A high-density dense back-drilling PCB processing control method and system

By combining multidimensional signal standardization, adaptive Kalman filtering, and bidirectional long short-time memory network with local weighted regression, the problems of inaccurate interlayer interface identification, inaccurate layer prediction, and unsuitable parameter adjustment in the processing of high-density back-drilled PCBs were solved, achieving high-precision and high-yield back-drilling processing.

CN122432982APending Publication Date: 2026-07-21AN HUI SHENG PENG JIE ZHI NENG KE JI YOU XIAN GONG SI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
AN HUI SHENG PENG JIE ZHI NENG KE JI YOU XIAN GONG SI
Filing Date
2026-04-23
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing high-density back-drilled PCB manufacturing technologies suffer from problems such as limited signal acquisition and processing methods, insufficient accuracy in interlayer interface identification, insufficient accuracy in layer prediction probability distribution and confidence level, and a lack of intelligent dynamic adaptation capabilities in adjusting processing parameters, resulting in low processing accuracy and product yield.

Method used

Multidimensional raw signals are collected and standardized. Interlayer transition events are detected by adaptive Kalman filtering and bidirectional long short-term memory network. The feed rate and spindle speed are dynamically adjusted by combining local weighted regression method to achieve accurate layer thickness analysis and machining parameter optimization.

Benefits of technology

It improves the accuracy of interlayer interface identification and the reliability of depth prediction, enhances the dynamic adaptive adjustment capability of processing parameters, realizes precise control of residual pile length, and significantly improves back drilling processing accuracy and product yield.

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Abstract

The application relates to a high-density dense back-drilling PCB processing control method and system. The method comprises the following steps: collecting multi-dimensional original signals and standardizing, obtaining high signal-to-noise ratio depth signals through adaptive Kalman filtering, detecting interlayer transition events to generate a queue, predicting layer positions and confidence through a bidirectional long short-term memory network, combining adjacent completed drilling data to predict the remaining depth, dynamically adjusting the feed speed and spindle speed, and generating real-time control instructions. Through technical means such as multi-dimensional signal fusion, adaptive Kalman filtering denoising, accurate layer position prediction, remaining depth prediction and dynamic adaptation of processing parameters, the processing precision, stability and processing efficiency of the high-density dense back-drilling PCB are further improved.
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