Method, device and equipment for determining tin solder joint site damage
By setting up a sensor array next to the solder joint to collect data in real time and using the linear cumulative fatigue damage theory to calculate the damage value, the problem of not being able to determine the damage at the solder joint in real time is solved, realizing real-time monitoring and early warning of the solder joint and extending the service life of electronic equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- VIVO MOBILE COMM CO LTD
- Filing Date
- 2026-04-27
- Publication Date
- 2026-07-21
AI Technical Summary
Existing technologies cannot determine solder joint damage in real time, which means that electronic devices can only be passively detected and repaired after solder joint failure, and cannot prevent serious faults such as solder cracks and open circuits.
By setting up a sensor array, including stress sensors and/or temperature sensors, near the solder joint, stress and temperature data are collected in real time. The damage value of the solder joint is calculated using the linear cumulative fatigue damage theory, enabling real-time monitoring and prediction of solder joint damage.
It enables real-time monitoring and prediction of solder joint damage, providing proactive warnings, slowing down fatigue crack propagation, and extending the trouble-free service life of electronic equipment.
Smart Images
Figure CN122431985A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the technical field of solder joint damage determination, specifically relating to a method, apparatus and equipment for determining solder joint damage. Background Technology
[0002] As smart electronic devices evolve towards ultra-thinness, high integration, high performance, and continuous high load, core components such as central processing units (CPUs), memory chips, camera modules, and radio frequency front-ends all utilize high-density solder connections such as ball grid array (BGA) and land grid array (LGA). Solder joints (simply called solder points) are subjected to multiple coupled effects from drop impacts, device bending, vibration stress, temperature cycling, and thermomechanical stress over long periods. This makes them highly susceptible to tin whisker growth, fatigue accumulation, and crack propagation, ultimately leading to solder joint failure, solder cracking, and open circuits, causing serious malfunctions such as black screens, system crashes, restarts, and inability to power on.
[0003] In related technologies, the handling of solder cracking problems is still in the stage of passive detection and post-repair, and it is impossible to determine the damage to the solder joint in real time. Summary of the Invention
[0004] The purpose of this application is to provide a method, apparatus, and device for determining solder joint damage, which can solve the problem of not being able to determine solder joint damage in real time.
[0005] In a first aspect, embodiments of this application provide a method for determining solder joint damage, including: Acquire stress data and / or temperature data collected by at least one sensor array at at least one solder joint of an electronic device within a first time period; wherein the sensor array includes a stress sensor and / or a temperature sensor; Based on the stress data and / or temperature data corresponding to the first solder joint, determine the damage value of the first solder joint within a first time period; wherein, the first solder joint is any one of at least one solder joint. The damage value of the first solder joint is determined based on the damage value of the first solder joint within the first time period.
[0006] Secondly, embodiments of this application provide a device for determining solder joint damage, comprising: The acquisition module is used to acquire stress data and / or temperature data collected by at least one sensor array on at least one solder joint of an electronic device within a first time period; wherein the sensor array includes a stress sensor and / or a temperature sensor. The first determining module is used to determine the damage value of the first solder joint within a first time period based on the stress data and / or temperature data corresponding to the first solder joint; wherein the first solder joint is any one of at least one solder joint. The second determining module is used to determine the damage value of the first solder joint based on the damage value of the first solder joint within a first time period.
[0007] Thirdly, embodiments of this application provide an electronic device, which includes a processor and a memory. The memory stores programs or instructions that can run on the processor. When the program or instructions are executed by the processor, they implement the steps of the solder joint damage determination method provided in embodiments of this application.
[0008] Fourthly, embodiments of this application provide a readable storage medium storing a program or instructions, which, when executed by a processor, implement the steps of the solder joint damage determination method provided in embodiments of this application.
[0009] Fifthly, embodiments of this application provide a chip, the chip including a processor and a communication interface, the communication interface being coupled to the processor, the processor being used to run programs or instructions to implement the steps of the solder joint damage determination method provided in embodiments of this application.
[0010] Sixthly, embodiments of this application provide a computer program product, which is stored in a storage medium and executed by at least one processor to implement the steps of the solder joint damage determination method provided in embodiments of this application.
[0011] In this embodiment, a sensor array, including a stress sensor and / or a temperature sensor, is pre-positioned next to each solder joint in at least one solder joint of an electronic device. The stress sensor in each solder joint array collects stress data, and the temperature sensor in each array collects temperature data. Based on the stress and / or temperature data corresponding to each solder joint, the damage value of each solder joint within a first time period is determined. Then, based on the damage value of each solder joint within the first time period, the overall damage value of each solder joint is determined. This allows for real-time determination of solder joint damage, enabling prediction of solder joint lifespan, proactive early warning for the electronic device, and intelligent control of the junction temperature of the device corresponding to the solder joint. This reduces the thermomechanical stress at the solder joint, fundamentally slowing the fatigue crack propagation rate, delaying the lifespan decay of the electronic device, and extending the fault-free service time of the electronic device. Attached Figure Description
[0012] Figure 1This is a flowchart illustrating a method for determining solder joint damage according to some embodiments of this application; Figure 2 This is a schematic diagram of the structure of a solder joint damage determination device provided in some embodiments of this application; Figure 3 These are schematic diagrams of the structure of electronic devices provided in some embodiments of this application; Figure 4 These are schematic diagrams of the hardware structure of electronic devices provided in some embodiments of this application. Detailed Implementation
[0013] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.
[0014] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0015] The following description, in conjunction with the accompanying drawings, details the method, apparatus, and equipment for determining solder joint damage provided in this application through specific embodiments and application scenarios.
[0016] Figure 1 This is a flowchart illustrating a method for determining solder joint damage according to some embodiments of this application. The method for determining solder joint damage may include: Step 101: Acquire stress data and / or temperature data collected by at least one sensor array on at least one solder joint of the electronic device within a first time period; wherein the sensor array includes stress sensors and / or temperature sensors; In some embodiments of this application, a sensor array, including a stress sensor and / or a temperature sensor, can be pre-positioned next to each solder joint in at least one solder joint of the electronic device. The stress sensor in the sensor array next to each solder joint is used to collect stress data for that solder joint, and the temperature sensor in the sensor array is used to collect temperature data for that solder joint. Solder joints in the embodiments of this application include, but are not limited to: central processing unit solder joints, memory chip solder joints, front-facing camera solder joints, rear-facing camera solder joints, radio frequency device solder joints, etc.
[0017] In some embodiments of this application, miniaturized, low-power micro-stress sensors and high-precision temperature sensors can be integrated at high-risk solder joints such as central processing units, memory chips, front-facing cameras, rear-facing cameras, and radio frequency devices in electronic devices. The sensor array can be directly integrated next to the solder joints without affecting the ultra-thin and highly integrated design of the electronic device, forming a distributed sensor array that acquires multiple physical quantities synchronously.
[0018] In some embodiments of this application, the sensor array may transmit load data using differential signaling and low-power methods.
[0019] In some embodiments of this application, stress data and / or temperature data may be electromagnetically shielded and digitally filtered to reduce electromagnetic interference.
[0020] In some embodiments of this application, the sampling frequency of the sensor array can be adaptively adjusted according to the current operating state of the electronic device. The sampling frequency can be dynamically switched between 10 Hz and 100 Hz. When the electronic device is under low load, the sampling frequency can be reduced to decrease the amount of computation; when the electronic device is under high load, the sampling frequency can be increased to ensure the counting accuracy of the number of stress cycles and improve the accuracy of the cumulative damage value of the solder joint.
[0021] Step 102: Determine the damage value of the first solder joint within a first time period based on the stress data and / or temperature data corresponding to the first solder joint; wherein, the first solder joint is any one of at least one solder joint. In some embodiments of this application, step 102 may include: determining multiple stress cycles corresponding to a first duration; determining stress information corresponding to each stress cycle among the multiple stress cycles; wherein the stress information includes stress amplitude, average stress, and number of cycles; determining the fatigue limit cycle number corresponding to each stress cycle based on temperature data, stress amplitude, average stress, and target correspondence; wherein the target correspondence is the correspondence between temperature, stress amplitude, stress, and fatigue limit cycle number; and determining the damage value of the first solder joint within the first duration based on the linear cumulative fatigue damage theory, the number of cycles corresponding to each stress cycle, and the fatigue limit cycle number.
[0022] In some embodiments of this application, multiple stress cycles corresponding to a first duration can be determined by the rainflow method.
[0023] In some embodiments of this application, when determining multiple stress cycles corresponding to a first duration using the rainflow method, the stress time series curve corresponding to the first duration can be identified, and the peak points and valley points in the stress time series curve can be extracted to form a stress extreme value sequence with alternating peaks and valleys. Based on the core principle of "rainflow flowing downward from the peak point", the stress extreme value sequence is counted cyclically to identify stress cycles.
[0024] For example, the stress change over a certain period of time is as follows: from 0 MPa to 25 MPa, from 25 MPa to 10 MPa, from 10 MPa to 30 MPa, from 30 MPa to 5 MPa, from 5 MPa to 20 MPa, and from 20 MPa to 10 MPa.
[0025] Three stress cycles were identified: from 25MPa to 10MPa and then back to 25MPa, from 30MPa to 5MPa and then back to 30MPa, and from 20MPa to 0MPa and then back to 20MPa.
[0026] For the stress cycle “from 25MPa to 10MPa and then back to 25MPa”, the stress amplitude of the stress cycle is: (25-10)-2=7.5MPa, the stress range is: 25-10=15MPa, the average stress is: (25+10) / 2=17.5MPa, and the number of cycles is 1.
[0027] For the stress cycle “from 30MPa to 5MPa and then back to 30MPa”, the stress amplitude of this stress cycle is 12.5MPa, the stress range is 25MPa, the average stress is 17.5MPa, and the number of cycles is 1.
[0028] For the stress cycle “from 20MPa to 0MPa and then back to 20MPa”, the stress amplitude of the stress cycle is 10MPa, the stress range is 20MPa, the average stress is 10MPa, and the number of cycles is 1.
[0029] In some embodiments of this application, when determining the fatigue limit cycle number corresponding to each stress cycle based on temperature data, stress amplitude, average stress and target correspondence, for a certain stress cycle, the fatigue limit cycle number corresponding to the temperature data corresponding to the first solder joint, the stress amplitude of the application cycle and the average stress can be determined as the fatigue limit cycle number corresponding to that stress cycle.
[0030] In some embodiments of this application, the fatigue limit cycle count of the solder under different stress amplitudes, stresses, and temperatures can be calibrated in advance through laboratory experiments, and the calibration data can be stored in the electronic device in advance. The solder in these embodiments can be lead-free solder.
[0031] For example, assuming a stress amplitude of 7.5 MPa and an average stress of 17.5 MPa at 45°C, the fatigue limit cycle number of the solder used in electronic devices is 10. 6 At 45℃, with a stress amplitude of 12.5 MPa and an average stress of 17.5 MPa, the fatigue limit cycle count of the solder used in electronic equipment is 10. 5 Once, under operating conditions of 45℃, with a stress amplitude of 10MPa and an average stress of 10MPa, the fatigue limit cycle number of the solder used in electronic equipment is 5×10⁻⁶. 5 Second-rate.
[0032] Assuming the temperature measured by the temperature sensor is 45℃, for the stress cycle described above, "from 25MPa to 10MPa and then back to 25MPa", the fatigue limit cycle number corresponding to this stress cycle is 10. 6 The fatigue limit cycle number corresponding to the stress cycle described above, "from 30 MPa to 5 MPa and then back to 30 MPa," is 10. 5 For the stress cycle described above, "from 20 MPa to 0 MPa and then back to 20 MPa," the fatigue limit cycle number corresponding to this stress cycle is 5 × 10⁻⁶. 5 Second-rate.
[0033] In some embodiments of this application, determining the damage value of the first solder joint within a first duration based on the linear cumulative fatigue damage theory, the number of cycles corresponding to each stress cycle, and the fatigue limit cycle count may include: determining the damage value corresponding to each stress cycle based on the number of cycles corresponding to each stress cycle and the fatigue limit cycle count; determining the total damage value corresponding to multiple stress cycles based on the damage value corresponding to each stress cycle; and determining the total damage value corresponding to multiple stress cycles as the damage value of the first solder joint within a first duration.
[0034] In some embodiments of this application, the model of the linear cumulative fatigue damage theory in these embodiments can be the Miner criterion. That is, the linear cumulative fatigue damage theory in these embodiments is a linear cumulative fatigue damage theory based on the Miner criterion.
[0035] In some embodiments of this application, when determining the damage value corresponding to each stress cycle based on the number of cycles corresponding to each stress cycle and the fatigue limit cycle number, the ratio of the number of cycles corresponding to the first stress cycle to the fatigue limit cycle number corresponding to the first stress cycle can be determined as the damage value corresponding to the first stress cycle; wherein, the first stress cycle is any one of multiple stress cycles.
[0036] For example, for the stress cycle described above, "from 25 MPa to 10 MPa and then back to 25 MPa", the damage value corresponding to this stress cycle is 1 / 10. 6 =10 -6 For the stress cycle described above, "from 30 MPa to 5 MPa and then back to 30 MPa", the corresponding damage value is 1 / 10. 5 =10 -5 For the stress cycle described above, "from 20 MPa to 0 MPa and then back to 20 MPa", the damage value corresponding to this stress cycle is 1 / (5 × 10). 5 10 5 =2×10 -6 .
[0037] In some embodiments of this application, when determining the total damage value corresponding to multiple stress cycles based on the damage value corresponding to each stress cycle, the damage values corresponding to multiple stress cycles can be summed to obtain the total damage value corresponding to multiple stress cycles. This total damage value is the damage value of the first solder joint within the first time period.
[0038] For example, for the three stress cycles described above, the total damage value for the three stress cycles is: 10. -6 +10 -5 +2×10 -6 =1.3×10 -5 .
[0039] In some embodiments of this application, the damage value of the solder joint within the first time period can be determined based on the linear cumulative fatigue damage theory using the following formula (1): (1) In formula (1), D represents the damage value of the solder joint during the first time period, and n represents the number of stress cycles during the first time period. Let i be the number of stress cycles. This represents the fatigue limit cycle number corresponding to the i-th stress cycle.
[0040] In some embodiments of this application, before determining the fatigue limit cycle number corresponding to each stress cycle based on temperature data, stress amplitude, average stress and target correspondence, the solder joint damage determination method provided in this application further includes: eliminating stress cycles in which the stress amplitude is less than a first threshold from multiple stress cycles.
[0041] In some embodiments of this application, the first threshold can be set according to actual needs, for example, the first threshold is 5MPa.
[0042] For example, suppose four stress cycles corresponding to a certain time period are identified. The four stress cycles are: from 25MPa to 10MPa and then to 25MPa, from 30MPa to 5MPa and then to 30MPa, from 20MPa to 0MPa and then to 20MPa, and from 20MPa to 0MPa and then to 20MPa.
[0043] For the stress cycle “from 25MPa to 10MPa and then back to 25MPa”, the stress amplitude of the stress cycle is: (25-10)-2=7.5MPa, the stress range is: 25-10=15MPa, the average stress is: (25+10) / 2=17.5MPa, and the number of cycles is 1.
[0044] For the stress cycle “from 30MPa to 5MPa and then back to 30MPa”, the stress amplitude of this stress cycle is 12.5MPa, the stress range is 25MPa, the average stress is 17.5MPa, and the number of cycles is 1.
[0045] For the stress cycle “from 20MPa to 0MPa and then back to 20MPa”, the stress amplitude of the stress cycle is 10MPa, the stress range is 20MPa, the average stress is 10MPa, and the number of cycles is 1.
[0046] For the stress cycle “from 25MPa to 10MPa and then back to 25MPa”, the stress amplitude of the stress cycle is: (25-10)-2=7.5MPa, the stress range is: 25-10=15MPa, the average stress is: (25+10) / 2=17.5MPa, and the number of cycles is 1.
[0047] For the stress cycle “from 30MPa to 5MPa and then back to 30MPa”, the stress amplitude of this stress cycle is 12.5MPa, the stress range is 25MPa, the average stress is 17.5MPa, and the number of cycles is 1.
[0048] For the stress cycle “from 10MPa to 1MPa and then back to 10MPa”, the stress amplitude of this stress cycle is 4.5MPa, the stress range is 9MPa, the average stress is 5.5MPa, and the number of cycles is 1.
[0049] If the stress amplitude of the stress cycle "from 10MPa to 1MPa and then to 10MPa" is less than 5MPa, then the stress cycle "from 10MPa to 1MPa and then to 10MPa" is removed.
[0050] In this embodiment of the application, by eliminating stress cycles with stress amplitudes less than a first threshold, invalid stress cycles can be removed, meaningless calculations can be reduced, and thus the amount of computation can be reduced.
[0051] Step 103: Determine the damage value of the first solder joint based on the damage value of the first solder joint within the first time period.
[0052] It should be noted that the damage value of the first solder joint is the current accumulated damage value of the first solder joint.
[0053] In some embodiments of this application, step 103 may include: summing the damage value of the first solder joint within a first time period with the historical damage value of the first solder joint to obtain the damage value of the first solder joint. The historical damage value of the first solder joint is the cumulative damage value from the first power-on of the electronic device to the start time of the first time period.
[0054] In some embodiments of this application, when determining the historical damage value of the first solder joint, the damage value of the first solder joint in various past time periods can be determined, and the damage values of the first solder joint in various past time periods can be summed to obtain the historical damage value of the first solder joint. The process of determining the damage value of the first solder joint in various past time periods is similar to the process of determining the damage value of the first solder joint in a first time period, and will not be described in detail here.
[0055] In this embodiment, a sensor array, including a stress sensor and / or a temperature sensor, is pre-positioned next to each of the multiple solder joints in the electronic device. The stress sensor in each solder joint array collects stress data, and the temperature sensor in each array collects temperature data. Based on the stress and / or temperature data corresponding to each solder joint, the damage value of each solder joint within a first time period is determined. Then, based on the damage value of each solder joint within the first time period, the overall damage value of each solder joint is determined. This allows for real-time determination of solder joint damage, enabling prediction of solder joint lifespan, proactive early warning for the electronic device, and intelligent control of the junction temperature of the device corresponding to the solder joint. This reduces the thermomechanical stress at the solder joint, fundamentally slowing the fatigue crack propagation rate, delaying the lifespan decay of the electronic device, and extending the fault-free service time of the electronic device.
[0056] In some embodiments of this application, the method for determining solder joint damage provided in this application may further include: performing a target operation corresponding to the damage value of the first solder joint.
[0057] In some embodiments of this application, performing the target operation corresponding to the damage value of the first solder joint may include: displaying a first prompt message when the damage value of the first solder joint is greater than or equal to a second threshold and less than a third threshold, wherein the first prompt message is used to prompt the user to back up the data of the electronic device and go to the after-sales service center for electronic device testing.
[0058] In some embodiments of this application, a first prompt message may be displayed in the form of a pop-up window. The pop-up window may include a control for backing up the data of the electronic device. When the user clicks the control, the data of the electronic device is backed up.
[0059] In some embodiments of this application, the second threshold and the third threshold can be set according to actual needs. For example, the second threshold is 0.8 and the third threshold is 0.9.
[0060] For example, assuming the damage value of a certain solder joint is determined to be 0.85, a pop-up window displays "The remaining lifespan of the electronic device hardware has been detected to be short. Please back up your data immediately and go to after-sales service." The pop-up window also displays a "One-click Backup" control. When the user clicks the "One-click Backup" control, the data in the electronic device is backed up.
[0061] In some embodiments of this application, performing a target operation corresponding to the damage value of the first solder joint may include: performing a first operation if the damage value of the first solder joint is greater than or equal to a third threshold; wherein the first operation includes at least one of the following: When the processor of an electronic device is a multi-core processor, disable the cores in the multi-core processor whose performance exceeds the fourth threshold; The second prompt message is continuously displayed in the target area; the second prompt message is used to remind the user that the hardware lifespan is about to expire, back up the data of the electronic device, and go to the after-sales service for electronic device testing; Back up the target data in the electronic device to the target partition, which is a partition that is independent of the system partition.
[0062] In some embodiments of this application, the fourth threshold can be set according to actual needs, for example, the fourth threshold is 95%.
[0063] For example, assuming that the damage value of a certain solder joint is determined to be 0.95, the cores with performance above 95% in the multi-core processor of the electronic device are turned off, and only the cores with performance below 95% are run, in order to extend the hardware life and reserve sufficient time for users to back up data.
[0064] In some embodiments of this application, the target area can be set according to actual needs. For example, the target area is the area corresponding to the status bar.
[0065] For example, assuming the damage value of a certain solder joint is determined to be 0.95, the status bar will display a persistently highlighted message: "The hardware lifespan of the electronic device is about to expire. Hardware performance has been limited. Please back up your data immediately and go to after-sales service." A "One-Click Backup" control will also be displayed. When the user clicks the "One-Click Backup" control, the data in the electronic device will be backed up.
[0066] In some embodiments of this application, the target data includes, but is not limited to: contacts, text messages, photos, videos, etc.
[0067] For example, assuming the damage value of a certain solder joint is determined to be 0.95, an encryption algorithm is used to encrypt and back up the target data to a target partition on the electronic device that is independent of the system partition. After-sales personnel can use a dedicated decryption key and professional equipment to read and decrypt the backup data in the target partition, restore the user's data, and prevent data loss due to the user's failure to back up in time, which could cause the electronic device to fail to boot.
[0068] In some embodiments of this application, performing a target operation corresponding to the damage value of the first solder joint may include: reducing the junction temperature of the device corresponding to the first solder joint when the damage value of the first solder joint is less than a second threshold.
[0069] In some embodiments of this application, the junction temperature is the actual operating temperature of the PN junction inside the semiconductor device.
[0070] In some embodiments of this application, the damage level of solder joints and high-load usage scenarios can be identified. When the damage level of solder joints is high and the electronic device is in a high-load usage scenario (such as a gaming scenario), the junction temperature of the device corresponding to the solder joint can be reduced by reducing the processor frequency, power consumption, refresh rate, etc., so as to reduce the thermomechanical stress of the solder joints, thereby slowing down the fatigue crack propagation speed from the root, delaying the life decay of electronic devices, and extending the fault-free service time of electronic devices.
[0071] In some embodiments of this application, electronic devices can desensitize data such as stress data, damage data, temperature control data, and life feedback data and then synchronize them to a cloud server. The cloud server continuously iterates and optimizes rainflow counting parameters, Miner damage models, life threshold judgment criteria, and junction temperature control strategies through massive user samples, achieving one-time deployment and continuous evolution, making life prediction and protection strategies more and more accurate with use, and possessing personalized life management capabilities.
[0072] The solder joint damage determination method provided in this application can be executed by a solder joint damage determination device. This application uses the example of a solder joint damage determination device executing the solder joint damage determination method to illustrate the solder joint damage determination device provided in this application.
[0073] Figure 2 This is a schematic diagram of the structure of a solder joint damage determination device provided in some embodiments of this application. The solder joint damage determination device 200 may include: The acquisition module 201 is used to acquire stress data and / or temperature data collected by at least one sensor array on at least one solder joint of an electronic device within a first time period; wherein the sensor array includes a stress sensor and / or a temperature sensor. The first determining module 202 is used to determine the damage value of the first solder joint within a first time period based on the stress data and / or temperature data corresponding to the first solder joint; wherein the first solder joint is any one of at least one solder joint. The second determining module 203 is used to determine the damage value of the first solder joint based on the damage value of the first solder joint within a first time period.
[0074] In some embodiments of this application, the first determining module 202 includes: The first determining submodule is used to determine multiple stress cycles corresponding to the first duration; The second determination submodule is used to determine the stress information corresponding to each stress cycle in multiple stress cycles; wherein, the stress information includes stress amplitude, average stress and number of cycles; The third determination submodule is used to determine the number of fatigue limit cycles corresponding to each stress cycle based on temperature data, stress amplitude, average stress, and the target correspondence; wherein, the target correspondence is the correspondence between temperature, stress amplitude, stress, and the number of fatigue limit cycles. The fourth determination submodule is used to determine the damage value of the first solder joint within the first time period based on the linear cumulative fatigue damage theory, the number of cycles corresponding to each stress cycle, and the fatigue limit cycle number.
[0075] In some embodiments of this application, the first determining submodule is specifically used for: Multiple stress cycles corresponding to the first duration were determined using the rainflow method.
[0076] In some embodiments of this application, the fourth determining submodule is specifically used for: The damage value corresponding to each stress cycle is determined based on the number of cycles corresponding to each stress cycle and the fatigue limit cycle number. Based on the damage value corresponding to each stress cycle, determine the total damage value corresponding to multiple stress cycles; The total damage value corresponding to multiple stress cycles is determined as the damage value of the first solder joint within the first time period.
[0077] In some embodiments of this application, the fourth determining submodule is specifically used for: The ratio of the number of cycles corresponding to the first stress cycle to the number of fatigue limit cycles corresponding to the first stress cycle is determined as the damage value corresponding to the first stress cycle; wherein, the first stress cycle is any one of multiple stress cycles.
[0078] In some embodiments of this application, the first determining module further includes: The elimination submodule is used to eliminate stress cycles whose stress amplitude is less than a first threshold from multiple stress cycles.
[0079] In some embodiments of this application, the solder joint damage determination device 200 provided in this application further includes: The execution module is used to perform the target operation corresponding to the damage value of the first solder joint.
[0080] In some embodiments of this application, the execution module is specifically used for: If the damage value at the first solder joint is greater than or equal to the second threshold and less than the third threshold, a first prompt message is displayed, which prompts the user to back up the data of the electronic device and go to the after-sales service center for electronic device testing.
[0081] In some embodiments of this application, the execution module is specifically used for: If the damage value at the first solder joint is greater than or equal to a third threshold, a first operation is performed; wherein the first operation includes at least one of the following: When the processor of an electronic device is a multi-core processor, disable the cores in the multi-core processor whose performance exceeds the fourth threshold; The second prompt message is continuously displayed in the target area; the second prompt message is used to remind the user that the hardware lifespan is about to expire, back up the data of the electronic device, and go to the after-sales service for electronic device testing; Back up the target data in the electronic device to the target partition, which is a partition that is independent of the system partition.
[0082] In some embodiments of this application, the execution module is specifically used for: If the damage value at the first solder joint is less than the second threshold, the junction temperature of the device corresponding to the first solder joint is reduced.
[0083] The solder joint damage determination device in this application embodiment can be an electronic device or a component within an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, PDA, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM, or self-service machine, etc. This application embodiment does not specifically limit the specific type of device.
[0084] The solder joint damage determination device in this application embodiment can be a device with an operating system. This operating system can be Android, iOS, or other possible operating systems; this application embodiment does not specifically limit it.
[0085] The solder joint damage determination device provided in this application embodiment can achieve... Figure 1 The various processes implemented in the embodiment of the method for determining solder joint damage will not be described again here to avoid repetition.
[0086] Optionally, such as Figure 3 As shown, this application embodiment also provides an electronic device 300, including a processor 301 and a memory 302. The memory 302 stores a program or instructions that can run on the processor 301. When the program or instructions are executed by the processor 301, they implement the various steps of the solder joint damage determination method embodiment provided in this application embodiment and can achieve the same technical effect. To avoid repetition, they will not be described again here.
[0087] Figure 4 These are schematic diagrams of the hardware structure of electronic devices according to some embodiments of this application.
[0088] The electronic device 400 includes, but is not limited to, components such as: radio frequency unit 401, network module 402, audio output unit 403, input unit 404, sensor 405, display unit 406, user input unit 407, interface unit 408, memory 409, and processor 410.
[0089] Those skilled in the art will understand that the electronic device 400 may also include a power supply (such as a battery) for supplying power to various components. The power supply may be logically connected to the processor 410 through a power management system, thereby enabling functions such as managing charging, discharging, and power consumption through the power management system. Figure 4 The electronic device structure shown does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements, which will not be elaborated here.
[0090] The processor 410 is configured to: acquire stress data and / or temperature data collected by at least one sensor array from at least one solder joint of an electronic device within a first time period; wherein the sensor array includes a stress sensor and / or a temperature sensor; determine the damage value of the first solder joint within the first time period based on the stress data and / or temperature data corresponding to the first solder joint; wherein the first solder joint is any one of at least one solder joint; and determine the damage value of the first solder joint based on the damage value of the first solder joint within the first time period.
[0091] In some embodiments of this application, the processor 410 is specifically used for: Determine the multiple stress cycles corresponding to the first duration; Determine the stress information for each stress cycle in a series of stress cycles; the stress information includes stress amplitude, average stress, and number of cycles. Based on the correspondence between temperature data, stress amplitude, average stress, and target values, the number of fatigue limit cycles corresponding to each stress cycle is determined; where the target correspondence is the correspondence between temperature, stress amplitude, stress, and the number of fatigue limit cycles. Based on the linear cumulative fatigue damage theory, the number of cycles corresponding to each stress cycle, and the fatigue limit cycle number, the damage value of the first solder joint within the first time period is determined.
[0092] In some embodiments of this application, the processor 410 is specifically used for: Multiple stress cycles corresponding to the first duration were determined using the rainflow method.
[0093] In some embodiments of this application, the processor 410 is specifically used for: The damage value corresponding to each stress cycle is determined based on the number of cycles corresponding to each stress cycle and the fatigue limit cycle number. Based on the damage value corresponding to each stress cycle, determine the total damage value corresponding to multiple stress cycles; The total damage value corresponding to multiple stress cycles is determined as the damage value of the first solder joint within the first time period.
[0094] In some embodiments of this application, the processor 410 is specifically used for: The ratio of the number of cycles corresponding to the first stress cycle to the number of fatigue limit cycles corresponding to the first stress cycle is determined as the damage value corresponding to the first stress cycle; wherein, the first stress cycle is any one of multiple stress cycles.
[0095] In some embodiments of this application, the processor 410 is also used for: The elimination submodule is used to eliminate stress cycles whose stress amplitude is less than a first threshold from multiple stress cycles.
[0096] In some embodiments of this application, the processor 410 is also used for: Perform the target operation corresponding to the damage value of the first solder joint.
[0097] In some embodiments of this application, the display unit 406 is used for: If the damage value at the first solder joint is greater than or equal to the second threshold and less than the third threshold, a first prompt message is displayed, which prompts the user to back up the data of the electronic device and go to the after-sales service center for electronic device testing.
[0098] In some embodiments of this application, the processor 410 is specifically used for: If the damage value at the first solder joint is greater than or equal to a third threshold, a first operation is performed; wherein the first operation includes at least one of the following: When the processor of an electronic device is a multi-core processor, disable the cores in the multi-core processor whose performance exceeds the fourth threshold; The second prompt message is continuously displayed in the target area; the second prompt message is used to remind the user that the hardware lifespan is about to expire, back up the data of the electronic device, and go to the after-sales service for electronic device testing; Back up the target data in the electronic device to the target partition, which is a partition that is independent of the system partition.
[0099] In some embodiments of this application, the processor 410 is specifically used for: If the damage value at the first solder joint is less than the second threshold, reduce the junction temperature of the device corresponding to the first solder joint. It should be understood that, in this embodiment, the input unit 404 may include a graphics processing unit (GPU) 4041 and a microphone 4042. The GPU 4041 processes image data of still images or videos obtained by an image capture device (such as a camera) in video capture mode or image capture mode. The display unit 406 may include a display panel 4061, which may be configured in the form of a liquid crystal display, an organic light-emitting diode, or the like. The user input unit 407 includes at least one of a touch panel 4071 and other input devices 4072. The touch panel 4071 is also called a touch screen. The touch panel 4071 may include a touch detection device and a touch controller. Other input devices 4072 may include, but are not limited to, physical keyboards, function keys (such as volume control buttons, power buttons, etc.), trackballs, mice, and joysticks, which will not be described in detail here.
[0100] The memory 409 can be used to store software programs and various data. The memory 409 may primarily include a first storage area for storing programs or instructions and a second storage area for storing data. The first storage area may store the operating system, application programs or instructions required for at least one function (such as sound playback, image playback, etc.). Furthermore, the memory 409 may include volatile memory or non-volatile memory, or both. The non-volatile memory may be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct memory bus RAM (DRRAM). The memory 409 in the embodiments of this application includes, but is not limited to, these and any other suitable types of memory.
[0101] Processor 410 may include one or more processing units; optionally, processor 410 integrates an application processor and a modem processor, wherein the application processor mainly handles operations involving the operating system, user interface, and applications, and the modem processor mainly handles wireless communication signals, such as a baseband processor. It is understood that the aforementioned modem processor may also not be integrated into processor 410.
[0102] This application also provides a readable storage medium storing a program or instructions. When the program or instructions are executed by a processor, they implement the various processes of the solder joint damage determination method provided in this application and achieve the same technical effect. To avoid repetition, they will not be described again here.
[0103] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.
[0104] This application also provides a chip, which includes a processor and a communication interface. The communication interface is coupled to the processor. The processor is used to run programs or instructions to implement the various processes of the solder joint damage determination method provided in this application, and can achieve the same technical effect. To avoid repetition, it will not be described again here.
[0105] It should be understood that the chip mentioned in the embodiments of this application may also be referred to as a system-on-a-chip, system chip, chip system, or system-on-a-chip, etc.
[0106] This application also provides a computer program product, which is stored in a storage medium and executed by at least one processor to implement the various processes of the solder joint damage determination method provided in this application, and can achieve the same technical effect. To avoid repetition, it will not be described again here.
[0107] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
[0108] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the solder joint damage determination method provided in the various embodiments of this application.
[0109] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. A method for determining solder joint damage, characterized in that, The method includes: Acquire stress data and / or temperature data collected by at least one sensor array at at least one solder joint of an electronic device within a first time period; wherein the sensor array includes a stress sensor and / or a temperature sensor; Based on the stress data and / or temperature data corresponding to the first solder joint, the damage value of the first solder joint within the first time period is determined; wherein, the first solder joint is any one of the at least one solder joints; Based on the damage value, the damage value of the first solder joint is determined.
2. The method according to claim 1, characterized in that, The step of determining the damage value of the first solder joint within the first time period based on the stress and temperature data corresponding to the first solder joint includes: Determine the multiple stress cycles corresponding to the first duration; Determine the stress information corresponding to each stress cycle among the plurality of stress cycles; wherein, the stress information includes stress amplitude, average stress, and number of cycles; Based on the temperature data, the stress amplitude, the average stress, and the target correspondence, the fatigue limit cycle number corresponding to each stress cycle is determined; wherein, the target correspondence is the correspondence between temperature, stress amplitude, stress, and fatigue limit cycle number. Based on the linear cumulative fatigue damage theory, the number of cycles corresponding to each stress cycle, and the fatigue limit cycle number, the damage value of the first solder joint within the first duration is determined.
3. The method according to claim 2, characterized in that, The step of determining the damage value of the first solder joint within the first duration based on the linear cumulative fatigue damage theory, the number of cycles corresponding to each stress cycle, and the fatigue limit cycle count includes: The damage value corresponding to each stress cycle is determined based on the number of cycles corresponding to each stress cycle and the fatigue limit cycle number. The total damage value corresponding to the plurality of stress cycles is determined based on the damage value corresponding to each stress cycle. The total damage value corresponding to the multiple stress cycles is determined as the damage value of the first solder joint within the first time period.
4. The method according to claim 3, characterized in that, The step of determining the damage value corresponding to each stress cycle based on the number of cycles corresponding to each stress cycle and the fatigue limit cycle number includes: The ratio of the number of cycles corresponding to the first stress cycle to the number of fatigue limit cycles corresponding to the first stress cycle is determined as the damage value corresponding to the first stress cycle; wherein, the first stress cycle is any one of the plurality of stress cycles.
5. The method according to claim 2, characterized in that, Before determining the fatigue limit cycle number corresponding to each stress cycle based on the temperature data, the stress amplitude, the average stress, and the target correspondence, the method further includes: Stress cycles with stress amplitudes less than a first threshold are removed from the plurality of stress cycles.
6. A device for determining solder joint damage, characterized in that, The device includes: An acquisition module is configured to acquire stress data and / or temperature data collected by at least one sensor array from at least one solder joint of an electronic device within a first time period; wherein the sensor array includes a stress sensor and / or a temperature sensor. The first determining module is used to determine the damage value of the first solder joint within the first time period based on the stress data and / or temperature data corresponding to the first solder joint; wherein the first solder joint is any one of the at least one solder joints; The second determining module is used to determine the damage value of the first solder joint based on the damage value.
7. The apparatus according to claim 6, characterized in that, The first determining module includes: The first determining submodule is used to determine multiple stress cycles corresponding to the first duration; The second determining submodule is used to determine the stress information corresponding to each stress cycle among the plurality of stress cycles; wherein, the stress information includes stress amplitude, average stress, and number of cycles; The third determining submodule is used to determine the number of fatigue limit cycles corresponding to each stress cycle based on the temperature data, the stress amplitude, the average stress, and the target correspondence; wherein, the target correspondence is the correspondence between temperature, stress amplitude, stress, and the number of fatigue limit cycles. The fourth determination submodule is used to determine the damage value of the first solder joint within the first duration based on the linear cumulative fatigue damage theory, the number of cycles corresponding to each stress cycle, and the fatigue limit cycle number.
8. The apparatus according to claim 7, characterized in that, The fourth determining submodule is specifically used for: The damage value corresponding to each stress cycle is determined based on the number of cycles corresponding to each stress cycle and the fatigue limit cycle number. The total damage value corresponding to the plurality of stress cycles is determined based on the damage value corresponding to each stress cycle. The total damage value corresponding to the multiple stress cycles is determined as the damage value of the first solder joint within the first time period.
9. The apparatus according to claim 8, characterized in that, The fourth determining submodule is specifically used for: The ratio of the number of cycles corresponding to the first stress cycle to the number of fatigue limit cycles corresponding to the first stress cycle is determined as the damage value corresponding to the first stress cycle; wherein, the first stress cycle is any one of the plurality of stress cycles.
10. The apparatus according to claim 7, characterized in that, The first determining module further includes: The elimination submodule is used to eliminate stress cycles in the plurality of stress cycles whose stress amplitude is less than a first threshold.
11. An electronic device, characterized in that, The electronic device includes a processor and a memory, the memory storing programs or instructions that can run on the processor, the programs or instructions being executed by the processor to implement the steps of the solder joint damage determination method as described in any one of claims 1-5.