Vehicle deformation simulation method, device and equipment
By acquiring inverse temperature field data and finite element simulation models, and combining measured temperature and gravitational field loads, the vehicle deformation simulation parameters are optimized, solving the problems of low simulation accuracy and low computational efficiency in existing technologies, and realizing efficient full-body deformation simulation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- YUANYI HUANYU (SHANGHAI) TECHNOLOGY CO LTD
- Filing Date
- 2026-03-03
- Publication Date
- 2026-07-21
Smart Images

Figure CN122433367A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of automotive technology, specifically to a vehicle deformation simulation method, apparatus, and equipment. Background Technology
[0002] Vehicle painting is an indispensable part of the entire manufacturing process. A well-painted vehicle body can improve its durability and lifespan. These painting processes can include electrophoresis and baking. For example, after the vehicle body-in-white enters the painting workshop and undergoes electrophoresis, it needs to be baked. During baking, deformation problems can occur in areas such as the side panels and hood, a common challenge in the target industry.
[0003] To address the aforementioned deformation issues, existing technologies typically employ simulation on the vehicle production line before the body-in-white baking process to identify the causes of vehicle deformation. However, most existing deformation simulation schemes simplify temperature loads and use simulated / estimated temperature data to perform simulation analysis on a single, localized area of the vehicle. This results in low simulation accuracy, difficulty in covering the entire vehicle body, and low computational efficiency. Summary of the Invention
[0004] In view of this, the embodiments of this application aim to provide a vehicle deformation simulation method, apparatus and equipment, which can solve the technical problems in the prior art such as low simulation accuracy, difficulty in simulating the entire vehicle body and low computational efficiency.
[0005] Firstly, this application provides a vehicle deformation simulation method, including: The reverse temperature field data of the vehicle is obtained, which is obtained by reverse heat conduction calculation based on the measured temperature data of the vehicle in the baking process. Construct a finite element simulation model and simulation constraints for the vehicle, wherein the simulation constraints are used to indicate the simulation constraints on the finite element simulation model; Based on the inverse temperature field data and the simulation constraints, the finite element simulation model is used to perform vehicle deformation simulation calculations to obtain the corresponding vehicle deformation information, which includes the deformation of at least one part of the vehicle.
[0006] In some embodiments, acquiring the vehicle's reverse temperature field data includes: Obtain measured temperature data of at least one part of the vehicle during the baking process; Based on the actual baking parameters corresponding to the baking process, a corresponding temperature field simulation model is constructed. The temperature field simulation model is used to simulate and calculate the temperature field data of the vehicle in the baking cycle corresponding to the baking process. Based on the temperature field simulation model, the measured temperature data is simulated and calculated to obtain the reverse temperature field data.
[0007] In some embodiments, constructing the finite element simulation model corresponding to the vehicle includes: Obtain the body-in-white information corresponding to the vehicle, wherein the body-in-white information includes at least one of the vehicle's body structure, material properties, and connection method; Based on the information about the vehicle body, a finite element simulation model of the vehicle is constructed.
[0008] In some embodiments, the step of performing vehicle deformation simulation calculations on the finite element simulation model based on the inverse temperature field data and the simulation constraints to obtain the corresponding vehicle deformation information includes: Obtain the gravity field load data corresponding to the vehicle, and the gravity field load data is used to indicate the magnitude of the load that the vehicle needs to apply under the action of gravity; The reverse temperature field data, the gravity field load data, and the simulation constraints are applied to the finite element simulation model for simulation and solution, thereby obtaining the vehicle deformation information.
[0009] In some embodiments, the vehicle deformation information further includes thermal stress and plastic strain values at at least one location in the vehicle, and the method further includes: Visualize and display the target information of each part in the vehicle deformation information; The target information includes at least one of the thermal stress value, the plastic strain value, and the deformation amount.
[0010] In some embodiments, the method further includes: When there is a target part in the vehicle deformation information whose deformation exceeds the corresponding preset deformation threshold, the target parameters of the vehicle are optimized and adjusted to re-execute the step of obtaining the reverse temperature field data of the vehicle until the deformation of each part in the vehicle deformation information does not exceed the corresponding preset deformation threshold. The target parameters include at least one of the actual baking parameters corresponding to the baking process in the reverse temperature field data, and the vehicle material and vehicle structure in the finite element simulation model.
[0011] In some embodiments, optimizing the target information of the vehicle includes: The target parameters are optimized and adjusted based on the standard vehicle parameters in the preset database so that the target parameters match the standard vehicle parameters. The target parameters and the standard vehicle parameters correspond one-to-one.
[0012] In some embodiments, the simulation constraints include a first constraint and / or a second constraint, wherein the first constraint indicates an opening and closing angle constraint on the corresponding opening and closing member in the vehicle, and the second constraint indicates a displacement constraint on the corresponding clamping point in the vehicle.
[0013] Secondly, this application provides a vehicle deformation simulation device, comprising: The acquisition module is used to acquire the reverse temperature field data of the vehicle, which is obtained by reverse heat conduction calculation based on the measured temperature data of the vehicle in the baking process. The processing module is used to construct the finite element simulation model and simulation constraints corresponding to the vehicle, wherein the simulation constraints are used to indicate the simulation constraints on the finite element simulation model. The processing module is further configured to perform vehicle deformation simulation calculations on the finite element simulation model based on the inverse temperature field data and the simulation constraints, and obtain corresponding vehicle deformation information, wherein the vehicle deformation information includes the deformation amount of at least one part of the vehicle.
[0014] For any content not introduced or described in the embodiments of this application, please refer to the relevant descriptions in the foregoing method embodiments; they will not be repeated here.
[0015] Thirdly, this application provides a computer device, including: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to execute the executable instructions to implement the steps of the above-described vehicle deformation simulation method.
[0016] Fourthly, this application provides a computer-readable storage medium storing computer program instructions thereon, which, when executed by a processor, implement the steps of the above-described vehicle deformation simulation method.
[0017] The technical solution provided in this application can include the following beneficial effects: This application can acquire reverse temperature field data of a vehicle, which is obtained by reverse heat conduction calculation based on measured temperature data of the vehicle during the baking process; construct a finite element simulation model and simulation constraints corresponding to the vehicle, wherein the simulation constraints are used to indicate the simulation constraints on the finite element simulation model; and perform vehicle deformation simulation calculation on the finite element simulation model based on the reverse temperature field data and the simulation constraints to obtain corresponding vehicle deformation information, wherein the vehicle deformation information includes the deformation amount of at least one part of the vehicle. Thus, this application can reversely infer and calculate the reverse temperature field data of the entire vehicle based on limited measured temperature data, and then perform vehicle deformation simulation calculation based on this reverse temperature field data and combined with the finite element simulation model of the whole vehicle. This allows for efficient and comprehensive calculation of the corresponding vehicle deformation information, which is beneficial to improving the comprehensiveness, efficiency, and reliability of vehicle deformation simulation. Compared with the prior art, this application can also solve the technical problems of low simulation accuracy, difficulty in simulating the entire vehicle body, and low computational efficiency in existing simulation schemes.
[0018] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description
[0019] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings.
[0020] Figure 1 This is a flowchart illustrating a vehicle deformation simulation method provided in an embodiment of this application.
[0021] Figure 2 This is a schematic diagram of a reverse temperature field data acquisition process provided in an embodiment of this application.
[0022] Figure 3 This is a schematic diagram of a finite element simulation model of a vehicle body-in-white provided in an embodiment of this application.
[0023] Figure 4 This is a schematic diagram of a vehicle deformation simulation calculation provided in an embodiment of this application.
[0024] Figure 5 This is a schematic diagram illustrating the process of simulating the deformation of an entire vehicle, as provided in an embodiment of this application.
[0025] Figure 6 This is a structural schematic diagram of a vehicle deformation simulation device provided in an embodiment of this application.
[0026] Figure 7 This is a schematic diagram of another vehicle deformation simulation device provided in an embodiment of this application.
[0027] Figure 8 This is a schematic diagram of the structure of a computer device provided in an embodiment of this application. Detailed Implementation
[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0029] Unless otherwise defined, the technical or scientific terms used in the embodiments of this specification shall have the ordinary meaning understood by one of ordinary skill in the art to which this specification pertains. The terms "first," "second," and similar terms used in the embodiments of this specification do not indicate any order, quantity, or importance, but are merely used to avoid confusion of constituent elements.
[0030] Unless the context otherwise requires, throughout this specification, "a plurality of" means "at least two," and "including" is interpreted as open-ended or encompassing, that is, "including, but not limited to." In the description of this specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this specification. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example.
[0031] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the scope of the present application to those skilled in the art.
[0032] In the process of filing this application, the applicant also discovered that deformation problems occurring during the baking process of the vehicle body typically only become apparent during the physical testing phase. In such cases, remedial measures such as mold repair and patching can only be implemented, which is time-consuming, costly, and takes several months, hindering production and sales. Existing technologies can also simulate and analyze the causes of vehicle deformation problems before baking. However, most existing simulation schemes simplify temperature loads, affecting simulation accuracy; and they can only perform simulation analysis on single, localized areas of the vehicle, lacking systematic and synchronous simulation of key areas such as the hood, doors, and side panels. If the above-mentioned methods are used to simulate and analyze the entire vehicle body one by one, the computational load is large and the calculation cycle is long. To solve the above problems, this application proposes a vehicle deformation simulation method, device, equipment, and medium.
[0033] Please see Figure 1 This is a flowchart illustrating a vehicle deformation simulation method provided in an embodiment of this application. Figure 1 The method shown can be applied to computer devices and may include the following implementation steps: S101. Obtain the reverse temperature field data of the vehicle, wherein the reverse temperature field data is obtained by reverse heat conduction calculation based on the measured temperature data of the vehicle in the baking process.
[0034] The reverse temperature field data mentioned above in this application may refer to the temperature distribution field data used to simulate the temperature distribution field data of the vehicle body-in-white during the entire baking process cycle. It may include the temperature distribution field data of different parts of the vehicle at different time points during the cycle, etc. This application does not impose any further limitations on this.
[0035] This application does not limit the implementation method for obtaining the aforementioned reverse temperature field data. For example, this application can obtain the data directly from a service provider via the network. Alternatively, please see... Figure 2 This is a schematic diagram illustrating a process for acquiring reverse temperature field data according to an embodiment of this application. Figure 2 The process shown may include image implementation steps: S201. Obtain measured temperature data of at least one part of the vehicle during the baking process.
[0036] This application can first obtain measured temperature data of at least one part of the vehicle during the baking process. Specifically, for example, in the painting oven of the vehicle production line, a furnace temperature testing vehicle, a furnace temperature meter, or other sensors can be used to collect temperature data of at least one part of the vehicle at different time points within the actual baking process cycle, which can also be called a temperature-time curve. The aforementioned part can refer to a key part of the vehicle's body-in-white, which may include, but is not limited to, side panels, hood, doors, tailgate, roof, or other custom areas, etc. This application does not impose further limitations or details on this. Generally, the more measured temperature data there are, the higher the accuracy of subsequent simulation analysis. Typically, this application can collect measured temperature data from at least 30 test points. These test points can be test sampling points in the corresponding parts of the vehicle, covering outer panels, inner panels, cavities, overlap areas, and sampling points at different heights, etc. This application does not impose further limitations on this.
[0037] S202. Based on the actual baking parameters corresponding to the baking process, a corresponding temperature field simulation model is constructed. The temperature field simulation model is used to simulate and calculate the temperature field data of the vehicle in the baking cycle corresponding to the baking process.
[0038] This application can construct a corresponding temperature field simulation model based on the actual baking parameters corresponding to the aforementioned baking process. The aforementioned actual baking parameters refer to the baking parameters set / used during the baking process of the vehicle body-in-white, which may include, but are not limited to, oven air supply and exhaust parameters, oven temperature change rate, oven maximum temperature, oven air velocity, convective heat transfer coefficient, heat source distribution parameters, or other custom baking parameters. This application does not impose further limitations or details on these parameters. The aforementioned temperature field simulation model is a model pre-defined by the system according to actual conditions, used to calculate inverse temperature field data. It may include, but is not limited to, computational fluid dynamics (CFD) models, empirical parameterized models, or other custom models. This application does not impose further limitations or details on these models. In specific implementation, this application can combine baking parameters such as oven drawings, oven air supply and exhaust parameters, and heat source distribution from the aforementioned baking process to establish a corresponding temperature field simulation model. This model can be used to simulate and calculate the temperature field data of the vehicle body-in-white throughout the entire baking cycle of the aforementioned baking process.
[0039] S203. Based on the temperature field simulation model, perform reverse heat conduction simulation calculations on the acquired measured temperature data to obtain the reverse temperature field data.
[0040] This application can perform reverse heat conduction simulation calculations on the aforementioned measured temperature data based on the established temperature field simulation model. Specifically, for example, the temperature field simulation model can be used to perform reverse heat transfer on the limited measured temperature data and reversely calculate the reverse temperature field data of the vehicle body-in-white during the entire baking process. The specific calculation implementation process of the temperature field simulation model can be referred to in the relevant introductions to traditional CFD model simulation calculations; this application will not elaborate further here. In practical applications, the error between the reverse temperature field data obtained by simulation calculation using the aforementioned temperature field simulation model and the measured temperature data obtained in actual tests can be controlled within 5℃ to ensure the accuracy or precision of the model simulation.
[0041] The body-in-white referred to in this application may refer to a body structure assembly that has been welded but not painted, which may include, but is not limited to, components and structures such as side panels, hood, doors, tailgate, and roof. This application does not impose further limitations or details on these components.
[0042] S102. Construct the finite element simulation model and simulation constraints corresponding to the vehicle. The simulation constraints are used to indicate the simulation constraints on the finite element simulation model.
[0043] The finite element simulation model mentioned above in this application can refer to a finite element model used to simulate the entire vehicle body-in-white, which can be constructed based on the physical state of the entire vehicle body-in-white. For example, please refer to... Figure 3 This is a schematic diagram of a possible finite element simulation model of a vehicle body-in-white as shown in this application. Figure 3 The finite element simulation model shown may include, but is not limited to, all or part of the entire vehicle body-in-white, its structure and connection methods, etc. The figures do not show them in detail, but this does not constitute a limitation. This application does not make any further limitations or details in this regard.
[0044] This application does not limit the implementation method of constructing the aforementioned finite element simulation model. Specifically, this application can first obtain the white body information corresponding to the aforementioned vehicle, for example, this application can directly read the white body information corresponding to the aforementioned vehicle from the corresponding database. The aforementioned white body information can refer to all information used to describe the vehicle's white body, which may include, but is not limited to, any combination of one or more of the following: body structure, material properties, connection methods, or other relevant information used to describe the vehicle's white body. The aforementioned body structure can refer to the structure used to describe the body shell, which may include, but is not limited to, crossbeams, longitudinal beams, pillars, side panels, hood, doors, tailgate, roof, or other custom structural components or coverings. This application does not impose further limitations or details on this. The aforementioned material properties can refer to the property information used to describe the materials used in the corresponding parts of the vehicle's white body, which may include, but is not limited to, any combination of one or more of the following: the elastic modulus, Poisson's ratio, coefficient of thermal expansion, specific heat capacity, density, thermal conductivity, or thermal conductivity of the material (e.g., steel, aluminum, adhesives), etc. This application does not impose further limitations or details on this. After obtaining the above-mentioned body-in-white information, this application can construct a whole vehicle finite element simulation model based on the above-mentioned body-in-white information, so as to simulate and simulate the baking deformation of the entire vehicle body-in-white. This application does not impose too many limitations or details on this.
[0045] The aforementioned simulation constraints can refer to constraints that are pre-defined by the system or R&D personnel based on actual conditions, used to constrain the aforementioned finite element simulation model. These constraints can include, but are not limited to, any combination of one or more of the following: a first constraint, a second constraint, or other custom constraints. The first constraint can refer to a constraint on the opening and closing angle of the corresponding opening and closing component in the aforementioned vehicle. The opening and closing component can refer to a vehicle part in the finite element simulation model that has an opening and closing function, such as a door, hood, or tailgate. Specifically, the first constraint can include the opening and closing angle supported by the opening and closing component being within a corresponding preset angle range, such as the opening and closing angle of a door being within the range of 0-30°, etc. This application does not further limit or elaborate on this. The second constraint can refer to a constraint on the positional displacement of the corresponding clamping point in the aforementioned vehicle. The clamping point can refer to a support point in the finite element simulation model used to support the upright position of the vehicle body-in-white, thus simulating and constraining the connection stiffness of the actual baking deformation of the vehicle body. Specifically, the second constraint mentioned above may include, but is not limited to, the clamping point / support point remaining stationary in the Z direction, for example, being 0; and expansion constraints in other directions, such as the X and Y directions. This application will not impose further limitations or details on these.
[0046] S103. Based on the inverse temperature field data and the simulation constraints, perform vehicle deformation simulation calculations on the finite element simulation model to obtain corresponding vehicle deformation information, wherein the vehicle deformation information includes the deformation amount of at least one part of the vehicle.
[0047] This application can apply the aforementioned inverse temperature field data and simulation constraints to the aforementioned finite element simulation model to perform vehicle deformation simulation calculations, thereby obtaining the corresponding vehicle deformation information. This application does not limit the specific implementation method of the aforementioned vehicle deformation simulation calculations; for specific examples, please refer to [link to relevant examples]. Figure 4 This is a schematic diagram illustrating a vehicle deformation simulation calculation process provided in an embodiment of this application. For example... Figure 4 The process shown may include the following implementation steps: S401. Obtain the gravity field load data corresponding to the vehicle, wherein the gravity field load data is used to indicate the magnitude of the load that the vehicle needs to apply under the action of gravity.
[0048] This application can also obtain the gravity field load data corresponding to the aforementioned vehicle. This gravity field load data can specifically be used to indicate the magnitude of the load that needs to be applied to the vehicle's body-in-white under the influence of gravity / geotropic force. In practical applications, the aforementioned gravity field load data usually does not change over time. The magnitude of the gravity load that needs to be applied to different parts of the vehicle's body-in-white at each point in time is the same. It can be customized according to the actual situation of the system, for example, the aforementioned gravity field load data can all be 1G, etc. This application does not impose further limitations or details on this.
[0049] S402. Apply the reverse temperature field data, the gravity field load data, and the simulation constraints to the finite element simulation model for simulation and solution, thereby obtaining the vehicle deformation information.
[0050] This application applies the aforementioned inverse temperature field data, gravity field load data, and simulation constraints to the aforementioned finite element simulation model for simulation and solution. Specifically, this application applies the aforementioned inverse temperature field data as a thermal load and the aforementioned gravity field load data as a gravity load to the finite element simulation model to simulate the actual posture of the vehicle body-in-white under heat in the oven; then, a finite element solver is used in conjunction with the aforementioned simulation constraints to perform a simulation solution of thermal-structural coupling, thereby calculating the corresponding vehicle deformation information. The aforementioned thermal-structural coupling can refer to the finite element analysis method that simultaneously considers the thermal expansion effect caused by the temperature field and the structural mechanical constraints, which is usually used to predict thermal deformation and stress. This application does not impose further limitations or details on this. The aforementioned vehicle deformation information can refer to relevant information used to describe the deformation of the vehicle body-in-white, which can at least include the deformation of various parts of the vehicle, and optionally may also include the thermal stress value, plastic strain value, or other custom parameters used to describe baking deformation of various parts. This application does not impose further limitations on this. Among them, the aforementioned thermal stress value can refer to the self-balancing force generated by temperature changes in the corresponding parts of the vehicle during the baking process. The aforementioned plastic strain values can be used to measure the degree of plastic deformation of the material in the corresponding parts of the vehicle, etc., and this application does not impose further limitations or details on this. This application does not limit the specific implementation method of the internal simulation calculation and solution of the aforementioned finite element simulation model. For example, this application can create a heat transfer analysis step in the simulation solver, the duration of which needs to cover the entire baking process cycle, i.e., the entire baking cycle. Next, this application can apply the aforementioned reverse temperature field data, loading the aforementioned reverse temperature field into the finite element simulation model through file import or subroutines, generating a result file containing the aforementioned reverse temperature field data; further, a new static analysis step is created in the simulation solver, loading the generated structure file containing the aforementioned reverse temperature field data into the finite element model through file import, and applying corresponding gravity field load data and constraints to the model. The simulation solver calculates the deformation information generated in various parts of the vehicle body-in-white under the combined action of the time-varying temperature field and gravity field, such as thermal stress, plastic strain, deformation amount, or other deformation information, etc., and this application does not impose further limitations or details on this.
[0051] The following describes some optional embodiments related to this application.
[0052] In some embodiments, after obtaining the aforementioned vehicle deformation information, this application can visualize and display the target information for each part in the vehicle deformation information. The target information may include at least one of the thermal stress value, plastic strain value, and deformation amount of the corresponding part. Specifically, for example, this application can visualize and draw the deformation amount of each part in the aforementioned vehicle deformation information to obtain a corresponding deformation risk map. The deformation risk map may include the deformation amount of various parts of the vehicle; and the deformation risk map is displayed on a corresponding display screen so that users can intuitively view the magnitude of deformation in various parts of the vehicle's body-in-white. Optionally, this application may use different colors to distinguish and display different deformation amounts so that users can more intuitively view the more severely deformed vehicle parts, etc., and this application does not impose further limitations on this. For example, this application can visualize the plastic strain values of each part in the above-mentioned vehicle deformation information to obtain the corresponding plastic strain diagram, which includes the plastic strain values of each part of the vehicle; and then display the plastic strain diagram on the corresponding display screen so that users can intuitively view the plastic strain values of each part of the vehicle body-in-white, etc. This application will not make any further limitations or details in this regard.
[0053] In some embodiments, after obtaining the aforementioned vehicle deformation information, this application can automatically detect / determine whether there are target parts in the aforementioned vehicle deformation information whose deformation exceeds the corresponding preset deformation threshold. If so, this application can optimize and adjust the target parameters of the vehicle body-in-white, specifically, for example, optimizing and adjusting the corresponding target parameters of the target parts in the aforementioned vehicle. The aforementioned target parameters may include, but are not limited to, any one or more of the following: actual baking parameters related to / corresponding to the aforementioned baking process in the aforementioned reverse temperature field data, specifically temperature parameters, such as adjusting the temperature change rate and maximum temperature of the oven; vehicle materials in the aforementioned finite element simulation model, such as adjusting material thickness, material properties, etc.; vehicle structure (also referred to as body structure) in the aforementioned finite element simulation model, such as adding reinforcing ribs / recesses, optimizing overlapping / connection methods, changing welding sequence, or changing adhesive application sequence, etc., which this application does not limit in detail. It is understood that after optimizing and adjusting the aforementioned target information, this application can simultaneously update the aforementioned reverse temperature field data and / or the aforementioned finite element simulation model. Accordingly, this application can re-execute steps S101-S103 above to recalculate the deformation of the entire vehicle body-in-white until the deformation of each part of the vehicle meets the corresponding design requirements. For example, the deformation of each part does not exceed the corresponding preset deformation threshold. This application does not impose further limitations or details on this. The aforementioned preset deformation threshold is a part deformation threshold pre-defined by the system based on actual conditions. It can be an empirical value customized based on user experience, or a statistical value calculated based on a series of experimental data, etc. This application does not impose further limitations or details on this. This application also does not limit the specific implementation method of optimizing and adjusting the aforementioned target parameters. For example, this application can sequentially try to adjust the material, structure, and temperature-related baking parameters of the aforementioned target parts to iteratively execute the scheme of this application until the deformation of the target part does not exceed the corresponding preset deformation threshold, at which point the process can end. Alternatively, this application can optimize and adjust the target parameters of the aforementioned vehicle based on standard vehicle parameters in a preset database, so that the aforementioned target parameters match the aforementioned standard vehicle parameters, and the aforementioned target parameters and the aforementioned standard vehicle parameters correspond one-to-one. The aforementioned preset database is a database pre-calibrated by the system based on actual conditions. This database includes standard vehicle manufacturing parameters (hereinafter referred to as standard vehicle parameters) for corresponding parts of the vehicle's body-in-white, such as standard material parameters, standard temperature parameters, standard thickness parameters, standard structural parameters, or other custom standard parameters. This application can optimize and adjust the corresponding target parameters of the vehicle based on the corresponding standard vehicle parameters in the aforementioned preset database, so that the target parameters are consistent with or the same as the aforementioned standard vehicle parameters, etc., and this application does not impose any further limitations in this regard.
[0054] To help better understand the embodiments of this application, please refer to the following: Figure 5 This describes the entire implementation process of vehicle deformation simulation. Please refer to [link / reference] for details. Figure 5 This is a schematic diagram illustrating the entire process of vehicle deformation simulation provided in an embodiment of this application. For example... Figure 5 In the flowchart shown, sensors such as furnace temperature gauges can be used to sample the temperature of the prototype vehicle or prototype vehicle model, such as the vehicle body-in-white, during the entire oven baking process, thereby obtaining the corresponding temperature curves, which can be referred to as measured temperature data. Furthermore, this application can perform oven calibration using, for example, the oven model provided in the drawings, the initial parameters used in the baking process (such as the maximum oven temperature), the prototype vehicle model (such as the vehicle body-in-white), and the collected temperature curves. This allows for the acquisition of vehicle models under different temperature curves through pre-calibration, which can also be referred to as production line models. Furthermore, this application can utilize the pre-calibrated temperature data related to the vehicle body-in-white to acquire temperature field data for the same vehicle model to be evaluated. For example, the pre-calibrated temperature data related to the vehicle body-in-white can be used as the measured temperature data of the vehicle body-in-white to be evaluated, and then the reverse temperature field data of the vehicle body-in-white to be evaluated can be obtained through reverse heat conduction calculations. Furthermore, the aforementioned temperature field data is used to simulate and analyze the baking deformation of the vehicle body-in-white under evaluation. This allows for continuous optimization and adjustment of the target parameters of the vehicle body-in-white, such as structural optimization, to simulate and obtain a vehicle body-in-white that meets the corresponding design requirements (e.g., deformation not exceeding the corresponding deformation threshold). For any content not described or introduced in this embodiment, please refer to the relevant descriptions in the aforementioned method embodiments; they will not be repeated here. In practical applications, this solution can be applied to the digital prototype stage. Simulation can identify potential deformation risks in advance and provide multiple optimization and adjustment schemes for virtual verification, eliminating deformation problems on the drawings and greatly reducing the cost and cycle of physical prototyping. For example, the deformation optimization cycle can be shortened to 4-6 weeks, significantly improving development efficiency. It also avoids the high costs associated with mold repair and patching after vehicle manufacturing due to deformation problems, thus saving costs. In addition, this application uses limited measured temperature data, reverse heat conduction reasoning, and temperature field simulation model to obtain high-precision whole-vehicle temperature field data, which solves the pain point of difficulty in obtaining temperature data in complex areas such as internal cavities, and provides high-confidence temperature field data for subsequent vehicle deformation simulation, thereby helping to improve simulation accuracy.
[0055] By implementing the embodiments of this application, this application can obtain reverse temperature field data of a vehicle, which is obtained by reverse heat conduction calculation based on measured temperature data of the vehicle during the baking process; construct a finite element simulation model and simulation constraints corresponding to the vehicle, the simulation constraints indicating the simulation constraints on the finite element simulation model; and perform vehicle deformation simulation calculation on the finite element simulation model based on the reverse temperature field data and the simulation constraints to obtain corresponding vehicle deformation information, which includes the deformation amount of at least one part of the vehicle. In this way, this application can reversely infer and calculate the reverse temperature field data of the entire vehicle based on limited measured temperature data, and then perform vehicle deformation simulation calculation based on this reverse temperature field data and the finite element simulation model of the whole vehicle. This allows for efficient and comprehensive calculation of the corresponding vehicle deformation information, improving the comprehensiveness, efficiency, and reliability of vehicle deformation simulation. Compared with existing technologies, this application also solves the technical problems of low simulation accuracy, difficulty in simulating the entire vehicle body, and low computational efficiency in existing simulation schemes.
[0056] Based on the above embodiments, please refer to Figure 6 This is a structural schematic diagram of a vehicle deformation simulation device provided in an embodiment of this application. Figure 6 The illustrated device 600 can be applied in a computer device. The device 600 may include an acquisition module 601 and a processing module 602, wherein: The acquisition module 601 is used to acquire the reverse temperature field data of the vehicle, which is obtained by reverse heat conduction calculation based on the measured temperature data of the vehicle in the baking process. The processing module 602 is used to construct the finite element simulation model and simulation constraints corresponding to the vehicle, wherein the simulation constraints are used to indicate the simulation constraints on the finite element simulation model. The processing module 602 is further configured to perform vehicle deformation simulation calculations on the finite element simulation model based on the inverse temperature field data and the simulation constraints, and obtain corresponding vehicle deformation information, wherein the vehicle deformation information includes the deformation amount of at least one part of the vehicle.
[0057] In some embodiments, the acquisition module 601 is specifically used for: Obtain measured temperature data of at least one part of the vehicle during the baking process; Based on the actual baking parameters corresponding to the baking process, a corresponding temperature field simulation model is constructed. The temperature field simulation model is used to simulate and calculate the temperature field data of the vehicle in the baking cycle corresponding to the baking process. Based on the temperature field simulation model, the measured temperature data is simulated and calculated to obtain the reverse temperature field data.
[0058] In some embodiments, the processing module 602 is specifically used for: Obtain the body-in-white information corresponding to the vehicle, wherein the body-in-white information includes at least one of the vehicle's body structure, material properties, and connection method; Based on the information about the vehicle body, a finite element simulation model of the vehicle is constructed.
[0059] In some embodiments, the processing module 602 is specifically used for: Obtain the gravity field load data corresponding to the vehicle, and the gravity field load data is used to indicate the magnitude of the load that the vehicle needs to apply under the action of gravity; The reverse temperature field data, the gravity field load data, and the simulation constraints are applied to the finite element simulation model for simulation and solution, thereby obtaining the vehicle deformation information.
[0060] In some embodiments, the vehicle deformation information further includes thermal stress values and plastic strain values at at least one part of the vehicle, and the processing module 602 is further configured to: Visualize and display the target information of each part in the vehicle deformation information; The target information includes at least one of the thermal stress value, the plastic strain value, and the deformation amount.
[0061] In some embodiments, the processing module 602 is further configured to: When there is a target part in the vehicle deformation information whose deformation exceeds the corresponding preset deformation threshold, the target parameters of the vehicle are optimized and adjusted to re-execute the step of obtaining the reverse temperature field data of the vehicle until the deformation of each part in the vehicle deformation information does not exceed the corresponding preset deformation threshold. The target parameters include at least one of the actual baking parameters corresponding to the baking process in the reverse temperature field data, and the vehicle material and vehicle structure in the finite element simulation model.
[0062] In some embodiments, the processing module 602 is specifically used for: The target parameters are optimized and adjusted based on the standard vehicle parameters in the preset database so that the target parameters match the standard vehicle parameters. The target parameters and the standard vehicle parameters correspond one-to-one.
[0063] In some embodiments, the simulation constraints include a first constraint and / or a second constraint, wherein the first constraint indicates an opening and closing angle constraint on the corresponding opening and closing member in the vehicle, and the second constraint indicates a displacement constraint on the corresponding clamping point in the vehicle.
[0064] For any content not introduced or described in the embodiments of this application, please refer to the relevant descriptions in the foregoing method embodiments; they will not be repeated here.
[0065] By implementing the embodiments of this application, the above-mentioned device can acquire reverse temperature field data of a vehicle, which is obtained by reverse heat conduction calculation based on measured temperature data of the vehicle during the baking process; construct a finite element simulation model and simulation constraints corresponding to the vehicle, wherein the simulation constraints are used to indicate the simulation constraints on the finite element simulation model; and perform vehicle deformation simulation calculation on the finite element simulation model based on the reverse temperature field data and the simulation constraints to obtain corresponding vehicle deformation information, which includes the deformation amount of at least one part of the vehicle. In this way, this application can reversely infer and calculate the reverse temperature field data of the entire vehicle based on limited measured temperature data, and then perform vehicle deformation simulation calculation based on this reverse temperature field data and the finite element simulation model of the whole vehicle. This allows for efficient and comprehensive calculation of the corresponding vehicle deformation information, improving the comprehensiveness, efficiency, and reliability of vehicle deformation simulation. Compared with existing technologies, it also solves the technical problems of low simulation accuracy, difficulty in simulating the entire vehicle body, and low computational efficiency in existing simulation schemes.
[0066] Please see Figure 7 This is a schematic diagram of another vehicle deformation simulation device provided in an embodiment of this application. For example... Figure 7 The device shown can be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, or other electronic device. This device can be applied to various types of vehicles, etc.
[0067] Reference Figure 7 The device 700 may include one or more of the following components: processing component 702, memory 704, power supply component 706, multimedia component 708, audio component 710, input / output interface 712, sensor component 714, and communication component 716.
[0068] Processing component 702 typically controls the overall operation of device 700, including operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 702 may include one or more processors 720 to execute instructions to complete all or part of the steps of the aforementioned vehicle deformation simulation method. Furthermore, processing component 702 may include one or more modules to facilitate interaction between processing component 702 and other components. For example, processing component 702 may include a multimedia module to facilitate interaction between multimedia component 708 and processing component 702.
[0069] Memory 704 is configured to store various types of data to support the operation of device 700. Examples of this data include instructions for any application or method operating on device 700, contact data, phonebook data, messages, pictures, videos, etc. Memory 704 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.
[0070] Power supply assembly 706 provides power to various components of device 700. Power supply assembly 706 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to device 700.
[0071] Multimedia component 708 includes a screen that provides an output interface between the device 700 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 708 includes a front-facing camera and / or a rear-facing camera. When the device 700 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.
[0072] Audio component 710 is configured to output and / or input audio signals. For example, audio component 710 includes a microphone (MIC) configured to receive external audio signals when device 700 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 704 or transmitted via communication component 716. In some embodiments, audio component 710 also includes a speaker for outputting audio signals.
[0073] Input / output interface 712 provides an interface between processing component 702 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, start buttons, and lock buttons.
[0074] Sensor assembly 714 includes one or more sensors for providing state assessments of various aspects of device 700. For example, sensor assembly 714 may detect the on / off state of device 700, the relative positioning of components such as the display and keypad of device 700, changes in the position of device 700 or a component of device 700, the presence or absence of user contact with device 700, the orientation or acceleration / deceleration of device 700, and temperature changes of device 700. Sensor assembly 714 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 714 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 714 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.
[0075] Communication component 716 is configured to facilitate wired or wireless communication between device 700 and other devices. Device 700 can access wireless networks based on communication standards, such as WiFi, 2G, or 3G, or combinations thereof. In one exemplary embodiment, communication component 716 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 716 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.
[0076] In an exemplary embodiment, the apparatus 700 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the vehicle deformation simulation method described above.
[0077] Understandably, the processor 720 in this application embodiment can be an integrated circuit chip with signal processing capabilities. In implementation, each step of the above method embodiment can be completed by integrated logic circuits in the processor's hardware or by software instructions. The processor described above can be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.
[0078] Understandably, the memory 704 in the embodiments of this application can be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. The non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory can be random access memory (RAM), which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous linked dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM). It should be noted that the memory used in the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.
[0079] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 704 including instructions, which can be executed by the processor 720 of the device 700 to complete the above-described upper-level vehicle deformation simulation method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.
[0080] The aforementioned device can be a standalone electronic device or a part of a standalone electronic device. For example, in one embodiment, the device can be an integrated circuit (IC) or a chip, wherein the integrated circuit can be a single IC or a collection of multiple ICs. The chip can include, but is not limited to, the following types: GPU (Graphics Processing Unit), CPU (Central Processing Unit), FPGA (Field Programmable Gate Array), DSP (Digital Signal Processor), ASIC (Application Specific Integrated Circuit), and SoC (System on Chip). The aforementioned integrated circuit or chip can be used to execute executable instructions (or code) to implement the aforementioned vehicle deformation simulation method. The executable instructions can be stored in the integrated circuit or chip or obtained from other devices or equipment. For example, the integrated circuit or chip includes a processor, memory, and an interface for communicating with other devices. The executable instructions can be stored in the memory, and when the executable instructions are executed by the processor, the above-mentioned vehicle deformation simulation method can be implemented; or, the integrated circuit or chip can receive the executable instructions through the interface and transmit them to the processor for execution to implement the above-mentioned vehicle deformation simulation method.
[0081] Please see Figure 8 This is a schematic diagram of the structure of a computer device provided in an embodiment of this application. For example, as shown... Figure 8 As shown, the computer device 800 includes a memory 801 and a processor 802. The memory 801 stores executable program code 8011, and the processor 802 is used to call and execute the executable program code 8011 to perform a vehicle deformation simulation method.
[0082] This application embodiment can divide the computer device into functional modules according to the above method embodiment. For example, each function can be assigned to a separate module, or two or more functions can be integrated into a processing module. The integrated module can be implemented in hardware. It should be noted that the module division in this embodiment is illustrative and only represents one logical functional division. In actual implementation, there may be other division methods. When dividing each functional module according to its corresponding function, the vehicle may include: a processing module and a communication module, etc.
[0083] It should be noted that all relevant content of each step involved in the above method embodiments can be referenced from the functional description of the corresponding functional module, and will not be repeated here. The computer device provided in this embodiment is used to execute the above-described vehicle deformation simulation method, and therefore can achieve the same effect as the above implementation method.
[0084] In another exemplary embodiment, a computer program product is also provided, comprising a computer program executable by a programmable device, the computer program having a code portion for performing the above-described vehicle deformation simulation method when executed by the programmable device.
[0085] It should be noted that the descriptions of the above embodiments of storage media, devices, and equipment are similar to the descriptions of the above method embodiments, and have similar beneficial effects. For technical details not disclosed in the embodiments of storage media, devices, and equipment of this application, please refer to the descriptions of the method embodiments of this application for understanding.
[0086] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of this application. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed in this application. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.
[0087] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A method for simulating vehicle deformation, characterized in that, include: The reverse temperature field data of the vehicle is obtained, which is obtained by reverse heat conduction calculation based on the measured temperature data of the vehicle in the baking process. Construct a finite element simulation model and simulation constraints for the vehicle, wherein the simulation constraints are used to indicate the simulation constraints on the finite element simulation model; Based on the inverse temperature field data and the simulation constraints, the finite element simulation model is used to perform vehicle deformation simulation calculations to obtain the corresponding vehicle deformation information, which includes the deformation of at least one part of the vehicle.
2. The method according to claim 1, characterized in that, The acquisition of the vehicle's reverse temperature field data includes: Obtain measured temperature data for at least one part of the vehicle during the baking process; Based on the actual baking parameters corresponding to the baking process, a corresponding temperature field simulation model is constructed. The temperature field simulation model is used to simulate and calculate the temperature field data of the vehicle in the baking cycle corresponding to the baking process. Based on the temperature field simulation model, the measured temperature data is simulated and calculated to obtain the reverse temperature field data.
3. The method according to claim 1, characterized in that, The construction of the finite element simulation model corresponding to the vehicle includes: Obtain the body-in-white information corresponding to the vehicle, wherein the body-in-white information includes at least one of the vehicle's body structure, material properties, and connection method; Based on the information about the vehicle body, a finite element simulation model of the vehicle is constructed.
4. The method according to claim 1, characterized in that, The vehicle deformation simulation calculation based on the inverse temperature field data and the simulation constraints, obtained by performing vehicle deformation simulation on the finite element simulation model, includes: Obtain the gravity field load data corresponding to the vehicle, and the gravity field load data is used to indicate the magnitude of the load that the vehicle needs to apply under the action of gravity; The reverse temperature field data, the gravity field load data, and the simulation constraints are applied to the finite element simulation model for simulation and solution, thereby obtaining the vehicle deformation information.
5. The method according to claim 1, characterized in that, The vehicle deformation information also includes the thermal stress value and plastic strain value of at least one part of the vehicle, and the method further includes: Visualize and display the target information of each part in the vehicle deformation information; The target information includes at least one of the thermal stress value, the plastic strain value, and the deformation amount.
6. The method according to claim 1, characterized in that, The method further includes: When there is a target part in the vehicle deformation information whose deformation exceeds the corresponding preset deformation threshold, the target parameters of the vehicle are optimized and adjusted to re-execute the step of obtaining the reverse temperature field data of the vehicle until the deformation of each part in the vehicle deformation information does not exceed the corresponding preset deformation threshold. The target parameters include at least one of the actual baking parameters corresponding to the baking process in the reverse temperature field data, and the vehicle material and vehicle structure in the finite element simulation model.
7. The method according to claim 6, characterized in that, The optimization and adjustment of the target information of the vehicle includes: The target parameters are optimized and adjusted based on the standard vehicle parameters in the preset database so that the target parameters match the standard vehicle parameters. The target parameters and the standard vehicle parameters correspond one-to-one.
8. The method according to any one of claims 1-7, characterized in that, The simulation constraints include a first constraint and / or a second constraint. The first constraint indicates the constraint on the opening and closing angle of the corresponding opening and closing member in the vehicle, and the second constraint indicates the displacement constraint on the corresponding clamping point in the vehicle.
9. A vehicle deformation simulation device, characterized in that, include: The acquisition module is used to acquire the reverse temperature field data of the vehicle, which is obtained by reverse heat conduction calculation based on the measured temperature data of the vehicle in the baking process. The processing module is used to construct the finite element simulation model and simulation constraints corresponding to the vehicle, wherein the simulation constraints are used to indicate the simulation constraints on the finite element simulation model. The processing module is further configured to perform vehicle deformation simulation calculations on the finite element simulation model based on the inverse temperature field data and the simulation constraints, and obtain corresponding vehicle deformation information, wherein the vehicle deformation information includes the deformation amount of at least one part of the vehicle.
10. A computer device, characterized in that, include: processor; A memory for storing processor-executable instructions; wherein the processor is configured to execute the executable instructions to implement the steps of the method according to any one of claims 1 to 8.