Low-od value mini-led backlight module optical structure
By combining microstructure secondary optical lenses, ultra-thin optical film groups, and a reflective structure with an integrated support structure, the problems of large thickness and insufficient optical performance of MiniLED backlight modules are solved, achieving efficient light uniformity, low halo, ultra-thinness, and stable display.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUAIAN COLLEGE OF INFORMATION TECH
- Filing Date
- 2026-06-16
- Publication Date
- 2026-07-21
AI Technical Summary
The excessively large OD value of the mixing distance in traditional MiniLED backlight modules results in a thick module that is difficult to meet the requirements for thinner and lighter designs. It also suffers from problems such as a bright spot in the center, uneven brightness, obvious halo, light crosstalk, and difficulty in balancing heat dissipation and structural stability.
By combining a microstructured secondary optical lens with an ultrathin optical film assembly, along with a reflective structure and an integrated support structure, rapid and efficient light homogenization of the point light source is achieved. Through high-density arrangement and a fine-tuning algorithm, optical crosstalk is suppressed, and light utilization and structural stability are improved.
Achieving high uniformity, high contrast, and low halo backlight output within an extremely small mixing distance, significantly reducing module thickness, and maintaining efficient heat dissipation and stable display within an ultra-thin space.
Smart Images
Figure CN122431038A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of MiniLED backlight display technology, and particularly relates to an optical structure for a low OD value MiniLED backlight module. Background Technology
[0002] MiniLED backlighting has become the mainstream technology for mid-to-high-end displays due to its advantages such as high local dimming, high contrast, high brightness, and long lifespan. Traditional direct-lit MiniLED backlight modules typically have a mixing distance (OD) of over 10mm, resulting in a relatively large overall thickness, making it difficult to meet the demand for thinner and lighter designs.
[0003] Reducing the OD value can significantly compress the module thickness, but shortening the mixing distance will bring a series of problems: If a point light source emits light before it is fully mixed, it is easy to form a central hotspot and uneven brightness (mura). The light crosstalk between adjacent zones is aggravated, the halo is obvious, and the purity of the black field is reduced; It is difficult to balance heat dissipation and structural stability in ultra-thin structures; Conventional optical films and lenses cannot achieve efficient light homogenization within a short optical path. Existing technologies often rely on thickening the diffuser plate or increasing the number of film layers to improve uniformity, but this increases the thickness and reduces the light efficiency, making it impossible to truly achieve a balance between low OD and high performance.
[0004] Therefore, it is necessary to develop a low-OD value MiniLED backlight module optical structure that can achieve high luminous efficiency, high uniformity, and low halo within a very small mixing distance to solve the above problems. Summary of the Invention
[0005] To address the aforementioned problems, this invention provides a low OD value MiniLED backlight module optical structure to solve one of the problems mentioned in the background art.
[0006] To achieve the above objectives, the present invention provides the following technical solution: an optical structure for a low OD value MiniLED backlight module, comprising: a MiniLED light source board, a microstructure secondary optical lens, an ultra-thin optical film group, a reflective structure, and an integrated support structure; The MiniLED light source board consists of a substrate and MiniLED light-emitting chips mounted on the substrate. A support frame is provided at the edge of the substrate, and the height of the support frame is the same as the height of the MiniLED light-emitting chips. The microstructure secondary optical lens is directly attached to the support frame to expand and homogenize the point light source within a short mixing distance. The ultra-thin optical film group is located above the lens to achieve uniformity and brightness enhancement of the surface light source. Through the cooperation of the microstructure secondary optical lens and the ultra-thin optical film group, the OD value is minimized, achieving high uniformity, high contrast, and low halo emission within an ultra-thin space. The reflective structure is disposed on the MiniLED light-emitting chips to recover large-angle light, compensate for dark areas, and improve light utilization. The integrated support structure is located at the bottom of the MiniLED light source board, and a mounting slot is provided on the top of the integrated support structure. An encapsulation plate is attached to the top of the integrated support structure to cooperate with the mounting slot in encapsulating the MiniLED light source board, the microstructure secondary optical lens, the ultra-thin optical film group, and the reflective structure.
[0007] Furthermore, the MiniLED light-emitting chip is a micron-sized LED chip with a size of up to μm, and the die-bonding position accuracy is controlled at the micron level to achieve high-density arrangement.
[0008] Furthermore, the MiniLED light source board adopts COB packaging or COG glass-based packaging, integrates driving circuitry, and supports fine local dimming of tens of thousands of zones.
[0009] Furthermore, the microstructure secondary optical lens is an aspherical lens or a microlens array, which converges the Lambertian light source to a beam angle of ±30° and eliminates the central bright spot within a mixing distance of 0 to 3 mm.
[0010] Furthermore, the ultrathin optical film group is composed of a quantum dot film, a single prism sheet, and an ultrathin diffusion film from top to bottom, and the total thickness of the ultrathin optical film group is ≤0.5mm.
[0011] Furthermore, the reflective structure comprises a high-reflectivity layer and a chip gap reflective microstructure, used to recover large-angle light, compensate for dark areas, and improve light utilization. The chip gap reflective microstructure has a conical design and is uniformly disposed between adjacent MiniLED light-emitting chips.
[0012] Furthermore, the integrated support structure uses composite materials or a heat dissipation plate to achieve optical device positioning and heat dissipation within the ultra-thin body.
[0013] Furthermore, the MiniLED backlight module's optical structure, combined with high-precision local dimming drive and zone dimming algorithm, suppresses inter-zone light crosstalk and improves black level performance and contrast.
[0014] Furthermore, the bottom of the integrated support structure is uniformly provided with multiple parallel heat dissipation grooves.
[0015] The technical effects and advantages of this invention are as follows: 1. This invention achieves rapid light homogenization of point light sources within an extremely small light mixing distance of 0 to 3 mm by using a microstructure secondary optical lens and a support frame to eliminate bright spots, thereby minimizing the OD value and making the whole machine ultra-thin. 2. This invention achieves efficient light homogenization, brightness enhancement, color gamut improvement, and light path recovery by combining a top-down ultrathin optical film assembly with a conical reflective microstructure, significantly improving uniformity and light utilization under low OD conditions; 3. This invention adopts an integrated support structure, a heat spreader material, and a bottom heat dissipation groove, which simultaneously achieves structural positioning, encapsulation and fixation, and efficient heat dissipation within an ultra-thin body. Combined with tens of thousands of fine-zone dimming, it achieves high contrast, low halo, and high stability backlight output.
[0016] It should be understood that both the foregoing general description and the following detailed description are for illustrative purposes and do not necessarily limit the scope of this disclosure. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate the subject matter of this disclosure. Furthermore, the specification and drawings serve to explain the principles of this disclosure. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the specific embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation of this application.
[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the bottom three-dimensional structure of the integrated support structure in this invention; Figure 3 This is an exploded view of the entire invention; Figure 4 In this invention Figure 3 Enlarged view of part A; Figure 5 This is a three-dimensional schematic diagram of the MiniLED light source board and the reflective structure in this invention.
[0019] In the diagram: 1. MiniLED light source board; 11. Substrate; 12. MiniLED light-emitting chip; 2. Microstructure secondary optical lens; 3. Ultra-thin optical film group; 31. Quantum dot film; 32. Single prism sheet; 33. Ultra-thin diffusion film; 4. Reflective structure; 41. Chip gap reflective microstructure; 5. Integrated support structure; 6. Support frame; 7. Packaging board; 8. Heat sink. Detailed Implementation
[0020] To make the technical solutions and advantages of the embodiments of this application clearer, the exemplary embodiments of this application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not an exhaustive list of all embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This invention provides, for example Figures 1 to 5 The optical structure of a low OD value MiniLED backlight module shown includes a MiniLED light source plate 1, a microstructure secondary optical lens 2, an ultra-thin optical film group 3, a reflective structure 4, and an integrated support structure 5. The MiniLED light source board 1 consists of a substrate 11 and MiniLED light-emitting chips 12 mounted on the substrate 11. The MiniLED light-emitting chips 12 are micron-sized LED chips with a size of 50 to 300 μm. The die-bonding position accuracy is controlled at the micron level to achieve high-density arrangement. A support frame 6 is provided at the edge of the substrate 11, and the height of the support frame 6 is the same as the height of the MiniLED light-emitting chips 12. A microstructure secondary optical lens 2 is directly attached to the support frame 6 to expand and homogenize the point light source within a short mixing distance. The microstructure secondary optical lens 2 is an aspherical lens or a microlens array, which converges the Lambertian light source to a ±30° output angle and eliminates the central bright spot within a mixing distance of 0 to 3 mm. An ultrathin optical film group 3 is located above the lens to achieve surface light source homogenization and brightness enhancement. Through the cooperation of the microstructure secondary optical lens 2 and the ultrathin optical film group 3, the light source is... Minimizing the OD value achieves high uniformity, high contrast, and low halo emission within an ultra-thin space. The reflective structure 4 is set on the MiniLED light-emitting chip 12 to recover large-angle light, compensate for dark areas, and improve light utilization. The integrated support structure 5 is located at the bottom of the MiniLED light source board 1, and the top of the integrated support structure 5 has a mounting groove. The top of the integrated support structure 5 is attached to the encapsulation plate 7, which is used to cooperate with the mounting groove to encapsulate the MiniLED light source board 1, the microstructure secondary optical lens 2, the ultra-thin optical film group 3, and the reflective structure 4. The MiniLED light source board 1 adopts COB packaging or COG glass substrate packaging, integrates driving circuits, and supports fine local dimming of tens of thousands of zones. The optical structure of the MiniLED backlight module, combined with high-precision local dimming drive and zone dimming algorithm, suppresses light crosstalk between zones and improves black level performance and contrast.
[0021] When the present invention is working, the MiniLED light-emitting chip 12 on the MiniLED light source board 1 is powered on and emits Lambertian light; the support frame 6 at the edge of the substrate 11 keeps the microstructure secondary optical lens 2 in stable contact, and quickly converges the large-angle scattered light emitted by the MiniLED light-emitting chip 12 to a light output angle of ±30°, completes the primary light distribution within a short light mixing distance of 0 to 3 mm, eliminates the central bright spot, and achieves stable light output under low OD conditions; As light continues upward into the ultra-thin optical film group 3, it is further homogenized, brightened, and has its color gamut enhanced by multiple layers of films. Within the ultra-thin space, the point light source is transformed into a uniform surface light source, achieving high uniformity, high contrast, and low halo emission. During optical propagation, the reflection structure 4 can reflect and recover large-angle stray light from the sides and below the MiniLED light-emitting chip 12, filling the dark areas between the MiniLED light-emitting chips 12 and improving the overall light utilization rate. The integrated support structure 5 precisely positions and fixes each optical component through the top mounting slot and completes the overall encapsulation with the packaging board 7. At the same time, it adopts high thermal conductivity materials and structural design to quickly dissipate the heat generated by the MiniLED light-emitting chip 12 during operation, ensuring long-term stable operation of the module within the ultra-thin body. The MiniLED light-emitting chips 12 are arranged in a high-density manner with micron-level precision. Combined with COB or COG packaging, integrated driving circuits, and high-precision local dimming algorithms, it achieves independent light control for tens of thousands of zones, effectively suppressing light crosstalk between zones, enhancing black level performance, and significantly improving contrast and display quality.
[0022] like Figure 3 and Figure 4 As shown, the ultrathin optical film group 3 consists of a quantum dot film 31, a single prism sheet 32 and an ultrathin diffusion film 33 from top to bottom, and the total thickness of the ultrathin optical film group 3 is ≤0.5mm.
[0023] After light is emitted from the microstructure secondary optical lens 2, it passes through the ultrathin diffusion film 33, the single prism sheet 32, and the quantum dot film 31 from bottom to top: the ultrathin diffusion film 33 first scatters and homogenizes the light, breaking up local overly bright areas and making the light intensity distribution smoother; the single prism sheet 32 uses the prism microstructure to converge the light angle, deflecting large-angle side light to the axis and improving the center brightness; the quantum dot film 31 is excited by blue light to generate narrow red and green spectra, which are combined with the remaining blue light to synthesize high color gamut white light, realizing wide color gamut output; the three films complete all optical processing within an ultrathin thickness of ≤0.5mm, without extending the optical path or increasing the OD value, realizing high-performance light output of the low OD backlight module.
[0024] like Figures 3 to 5 As shown, the reflective structure 4 consists of a high reflective layer and a chip gap reflective microstructure 41, which is used to recover large-angle light, compensate for dark areas, and improve light utilization. The chip gap reflective microstructure 41 is a conical design and is uniformly arranged between adjacent MiniLED light-emitting chips 12. A high-reflectivity layer is laid on the surface of the substrate 11 of the MiniLED light source board 1. The chip gap reflective microstructure 41 is a conical design and is evenly arranged between adjacent MiniLED light-emitting chips 12. The large-angle lateral light and downward scattered light emitted by the MiniLED light-emitting chip 12 are reflected by specular reflection and diffuse reflection after entering the high-reflectivity layer and the conical chip gap reflective microstructure 41, and are redirected to the upward light emission direction. The conical structure can efficiently gather and reflect the stray light in the chip gap area to the light emission surface, fill the dark area and uneven brightness caused by the chip spacing, and improve the overall light efficiency and light emission uniformity without increasing the OD value.
[0025] like Figure 1 and Figure 2 As shown, the integrated support structure 5 uses composite materials or a heat dissipation plate to achieve the positioning and heat dissipation of optical devices within the ultra-thin body. Multiple parallel heat dissipation grooves 8 are evenly arranged at the bottom of the integrated support structure 5. The integrated support structure 5 serves as the base for the entire backlight module. Made of composite materials or a heat spreader, it can quickly and evenly conduct and diffuse the heat generated by the MiniLED light-emitting chip 12 during operation, preventing local overheating that could lead to brightness decay or failure. The mounting slot on its top can precisely limit and fix the MiniLED light source board 1, the microstructure secondary optical lens 2, and the ultra-thin optical film group 3, ensuring that each optical layer remains stably aligned within the ultra-thin body and ensuring the reliable operation of the low-OD optical structure. The multiple parallel heat dissipation slots 8 evenly arranged at the bottom increase the heat dissipation area and further enhance the heat dissipation efficiency. This allows for the simultaneous implementation of structural support, device positioning, packaging fixation, and efficient heat dissipation within the ultra-thin space, ensuring the long-term stable operation of the module.
[0026] Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this disclosure.
[0027] In the description of this disclosure, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0028] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.
[0029] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.
[0030] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.
Claims
1. An optical structure for a low OD value MiniLED backlight module, characterized in that, include: MiniLED light source board (1), microstructure secondary optical lens (2), ultrathin optical film group (3), reflection structure (4) and integrated support structure (5). The MiniLED light source board (1) consists of a substrate (11) and a MiniLED light-emitting chip (12) mounted on the substrate (11). A support frame (6) is provided on the edge of the substrate (11), and the height of the support frame (6) is the same as the height of the MiniLED light-emitting chip (12). The microstructure secondary optical lens (2) is directly attached to the support frame (6) to expand and homogenize the point light source within a short mixing distance. The ultrathin optical film group (3) is located above the lens to achieve uniformity and brightness enhancement of the surface light source. Through the cooperation of the microstructure secondary optical lens (2) and the ultrathin optical film group (3), the OD value is increased. Minimize the light source to achieve high uniformity, high contrast, and low halo emission in an ultra-thin space; the reflective structure (4) is set on the MiniLED light-emitting chip (12) to recover large-angle light, compensate for dark areas, and improve light utilization; the integrated support structure (5) is located at the bottom of the MiniLED light source board (1), and the top of the integrated support structure (5) is provided with an installation groove; the top of the integrated support structure (5) is attached with an encapsulation plate (7) to cooperate with the installation groove to realize the encapsulation operation of the MiniLED light source board (1), the microstructure secondary optical lens (2), the ultra-thin optical film group (3), and the reflective structure (4).
2. The low OD value MiniLED backlight module optical structure according to claim 1, characterized in that: The MiniLED light-emitting chip (12) is a micron-sized LED chip with a size of 50 to 300 μm. The die-bonding position accuracy is controlled at the micron level to achieve high-density arrangement.
3. The low OD value MiniLED backlight module optical structure according to claim 2, characterized in that: The MiniLED light source board (1) adopts COB packaging or COG glass substrate packaging, integrates driving circuit, and supports fine local dimming of tens of thousands of zones.
4. The low OD value MiniLED backlight module optical structure according to claim 3, characterized in that: The microstructure secondary optical lens (2) is an aspherical lens or a microlens array, which converges the Lambert light source to a light output angle of ±30° and eliminates the central bright spot within a light mixing distance of 0 to 3 mm.
5. The low OD value MiniLED backlight module optical structure according to claim 4, characterized in that: The ultrathin optical film group (3) consists of a quantum dot film (31), a single prism sheet (32) and an ultrathin diffusion film (33) from top to bottom, and the total thickness of the ultrathin optical film group (3) is ≤0.5mm.
6. The low OD value MiniLED backlight module optical structure according to claim 5, characterized in that: The reflective structure (4) consists of a high reflective layer and a chip gap reflective microstructure (41), which is used to recover large-angle light, compensate for dark areas, and improve light utilization. The chip gap reflective microstructure (41) is a conical design and is uniformly arranged between adjacent MiniLED light-emitting chips (12).
7. The low OD value MiniLED backlight module optical structure according to claim 6, characterized in that: The integrated support structure (5) uses composite materials or a heat dissipation plate to achieve optical device positioning and heat dissipation within the ultra-thin body.
8. The low OD value MiniLED backlight module optical structure according to claim 7, characterized in that: The MiniLED backlight module's optical structure, combined with high-precision local dimming drive and zone dimming algorithm, suppresses inter-zone crosstalk and improves black level performance and contrast.
9. The low OD value MiniLED backlight module optical structure according to claim 7, characterized in that: The bottom of the integrated support structure (5) is uniformly provided with multiple parallel heat dissipation grooves (8).