Optical module coupling device and control method

Abstract

This invention discloses an optical module coupling device and control method, relating to the field of optical communication technology. It includes the following steps: S1, System Initialization and Calibration: The coupling device is powered on and started. The MCU control unit performs rotation angle repositioning and motion accuracy calibration on the drive motor, simultaneously completing CCD camera visual recognition threshold calibration, slide travel calibration, and probe height detection reference value setting, and pre-storing coupling parameters for multiple specifications of optical devices. Through system initialization, the drive motor accuracy calibration, CCD visual threshold calibration, slide travel calibration, and probe reference setting are completed simultaneously, and coupling parameters for multiple specifications of optical devices are pre-stored. Combined with CCD camera multi-scale image recognition, micron-level visual positioning of the FA component is achieved. A composite clamping structure of top-surface vacuum adsorption and side flexible grippers is adopted, relying on a dual-probe height detection and a three-dimensional closed-loop model of height difference-rotation angle-parallelism to achieve adaptive horizontal leveling.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to an optical module coupling device and control method. Background Technology

[0002] In the manufacturing process of modern optical communication, optical modules, as core transmission devices, play an indispensable role in the transmission, reception, conversion, and efficient transmission of optical signals. The precise coupling of the optical chip and the FA (Fabry-Performance Component) assembly during the packaging process is a crucial step in ensuring the coupling power, transmission performance, and reliability of the optical module. By achieving precise alignment, parallel leveling, and stable coupling between the FA assembly, the optical chip, and the circuit board, low-loss optical signal transmission is achieved. Optical module coupling devices are widely used in data centers, 5G communications, fiber optic transmission, optoelectronic device manufacturing, and many other fields, and are essential equipment for ensuring the efficient and stable operation of large-scale optical module production.

[0003] Currently, although some optical module coupling devices and control methods exist in the market, there are still significant technical bottlenecks. Some products use simple visual positioning schemes, which cannot be compatible with the accurate calculation of multi-channel FA components, and the positioning accuracy is difficult to meet the micron-level coupling requirements. Others use rigid clamping structures, which are prone to contact stress on FA components, causing device damage, and lack flexible adaptive clamping capabilities. Still others lack closed-loop control logic in the leveling process, resulting in large parallelism adjustment errors. Switching between multiple specifications of optical devices requires repeated equipment calibration, and the coupling process has a low degree of automation and no real-time power feedback correction mechanism, leading to low coupling efficiency and poor power stability, which cannot meet the continuous and stable requirements of high-efficiency mass production and high-precision coupling of optical modules. Summary of the Invention

[0004] The purpose of this invention is to provide an optical module coupling device and control method, which solves the technical problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a control method for an optical module coupling device, comprising the following steps:

[0006] S1. System initialization calibration: The coupling device is powered on and started. The MCU control unit performs rotation angle homing and motion accuracy calibration on the drive motor. Simultaneously, it completes the CCD camera visual recognition threshold calibration, slide table movement stroke calibration, probe height detection benchmark value setting, and pre-stores coupling parameters of multiple optical devices.

[0007] S2, FA component visual precision positioning: The CCD camera acquires image information of the FA component carried by the slide in real time, and analyzes the center coordinates and contour position of the FA component through image algorithm, and transmits the positioning data to the MCU control unit;

[0008] S3. Automatic transfer and alignment at the coupling station: The MCU control unit drives the slide to move according to the positioning data, moving the circuit board and FA assembly to the coupling station, so that the FA assembly and the nozzle assembly are kept in a coaxial alignment state.

[0009] S4, FA component flexible clamping pre-descent: The nozzle assembly adopts top surface vacuum suction combined with side grippers to flexibly clamp the FA component. After clamping, the nozzle assembly is driven to descend at a constant speed, approaching the circuit board coupling area.

[0010] S5. Probe detection and adaptive horizontal leveling: The probes on both sides of the nozzle assembly contact the surface of the circuit board, collect the height signals of the left and right sides in real time and upload them to the MCU control unit; the MCU control unit calculates the tilt angle of the circuit board based on the height difference between the two sides, and uses closed-loop control to drive the motor to rotate and adjust the attitude of the nozzle assembly until the FA assembly and the circuit board reach the required coupling parallelism.

[0011] S6. Closed-loop coupling and process completion: The MCU control unit drives the coupling actuator based on the deep learning real-time feedback algorithm to complete the fully automatic coupling of the optical chip and the FA component; after the coupling is completed, the nozzle component releases the FA component, and the slide and drive motor are reset in sequence.

[0012] Preferably, in step S1, the initialization calibration process has a built-in preset library of coupling parameters for multiple specifications of optical devices, which supports one-click switching and calling of coupling parameters for different models of optical devices, and the switching process does not require re-performing device calibration.

[0013] Preferably, in step S2, the CCD camera is equipped with a multi-scale image recognition algorithm, which can perform image recognition and position calculation on the FA components of 4-channel, 8-channel, and 12-channel multi-specification optical chips, with a visual recognition positioning accuracy of ≤±3μm.

[0014] Preferably, in step S4, the nozzle assembly adopts a composite clamping structure that combines top surface vacuum negative pressure adsorption with side flexible grippers. The clamping force and clamping opening are adaptively adjusted according to the material and shape specifications of the FA assembly, and there is no rigid contact stress during the clamping process.

[0015] Preferably, in step S5, the MCU control unit constructs a three-dimensional closed-loop control model of height difference-rotation angle-parallelism based on the height signal collected by the dual probes, converts the height analog signal into a digital adjustment signal in real time, and outputs a drive command to the drive motor according to the digital adjustment signal. The angle adjustment response time of the drive motor does not exceed 50ms, and the parallelism tolerance between the FA component and the circuit board is controlled within ±5μm.

[0016] Preferably, in step S6, the MCU control unit collects the coupling power signal in real time through a deep learning real-time feedback algorithm, and dynamically corrects the coupling position parameters based on the coupling power signal to form a fully closed-loop motion control of detection-calculation-adjustment-verification, with a single fully automatic coupling time of ≤3 minutes.

[0017] An optical module coupling device includes a base, a drive motor, a CCD camera, a nozzle assembly, a circuit board, a slide, a probe, side grippers, an FA assembly, and an MCU control unit.

[0018] The MCU control unit is electrically connected to the drive motor, CCD camera, nozzle assembly, slide, and probe, respectively.

[0019] The slide is fixed to the horizontal plate of the base, the circuit board is installed in the slide slot, the CCD camera is located above the circuit board, and the drive motor is fixed to the back of the vertical plate of the base and its output end is connected to the nozzle assembly.

[0020] The nozzle assembly has probes symmetrically arranged on both sides, and a side gripper with adaptive width adjustment is installed at the end.

[0021] Preferably, the probe is a symmetrical contact height sensor, symmetrically arranged with the central axis of the nozzle assembly as a reference, which converts the analog height signals of the left and right sides of the circuit board into digital signals in real time and transmits them synchronously to the MCU control unit.

[0022] Preferably, the suction nozzle assembly integrates a vacuum adsorption mechanism and a flexible adaptive clamping mechanism. The top vacuum nozzle is positioned at the center of the top surface of the FA assembly, and the side grippers can adaptively adjust the clamping width in the horizontal direction and flexibly wrap around the side wall of the FA assembly.

[0023] Preferably, the slide adopts a pneumatically integrated high-precision translation mechanism, which automatically and adaptively adjusts the translation stroke and clamping adaptation width according to the shape and specifications of the circuit board and FA components.

[0024] Compared with related technologies, the optical module coupling device and control method provided by the present invention have the following beneficial effects:

[0025] 1. This invention provides an optical module coupling device and control method. Through system initialization, it synchronously completes drive motor precision calibration, CCD visual threshold calibration, slide stage stroke calibration, and probe reference setting, and pre-stores coupling parameters for multiple optical devices. Combined with CCD camera multi-scale image recognition, it achieves micron-level visual positioning of the FA component. It employs a composite clamping structure of top-surface vacuum adsorption and side flexible grippers, and relies on dual-probe height detection and a three-dimensional closed-loop model of height difference-rotation angle-parallelism to achieve adaptive horizontal leveling. This solves the problems of low visual positioning accuracy, poor compatibility with multiple device specifications requiring repeated calibration, easy generation of rigid stress during clamping leading to FA component damage, and large parallelism adjustment errors between the FA component and the circuit board, making it difficult to meet coupling tolerance requirements.

[0026] 2. This invention provides an optical module coupling device and control method. Through the full-process automated collaborative management and control of the MCU control unit, the drive motor responds at high speed to complete the attitude adjustment. Based on the deep learning real-time feedback algorithm, the coupling power signal is collected and the coupling position is dynamically corrected, forming a detection-calculation-adjustment-verification full closed-loop coupling control. After the operation is completed, each mechanism automatically resets. This solves the problems of traditional optical module coupling, such as many manual intervention links, cumbersome and complex operation process, slow coupling adjustment response, insufficient coupling power stability, and long time consumption and low production efficiency of single coupling operation. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of the drive motor of the present invention;

[0029] Figure 3 This is a schematic diagram of the structure of the slide table in this invention;

[0030] Figure 4 For the present invention Figure 3 Enlarged view of the structure at point A in the middle;

[0031] Figure 5 This is a schematic diagram of the CCD camera structure of the present invention;

[0032] Figure 6 For the present invention Figure 5 Enlarged view of the structure at point B in the middle;

[0033] Figure 7 This is the control flowchart of the present invention.

[0034] In the diagram: 1. Base; 2. Drive motor; 3. CCD camera; 4. Nozzle assembly; 5. Circuit board; 6. Slide table; 7. Probe; 8. Side gripper; 9. FA assembly. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0036] Please see Figures 1-7 The present invention provides a technical solution: a control method for an optical module coupling device, comprising the following steps:

[0037] S1. System initialization calibration: The coupling device is powered on and started. The MCU control unit performs rotation angle homing and motion accuracy calibration on the drive motor 2. Simultaneously, it completes the visual recognition threshold calibration of the CCD camera 3, the movement stroke calibration of the slide table 6, the height detection reference value setting of the probe 7, and pre-stores coupling parameters of multiple optical devices.

[0038] In step S1, the initialization calibration process has a built-in preset library of coupling parameters for multiple specifications of optical devices, which supports one-click switching and calling of coupling parameters for different models of optical devices. The switching process does not require re-performing device calibration.

[0039] In this implementation scheme, after the coupling device is powered on, the MCU control unit, in conjunction with the encoder and zero-point limit switch integrated into the drive motor, completes the mechanical repositioning of the drive motor's rotation angle and the closed-loop calibration of its motion accuracy. Simultaneously, the MCU control unit inputs a standard calibration image to the CCD camera to automatically calibrate the visual recognition grayscale threshold and edge detection threshold. It then uses a grating ruler to detect the full-stroke displacement of the slide table, completing the accuracy calibration of the slide table's movement stroke. Finally, it contacts the probe with a standard reference plane to zero and set the height detection reference value. The MCU control unit has a built-in Flash storage module that pre-stores coupling parameter libraries for various specifications of optical devices, including 4-channel, 8-channel, and 12-channel devices. When the user triggers parameter switching via external commands, the MCU directly calls the pre-stored parameters, eliminating the need to re-execute the calibration process for the drive motor, CCD camera, slide table, and probe, thus quickly adapting to coupling operations for different types of optical devices.

[0040] S2, FA component visual precision positioning: CCD camera 3 acquires image information of FA component 9 carried by slide table 6 in real time, analyzes the center coordinates and contour position of FA component 9 through image algorithm, and transmits the positioning data to MCU control unit;

[0041] In step S2, the CCD camera 3 is equipped with a multi-scale image recognition algorithm, which can perform image recognition and position calculation on the FA component 9 that is matched with 4-channel, 8-channel, and 12-channel multi-specification optical chips, with a visual recognition positioning accuracy of ≤±3μm;

[0042] In this implementation scheme, a high-definition industrial CCD camera is used, equipped with a Gaussian pyramid multi-scale image recognition algorithm. Through image analysis processes such as edge detection, contour extraction, and centroid calculation, the algorithm identifies the shape contour and center coordinates of the FA component. The algorithm has a built-in multi-channel FA component adaptation template, which can automatically match the specifications of FA components for 4-channel, 8-channel, and 12-channel optical chips to complete the position data calculation. Through sub-pixel image processing technology and camera distortion correction, the visual recognition positioning accuracy is controlled within the range of ≤±3μm. The calculated positioning data is transmitted to the MCU control unit in real time via a high-speed serial port, providing accurate data for subsequent transfer and alignment.

[0043] S3. Automatic transfer and alignment of coupling station: The MCU control unit drives the slide table 6 to move according to the positioning data, which moves the circuit board 5 and FA component 9 to the coupling station, so that the FA component 9 and the nozzle component 4 are kept in a coaxial alignment state.

[0044] In this implementation scheme, after receiving the positioning data of the FA component, the MCU control unit drives the pneumatic / servo drive mechanism of the slide table through a PID closed-loop control algorithm, causing the slide table to move horizontally with high precision. During the translation of the slide table, displacement data is fed back in real time through a grating ruler, and the MCU continuously corrects the translation error until the circuit board and the FA component are accurately moved to the preset coupling operation position. At this time, the central axis of the FA component coincides with the central axis of the suction nozzle component, achieving a coaxial alignment state, and the alignment deviation meets the accuracy requirements of subsequent clamping and coupling.

[0045] S4, FA component flexible clamping pre-descent: The suction nozzle assembly 4 uses top surface vacuum suction combined with side gripper 8 to flexibly clamp the FA component 9. After clamping, the suction nozzle assembly 4 is driven to descend at a constant speed and approach the coupling area of ​​circuit board 5.

[0046] In step S4, the suction nozzle assembly 4 adopts a composite clamping structure that combines top surface vacuum negative pressure adsorption with side flexible grippers 8. The clamping force and clamping opening are adaptively adjusted according to the material and shape specifications of the FA assembly 9, and there is no rigid contact stress during the clamping process.

[0047] In this implementation scheme, the vacuum adsorption mechanism on the top surface of the nozzle assembly generates negative pressure through a vacuum generator to attract the center position of the top surface of the FA assembly. The side grippers are made of elastic and flexible material and are driven by a micro stepper motor to adjust the horizontal opening. Based on the material and shape specifications of the FA assembly, the MCU adaptively adjusts the clamping force and clamping opening through the clamping force signal fed back by the pressure sensor, forming a composite clamping state of top surface adsorption + side encirclement. There is no rigid contact stress during the clamping process, avoiding damage or deformation of the FA assembly. After clamping, the MCU controls the drive motor to drive the nozzle assembly to descend at a constant speed until the FA assembly is close to the coupling area of ​​the circuit board, at which point the descent stops and awaits leveling.

[0048] S5. Probe detection and adaptive horizontal leveling: The probes 7 on both sides of the nozzle assembly 4 contact the surface of the circuit board 5, collect the height signals of the left and right sides in real time and upload them to the MCU control unit; the MCU control unit calculates the tilt angle of the circuit board 5 according to the height difference on both sides, and controls the drive motor 2 to rotate and adjust the posture of the nozzle assembly 4 until the FA assembly 9 and the circuit board 5 reach the required parallelism of coupling.

[0049] In step S5, the MCU control unit constructs a three-dimensional closed-loop control model of height difference-rotation angle-parallelism based on the height signal collected by the dual probes 7, converts the height analog signal into a digital adjustment signal in real time, and outputs a drive command to the drive motor 2 according to the digital adjustment signal. The angle adjustment response time of the drive motor 2 does not exceed 50ms, and the parallelism tolerance between the FA component 9 and the circuit board 5 is controlled within ±5μm.

[0050] In this implementation, symmetrical contact probes on both sides of the nozzle assembly synchronously contact the circuit board surface, acquiring analog height signals from both sides of the circuit board in real time. The probes have built-in AD conversion modules that convert the analog signals into digital signals at high speed and transmit them to the MCU control unit. Based on a pre-stored three-dimensional closed-loop control model of height difference, rotation angle, and parallelism, the MCU control unit calculates the tilt angle of the circuit board according to the height difference between the two sides and converts the angle signal into adjustment commands for the drive motor. The drive motor is a high-speed servo motor with an angle adjustment response time of no more than 50ms, rapidly rotating and adjusting the posture of the nozzle assembly to correct the parallelism between the FA assembly and the circuit board in real time. The leveling process is completed when the height difference between the probes on both sides is ≤±5μm, achieving the coupling parallelism tolerance requirement between the FA assembly and the circuit board.

[0051] S6. Closed-loop coupling and process completion: The MCU control unit drives the coupling actuator based on the deep learning real-time feedback algorithm to complete the fully automatic coupling of the optical chip and FA component 9; after coupling is completed, the nozzle component 4 releases the FA component 9, and the slide 6 and drive motor 2 are reset in sequence.

[0052] In step S6, the MCU control unit collects the coupling power signal in real time through a deep learning real-time feedback algorithm, and dynamically corrects the coupling position parameters based on the coupling power signal to form a fully closed-loop motion control of detection-calculation-adjustment-verification. The time for a single fully automatic coupling is ≤3 minutes.

[0053] In this implementation scheme, the MCU control unit loads a deep learning real-time feedback algorithm, which collects the coupling power signal between the optical chip and the FA component in real time through a power sensor. The coupling power data is input into the algorithm model to dynamically correct the position parameters of the coupling actuator, forming a closed-loop motion control system of detection-calculation-adjustment-verification, continuously optimizing the coupling position until the coupling power reaches its peak. The entire fully automated coupling process is seamless and without redundant steps, with a single coupling time controlled to ≤3 minutes. After coupling is completed, the nozzle assembly disconnects the vacuum, releases the side grippers, and releases the FA component; subsequently, the MCU controls the slide to translate and reset, and the drive motor to rotate and return to its original position, restoring the device to its initial state, ready for the next coupling operation.

[0054] An optical module coupling device includes a base 1, a drive motor 2, a CCD camera 3, a nozzle assembly 4, a circuit board 5, a slide 6, a probe 7, a side gripper 8, an FA assembly 9, and an MCU control unit.

[0055] The MCU control unit is electrically connected to the drive motor 2, CCD camera 3, nozzle assembly 4, slide 6, and probe 7 respectively;

[0056] The slide table 6 is fixed to the horizontal plate of the base 1, the circuit board 5 is installed in the slot of the slide table 6, the CCD camera 3 is located above the circuit board 5, and the drive motor 2 is fixed to the back of the vertical plate of the base 1 and its output end is connected to the suction nozzle assembly 4.

[0057] The nozzle assembly 4 has probes 7 symmetrically arranged on both sides, and a side gripper 8 with adaptive width adjustment installed at the end;

[0058] Probe 7 is a symmetrical contact height sensor, which is symmetrically arranged with the central axis of the nozzle assembly 4 as the reference. It converts the analog height signals on the left and right sides of the circuit board 5 into digital signals in real time and transmits them synchronously to the MCU control unit.

[0059] The suction nozzle assembly 4 integrates a vacuum adsorption mechanism and a flexible adaptive clamping mechanism. The top vacuum nozzle is positioned at the center of the top surface of the FA assembly 9, and the side grippers 8 can adaptively adjust the clamping width in the horizontal direction and flexibly wrap around the side wall of the FA assembly 9.

[0060] The slide 6 adopts a pneumatic integrated high-precision translation mechanism, which automatically and adaptively adjusts the translation stroke and clamping adaptation width according to the shape and specifications of the circuit board 5 and FA component 9.

[0061] In this implementation scheme, the MCU control unit serves as the core control module, connecting to the drive motor, CCD camera, nozzle assembly, slide, and probes via I / O interfaces, AD conversion interfaces, and drive interfaces, respectively, to achieve full-process electrical signal control and data interaction. The horizontal plate of the base provides a fixed mounting foundation for the slide, which employs a pneumatically integrated high-precision translation mechanism with built-in guide rails and grating rulers. This mechanism automatically adjusts the translation stroke and clamping width according to the shape and specifications of the circuit board and FA assembly. The vertical plate of the base provides mounting support for the drive motor, whose output is directly connected to the nozzle assembly, enabling attitude adjustment of the nozzle assembly. Probes are symmetrically arranged on both sides of the nozzle assembly with the central axis as a reference, ensuring symmetry and accuracy in height detection. The end of the nozzle assembly integrates a vacuum adsorption mechanism and a flexible adaptive clamping mechanism. The side grippers can adaptively adjust their width in the horizontal direction, achieving flexible circumferential clamping of the FA assembly. All components work together to complete the fully automated, high-precision coupling operation of the optical module.

[0062] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0063] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A control method for an optical module coupling device, characterized in that: Includes the following steps: S1. System initialization calibration: The coupling device is powered on and started. The MCU control unit performs rotation angle return and motion accuracy calibration on the drive motor (2). Simultaneously, the visual recognition threshold calibration of the CCD camera (3), the movement stroke calibration of the slide (6), and the height detection reference value setting of the probe (7) are completed. The coupling parameters of multiple optical devices are pre-stored. S2, FA component visual precision positioning: CCD camera (3) collects image information of FA component (9) carried by slide (6) in real time, analyzes the center coordinates and contour position of FA component (9) through image algorithm, and transmits the positioning data to MCU control unit; S3, Automatic transfer and alignment of coupling station: The MCU control unit drives the slide (6) to move according to the positioning data, which drives the circuit board (5) and FA component (9) to the coupling station, so that the FA component (9) and the nozzle component (4) are kept in a coaxial alignment state; S4, FA component flexible clamping pre-descent: The suction nozzle assembly (4) adopts top surface vacuum suction and side gripper (8) to flexibly clamp the FA component (9). After clamping, the suction nozzle assembly (4) is driven to descend at a constant speed and approach the coupling area of ​​the circuit board (5). S5, Probe detection and horizontal adaptive leveling: The probes (7) on both sides of the nozzle assembly (4) contact the surface of the circuit board (5), collect the height signals on the left and right sides in real time and upload them to the MCU control unit; The MCU control unit calculates the tilt angle of the circuit board (5) based on the height difference on both sides, and controls the drive motor (2) to rotate and adjust the posture of the nozzle assembly (4) until the FA assembly (9) and the circuit board (5) reach the coupling parallelism requirement. S6. Closed-loop coupling and process completion: The MCU control unit drives the coupling actuator based on the deep learning real-time feedback algorithm to complete the fully automatic coupling of the optical chip and the FA component (9); after the coupling is completed, the nozzle component (4) releases the FA component (9), and the slide (6) and the drive motor (2) are reset in sequence.

2. The control method for an optical module coupling device according to claim 1, characterized in that: In step S1, the initialization calibration process has a built-in preset library of coupling parameters for multiple specifications of optical devices, which supports one-click switching of coupling parameters for different models of optical devices. The switching process does not require re-performing device calibration.

3. The control method for an optical module coupling device according to claim 1, characterized in that: In step S2, the CCD camera (3) is equipped with a multi-scale image recognition algorithm, which can perform image recognition and position calculation on the FA component (9) of 4-channel, 8-channel and 12-channel multi-specification optical chips. The visual recognition positioning accuracy is ≤ ±3μm.

4. The control method for an optical module coupling device according to claim 1, characterized in that: In step S4, the suction nozzle assembly (4) adopts a composite clamping structure that combines top surface vacuum negative pressure adsorption with side flexible grippers (8) to surround it. The clamping force and clamping opening are adaptively adjusted according to the material and shape specifications of the FA assembly (9), and there is no rigid contact stress during the clamping process.

5. The control method for an optical module coupling device according to claim 1, characterized in that: In step S5, the MCU control unit constructs a three-dimensional closed-loop control model of height difference-rotation angle-parallelism based on the height signal collected by the dual probes (7), converts the height analog signal into a digital adjustment signal in real time, and outputs a drive command to the drive motor (2) according to the digital adjustment signal. The angle adjustment response time of the drive motor (2) does not exceed 50ms, and the parallelism tolerance between the FA component (9) and the circuit board (5) is controlled within ±5μm.

6. The control method for an optical module coupling device according to claim 1, characterized in that: In step S6, the MCU control unit collects the coupling power signal in real time through a deep learning real-time feedback algorithm, and dynamically corrects the coupling position parameters based on the coupling power signal to form a fully closed-loop motion control of detection-calculation-adjustment-verification. The time for a single fully automatic coupling is ≤3 minutes.

7. A coupling device for using the control method of the optical module coupling device according to any one of claims 1-6, characterized in that: Includes base (1), drive motor (2), CCD camera (3), nozzle assembly (4), circuit board (5), slide (6), probe (7), side gripper (8), FA assembly (9) and MCU control unit; The MCU control unit is electrically connected to the drive motor (2), CCD camera (3), nozzle assembly (4), slide (6), and probe (7), respectively; The slide (6) is fixed to the horizontal plate of the base (1), the circuit board (5) is installed in the slot of the slide (6), the CCD camera (3) is located above the circuit board (5), and the drive motor (2) is fixed to the back of the vertical plate of the base (1) and the output end is connected to the nozzle assembly (4). The suction nozzle assembly (4) has probes (7) symmetrically arranged on both sides, and a side gripper (8) with adaptive width adjustment installed at the end.

8. The optical module coupling device according to claim 7, characterized in that: The probe (7) is a symmetrical contact height sensor, which is symmetrically arranged with the central axis of the nozzle assembly (4) as the reference. It converts the analog height signals on the left and right sides of the circuit board (5) into digital signals in real time and transmits them to the MCU control unit synchronously.

9. The optical module coupling device according to claim 7, characterized in that: The suction nozzle assembly (4) integrates a vacuum adsorption mechanism and a flexible adaptive clamping mechanism. The top vacuum nozzle is set at the center of the top surface of the FA assembly (9), and the side grippers (8) can adaptively adjust the clamping width in the horizontal direction and flexibly surround the side wall of the FA assembly (9).

10. The optical module coupling device according to claim 7, characterized in that: The slide (6) adopts a pneumatic integrated high-precision translation mechanism, which automatically and adaptively adjusts the translation stroke and clamping adaptation width according to the shape and specifications of the circuit board (5) and FA component (9).

Images