle, and the vent (1122) connected to the test groove (1121) is provided on one side.
8. The system-on-a-chip testing apparatus according to claim 7, characterized in that, A first sealing groove (1111) is formed on the top surface of the lower substrate (111); a second sealing groove (1123) is formed on the bottom surface and the top surface of the upper substrate (112); The base (110) also includes: The first sealing ring (113) is installed in the first sealing groove (1111); There are two second sealing rings (114), which are installed in the second sealing grooves (1123) in a one-to-one correspondence with the two second sealing grooves (1123).
9. The system-on-a-chip testing apparatus according to any one of claims 1 to 4, characterized in that, One side of the support frame (140) is rotatably connected to one side of the base (110).
10. The system-on-a-chip testing apparatus according to claim 9, characterized in that, Also includes: A locking mechanism (190) is installed on the other side of the support frame (140) and the base (110) to connect or disconnect the support frame (140) and the other side of the base (110).