Signal transmission circuit, connecting assembly and mainboard

Abstract

The embodiment of the application provides a signal transmission circuit, a connecting assembly and a mainboard, relates to the technical field of signal transmission, and the signal transmission circuit comprises at least one signal transmitting assembly, and a connecting assembly electrically connected with the at least one signal transmitting assembly through a first transmission line; a pin and at least one group of first coupling capacitors are arranged in the connecting assembly, and the at least one group of first coupling capacitors correspond to the at least one signal transmitting assembly one by one; for any group of first coupling capacitors, one end of the any group of first coupling capacitors is connected with the first transmission line of the signal transmitting assembly corresponding to the first coupling capacitor, and the other end of the any group of first coupling capacitors is connected with the pin, and is used for transmitting the signal of the corresponding signal transmitting assembly to an external device connected with the pin. In the technical scheme of the embodiment of the application, the integrity of the signal is improved.

Description

Technical Field

[0001] This application relates to the field of signal transmission technology, and in particular to a signal transmission circuit, a connection component, and a motherboard. Background Technology

[0002] The signal transmission circuit is a circuit located on the motherboard used for transmitting signals. It provides an interface for external cards and transmits signals to these cards via signal transmission lines on the motherboard. Coupling capacitors are included in these signal transmission lines to block DC signals while allowing AC signals to pass through. However, because the solder joints of these coupling capacitors are often larger than the signal transmission lines themselves, impedance discontinuities are created at these points. When a signal encounters an impedance discontinuity, part of the signal is reflected back to the source, weakening the signal and negatively impacting signal integrity and quality. Summary of the Invention

[0003] This application provides a signal transmission circuit, a connection component, and a motherboard to alleviate or solve one or more technical problems existing in the prior art.

[0004] In a first aspect, embodiments of this application provide a signal transmission circuit, including: at least one signal transmitting component, and a connection component electrically connected to the at least one signal transmitting component via a first transmission line; the connection component is provided with pins and at least one set of first coupling capacitors, the at least one set of first coupling capacitors corresponding one-to-one with the at least one signal transmitting component; for any one set of first coupling capacitors, one end of the any one set of first coupling capacitors is connected to the first transmission line of the signal transmitting component corresponding to the any one set of first coupling capacitors, the other end of the any one set of first coupling capacitors is connected to the pin, and the any one set of coupling capacitors is used to transmit the signal of the corresponding signal transmitting component to the external device connected to the pin.

[0005] Secondly, embodiments of this application provide a connection component, including pins and at least one set of first coupling capacitors, wherein each set of first coupling capacitors corresponds to at least one signal transmitting component; for any one set of first coupling capacitors, one end of each set of first coupling capacitors is connected to a first transmission line of the signal transmitting component corresponding to the set of first coupling capacitors, and the other end of each set of first coupling capacitors is connected to the pins; the set of first coupling capacitors is used to transmit the signal of the corresponding signal transmitting component to the external device connected to the pins, wherein the signal transmission circuit provided in the first aspect includes the signal transmitting component and the first transmission line.

[0006] Thirdly, embodiments of this application provide a motherboard including the signal transmission circuit provided in the first aspect above.

[0007] According to the signal transmission circuit provided in the embodiments of this application, by placing the first coupling capacitor in the connection component, impedance discontinuities caused by the size of the solder joint of the first coupling capacitor being larger than the size of the first transmission line are avoided, which is beneficial to improving signal integrity and quality. Furthermore, placing the first coupling capacitor in the connection component, making it close to the external device receiving the signal, can reduce signal reflection caused by the first coupling capacitor. Because the signal has already attenuated during transmission on the first transmission line, the reflected energy when it reaches the first coupling capacitor will be smaller, thereby reducing the adverse effects of the first coupling capacitor on signal integrity and quality.

[0008] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0009] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments according to this application and should not be construed as limiting the scope of this application.

[0010] Figure 1A and Figure 1B A schematic diagram of a signal transmission circuit in the prior art is shown;

[0011] Figure 2 A schematic diagram of the connection components provided in an embodiment of this application is shown;

[0012] Figure 3 A schematic diagram illustrating the pin connection relationship provided in an embodiment of this application is shown;

[0013] Figure 4 This illustration shows a first side view of the connection component provided in an embodiment of this application;

[0014] Figure 5 A second side view schematic diagram of the connection component provided in an embodiment of this application is shown;

[0015] Figure 6 This illustration shows a first possible configuration of the signal transmission circuit provided in an embodiment of this application;

[0016] Figure 7A second schematic diagram of the signal transmission circuit provided in an embodiment of this application is shown;

[0017] Figure 8 This illustration shows a third configuration of the signal transmission circuit provided in an embodiment of this application;

[0018] Figure 9 A schematic diagram of a motherboard provided in an embodiment of this application is shown;

[0019] Figure 10 A schematic diagram illustrating the continuity between the motherboard of this application and the substrate in the prior art is shown.

[0020] Explanation of reference numerals in the attached figures:

[0021] 10: Substrate;

[0022] 11: Second coupling capacitor;

[0023] 12: Signal transmitter;

[0024] 13: Connector;

[0025] 14: External card;

[0026] 15: Signal receiver;

[0027] 21: Signal transmitting component;

[0028] 22: First transmission line;

[0029] 221: Differential line in the first transmission line

[0030] 23: Connecting components;

[0031] 231: Pin;

[0032] 2311: Signal input pin;

[0033] 2312: Signal output pin;

[0034] 232: First coupling capacitor;

[0035] 233: Shell;

[0036] 234: Slot;

[0037] 2341: First reed;

[0038] 2342: Second reed;

[0039] 235: Grounding module

[0040] 24: Signal forwarding component;

[0041] 25: Second transmission line;

[0042] 26: Signal receiving component;

[0043] 271: Differential lines in the third transmission line;

[0044] 28: Main control chip;

[0045] 30: External devices

[0046] 40: Motherboard. Detailed Implementation

[0047] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the concept or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0048] To facilitate understanding of the technical solutions of the embodiments of this application, the relevant technologies of the embodiments of this application are described below. The following relevant technologies are optional solutions and can be combined with the technical solutions of the embodiments of this application in any way, and all of them fall within the protection scope of the embodiments of this application.

[0049] The following terms will be used in the following text:

[0050] Peripheral Component Interconnect Express (PCIE): A high-speed serial computer expansion bus standard.

[0051] Alternating Current Coupling Capacitor (AC cap): Also known as the first coupling capacitor, it is typically used in high-speed differential signal transmission to block DC components while allowing AC signals to pass through.

[0052] In existing signal transmission circuits based on the PCIe standard, such as Figure 1A As shown, the second coupling capacitor 11 is disposed on the substrate 10. The signal emitted by the signal transmitter 12 is transmitted on the signal transmission line, and after passing through the second coupling capacitor 11, it is transmitted to the external card 14 inserted into the connector 13. Figure 1BAs shown, the external card 14 can transmit its signal to the signal receiver 15 on the substrate 10 via the connector 13. However, since the solder joint of the second coupling capacitor 11 is often larger than the size of the signal transmission line, an impedance discontinuity point will be generated at the second coupling capacitor 11. When the signal encounters an impedance discontinuity point, part of the signal will be reflected back to the source, and the signal strength will be weakened, thus adversely affecting the integrity and quality of the signal. To improve signal integrity, back-drilling process is often required, which increases the operation and complexity. To solve this technical problem, one approach in related technologies is to integrate the second coupling capacitor 11 on a self-developed chip. However, according to the PCIe standard, the current mainstream design places the second coupling capacitor 11 on the outside of the chip. Therefore, if the second coupling capacitor 11 is built into the chip, when it interfaces with another general PCIe device (i.e., the second coupling capacitor 11 is located on the outside of the chip), it will result in an additional set of second coupling capacitors 11 in the PCIe link, which will affect the stability of the link. Based on this, this application provides a signal transmission circuit, connection component, and motherboard to reduce the adverse effects of the first coupling capacitor on signal integrity and quality.

[0053] The technical solution of this application and how it solves the aforementioned technical problems are described in detail below with specific embodiments. The listed specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0054] Figure 2 This illustration shows a schematic diagram of the composition of a connection component 23 provided in an embodiment of this application, as shown below. Figure 2 As shown, the connection component 23 includes: pins 231 and at least one set of first coupling capacitors 232. Each set of first coupling capacitors 232 corresponds to at least one signal transmitting component 21. It is understood that... Figure 2 The dashed line in the figure represents a first coupling capacitor 232.

[0055] For any one of the at least one set of first coupling capacitors 232, one end of the first coupling capacitor 232 is connected to the first transmission line 22 of the signal transmitting component 21 corresponding to the first coupling capacitor 232; the other end of the first coupling capacitor 232 is connected to the pin 231 for transmitting the signal of the corresponding signal transmitting component 21 to the external device 30 connected to the pin 231.

[0056] The signal transmitting component 21 and its first transmission line 22 are disposed in the signal transmission circuit. That is, the connecting component 23 can be applied to the signal transmission circuit to transmit the signal emitted by the signal transmitting component 21 to the external device 30 connected to the connecting component 23. In other words, this application improves upon existing connectors by incorporating at least one first coupling capacitor 232 into the existing connector to obtain the connecting component 23. This allows the connecting component 23, when applied to the signal transmission circuit, to avoid impedance discontinuities caused by the solder joint of the first coupling capacitor 232 being larger than the size of the first transmission line 22, thus improving signal integrity and quality. Furthermore, placing the first coupling capacitor 232 in the connecting component 23, making it close to the external device 30 receiving the signal, reduces signal reflection caused by the first coupling capacitor 232. Since the signal has already attenuated during transmission on the first transmission line 22, the reflected energy reaching the first coupling capacitor 232 is smaller, thereby reducing the adverse effects of the first coupling capacitor 232 on signal integrity and quality.

[0057] In one implementation, such as Figure 3 As shown, pin 231 includes a signal input pin 2311 and a signal output pin 2312. Correspondingly, the signal input pin 2311 is connected to each of the first coupling capacitors 232 and the external device 30, respectively, and is used to transmit the signal transmitted by the first coupling capacitors 232 to the external device 30. The signal output pin 2312 is connected to the external device 30 and is used to receive the signal output by the external device 30 and transmit it to the signal receiving component 26. The signal receiving component 26 can be located in the signal transmission circuit. It should be noted that... Figure 3 Only a first coupling capacitor 232 and a signal receiving component 26 are shown for illustration.

[0058] In one embodiment, the connection component 23 includes a housing 233, and at least one set of first coupling capacitors 232 are fixed inside the cavity of the housing 233 and arranged in parallel. The fixing method of the first coupling capacitors 232 can be welding, snap-fitting, etc., and is not specifically limited in this application. The arrangement direction of the at least one set of first coupling capacitors 232 can be the same as the arrangement direction of the corresponding at least one signal transmitting component 21 in the signal transmission circuit, to facilitate connection.

[0059] In one embodiment, the connecting assembly 23 is further provided with a slot 234, and an opening is provided on the side of the housing 233 facing the other end of the first coupling capacitor 232 to form the entrance of the slot 234, which extends into the cavity of the housing 233. Accordingly, signal input pin 2311 and signal output pin 2312 can be provided on the slot 234.

[0060] In one implementation, such as Figure 4 As shown, slot 234 includes a first spring 2341 and a second spring 2342, which are arranged opposite to each other to form a channel for inserting an external device 30. One end of the first spring 2341 is fixed to the housing 233 (e.g., fixed to the upper wall) and connected to the other end of each first coupling capacitor 232; the other end of the first spring 2341 is used to contact the external device 30. One end of the second spring 2342 is fixed to the housing 233 (e.g., fixed to the lower wall), and the other end of the second spring 2342 is used to contact the external device 30. The spacing between the first spring 2341 and the second spring 2342 can be set according to the size of the external device 30 in practical applications, and is not specifically limited in this application. Correspondingly, signal input pin 2311 can be the contact point between the other end of the first spring 2341 and the external device 30, and signal output pin 2312 can be the contact point between the other end of the second spring 2342 and the external device 30.

[0061] In another implementation, such as Figure 5 As shown, slot 234 includes a connection side, which is the side opposite to the slot inlet. Accordingly, signal input pin 2311 and signal output pin 2312 can be disposed on the connection side of slot 234, and when external device 30 is inserted into slot 234, they come into contact with signal input pin 2311 and signal output pin 2312 to make electrical connection.

[0062] The specific configuration of signal input pin 2311 and signal output pin 2312 can be set as needed in actual applications, and this application does not impose specific limitations on them. It is understood that the specific shape of slot 234 can vary depending on the external device 30; for example, slot 234 can be set to square, circular, elliptical, etc.

[0063] Therefore, by setting signal input pin 2311 and signal output pin 2312, the signal emitted by the signal transmitting component 21 is transmitted to the external device 30 through the signal input pin 2311, and the signal from the external device 30 is received through the signal output pin 2312 and transmitted to the signal receiving component 26, thus ensuring the orderly transmission of the signal.

[0064] In one embodiment, the external device 30 may include at least one of an expansion card, a USB device, a display device, an audio device, and a network device. The expansion card may include, for example, a network card, a graphics card, or a memory card; the USB device may include, for example, a keyboard, a mouse, a printer, or a scanner; the display device may include, for example, a monitor or a projector; the audio device may include, for example, a speaker, headphones, or a microphone; and the network device may include, for example, a switch or a router. In other words, the connection component 23 can connect to a variety of devices, exhibiting high adaptability.

[0065] In one embodiment, the connection component 23 is further provided with a grounding module 235, which is connected to one end and pin 231 of at least one set of first coupling capacitors 232.

[0066] It should be noted that when the input pin 2311 and signal output pin 2312 in pin 231 are the contact points between the first spring 2341 and the second spring 2342 and the external device 30, respectively, one end of the first spring 2341 and one end of the second spring 2342 are respectively connected to the grounding module 235. That is, the input pin 2311 is connected to the grounding module 235 through the first spring 2341, and the signal output pin 2312 is connected to the grounding module 235 through the second spring 2342.

[0067] By setting up the grounding module 235 for effective grounding, signal interference can be reduced, signal transmission speed and accuracy can be improved, and overall safety and stability can be enhanced.

[0068] Figure 6 A schematic diagram of a signal transmission circuit provided in an embodiment of this application is shown, as follows: Figure 5 As shown, the signal transmission circuit includes: at least one signal transmitting component 21, and a connection component 23 electrically connected to the at least one signal transmitting component 21 via a first transmission line 22; the connection component 23 is provided with pins 231 and at least one set of first coupling capacitors 232, and the at least one set of first coupling capacitors 232 corresponds one-to-one with the at least one signal transmitting component 21.

[0069] For any one of the at least one set of first coupling capacitors 232, one end of the first coupling capacitor 232 is connected to the first transmission line 22 of the signal transmitting component 21 corresponding to the first coupling capacitor 232, and the other end of the first coupling capacitor 232 is connected to the pin 231 for transmitting the signal of the corresponding signal transmitting component to the external device 30 connected to the pin 231.

[0070] The specific structure of the connecting component 23 can be found in the previous description, and the repeated parts will not be repeated here.

[0071] The signal transmission circuit provided in this application embodiment avoids impedance discontinuities caused by the size of the solder joint of the first coupling capacitor being larger than the size of the first transmission line by placing the first coupling capacitor in the connection component, which is beneficial to improving signal integrity and quality. Furthermore, placing the first coupling capacitor in the connection component, making it close to the external device receiving the signal, reduces signal reflection caused by the first coupling capacitor. Because the signal has already attenuated during transmission on the first transmission line, the reflected energy reaching the first coupling capacitor is smaller, thereby reducing the adverse effects of the first coupling capacitor on signal integrity and quality.

[0072] In one embodiment, any signal transmitting component 21 is used to transmit a differential signal, and the signal transmission circuit includes at least one first transmission line 22, with each first transmission line 22 corresponding to a signal transmitting component 21. For example... Figure 7 As shown, any first transmission line 22 includes two differential lines 221. One end of the two differential lines 221 is connected to the corresponding signal transmitting component 21, and the other end of the two differential lines 221 extends into the connecting component 23 and is electrically connected to a corresponding set of first coupling capacitors 232. Specifically, the two differential lines 221 are connected one-to-one with the two first coupling capacitors 232 in the corresponding set of first coupling capacitors 232.

[0073] Specifically, any signal transmitting component 21 may include two transmitting ports for transmitting differential signals. These two transmitting ports correspond one-to-one with two differential lines 221 in the corresponding first transmission line 22, and each transmitting port is connected to one end of the corresponding differential line 221. The two differential lines 221 in any first transmission line 22 are used to transmit two voltage signals of equal value but opposite direction. After receiving these two voltage signals, the external device 30 determines the logic state by comparing the voltage difference, for example, determining whether the logic state is 0 or 1.

[0074] Therefore, since any external interference or noise usually affects both differential lines 221 simultaneously, and the external device 30 (i.e., the signal receiver) only cares about the difference between the two line signals, the common-mode noise will be canceled out, thus ensuring that the differential signal has a strong anti-interference capability.

[0075] To ensure effective signal transmission, in one implementation, such as Figure 8As shown, the signal transmission circuit may further include at least one signal forwarding component 24, with each signal forwarding component 24 corresponding to at least one signal transmitting component 21. For any of the at least one signal forwarding component 24, one end of the signal forwarding component 24 is connected to the first transmission line 22 of the corresponding signal transmitting component 21, and the other end of the signal forwarding component 24 is connected to the connection component 23 through a second transmission line 25.

[0076] Specifically, each signal forwarding component 24 includes at least two input terminals and at least two output terminals, with each input terminal corresponding to one of the output terminals. Each second transmission line 25 includes two differential lines. Any two input terminals in any forwarding component 24 are respectively connected to the other ends of the two differential lines 221 in the corresponding first transmission line 22. The two output terminals corresponding to these two input terminals are respectively connected to one end of the two differential lines in the corresponding second transmission line 25. The other ends of these two differential lines are respectively connected to one end of two first coupling capacitors 232 in a corresponding set of first coupling capacitors 232.

[0077] The signal forwarding component 24 can be used for signal relay and amplification, ensuring that the signal does not attenuate due to long transmission distances and maintaining signal stability and strength. When the signal transmitting component 21 and the external device use different communication protocols, the signal forwarding component can also perform protocol conversion, enabling the signal transmitting component 21 to communicate smoothly with the external device. Therefore, by setting up the signal forwarding component 24, effective signal transmission is ensured.

[0078] Considering that in practical applications, signals emitted by external device 30 are often also transmitted to the signal transmission circuit, based on this, such as Figure 7 As shown, in one embodiment, the signal transmission circuit further includes at least one signal receiving component 26. Figure 7 (Only one is shown in the diagram), at least one signal receiving component 26 is connected to the signal output pin 2312 in the connection component 23 via a third transmission line. When the signal output pin 2312 receives a signal from the external device 30, it transmits the signal to the corresponding signal receiving component 26 via the corresponding third transmission line 27 according to the transmission line identifier in the signal.

[0079] In one embodiment, any signal receiving component 26 includes two receiving ports for receiving differential signals. Accordingly, as... Figure 7 As shown, any third transmission line includes two differential lines 271. One end of each differential line 271 is connected to one of the two receiving ports of the corresponding signal component 26, and the other end of each differential line 271 is connected to the signal output pin 2312.

[0080] In one embodiment, at least one signal transmitting component 21 and at least one signal receiving component 26 may be disposed on the main control chip 28. The at least one signal transmitting component 21 and at least one signal receiving component 26 may be arranged alternately on the main control chip 28. For example, a first signal receiving component 26 may be arranged below a first signal transmitting component 21, a second signal transmitting component 21 may be arranged below the first signal receiving component, a second signal receiving component 26 may be arranged below the second signal transmitting component 21, and so on. Alternatively, at least one signal transmitting component 21 may be arranged first, and then at least one signal receiving component 26 may be arranged below it; or at least one signal receiving component 26 may be arranged first, and then at least one signal transmitting component 21 may be arranged below it. The arrangement of the signal transmitting component 21 and the signal receiving component 26 is not specifically limited in this application and can be set as needed in practical applications.

[0081] Therefore, by setting up a signal receiving component, it is ensured that the signal transmission circuit can effectively receive signals transmitted from external devices.

[0082] This application also provides a motherboard 40, which includes the signal transmission circuit provided in any of the foregoing embodiments, that is, the components in the signal transmission circuit can be disposed on the motherboard 40.

[0083] In one embodiment, at least one signal transmitting component 21 and at least one signal receiving component 26 in the signal transmission circuit may be disposed on the main control chip 27, which may be disposed on the motherboard 40, as shown in the schematic diagram. Figure 9 As shown.

[0084] Furthermore, such as Figure 10 As shown, by placing the first coupling capacitor 232 in the connection component 23, compared to placing the second coupling capacitor 11 on the substrate 10 in FIG1, on the one hand, since board-level reflow soldering is not required on the motherboard 40, the risk of tombstoning during the processing of the coupling capacitor is reduced; on the other hand, since the second coupling capacitor 11 is placed in the substrate 10, the transmission line of the substrate 10 is not through, while the transmission line in the motherboard 40 in this application is through, thereby improving the throughness of the motherboard 40.

[0085] The motherboard provided in this application embodiment, based on the above-described configuration, avoids impedance discontinuities caused by the solder joint of the first coupling capacitor being larger than the size of the first transmission line, thus improving signal integrity and quality. Furthermore, placing the first coupling capacitor within the connection assembly, bringing it close to the external device receiving the signal, reduces signal reflection caused by the first coupling capacitor. Since the signal has already attenuated during transmission on the first transmission line, the reflected energy upon reaching the first coupling capacitor is smaller, thereby mitigating the adverse effects of the first coupling capacitor on signal integrity and quality.

[0086] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0087] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0088] The above description is merely an exemplary embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope described in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A signal transmission circuit, characterized in that, include: At least one signal transmitting component, and a connecting component electrically connected to the at least one signal transmitting component via a first transmission line; The connection component is provided with pins and at least one set of first coupling capacitors, and the at least one set of first coupling capacitors corresponds one-to-one with the at least one signal transmitting component. For any one of the at least one set of first coupling capacitors, one end of the first coupling capacitor is connected to the first transmission line of the signal transmitting component corresponding to the first coupling capacitor, and the other end of the first coupling capacitor is connected to the pin. The first coupling capacitor is used to transmit the signal of the corresponding signal transmitting component to the external device connected to the pin.

2. The circuit according to claim 1, characterized in that, The pins include signal input pins and signal output pins; The signal input pin is connected to either of the first set of coupling capacitors and the external device respectively, and the signal input pin is used to transmit the signal transmitted by the first set of coupling capacitors to the external device; The signal output pin is connected to the external device and is used to receive signals output by the external device.

3. The circuit according to claim 1 or 2, characterized in that, The signal transmission circuit includes at least one first transmission line, which corresponds one-to-one with the at least one signal transmitting component. Each first transmission line includes two differential lines, one end of which is connected to the corresponding signal transmitting component, and the other end of which extends into the connection component and is electrically connected to a corresponding set of first coupling capacitors. The two differential lines are connected one-to-one with the two first coupling capacitors in the corresponding set of first coupling capacitors.

4. The circuit according to claim 2, characterized in that, The circuit also includes at least one signal receiving component; The at least one signal receiving component is connected to the signal output pin via a third transmission line, and the signal receiving component is used to receive the signal output by the external device transmitted by the signal output pin.

5. The circuit according to claim 1, characterized in that, The connection assembly includes a housing, and the at least one set of first coupling capacitors are fixed inside the cavity of the housing and arranged in parallel.

6. The circuit according to claim 1, characterized in that, The connection component is also provided with a grounding module; The grounding module is connected to one end of the at least one set of first coupling capacitors and the pin, respectively.

7. The circuit according to claim 1, characterized in that, The circuit further includes at least one signal forwarding component, which corresponds one-to-one with the at least one signal transmitting component; For any of the at least one signal forwarding components, one end of the signal forwarding component is connected to the first transmission line of the corresponding signal transmitting component, and the other end of the signal forwarding component is connected to the connection component through a second transmission line.

8. The circuit according to any one of claims 1-2 and 4-7, characterized in that, The external device includes at least one of the following: an expansion card, a USB device, a display device, an audio device, and a network device.

9. A connecting component, characterized in that, It includes pins and at least one set of first coupling capacitors, wherein the at least one set of first coupling capacitors corresponds one-to-one with at least one signal transmitting component; For any one of the at least one set of first coupling capacitors, one end of the first coupling capacitor is connected to the first transmission line of the signal transmitting component corresponding to the first coupling capacitor, and the other end of the first coupling capacitor is connected to the pin. The first coupling capacitor is used to transmit the signal of the corresponding signal transmitting component to the external device connected to the pin. The signal transmission circuit according to any one of claims 1-8 includes the signal transmitting component and the first transmission line.

10. A motherboard, characterized in that, Includes the signal transmission circuit as described in any one of claims 1-8.

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