A patterned substrate for projection imaging and a method of making the same
By using stacked color functional film layers and light-shielding film layers on the projection imaging substrate, and achieving alignment through overprinting marks, the problem of high overprinting accuracy between the color film layer and the light-shielding layer is solved, enabling high-yield production of high-contrast projection patterns and improving design freedom.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HANGZHOU MDK OPTO ELECTRONICS CO LTD
- Filing Date
- 2026-06-23
- Publication Date
- 2026-07-21
AI Technical Summary
In existing projection imaging devices, the overlay precision requirements for the color film layer and the light-shielding layer are extremely high, resulting in a narrow process window, low yield, limited design freedom, and difficulty in achieving high-precision, multi-color, and high-contrast projection patterns.
The first substrate layer and the second substrate layer are stacked. The first substrate layer is covered with a colored functional film layer, and the second substrate layer is covered with a light-shielding film layer except for the overprinted mark and the preset pattern area. Alignment is achieved by overprinting the mark. The colored pattern is exposed by the colored functional film layer, and the black background is composed of the light-shielding film layer, which reduces the alignment accuracy requirements.
It significantly broadens the process window, improves product yield, ensures high contrast and edge clarity of the projected pattern, reduces the overlay accuracy requirements of the photolithography equipment, and improves design flexibility.
Smart Images
Figure CN122431065A_ABST