Defect detection method based on circuit breaker bundle collet

Abstract

The present application belongs to the technical field of circuit breaker defect detection, and relates to a defect detection method based on a circuit breaker bundle-shaped chuck, specifically comprising: collecting total contact voltage drop during closing and each contact finger shunt current, calculating contact resistance of each contact finger at each time and generating a time sequence; intercepting a synchronous window in a current stable interval, calculating inter-plate dispersion of this closing operation, and contact resistance fluctuation amplitude of each contact finger in the window; comparing the current inter-plate dispersion with an adaptive dynamic baseline to determine abnormalities, outputting a clamping force degradation identifier when the number of abnormal accumulations or continuous deviations exceeds the tolerance limit; positioning the degradation target position according to the fluctuation amplitude, and determining the degradation level according to the incremental accumulation rate of the inter-plate resistance dispersion in continuous operation, and pushing to the operation and maintenance terminal. The present application breaks through the masking of parallel shunt compensation effect, realizes online detection, accurate positioning and graded early warning of single contact finger defects.

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