Vehicle-mounted patch type common mode inductor and manufacturing method thereof

Abstract

The present application relates to a kind of vehicle-mounted ethernet sheet type common mode inductor and its manufacturing method, belong to vehicle-mounted ethernet sheet type common mode inductor network communication technical field.The sheet type common mode inductor includes H-type magnetic core and two inside and outside distribution enameled wire groups;Two enameled wires are double-layered and are wound on H-type magnetic core and form at least two interval windings;In adjacent two windings, the inside and outside positions of two enameled wires are transposed.The vehicle-mounted ethernet sheet type common mode inductor and its manufacturing method provided by the present application can avoid the hidden danger of product wire breakage, improve reliability, and can reduce the resistance of single winding, improve product performance.In addition, since the enameled wires in the bottom enameled wire group and the surface enameled wire group are double-wire wound and cross-phase in two windings, four-layer wiring can be achieved, thereby improving product distributed capacitance and improving S parameter.

Description

Technical Field

[0001] This invention belongs to the field of automotive Ethernet chip common mode inductor network communication technology, specifically relating to an automotive Ethernet chip common mode inductor and its manufacturing method. Background Technology

[0002] With the technological demands for higher speeds and greater intelligence in intelligent vehicle electronic architectures, and the limitations of traditional CAN buses in terms of bandwidth and electromagnetic compatibility, autonomous driving, vehicle-to-everything (V2X) systems, and advanced driver assistance systems are all evolving towards miniaturization and higher frequencies. In-vehicle networks need to process large amounts of sensor data, audio and video signals, and high-definition map information, placing higher demands on network bandwidth and signal integrity. Against this backdrop, automotive Ethernet technology has emerged. Traditional chip common-mode inductors can no longer meet the high-speed transmission performance requirements and are insufficient to meet the design needs of next-generation automotive electronic architecture systems. Summary of the Invention

[0003] Therefore, the purpose of this invention is to provide an in-vehicle Ethernet chip common-mode inductor and its manufacturing method, which can effectively improve the above-mentioned problems.

[0004] The technical solution of the present invention is as follows: This invention provides an in-vehicle Ethernet chip common-mode inductor, comprising an H-shaped magnetic core and two inner and outer enameled wire groups; the H-shaped magnetic core includes four electrodes, each enameled wire group includes two enameled wires, the ends of the two enameled wires are connected to the same electrode and the ends are connected to the other electrode, the two enameled wires are double-layered and wound around the H-shaped magnetic core to form at least two spaced windings; in two adjacent windings, the inner and outer positions of the two enameled wires are interchanged.

[0005] As an optional configuration, the enameled wire group consists of a first enameled wire and a second enameled wire; in the first winding, the first enameled wire is located inside the second enameled wire; in the second winding, the first enameled wire is located outside the second enameled wire.

[0006] As an alternative, the two enameled wires form a cross joint between two adjacent windings to achieve commutation.

[0007] Alternatively, the cross joint and the electrode are located on the same side of the H-shaped magnetic core.

[0008] As an alternative, the number of turns of the same enameled wire is equal in different windings.

[0009] Alternatively, the two enameled wire groups may be wound in the same direction.

[0010] As an alternative, the four electrodes are arranged in a rectangular pattern, with the two electrodes corresponding to the same enameled wire group located at adjacent corners of the rectangle and on the two sides of the H-shaped magnetic core.

[0011] As an optional feature, the chip common-mode inductor also includes an I-type magnetic core, which is bonded and fixed to one side of the H-type magnetic core.

[0012] As an alternative, the type I magnetic core and the electrode are located on opposite sides of the type H magnetic core.

[0013] This invention also provides a method for manufacturing an automotive Ethernet chip common-mode inductor, comprising: Step S1: Fix the ends of the two enameled wires of the enameled wire assembly to the same electrode; Step S2: Two enameled wires are double-layered and wound several turns around the central column of the H-shaped magnetic core to form the first winding; Step S3: Swap the two enameled wires inside and out, continue to form a double layer and wind them around the central column of the H-shaped magnetic core to form a second winding. The two windings are set at intervals. Step S4: Fix the ends of the two enameled wires to another electrode; Step S5: Repeat steps S1-S4 to complete the winding of another enameled wire group. The two enameled wire groups are distributed inside and outside each other.

[0014] As an optional solution, in step S3, the two enameled wires are rotated 180° and form a cross joint to complete the phase commutation.

[0015] As an optional solution, it also includes: step S6, bonding and fixing the type I magnetic core to one side of the type H magnetic core.

[0016] The beneficial effects of this invention are: The automotive Ethernet chip common-mode inductor and its manufacturing method provided by this invention fix the ends of the two enameled wires in each enameled wire group to the same electrode, which can avoid the risk of wire breakage, improve reliability, and reduce the resistance of a single winding, thereby improving product performance. Furthermore, because the enameled wires in the bottom and top enameled wire groups are wound in parallel and cross-phased between the two windings, four layers of wiring can be achieved, thereby increasing the distributed capacitance and improving the S-parameters. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. The above and other objects, features, and advantages of the present invention will become clearer through the accompanying drawings. The same reference numerals indicate the same parts in all the drawings. The drawings are not intentionally drawn to scale to actual dimensions; the focus is on illustrating the main points of the invention.

[0018] Figure 1 A schematic diagram of the structure of a chip common-mode inductor provided in an embodiment of the present invention. Figure 1 ; Figure 2 A schematic diagram of the structure of a chip common-mode inductor provided in an embodiment of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the structure of the H-type magnetic core and the I-type magnetic core of the chip common mode inductor provided in the embodiments of the present invention; Figure 4 This is a schematic diagram of the structure of a chip common-mode inductor (corresponding to steps S1-S4) provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of a chip common-mode inductor (corresponding to step S5) provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the circuit structure and internal winding of a chip common-mode inductor provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of a chip common-mode inductor (corresponding to step S6) provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of test data for a chip common-mode inductor provided in an embodiment of the present invention. Figure 1 ; Figure 9 This is a schematic diagram of test data for a chip common-mode inductor provided in an embodiment of the present invention. Figure 2 ; Figure 10 This is a schematic diagram of test data for a chip common-mode inductor provided in an embodiment of the present invention. Figure 3 ; Figure 11 This is a schematic diagram of test data for a chip common-mode inductor provided in an embodiment of the present invention. Figure 4 .

[0019] Icons: 10 - Chip common mode inductor; 11 - H-type magnetic core; 12 - Enamelled wire assembly; 14 - I-type magnetic core; 110 - Center post; 111 - Sidewall; 112 - First electrode; 113 - Second electrode; 114 - Third electrode; 115 - Fourth electrode; 120 - First winding; 121 - Second winding; 122 - First cross joint; 123 - Third winding; 124 - Fourth winding; 125 - Second cross joint; 130 - First enamelled wire; 131 - Second enamelled wire; 132 - Third enamelled wire; 133 - Fourth enamelled wire; 140 - Adhesive. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0024] Please refer to Figure 1 , Figure 2 As shown, an embodiment of the present invention provides an in-vehicle Ethernet chip common-mode inductor 10, which is mainly used for network communication in the intelligent vehicle industry. Generally, the chip common-mode inductor 10 needs to be soldered to PCB pads, and the soldering method is not limited, such as reflow soldering. Figure 4 , Figure 5 , Figure 7 This is a schematic diagram illustrating the fabrication method of the chip common-mode inductor 10. Figures 8-11 This is a schematic diagram of test data for a chip common-mode inductor.

[0025] The chip common mode inductor 10 mainly consists of an H-type magnetic core 11, an I-type magnetic core 14, and two enameled wire groups 12. The I-type magnetic core 14 is fixed to the H-type magnetic core 11, and the two enameled wire groups 12 are wound on the H-type magnetic core 11.

[0026] The structure of the H-type magnetic core 11 is not limited and can refer to existing technologies. For example, please combine... Figure 3 As shown, the H-shaped magnetic core 11 includes a central post 110 and two flanges 111, which are located at both ends of the central post 110. Generally, the cross-sectional area of ​​the flanges 111 is larger than that of the central post 110, and the cross-section of the H-shaped magnetic core 11 is approximately H-shaped, I-shaped, or C-shaped. In some embodiments, it is also permissible for the cross-sectional area of ​​the flanges 111 to be less than or equal to the cross-sectional area of ​​the central post 110.

[0027] The H-shaped magnetic core 11 includes four electrodes. The positions of the four electrodes are not limited and can be set as needed. In this embodiment, the four electrodes are distributed in a rectangular shape on one side of the H-shaped magnetic core 11, and two electrodes are provided on each side 111.

[0028] The electrode design is not limited and can refer to existing technologies. For ease of description, the four electrodes are defined as the first electrode 112, the second electrode 113, the third electrode 114, and the fourth electrode 115, respectively, in a clockwise or counterclockwise direction within the rectangle. The first electrode 112 and the second electrode 113 are located on the same side 111, while the third electrode 114 and the fourth electrode 115 are located on another side 111. The first electrode 112 and the second electrode 113, the first electrode 112 and the third electrode 114, the second electrode 113 and the fourth electrode 115, and the third electrode 114 and the fourth electrode 115 are adjacent and located at adjacent corners of the rectangle, with the first electrode 112 and the fourth electrode 115, and the second electrode 113 and the third electrode 114 arranged diagonally.

[0029] Please combine Figure 4 , Figure 5 As shown, the two enameled wire groups 12 are distributed internally and externally, that is, one enameled wire is wound on the H-shaped magnetic core 11, and the other enameled wire group 12 is wound on it. The two enameled wire groups 12 are matched with four electrodes. For example, the first enameled wire group 12 is matched with the first electrode 112 and the third electrode 114, and the second enameled wire group 12 is matched with the second electrode 113 and the fourth electrode 115.

[0030] Each enameled wire group 12 includes two enameled wires. The material of the enameled wires is not limited, such as enameled copper wire, enameled silver wire, etc., but enameled copper wire is preferred.

[0031] Each enameled wire has a head and a tail. The heads of two enameled wires are electrically connected to the same electrode, and the tails are electrically connected to another electrode. The electrical connections between the head and electrode, and between the tail and electrode, can be made in any way, such as silver printing or soldering. It is important to note that the heads of the two enameled wires connected to the same electrode are spaced apart, forming a blank area. This blank area can be used for soldering to PCB pads, effectively avoiding the risk of wire breakage caused by tension shrinkage during reflow soldering between the PCB pads and the product electrodes. Of course, in other embodiments, the PCB pads can also be soldered to other locations on the product.

[0032] Two enameled wires are wound in double layers on the central post 110 of the H-shaped magnetic core 11. Double-layer winding means that one enameled wire is the inner layer wire and the other is the outer layer wire. The outer layer wire and the inner layer wire are wound simultaneously or separately to form a coil. After winding, the coil formed by the inner layer wire is the inner coil, and the coil formed by the outer layer wire is the outer coil. The outer coil is overlaid on the inner coil.

[0033] Two enameled wires are wound to form at least two windings, each winding comprising a portion of one enameled wire and a portion of the other. There is a gap between adjacent windings, the size of which can be set as needed, either large or small. The number of windings can be set as needed, for example, two, three, or four; in this embodiment, two windings are preferred. The number of enameled coils in each winding is not limited, for example, eight, ten, or twenty turns.

[0034] In two adjacent windings, the inner and outer positions of the two enameled wires are interchanged. Specifically, taking the first enameled wire group 130 12 as an example, the two enameled wires in the first enameled wire group 130 12 are the first enameled wire 130 and the second enameled wire 131. In the first winding, the first enameled wire 130 is located inside the second enameled wire 131, the first enameled wire 130 is the inner layer wire, and the second enameled wire 131 is the outer layer wire; in the second winding, the first enameled wire 130 is located outside the second enameled wire 131, the second enameled wire 131 is the inner layer wire, and the first enameled wire 130 is the outer layer wire.

[0035] The section between the two enameled wires and the two windings is the commutation section. The commutation section of the two enameled wires forms a cross joint. The two enameled wires rotate 180° at this point to achieve commutation. The inner and outer parts of the two enameled wires are swapped before and after commutation.

[0036] In other embodiments, the commutation segments of the two enameled wires may not cross. For example, the commutation segment of one enameled wire may be located on the first side of the central column 110, and the commutation segment of the other enameled wire may be located on the second side of the central column 110, with the first side being adjacent to or opposite to the second side.

[0037] The position of the cross joint is not limited. In this embodiment, it is preferred that the cross joint and the electrode are located on the same side of the H-shaped magnetic core 11. In other embodiments, the cross joint and the electrode may also be located on adjacent sides or opposite sides of the H-shaped magnetic core 11.

[0038] The cross joint formed by the two enameled wire groups 12 can be located on the same side, adjacent side, or opposite side of the H-type magnetic core 11. Preferably, the cross joint formed by the two enameled wire groups 12 can be located on the same side of the H-type magnetic core 11.

[0039] In different windings, the number of turns of the same enameled wire is equal. For example, the number of turns of the first enameled wire in the first winding 120 is equal to the number of turns in the second winding 121. The number of turns is not limited; for example, both can be ten turns. In other embodiments, the two numbers may not be equal.

[0040] The two enameled wire groups 12 are distributed inside and outside, that is, the winding formed by the second enameled wire group 12 is located outside the winding formed by the first enameled wire group 12.

[0041] The two enameled wire groups 12 are wound in the same direction; for example, the enameled wires in both enameled wire groups 12 are wound in a clockwise or counterclockwise direction. The correspondence of the windings formed by the two enameled wire groups 12 is as follows: Figure 6 As shown.

[0042] Preferably, the two electrodes corresponding to the same enameled wire group 12 are located at adjacent corners of a rectangle and on the two flanges 111 of the H-shaped magnetic core 11. For example, the ends of the two enameled wires in the first enameled wire group 12 are located on the first electrode 112, and the ends of the two enameled wires are located on the fourth electrode 115; the ends of the two enameled wires in the second enameled wire group 12 are located on the second electrode 113, and the ends of the two enameled wires are located on the third electrode 114. Of course, in other embodiments, the two electrodes corresponding to the same enameled wire group 12 can also be located at opposite corners of a rectangle or on the same flange 111 of the H-shaped magnetic core 11.

[0043] The structure of the type I magnetic core 14 is not limited and can refer to existing technologies, such as rectangular block, prism, cylindrical, elliptical cylinder, etc. The type I magnetic core 14 and the type H magnetic core 11 are fixedly connected, and the connection method is not limited, such as bonding, welding, or connection via threaded fasteners. Preferably, please refer to... Figure 7 As shown, the type I magnetic core 14 is bonded and fixed to one side of the type H magnetic core 11. Specifically, adhesive 140 is applied to one side of the two flanges 111, and then the type I magnetic core 14 and the wound type H magnetic core 11 are assembled and pressed together, and then dried to achieve the fixation of the two.

[0044] Preferably, the type I magnetic core 14 and the electrodes are located on opposite sides of the type H magnetic core 11. In other embodiments, the type I magnetic core 14 and the electrodes may also be located on adjacent sides of the type H magnetic core 11.

[0045] Correspondingly, embodiments of the present invention also provide a method for manufacturing an in-vehicle Ethernet chip common-mode inductor 10, which is mainly used for manufacturing the in-vehicle Ethernet chip common-mode inductor 10.

[0046] The production method includes the following steps: Step S1: Fix the ends of the two enameled wires of the enameled wire assembly 12 to the same electrode.

[0047] In this step, the enameled wire group 12 is defined as the first wire group, and the two enameled wires in the first wire group are defined as the first enameled wire 130 and the second enameled wire 131. The ends of the first enameled wire 130 and the second enameled wire 131 are fixed to the same electrode, such as the first electrode 112.

[0048] The method of fixing the wire end to the electrode is not limited and can refer to existing technology.

[0049] In step S2, two enameled wires are double-layered and wound several times on the central post 110 of the H-shaped magnetic core 11 to form the first winding.

[0050] In this step, the number of turns of the first enameled wire 130 and the second enameled wire 131 is unlimited and can be set as needed. The first enameled wire 130 is located on the inner side, and the second enameled wire 131 is located on the outer side. That is, the first enameled wire 130 is evenly wound into a first coil on the central post 110, and the second enameled wire 131 is wound into a second coil outside the first coil. The first enameled wire 130 and the second enameled wire 131 can be wound together and simultaneously, or they can be wound separately, i.e., the first enameled wire 130 is wound first, and then the second enameled wire 131 is wound.

[0051] Step S3: Swap the two enameled wires inside and out, continue to form a double layer and wind them around the central post 110 of the H-shaped magnetic core 11 to form a second winding. The two windings are set at intervals.

[0052] In this step, the two enameled wires are swapped, with the second enameled wire 131 located on the inside and the first enameled wire 130 located on the outside. That is, the second enameled wire 131 is evenly wound into a third coil on the second coil, and the first enameled wire 130 is wound into a fourth coil on the outside of the third coil.

[0053] In the two windings, the winding direction of the enameled wire can be the same or different, but it is preferred to wind it along the same winding direction, such as clockwise or counterclockwise.

[0054] Furthermore, in this step, after the commutation segments of the two enameled wires are rotated 180°, the first cross joint 122 can be formed, that is, the commutation segments of the two enameled wires are distributed in an X shape.

[0055] Step S4: Fix the ends of the two enameled wires to another electrode.

[0056] In this step, it is preferable to fix the ends of the two enameled wires to the third electrode 114. Of course, in some embodiments, it is also permissible to fix them to the second electrode 113 or the fourth electrode 115.

[0057] The method of fixing the wire end to the electrode is not limited and can refer to existing technology.

[0058] The semi-finished products formed in steps S1-S4 can be referred to Figure 4 As shown.

[0059] Step S5: Repeat steps S1-S4 to complete the winding of another enameled wire group 12. The two enameled wire groups 12 are distributed inside and outside.

[0060] Step S5 includes the following steps: Step S51: Fix the ends of the two enameled wires of another enameled wire group 12 to the same electrode.

[0061] In this step, the enameled wire group 12 is defined as the second wire group, and the two enameled wires in the second wire group are defined as the third enameled wire 132 and the fourth enameled wire 133. The ends of the third enameled wire 132 and the fourth enameled wire 133 are fixed to the same electrode, such as the second electrode 113.

[0062] In step S52, the two enameled wires in the second group 131 of the enameled wires are double-layered and wound several times on the first winding formed by the two enameled wires in the first group 130 of the enameled wires to form the third winding.

[0063] In this step, the number of turns of the third enameled wire 132 and the fourth enameled wire 133 is unlimited and can be set as needed. The third enameled wire 132 is located on the inner side, and the fourth enameled wire 133 is located on the outer side. That is, the third enameled wire 132 is evenly wound into a fifth coil on the second coil, and the fourth enameled wire 133 is wound into a sixth coil outside the fifth coil. The third enameled wire 132 and the fourth enameled wire 133 can be wound together and simultaneously, or they can be wound separately, i.e., the third enameled wire 132 is wound first, followed by the fourth enameled wire 133.

[0064] In step S53, the two enameled wires are swapped inside and out, and then wound in a double layer on the second winding formed by the two enameled wires in the first enameled wire group 130 12, forming a fourth winding. The third winding 123 and the fourth winding 124 are set alternately.

[0065] In this step, after the third enameled wire 132 and the fourth enameled wire 133 are rotated 180°, the fourth enameled wire 133 is located on the inside and the third enameled wire 132 is located on the outside. That is, the fourth enameled wire 133 is evenly wound into the seventh coil on the fourth coil, and the third enameled wire 132 is wound into the eighth coil on the outside of the seventh coil.

[0066] In the two windings, the winding direction of the enameled wire can be the same or different, but it is preferred to wind it along the same winding direction, such as clockwise or counterclockwise.

[0067] Furthermore, in this step, after the commutation segments of the two enameled wires are rotated 180°, a second cross joint 125 can be formed, meaning the commutation segments of the two enameled wires are distributed in an X-shape. The commutation segments formed by the third enameled wire 132 and the fourth enameled wire 133 can be located on the same side, adjacent side, or opposite side of the H-shaped magnetic core 11 as the commutation segments formed by the first enameled wire 130 and the second enameled wire 131.

[0068] Step S54: Fix the ends of the two enameled wires to another electrode.

[0069] In this step, it is preferable to fix the ends of the two enameled wires to the fourth electrode 115. Of course, in some embodiments, it is also permissible to fix them to the first electrode 112 or the third electrode 114.

[0070] The method of fixing the wire end to the electrode is not limited and can refer to existing technology.

[0071] The semi-finished product formed in step S5 can be referred to Figure 5 As shown.

[0072] Step S6: Bond and fix the type I magnetic core 14 to one side of the type H magnetic core 11.

[0073] Please combine Figure 7 As shown, step S6 includes the following steps: Step S61: Apply adhesive 140 to the top surface of the two flanges 111. Step S62: Assemble and press the type I magnetic core 14 and the wound type H magnetic core 11 together and dry them.

[0074] Please refer to the reference. Figures 8-11The test data diagrams are schematic diagrams of the results of mixed-mode S-parameter tests. In high-speed differential communication, these diagrams can evaluate the device's ability to handle both "useful signals" and "noise." All four graphs include OPEN ALLIANCE standard curves, indicating that the four test results were performed in accordance with automotive Ethernet industry standards. The test results presented in the four graphs evaluate the performance of the common-mode inductor in application scenarios ranging from 100BASE-T1 to 1000BASE-T1.

[0075] The horizontal axis of all four graphs represents the frequency of the test signal, measured in megahertz (MHz), ranging from 1 MHz to 1000 MHz, covering a wide frequency band from low-frequency audio to high-speed data transmission. The vertical axis represents the amplitude of the S-parameters, measured in decibels (dB).

[0076] Specifically, Figure 8 The test results for differential return loss demonstrate the reflection of the differential signal as it passes through the common-mode inductor provided in this application. In the figure, the Sdd11 curve (blue curve) represents the impedance matching degree, and the Sdd22 curve (green curve) represents the transmission quality of the useful signal. Both curves are below the OPEN ALLIANCE standard curve within the 100MHz frequency band, proving that the differential impedance matching of the common-mode inductor provided in this application is excellent, effectively preventing the useful signal from being emitted at the input and ensuring good signal integrity. Furthermore, the S-parameter amplitude of the blue curve is between -30dB and -10dB, meaning that the optimal reflected power is only 0.1% of the incident power. This indicates that the common-mode inductor provided in this application has excellent impedance matching on the differential path, ensuring that there is no significant energy loss or reflection when the useful signal enters and leaves the device.

[0077] Figure 9 The test results for differential insertion loss demonstrate the transmission loss of the useful differential signal. In the figure, the Sdd21 curve (blue curve) is close to 0dB in the low-frequency range, only dropping significantly to around -5dB at 1000MHz; this proves that the common-mode inductor has extremely low DC / low-frequency insertion loss and will not hinder the normal transmission of differential signals such as CAN bus or Ethernet. It is almost "transparent" to the useful signal.

[0078] Figure 10The test results for common-mode insertion loss demonstrate the degree to which common-mode noise is suppressed. As shown in the figure, the Scc21 curve (blue curve) remains below -25dB throughout the entire 1MHz to 1000MHz range, and shows a further decreasing trend as the frequency increases. This means that the device can attenuate more than 70% of the common-mode noise energy, proving that the noise reduction capability of this common-mode inductor reaches a moderately high level, fully meeting the radiated emission (RE) suppression requirements of typical automotive Ethernet.

[0079] Figure 11 The test results for mode conversion loss demonstrate the symmetry of the filter. As can be seen from the figure, both the Ssd21 curve (green curve) and the Ssd12 curve (blue curve) are below the red standard line in the range of 1MHz to 100MHz. This proves that the device has excellent differential / common-mode conversion suppression in the low-frequency band.

[0080] Based on the comprehensive test analysis across the four dimensions above, it can be demonstrated that the common-mode inductor provided in this application exhibits excellent performance and signal integrity preservation capabilities. It has extremely low insertion loss for differential useful signals and low return loss, making it highly suitable for communication links with high signal rate requirements, such as 100BASE-T1 or CAN FD, without causing signal eye diagram closure due to the addition of filters. Furthermore, it possesses good noise suppression capabilities, effectively filtering out high-frequency common-mode noise in the system and resolving radiation exceeding standards. All test curves (blue and green curves) are below the red "OPEN ALLIANCE" curve, proving that the device has passed industry standard verification and can be safely applied in automotive Ethernet physical layer designs.

[0081] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A vehicle-mounted Ethernet chip common-mode inductor, characterized in that, It includes an H-shaped magnetic core and two inner and outer enameled wire groups; the H-shaped magnetic core includes four electrodes, each enameled wire group includes two enameled wires, the ends of the two enameled wires are connected to the same electrode and the ends are connected to the other electrode, the two enameled wires are double-layered and wound around the H-shaped magnetic core to form at least two spaced windings; in two adjacent windings, the inner and outer positions of the two enameled wires are interchanged.

2. The vehicle-mounted Ethernet chip common-mode inductor according to claim 1, characterized in that, The enameled wire groups are a first enameled wire and a second enameled wire; in the first winding, the first enameled wire is located inside the second enameled wire; in the second winding, the first enameled wire is located outside the second enameled wire.

3. The vehicle-mounted Ethernet chip common-mode inductor according to claim 1, characterized in that, Between two adjacent windings, the two enameled wires form a cross joint to achieve commutation.

4. The vehicle-mounted Ethernet chip common-mode inductor according to claim 1, characterized in that, In different windings, the number of turns of the same enameled wire is equal.

5. The vehicle-mounted Ethernet chip common-mode inductor according to claim 1, characterized in that, The two enameled wire assemblies are wound in the same direction.

6. The vehicle-mounted Ethernet chip common-mode inductor according to claim 1, characterized in that, The four electrodes are arranged in a rectangular pattern, with the two electrodes corresponding to the same enameled wire group located at adjacent corners of the rectangle and on the two sides of the H-shaped magnetic core.

7. The vehicle-mounted Ethernet chip common-mode inductor according to claim 1, characterized in that, The chip common-mode inductor also includes an I-type magnetic core, which is bonded and fixed to one side of the H-type magnetic core.

8. A method for manufacturing an in-vehicle Ethernet chip common-mode inductor, characterized in that, include: Step S1: Fix the ends of the two enameled wires of the enameled wire assembly to the same electrode; Step S2: Two enameled wires are double-layered and wound several turns around the central column of the H-shaped magnetic core to form the first winding; Step S3: Swap the two enameled wires inside and out, continue to form a double layer and wind them around the central column of the H-shaped magnetic core to form a second winding. The two windings are set at intervals. Step S4: Fix the ends of the two enameled wires to another electrode; Step S5: Repeat steps S1-S4 to complete the winding of another enameled wire group. The two enameled wire groups are distributed inside and outside each other.

9. The method for manufacturing an in-vehicle Ethernet chip common-mode inductor according to claim 8, characterized in that, In step S3, the two enameled wires rotate 180° and form a cross joint, completing the phase commutation.

10. The method for manufacturing an in-vehicle Ethernet chip common-mode inductor according to claim 8, characterized in that, Also includes: Step S6: Bond and fix the type I magnetic core to one side of the type H magnetic core.

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