Power inductance package structure and manufacturing method thereof

Abstract

The present application provides a power inductor package structure and a manufacturing method thereof. The power inductor package structure includes a magnetic core structure, a coil structure, a package structure, a top end conductive structure, a side end conductive structure, a top end insulation structure, a bottom end insulation structure, and a side end insulation structure. The package structure is configured to cover the magnetic core structure and the coil structure. The top end conductive structure includes a first top end electrode layer and a second top end electrode layer disposed on a top end of the package structure. The side end conductive structure includes a first side end conductive layer and a second side end conductive layer disposed on a first side end and a second side end of the package structure, respectively. The top end insulation structure includes a top end insulation layer disposed on the top end of the package structure. The bottom end insulation structure includes a bottom end insulation layer disposed on a bottom end of the package structure. The side end insulation structure includes a first side end insulation layer and a second side end insulation layer disposed on a third side end and a fourth side end of the package structure, respectively.

Description

Technical Field

[0001] This invention relates to a packaging structure and its manufacturing method, specifically to a power inductor packaging structure and its manufacturing method. Background Technology

[0002] An inductor is an electromagnetic induction component made by winding a coil of insulated wire with a certain number of turns on a bobbin or iron core. This coil is called an inductor coil or inductor. According to the principle of electromagnetic induction, when the coil moves relative to a magnetic field (or when the coil generates an alternating magnetic field by passing an alternating current through it), an induced voltage is generated to resist the change in the original magnetic field. This characteristic of suppressing current changes is called inductance. However, there is still room for improvement in existing inductor technology and its manufacturing methods. Summary of the Invention

[0003] The problem that this invention aims to improve or solve is to provide a power inductor packaging structure and its manufacturing method to address the shortcomings of the prior art.

[0004] To improve or solve the above-mentioned problems, one technical means adopted by the present invention is to provide a power inductor packaging structure, which includes: a magnetic core structure, a coil structure, a packaging structure, a top conductive structure, a side conductive structure, a top insulating structure, a bottom insulating structure, and a side insulating structure. The coil structure is disposed around the magnetic core structure. The packaging structure is configured to cover the magnetic core structure and the coil structure. The top conductive structure includes a first top electrode layer and a second top electrode layer disposed on a top of the packaging structure. The side conductive structure includes a first side conductive layer and a second side conductive layer disposed on a first side and a second side of the packaging structure, respectively. The top insulating structure includes a top insulating layer disposed on the top of the packaging structure. The bottom insulating structure includes a bottom insulating layer disposed on a bottom of the packaging structure. The side insulating structure includes a first side insulating layer and a second side insulating layer disposed on a third side and a fourth side of the packaging structure, respectively. The coil structure has a first end portion electrically connected to a first top electrode layer via a first side conductive layer, and a second end portion electrically connected to a second top electrode layer via a second side conductive layer. The core structure and the encapsulation structure are seamlessly and tightly connected, as are the coil structure and the encapsulation structure. The top conductive structure and the encapsulation structure are seamlessly and tightly connected, as are the top insulating structure and the encapsulation structure. The top insulating structure and the encapsulation structure are seamlessly and tightly connected, the bottom insulating structure and the encapsulation structure are seamlessly and tightly connected, and the side insulating structure and the encapsulation structure are seamlessly and tightly connected.

[0005] To improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a power inductor packaging structure, which includes: a magnetic core structure, a coil structure, a packaging structure, a top conductive structure, a side conductive structure, a top insulating structure, a bottom insulating structure, and a side insulating structure. The coil structure is disposed around the magnetic core structure. The packaging structure is configured to cover the magnetic core structure and the coil structure. The top conductive structure includes a first top electrode layer and a second top electrode layer disposed on a top of the packaging structure. The side conductive structure includes a first side conductive layer and a second side conductive layer disposed on a first side and a second side of the packaging structure, respectively. The top insulating structure includes a top insulating layer disposed on the top of the packaging structure. The bottom insulating structure includes a bottom insulating layer disposed on a bottom of the packaging structure. The side insulating structure includes a first side insulating layer and a second side insulating layer disposed on a third side and a fourth side of the packaging structure, respectively. In this coil structure, a first end portion is electrically connected to a first top electrode layer via a first side conductive layer, and a second end portion is electrically connected to a second top electrode layer via a second side conductive layer.

[0006] To improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a method for manufacturing a power inductor packaging structure, which includes: providing a plurality of pre-fabricated magnetic core structures; respectively arranging a plurality of coil structures around the plurality of magnetic core structures to form a plurality of magnetic core and coil mating parts, each magnetic core and coil mating part including a corresponding magnetic core structure and a corresponding coil structure; respectively embedding the plurality of magnetic core and coil mating parts into a plurality of intermediate encapsulating colloids supported by a carrier frame; forming a top encapsulating colloid at the top of the carrier frame to cover the plurality of magnetic core and coil mating parts and the plurality of intermediate encapsulating colloids; forming a bottom encapsulating colloid at the top of the carrier frame. The bottom of the supporting frame is covered with multiple magnetic cores and coil mating parts, as well as multiple intermediate encapsulating colloids; multiple first conductive materials, multiple second conductive materials, and multiple insulating materials are formed on the top encapsulating colloid; a cutting step is performed: multiple coil structures, multiple intermediate encapsulating colloids, top encapsulating colloids, bottom encapsulating colloids, multiple first conductive materials, multiple second conductive materials, and multiple insulating materials are cut along multiple predetermined cutting lines to form multiple power inductor package structure semi-finished products; and a side-end conductive structure, a bottom-end insulating structure, and a side-end insulating structure are formed on each power inductor package structure semi-finished product to complete the fabrication of multiple power inductor package structures.

[0007] One of the beneficial effects of the present invention is that the power inductor packaging structure provided by the present invention, through the technical solutions of "the packaging structure being configured to cover the magnetic core structure and the coil structure", "the top conductive structure including a first top electrode layer and a second top electrode layer disposed on a top of the packaging structure", "the side conductive structure including a first side conductive layer and a second side conductive layer respectively disposed on a first side and a second side of the packaging structure", "the top insulating structure including a top insulating layer disposed on the top of the packaging structure", "the bottom insulating structure including a bottom insulating layer disposed on a bottom of the packaging structure", and "the side insulating structure including a first side insulating layer and a second side insulating layer respectively disposed on a third side and a fourth side of the packaging structure", allows a first end portion of the coil structure to be electrically connected to the first top electrode layer through the first side conductive layer, and allows a second end portion of the coil structure to be electrically connected to the second top electrode layer through the second side conductive layer.

[0008] One of the beneficial effects of this invention is that the method for manufacturing a power inductor packaging structure provided by this invention can achieve the following: "providing a plurality of pre-fabricated magnetic core structures," "distributing a plurality of coil structures around the plurality of magnetic core structures to form a plurality of magnetic core and coil mating parts," "embedding the plurality of magnetic core and coil mating parts into a plurality of intermediate encapsulation colloids supported by a support frame," "forming a top encapsulation colloid at the top of the support frame to cover the plurality of magnetic core and coil mating parts and the plurality of intermediate encapsulation colloids," and "forming a bottom encapsulation colloid at the bottom of the support frame to cover the plurality of magnetic core and coil mating parts." The technical solutions include: "and multiple intermediate encapsulants", "forming multiple first conductive materials, multiple second conductive materials and multiple insulating materials on the top encapsulant", "performing a cutting step: cutting multiple coil structures, multiple intermediate encapsulants, top encapsulants, bottom encapsulants, multiple first conductive materials, multiple second conductive materials and multiple insulating materials along multiple predetermined cutting lines to form multiple power inductor encapsulation structure semi-finished products", and "forming a side-end conductive structure, a bottom-end insulating structure and a side-end insulating structure on each power inductor encapsulation structure semi-finished product", to complete the fabrication of multiple power inductor encapsulation structures.

[0009] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0010] Figure 1 This is a flowchart illustrating the fabrication method of the power inductor packaging structure provided in the first embodiment of the present invention.

[0011] Figure 2 This is a side cross-sectional view of step S100 of the method for manufacturing the power inductor package structure provided in the first embodiment of the present invention.

[0012] Figure 3 This is a side cross-sectional view of step S102 of the method for manufacturing the power inductor packaging structure provided in the first embodiment of the present invention.

[0013] Figure 4 This is a side cross-sectional view of steps S1030, S1032, S1034 and S1036 of the method for manufacturing the power inductor packaging structure provided in the first embodiment of the present invention.

[0014] Figure 5 This is a side cross-sectional view of step S104 of the method for manufacturing the power inductor packaging structure provided in the first embodiment of the present invention.

[0015] Figure 6 This is a side cross-sectional view of steps S106 and S108 of the method for manufacturing the power inductor packaging structure provided in the first embodiment of the present invention.

[0016] Figure 7 This is a side cross-sectional view of step S110 of the method for manufacturing the power inductor packaging structure provided in the first embodiment of the present invention.

[0017] Figure 8 This is a side cross-sectional view of step S112 of the method for manufacturing the power inductor package structure provided in the first embodiment of the present invention.

[0018] Figure 9 This is a three-dimensional schematic diagram of step S112 of the method for manufacturing the power inductor packaging structure provided in the first embodiment of the present invention.

[0019] Figure 10 The first embodiment of the present invention provides a three-dimensional schematic diagram of step S114 of the method for manufacturing a power inductor packaging structure, and the second embodiment of the present invention provides a three-dimensional schematic diagram of the power inductor packaging structure. Detailed Implementation

[0020] The following specific embodiments illustrate the implementation of the "power inductor packaging structure" and "method of manufacturing the power inductor packaging structure" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, it should be stated in advance that the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. Additionally, the term "or" used herein should, depending on the actual situation, include any combination of one or more of the associated listed items.

[0021] First Embodiment

[0022] See Figures 1 to 10 As shown, the first embodiment of the present invention provides a method for fabricating a power inductor package structure S (or a method for fabricating a composite power inductor), which may include at least the following steps: First, in conjunction with... Figure 1 and Figure 2 As shown, multiple pre-fabricated magnetic core structures 1 are provided (step S100); then, in conjunction with Figure 1 , Figure 3 and Figure 4 As shown, multiple coil structures 2 are respectively arranged around multiple magnetic core structures 1 to form multiple magnetic core and coil mating parts M. Each magnetic core and coil mating part M may include a corresponding magnetic core structure 1 and a corresponding coil structure 2 (step S102); then, mating... Figure 1 , Figure 4 and Figure 5 As shown, multiple magnetic cores and coil mating parts M are respectively implanted (or pressed into) multiple intermediate encapsulation colloids 3A supported by a supporting frame F (step S104); next, mating Figure 1 , Figure 5 and Figure 6 As shown, a top encapsulating colloid 3B is formed on the top of the support frame F to cover one end of multiple magnetic core and coil mating parts M and one end of multiple intermediate encapsulating colloids 3A (step S106); then, mating Figure 1 , Figure 5 and Figure 6 As shown, a bottom encapsulating colloid 3C is formed at the bottom of the support frame F to cover the other ends of multiple magnetic core and coil mating parts M and the other ends of multiple intermediate encapsulating colloids 3A (step S108); then, mating Figure 1 , Figure 6 and Figure 7As shown, multiple first conductive materials 4A, multiple second conductive materials 4B, and multiple insulating materials 6A are formed on the top encapsulating colloid 3B (step S110); next, in conjunction with Figure 1 , Figure 7 and Figure 8 As shown, a cutting step is performed: along multiple predetermined cutting lines L, multiple coil structures 2, multiple intermediate encapsulating colloids 3A, top encapsulating colloids 3B, bottom encapsulating colloids 3C, multiple first conductive materials 4A, multiple second conductive materials 4B, and multiple insulating materials 6A are cut to form multiple power inductor package structure semi-finished products (step S112); finally, in conjunction with Figure 1 , Figure 8 , Figure 9 and Figure 10 As shown, a one-side conductive structure 5, a bottom insulating structure 7, and a one-side insulating structure 8 are formed on each power inductor package structure semi-finished product to complete the fabrication of multiple power inductor package structures S (step S114).

[0023] For example, coordination Figure 1 and Figure 2 As shown, step S100, which provides a plurality of pre-fabricated magnetic core structures 1, may further include: first, forming a magnetic core material sheet 1A (step S1000, for example, first forming a flexible magnetic core material layer, and then flattening the flexible magnetic core material layer with a scraper); next, baking the magnetic core material sheet 1A to solidify the magnetic core material sheet 1A (step S1002); next, pressing the magnetic core material sheet 1A to increase the density of the magnetic core material sheet 1A (step S1004); then, stamping the magnetic core material sheet 1A to produce a plurality of magnetic core structures 1 (step S1006, as shown). Figure 2 (As shown). It is worth noting that the magnetic core structure 1 can be configured as a stamped central column formed by non-dry powder hot pressing, and the magnetic core structure 1 has an uncut upper surface 1001, an uncut lower surface 1002 corresponding to the uncut upper surface 1001, and a sheared outer surrounding surface 1003 (i.e., an outer surrounding surface produced by a stamping process) connecting the uncut upper surface 1001 and the uncut lower surface 1002. However, the examples given above are only one possible embodiment and are not intended to limit the invention.

[0024] For example, coordination Figure 1 and Figure 3As shown, in step S102, where multiple coil structures 2 are respectively arranged around multiple magnetic core structures 1, each coil structure 2 can be fixed to the corresponding magnetic core structure 1 by heating. Each coil structure 2 can be a flat coil (its cross-section can be flat) or a circular coil (its cross-section can be circular) arranged in a circular or arbitrary shape. Furthermore, the shape of each magnetic core structure 1 (e.g., a circular cylinder or an elliptical cylinder) can be the same as the inner edge shape of the corresponding coil structure 2. That is, after multiple coil structures 2 are respectively arranged around multiple magnetic core structures 1, each coil structure 2 and the corresponding magnetic core structure 1 can be tightly fitted together by heating. It is worth noting that the coil structure 2 has a surrounding coil 20 (e.g., a coil made of any conductive material) around the magnetic core structure 1 and a receiving space 21 for accommodating the magnetic core structure 1. However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0025] For example, coordination Figure 1 and Figure 4 As shown, before step S104, in which multiple magnetic cores and coil mating components M are respectively implanted into multiple intermediate encapsulation colloids 3A carried by the carrier frame F, the method of manufacturing the power inductor package structure S may further include: first, providing a carrier frame F having multiple through openings F100 (step S1030); next, attaching a backing tape T (or any removable adhesive layer) to a back side of the carrier frame F to close one end of each through opening F100 (step S1032); then, filling the multiple through openings F100 with multiple intermediate encapsulation colloids 3A respectively (step S1034); next, setting (or positioning) the multiple magnetic cores and coil mating components M respectively on the multiple intermediate encapsulation colloids 3A through multiple adhesive colloids H (or any fixing material layer) (step S1036). However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0026] For example, coordination Figure 1 , Figure 4 and Figure 5As shown, after step S104, in which multiple magnetic cores and coil mating parts M are respectively implanted into multiple intermediate encapsulating colloids 3A carried by the carrier frame F, the method for manufacturing the power inductor package structure S may further include: first, removing the back adhesive tape T from the back of the carrier frame F (step S1050); then, baking the multiple intermediate encapsulating colloids 3A (each adhesive H may contain a corresponding intermediate encapsulating colloid 3A) to cure the multiple intermediate encapsulating colloids 3A (step S1052); then, applying heavy pressure to the multiple intermediate encapsulating colloids 3A to increase the density of each intermediate encapsulating colloid 3A (step S1054). However, the example given above is only one feasible embodiment and is not intended to limit the present invention.

[0027] For example, coordination Figure 7 and Figure 8 As shown, in the cutting step S112, multiple intermediate encapsulating colloids 3A (e.g., silicone, epoxy resin, or any type of insulating material), top encapsulating colloids 3B (e.g., silicone, epoxy resin, or any type of insulating material), and bottom encapsulating colloids 3C (e.g., silicone, epoxy resin, or any type of insulating material) can be cut into multiple encapsulation structures 3. Furthermore, multiple first conductive materials 4A can be cut into multiple first top electrode layers 41 (e.g., may include copper, nickel, and tin layers formed sequentially by electroplating, or may include nickel and tin layers formed sequentially by electroplating), multiple second conductive materials 4B can be cut into multiple second top electrode layers 42 (e.g., may include copper, nickel, and tin layers formed sequentially by electroplating, or may include nickel and tin layers formed sequentially by electroplating), and multiple insulating materials 6A (e.g., silicone, epoxy resin, or any type of insulating material) can be cut into multiple top insulating layers 60. Furthermore, for each power inductor package structure S, the package structure 3 can be configured to cover the core structure 1 and the coil structure 2. A first top electrode layer 41 and a second top electrode layer 42 can be disposed on a top 3000 of the package structure 3 to form a top conductive structure 4, and a top insulating layer 60 can be disposed on the top 3000 of the package structure 3 to form a top insulating structure 6. It is worth noting that the package structure 3 may include a top stacked printed layer 31, an intermediate stacked printed layer 32, and a bottom stacked printed layer 33 stacked sequentially. However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0028] For example, coordination Figure 8 , Figure 9 and Figure 10As shown, in step S114 of forming the side-end conductive structure 5, the bottom-end insulating structure 7, and the side-end insulating structure 8 on each power inductor package structure semi-finished product, for each power inductor package structure S, the side-end conductive structure 5 may include a first side-end conductive layer 51 (e.g., may include a copper layer, a nickel layer, and a tin layer formed sequentially by electroplating, or may include a nickel layer and a tin layer formed sequentially by electroplating) and a second side-end conductive layer 52 (e.g., may include a copper layer, a nickel layer, and a tin layer formed sequentially by electroplating, or may include a nickel layer and a tin layer formed sequentially by electroplating) respectively disposed on a first side end 3001 and a second side end 3002 of the package structure 3, the bottom-end insulating structure 7 may include a bottom-end insulating layer 70 disposed on a bottom end 3005 of the package structure 3, and the side-end insulating structure 8 may include a first side-end insulating layer 81 and a second side-end insulating layer 82 respectively disposed on a third side end 3003 and a fourth side end 3004 of the package structure 3. It is worth noting that after the side conductive structure 5 is formed on each power inductor package semi-finished product, a first cut surface 2010 of the first end portion 201 of the coil structure 2 and a second cut surface 2020 of the second end portion 202 of the coil structure 2 can be covered by the first side conductive layer 51 and the second side conductive layer 52, respectively. Therefore, in each power inductor package structure S, the first end portion 201 of the coil structure 2 can be electrically connected to the first top electrode layer 41 through the first side conductive layer 51, and the second end portion 202 of the coil structure 2 can be electrically connected to the second top electrode layer 42 through the second side conductive layer 52. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0029] For example, in another feasible embodiment, the first end portion 201 and the second end portion 202 of the coil structure 2 can also extend obliquely directly to the bottom end of the encapsulation structure 3, so as to be electrically connected to a first bottom electrode layer (not shown in the figure) and a second bottom electrode layer (not shown in the figure) respectively disposed on the bottom end 3005 of the encapsulation structure 3. It is worth noting that in this embodiment, the first top electrode layer 41 and the second top electrode layer 42 can be omitted. However, the examples given above are only one feasible embodiment and are not intended to limit the present invention.

[0030] Second Embodiment

[0031] See Figure 8 , Figure 9 and Figure 10As shown, the second embodiment of the present invention provides a power inductor packaging structure S (or a composite power inductor), which may include: a magnetic core structure 1, a coil structure 2, a packaging structure 3, a top conductive structure 4, a side conductive structure 5, a top insulating structure 6, a bottom insulating structure 7, and a side insulating structure 8.

[0032] Furthermore, in coordination Figure 8 , Figure 9 and Figure 10 As shown, the coil structure 2 is disposed around the magnetic core structure 1, and the encapsulation structure 3 can be configured to encapsulate the magnetic core structure 1 and the coil structure 2. Furthermore, the top conductive structure 4 may include a first top electrode layer 41 and a second top electrode layer 42 disposed on a top end 3000 of the encapsulation structure 3, and the side conductive structure 5 may include a first side conductive layer 51 and a second side conductive layer 52 disposed on a first side end 3001 and a second side end 3002 of the encapsulation structure 3, respectively. Additionally, the top insulating structure 6 may include a top insulating layer 60 disposed on the top end 3000 of the encapsulation structure 3, the bottom insulating structure 7 may include a bottom insulating layer 70 disposed on a bottom end 3005 of the encapsulation structure 3, and the side insulating structure 8 may include a first side insulating layer 81 and a second side insulating layer 82 disposed on a third side end 3003 and a fourth side end 3004 of the encapsulation structure 3, respectively. Therefore, a first end portion 201 of the coil structure 2 can be electrically connected to the first top electrode layer 41 through the first side conductive layer 51, and a second end portion 202 of the coil structure 2 can be electrically connected to the second top electrode layer 42 through the second side conductive layer 52. For example, in one feasible embodiment, the core structure 1 and the encapsulation structure 3 can be seamlessly and tightly connected, and the coil structure 2 and the encapsulation structure 3 can be seamlessly and tightly connected. Furthermore, the top conductive structure 4 and the encapsulation structure 3 can be seamlessly and tightly connected, and the top insulating structure 6 and the encapsulation structure 3 can be seamlessly and tightly connected. Additionally, the top insulating structure 6 and the encapsulation structure 3 can be seamlessly and tightly connected, the bottom insulating structure 7 and the encapsulation structure 3 can be seamlessly and tightly connected, and the side insulating structure 8 and the encapsulation structure 3 can be seamlessly and tightly connected. However, the examples given above are merely feasible embodiments and are not intended to limit the present invention.

[0033] For example, coordination Figure 8 , Figure 9 and Figure 10As shown, the magnetic core structure 1 can be configured as a non-dry powder thermoforming stamped central column, and the magnetic core structure 1 has an uncut upper surface 1001, an uncut lower surface 1002 corresponding to the uncut upper surface 1001, and a sheared outer surrounding surface 1003 connecting the uncut upper surface 1001 and the uncut lower surface 1002. Furthermore, the uncut upper surface 1001 and the uncut lower surface 1002 of the magnetic core structure 1 can be completely covered by the encapsulation structure 3 without contacting air. Additionally, the magnetic core structure 1 can have a viscosity of 6.3 g / cm³. 3 The density above (e.g., 6300 mg / cm³) 3 The density of any positive integer above, or between 6000 mg / cm³ 3 Up to 9000 mg / cm 3 The power inductor package structure S has a length between 1 mm and 12 mm (e.g., a length between 1000 µm and 12000 µm, any positive integer), a width between 0.5 mm and 12 mm (e.g., a width between 500 µm and 12000 µm, any positive integer), and a height between 0.5 mm and 10 mm (e.g., a height between 500 µm and 10000 µm, any positive integer). However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0034] For example, coordination Figure 8 , Figure 9 and Figure 10 As shown, the coil structure 2 may have a surrounding coil 20 around the magnetic core structure 1 and a receiving space 21 for accommodating the magnetic core structure 1. The first end portion 201 of the coil structure 2 has a first cut surface 2010, and the second end portion 202 of the coil structure 2 has a second cut surface 2020. Furthermore, apart from the first cut surface 2010 of the first end portion 201 and the second cut surface 2020 of the second end portion 202 of the coil structure 2, the remaining outer surface of the coil structure 2 can be completely covered by the encapsulation structure 3 without contacting the air (in conjunction with...). Figure 8 and Figure 9 (As shown). However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0035] For example, coordination Figure 8 , Figure 9 and Figure 10As shown, the packaging structure 3 may include a top stacked printed layer 31, an intermediate stacked printed layer 32, and a bottom stacked printed layer 33 stacked sequentially. The top stacked printed layer 31 and the intermediate stacked printed layer 32 may be made of the same or different materials, the intermediate stacked printed layer 32 and the bottom stacked printed layer 33 may be made of the same or different materials, and the bottom stacked printed layer 33 and the top stacked printed layer 31 may be made of the same or different materials. Furthermore, the top end 3000 of the packaging structure 3 may be completely covered by the first top electrode layer 41, the second top electrode layer 42, and the top insulating layer 60, and the bottom end 3005 of the packaging structure 3 may be completely covered by the bottom insulating layer 70. Moreover, the first side end 3001 of the packaging structure 3 may be completely covered by the first side conductive layer 51, and the second side end 3002 of the packaging structure 3 may be completely covered by the second side conductive layer 52. Furthermore, the third side end 3003 of the encapsulation structure 3 can be completely covered by the first side end insulating layer 81, and the fourth side end 3004 of the encapsulation structure 3 can be completely covered by the second side end insulating layer 82. Additionally, the first side end 3001, the second side end 3002, the third side end 3003, and the fourth side end 3004 of the encapsulation structure 3 can be the left side end, the right side end, the front side end, and the rear side end, respectively, and all of these can be side end cut surfaces. However, the examples described above are merely one possible embodiment and are not intended to limit the invention.

[0036] For example, coordination Figure 8 , Figure 9 and Figure 10As shown, the first top electrode layer 41 can be configured as a first top silver paste layer separate from the coil structure 2, and the second top electrode layer 42 can be configured as a second top silver paste layer separate from the coil structure 2. The top insulating layer 60 can be connected between the first top electrode layer 41 and the second top electrode layer 42. Furthermore, the first side conductive layer 51 can be configured as a first side electroplated layer electrically connected between the coil structure 2 and the first top electrode layer 41, and the second side conductive layer 52 can be configured as a second side electroplated layer electrically connected between the coil structure 2 and the second top electrode layer 42. Further, the upper surfaces of the first top electrode layer 41, the second top electrode layer 42, and the top insulating layer 60 can be flush with each other, and the side surfaces of the first top electrode layer 41 and the second top electrode layer 42 can be covered by the first side conductive layer 51 and the second side conductive layer 52, respectively. Furthermore, the lower surfaces of the first side conductive layer 51 and the second side conductive layer 52 can be covered by the bottom insulating structure 7, and a first cut surface 2010 of the first end portion 201 of the coil structure 2 and a second cut surface 2020 of the second end portion 202 of the coil structure 2 can be covered by the first side conductive layer 51 and the second side conductive layer 52, respectively. It is worth noting that in one feasible embodiment, the first top electrode layer 41 and the first side conductive layer 51 can cooperate to form a first L-shaped conductive structure, and the second top electrode layer 42 and the second side conductive layer 52 can cooperate to form a second L-shaped conductive structure. Additionally, depending on different usage requirements, when the power inductor package structure S can be configured to be mounted on a circuit board (not shown in the figure), the first side conductive layer 51 and the second side conductive layer 52 can be protected by the insulating barrier of the bottom insulating structure 7 without directly contacting the circuit board.

[0037] Beneficial effects of the embodiments

[0038] One of the beneficial effects of the present invention is that the power inductor packaging structure S provided by the present invention can be configured to cover the magnetic core structure 1 and the coil structure 2 through the following: "the top conductive structure 4 may include a first top electrode layer 41 and a second top electrode layer 42 disposed on a top of the packaging structure 3"; "the side conductive structure 5 may include a first side conductive layer 51 and a second side conductive layer 52 respectively disposed on a first side end 3001 and a second side end 3002 of the packaging structure 3"; "the top insulating structure 6 may include a... The technical solutions of “top insulating layer 60”, “bottom insulating structure 7 may include a bottom insulating layer 70 disposed on a bottom end of the encapsulation structure 3” and “side insulating structure 8 may include a first side insulating layer 81 and a second side insulating layer 82 disposed on a third side end 3003 and a fourth side end 3004 of the encapsulation structure 3” are such that a first end portion 201 of the coil structure 2 can be electrically connected to the first top electrode layer 41 through the first side conductive layer 51, and a second end portion 202 of the coil structure 2 can be electrically connected to the second top electrode layer 42 through the second side conductive layer 52.

[0039] One of the beneficial effects of the present invention is that the method for manufacturing a power inductor packaging structure S provided by the present invention can achieve the following: "providing a plurality of pre-fabricated magnetic core structures 1", "distributing a plurality of coil structures 2 around the plurality of magnetic core structures 1 to form a plurality of magnetic core and coil mating parts M", "implanting the plurality of magnetic core and coil mating parts M into a plurality of intermediate encapsulation colloids 3A supported by a support frame F", "forming a top encapsulation colloid 3B at the top of the support frame F to cover the plurality of magnetic core and coil mating parts M and the plurality of intermediate encapsulation colloids 3A", and "forming a bottom encapsulation colloid 3C at the bottom of the support frame F to cover the plurality of magnetic core and coil mating parts M and the plurality of intermediate encapsulation colloids 3A". The technical solutions include: “intermediate encapsulating colloid 3A”, “forming multiple first conductive materials 4A, multiple second conductive materials 4B and multiple insulating materials 6A on the top encapsulating colloid 3B”, “performing a cutting step: cutting multiple coil structures 2, multiple intermediate encapsulating colloids 3A, top encapsulating colloid 3B, bottom encapsulating colloid 3C, multiple first conductive materials 4A, multiple second conductive materials 4B and multiple insulating materials 6A along multiple predetermined cutting lines to form multiple power inductor encapsulation structure semi-finished products”, and “forming a side end conductive structure 5, a bottom end insulating structure 7 and a side end insulating structure 8 on each power inductor encapsulation structure semi-finished product”, to complete the fabrication of multiple power inductor encapsulation structures S.

[0040] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of protection of the claims of the present invention.

Claims

1. A power inductor packaging structure, characterized in that, The power inductor packaging structure includes: One magnetic core structure; A coil structure is disposed around the magnetic core structure; A packaging structure configured to enclose the magnetic core structure and the coil structure; A top conductive structure, the top conductive structure including a first top electrode layer and a second top electrode layer disposed on a top of the encapsulation structure; A side-end conductive structure, the side-end conductive structure including a first side-end conductive layer and a second side-end conductive layer respectively disposed on a first side end and a second side end of the packaging structure; A top insulating structure, the top insulating structure including a top insulating layer disposed on the top of the encapsulation structure; A bottom insulating structure, the bottom insulating structure including a bottom insulating layer disposed on a bottom end of the encapsulation structure; and A side-end insulation structure, the side-end insulation structure including a first side-end insulation layer and a second side-end insulation layer respectively disposed on a third side end and a fourth side end of the encapsulation structure; Wherein, a first end portion of the coil structure is electrically connected to the first top electrode layer through the first side conductive layer, and a second end portion of the coil structure is electrically connected to the second top electrode layer through the second side conductive layer; The magnetic core structure and the packaging structure are seamlessly and tightly connected, and the coil structure and the packaging structure are seamlessly and tightly connected. Wherein, the top conductive structure and the encapsulation structure are seamlessly and tightly connected, and the top insulating structure and the encapsulation structure are seamlessly and tightly connected; The top insulating structure and the encapsulation structure are seamlessly and tightly connected, the bottom insulating structure and the encapsulation structure are seamlessly and tightly connected, and the side insulating structure and the encapsulation structure are seamlessly and tightly connected.

2. The power inductor packaging structure according to claim 1, characterized in that, in, The magnetic core structure is configured as a non-dry powder hot-pressed stamped central column, and the magnetic core structure has an uncut upper surface, an uncut lower surface corresponding to the uncut upper surface, and a sheared outer surrounding surface connecting the uncut upper surface and the uncut lower surface. The uncut upper and lower surfaces of the magnetic core structure are completely covered by the encapsulation structure and do not come into contact with air. The magnetic core structure has a density of 6.3 g / cm³. 3 The density is above, and the power inductor package structure has a length between 1 mm and 12 mm, a width between 0.5 mm and 12 mm, and a height between 0.5 mm and 10 mm; The coil structure has a surrounding coil around the magnetic core structure and a receiving space for accommodating the magnetic core structure. The first end portion of the coil structure has a first cut surface, and the second end portion of the coil structure has a second cut surface. Except for the first cut surface at the first end of the coil structure and the second cut surface at the second end of the coil structure, the remaining outer surface of the coil structure is completely covered by the encapsulation structure and does not come into contact with air; The encapsulation structure includes a top stacked printed layer, an intermediate stacked printed layer, and a bottom stacked printed layer stacked sequentially. The top stacked printed layer and the intermediate stacked printed layer have the same or different materials, the intermediate stacked printed layer and the bottom stacked printed layer have the same or different materials, and the bottom stacked printed layer and the top stacked printed layer have the same or different materials. Wherein, the top end of the packaging structure is completely covered by the first top electrode layer, the second top electrode layer and the top insulating layer, and the bottom end of the packaging structure is completely covered by the bottom insulating layer; Wherein, the first side end of the packaging structure is completely covered by the first side end conductive layer, and the second side end of the packaging structure is completely covered by the second side end conductive layer; Wherein, the third side of the encapsulation structure is completely covered by the first side insulating layer, and the fourth side of the encapsulation structure is completely covered by the second side insulating layer; Wherein, the first side end, the second side end, the third side end, and the fourth side end of the packaging structure are respectively the left side end, the right side end, the front side end, and the rear side end of the packaging structure, and the first side end, the second side end, the third side end, and the fourth side end of the packaging structure are all side end cut surfaces.

3. The power inductor packaging structure according to claim 1, characterized in that, in, The first top electrode layer is configured as a first top silver paste layer separate from the coil structure, the second top electrode layer is configured as a second top silver paste layer separate from the coil structure, and the top insulating layer is connected between the first top electrode layer and the second top electrode layer. The upper surfaces of the first top electrode layer, the second top electrode layer, and the top insulating layer are flush with each other, and the side surfaces of the first top electrode layer and the second top electrode layer are respectively covered by the first side conductive layer and the second side conductive layer. Wherein, the first side conductive layer is configured as a first side electroplated layer electrically connected between the coil structure and the first top electrode layer, and the second side conductive layer is configured as a second side electroplated layer electrically connected between the coil structure and the second top electrode layer. Wherein, the lower surfaces of the first side conductive layer and the second side conductive layer are covered by the bottom insulating structure, and a first cut surface of the first end portion of the coil structure and a second cut surface of the second end portion of the coil structure are respectively covered by the first side conductive layer and the second side conductive layer. The first top electrode layer and the first side conductive layer cooperate to form a first L-shaped conductive structure, and the second top electrode layer and the second side conductive layer cooperate to form a second L-shaped conductive structure.

4. A power inductor packaging structure, characterized in that, The power inductor packaging structure includes: One magnetic core structure; A coil structure is disposed around the magnetic core structure; A packaging structure configured to enclose the magnetic core structure and the coil structure; A top conductive structure, the top conductive structure including a first top electrode layer and a second top electrode layer disposed on a top of the encapsulation structure; A side-end conductive structure, the side-end conductive structure including a first side-end conductive layer and a second side-end conductive layer respectively disposed on a first side end and a second side end of the packaging structure; A top insulating structure, the top insulating structure including a top insulating layer disposed on the top of the encapsulation structure; A bottom insulating structure, the bottom insulating structure including a bottom insulating layer disposed on a bottom end of the encapsulation structure; and A side-end insulation structure, the side-end insulation structure including a first side-end insulation layer and a second side-end insulation layer respectively disposed on a third side end and a fourth side end of the encapsulation structure; Wherein, a first end portion of the coil structure is electrically connected to the first top electrode layer through the first side conductive layer, and a second end portion of the coil structure is electrically connected to the second top electrode layer through the second side conductive layer.

5. The power inductor packaging structure according to claim 4, characterized in that, in, The magnetic core structure is configured as a non-dry powder hot-pressed stamped central column, and the magnetic core structure has an uncut upper surface, an uncut lower surface corresponding to the uncut upper surface, and a sheared outer surrounding surface connecting the uncut upper surface and the uncut lower surface. The uncut upper and lower surfaces of the magnetic core structure are completely covered by the encapsulation structure and do not come into contact with air. The magnetic core structure has a density of 6.3 g / cm³. 3 The density is above, and the power inductor package structure has a length between 1 mm and 12 mm, a width between 0.5 mm and 12 mm, and a height between 0.5 mm and 10 mm; The coil structure has a surrounding coil around the magnetic core structure and a receiving space for accommodating the magnetic core structure. The first end portion of the coil structure has a first cut surface, and the second end portion of the coil structure has a second cut surface. Except for the first cut surface at the first end of the coil structure and the second cut surface at the second end of the coil structure, the remaining outer surface of the coil structure is completely covered by the encapsulation structure and does not come into contact with air; The encapsulation structure includes a top stacked printed layer, an intermediate stacked printed layer, and a bottom stacked printed layer stacked sequentially. The top stacked printed layer and the intermediate stacked printed layer have the same or different materials, the intermediate stacked printed layer and the bottom stacked printed layer have the same or different materials, and the bottom stacked printed layer and the top stacked printed layer have the same or different materials. Wherein, the top end of the packaging structure is completely covered by the first top electrode layer, the second top electrode layer and the top insulating layer, and the bottom end of the packaging structure is completely covered by the bottom insulating layer; Wherein, the first side end of the packaging structure is completely covered by the first side end conductive layer, and the second side end of the packaging structure is completely covered by the second side end conductive layer; Wherein, the third side of the encapsulation structure is completely covered by the first side insulating layer, and the fourth side of the encapsulation structure is completely covered by the second side insulating layer; Wherein, the first side end, the second side end, the third side end, and the fourth side end of the packaging structure are respectively the left side end, the right side end, the front side end, and the rear side end of the packaging structure, and the first side end, the second side end, the third side end, and the fourth side end of the packaging structure are all side end cut surfaces.

6. The power inductor packaging structure according to claim 4, characterized in that, in, The first top electrode layer is configured as a first top silver paste layer separate from the coil structure, the second top electrode layer is configured as a second top silver paste layer separate from the coil structure, and the top insulating layer is connected between the first top electrode layer and the second top electrode layer. The upper surfaces of the first top electrode layer, the second top electrode layer, and the top insulating layer are flush with each other, and the side surfaces of the first top electrode layer and the second top electrode layer are respectively covered by the first side conductive layer and the second side conductive layer. Wherein, the first side conductive layer is configured as a first side electroplated layer electrically connected between the coil structure and the first top electrode layer, and the second side conductive layer is configured as a second side electroplated layer electrically connected between the coil structure and the second top electrode layer. Wherein, the lower surfaces of the first side conductive layer and the second side conductive layer are covered by the bottom insulating structure, and a first cut surface of the first end portion of the coil structure and a second cut surface of the second end portion of the coil structure are respectively covered by the first side conductive layer and the second side conductive layer. The first top electrode layer and the first side conductive layer cooperate to form a first L-shaped conductive structure, and the second top electrode layer and the second side conductive layer cooperate to form a second L-shaped conductive structure.

7. A method for fabricating a power inductor packaging structure, characterized in that, The method for fabricating the power inductor packaging structure includes: Provides multiple pre-fabricated magnetic core structures; Multiple coil structures are respectively arranged around multiple magnetic core structures to form multiple magnetic core and coil mating parts, each of the magnetic core and coil mating parts including a corresponding magnetic core structure and a corresponding coil structure; Multiple magnetic cores and coil mating parts are respectively implanted into multiple intermediate encapsulation gel bodies supported by a support frame; A top encapsulating colloid is formed on the top of the support frame to cover the plurality of magnetic cores and coil mating parts and the plurality of intermediate encapsulating colloids; A bottom encapsulating colloid is formed at the bottom of the support frame to cover the plurality of magnetic cores and coil mating parts and the plurality of intermediate encapsulating colloids; Multiple first conductive materials, multiple second conductive materials, and multiple insulating materials are formed on the top encapsulating colloid; A cutting step is performed: along multiple predetermined cutting lines, multiple coil structures, multiple intermediate encapsulants, multiple top encapsulants, multiple bottom encapsulants, multiple first conductive materials, multiple second conductive materials, and multiple insulating materials are cut to form multiple power inductor package structure semi-finished products; and A conductive structure on one side, an insulating structure on the bottom, and an insulating structure on the other side are formed on each of the power inductor package semi-finished products to complete the fabrication of multiple power inductor package structures.

8. The method for fabricating the power inductor packaging structure according to claim 7, Its features are, in, The step of providing a plurality of pre-fabricated magnetic core structures further includes: forming a magnetic core material sheet; baking the magnetic core material sheet to solidify the magnetic core material sheet; pressing the magnetic core material sheet to increase the density of the magnetic core material sheet; and stamping the magnetic core material sheet to produce a plurality of the magnetic core structures; In the step of respectively surrounding and arranging the multiple coil structures on the multiple magnetic core structures, each coil structure is fixed to the corresponding magnetic core structure by heating. The method for manufacturing the power inductor package structure further includes, prior to the step of implanting the plurality of magnetic cores and coil mating components into the plurality of intermediate encapsulation colloids carried by the carrier frame, the method comprising: providing the carrier frame having a plurality of through openings; attaching a backing tape to a back side of the carrier frame to close one end of each of the through openings; filling the plurality of intermediate encapsulation colloids into the plurality of through openings; and respectively setting the plurality of magnetic cores and coil mating components on the plurality of intermediate encapsulation colloids by the plurality of adhesive colloids. The method for manufacturing the power inductor package structure further includes, after the step of embedding the plurality of magnetic cores and coil mating parts into the plurality of intermediate encapsulation bodies carried by the support frame, removing the back adhesive tape from the back side of the support frame. The intermediate encapsulation colloids are baked; and the intermediate encapsulation colloids are subjected to heavy compression.

9. The method for manufacturing the power inductor packaging structure according to claim 7, characterized in that, in, During the cutting step, the intermediate encapsulant, the top encapsulant, and the bottom encapsulant are cut into multiple encapsulation structures, such that in each power inductor encapsulation structure, the encapsulation structure is configured to cover the core structure and the coil structure. In the cutting step, multiple first conductive materials are cut into multiple first top electrode layers, and multiple second conductive materials are cut into multiple second top electrode layers, so that in each power inductor package structure, the first top electrode layer and the second top electrode layer are disposed on a top of the package structure to form a top conductive structure. In the cutting step, multiple insulating materials are cut into multiple top insulating layers, such that in each power inductor package structure, the top insulating layer is disposed on the top of the package structure to form a top insulating structure. In each of the power inductor package structures, the side conductive structure includes a first side conductive layer and a second side conductive layer respectively disposed on a first side and a second side of the package structure. In each of the power inductor package structures, the bottom insulation structure includes a bottom insulation layer disposed on a bottom end of the package structure. In each of the power inductor package structures, the side insulation structure includes a first side insulation layer and a second side insulation layer respectively disposed on a third side end and a fourth side end of the package structure. In each of the power inductor package structures, a first end portion of the coil structure is electrically connected to the first top electrode layer through the first side conductive layer, and a second end portion of the coil structure is electrically connected to the second top electrode layer through the second side conductive layer.

10. The method for manufacturing the power inductor packaging structure according to claim 9, characterized in that, in, The magnetic core structure and the packaging structure are seamlessly and tightly connected, and the coil structure and the packaging structure are seamlessly and tightly connected; Wherein, the top conductive structure and the encapsulation structure are seamlessly and tightly connected, and the top insulating structure and the encapsulation structure are seamlessly and tightly connected; Wherein, the top insulating structure and the encapsulation structure are seamlessly and tightly connected, the bottom insulating structure and the encapsulation structure are seamlessly and tightly connected, and the side insulating structure and the encapsulation structure are seamlessly and tightly connected. The magnetic core structure is configured as a non-dry powder hot-pressed stamped central column, and the magnetic core structure has an uncut upper surface, an uncut lower surface corresponding to the uncut upper surface, and a sheared outer surrounding surface connecting the uncut upper surface and the uncut lower surface. The uncut upper and lower surfaces of the magnetic core structure are completely covered by the encapsulation structure and do not come into contact with air. The magnetic core structure has a density of 6.3 g / cm³. 3 The density is above, and the power inductor package structure has a length between 1 mm and 12 mm, a width between 0.5 mm and 12 mm, and a height between 0.5 mm and 10 mm; The coil structure has a surrounding coil around the magnetic core structure and a receiving space for accommodating the magnetic core structure. The first end portion of the coil structure has a first cut surface, and the second end portion of the coil structure has a second cut surface. Except for the first cut surface at the first end of the coil structure and the second cut surface at the second end of the coil structure, the remaining outer surface of the coil structure is completely covered by the encapsulation structure and does not come into contact with air; The encapsulation structure includes a top stacked printed layer, an intermediate stacked printed layer, and a bottom stacked printed layer stacked sequentially. The top stacked printed layer and the intermediate stacked printed layer have the same or different materials, the intermediate stacked printed layer and the bottom stacked printed layer have the same or different materials, and the bottom stacked printed layer and the top stacked printed layer have the same or different materials. Wherein, the top end of the packaging structure is completely covered by the first top electrode layer, the second top electrode layer and the top insulating layer, and the bottom end of the packaging structure is completely covered by the bottom insulating layer; Wherein, the first side end of the packaging structure is completely covered by the first side end conductive layer, and the second side end of the packaging structure is completely covered by the second side end conductive layer; Wherein, the third side of the encapsulation structure is completely covered by the first side insulating layer, and the fourth side of the encapsulation structure is completely covered by the second side insulating layer; Wherein, the first side end, the second side end, the third side end, and the fourth side end of the packaging structure are respectively the left side end, the right side end, the front side end, and the rear side end of the packaging structure, and the first side end, the second side end, the third side end, and the fourth side end of the packaging structure are all side end cut surfaces; Wherein, the first top electrode layer is configured as a first top silver paste layer that is separate from the coil structure, the second top electrode layer is configured as a second top silver paste layer that is separate from the coil structure, and the top insulating layer is connected between the first top electrode layer and the second top electrode layer; The upper surfaces of the first top electrode layer, the second top electrode layer, and the top insulating layer are flush with each other, and the side surfaces of the first top electrode layer and the second top electrode layer are respectively covered by the first side conductive layer and the second side conductive layer. Wherein, the first side conductive layer is configured as a first side electroplated layer electrically connected between the coil structure and the first top electrode layer, and the second side conductive layer is configured as a second side electroplated layer electrically connected between the coil structure and the second top electrode layer. Wherein, the lower surface of the first side conductive layer and the lower surface of the second side conductive layer are covered by the bottom insulating structure, and the first cut surface of the first end portion of the coil structure and the second cut surface of the second end portion of the coil structure are respectively covered by the first side conductive layer and the second side conductive layer. The first top electrode layer and the first side conductive layer cooperate to form a first L-shaped conductive structure, and the second top electrode layer and the second side conductive layer cooperate to form a second L-shaped conductive structure.

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